No. STSE-CC7138A
<Cat.No.070706>
SPECIFICATIONS FOR NICHIA CHIP TYPE WARM WHITE LED
MODEL : NS6L083AT-H1
NICHIA CORPORATION
-0-
Nichia STSE-CC7138A-1
<Cat.No.070910>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Dice Temperature
Symbol
IF
IFP
IR
PD
Topr
Tstg
Tj
Absolute Maximum Rating
350
600
85
1.54
-30 ~ + 85
-40 ~ +100
120
(Ta=25°C)
Unit
mA
mA
mA
W
°C
°C
°C
IFP Conditions : Pulse Width <
= 10msec. and Duty <
= 1/10
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
VF
Luminous Flux
φv
x
½
Chromaticity Coordinate
y
Color Rendering
Ra
Condition
IF=300[mA]
IF=300[mA]
IF=300[mA]
IF=300[mA]
IF=300[mA]
Typ.
(3.8)
(52)
0.41
0.39
(92)
(Ta=25°C)
Max.
Unit
4.4
V
lm
-
Min.
4.0
3.6
3.2
60.5
51.0
42.8
36.0
85
(Ta=25°C)
Max.
Unit
4.4
V
4.0
3.6
72.0
60.5
lm
51.0
42.8
-
½ Please refer to CIE 1931 chromaticity diagram.
(3) Ranking
Item
Forward Voltage
Luminous Flux
Color Rendering
Rank H
Rank M
Rank L
Rank P15
Rank P14
Rank P13
Rank P12
-
Symbol
Condition
VF
IF=300[mA]
φv
IF=300[mA]
Ra
IF=300[mA]
½ Forward Voltage Measurement allowance is ± 3%.
½ Luminous Flux Measurement allowance is ± 10%.
½ Color Rendering Measurement allowance is ± 5.
Color Ranks
x
y
x
y
x
y
0.3575
0.3612
0.3545
0.3408
0.3897
0.3823
(IF=300mA,Ta=25°C)
0.3610
0.3850
Rank d1
0.3780 0.3988
0.3970 0.4116
0.3897
0.3823
0.3720
0.3714
0.3575
0.3612
Rank d2
0.3720 0.3897
0.3714 0.3823
0.3822
0.3580
0.3667
0.3484
0.3988
0.4116
Rank e1
0.4162 0.4390
0.4200 0.4310
0.4255
0.4000
0.4053
0.3907
-1-
Nichia STSE-CC7138A-1
<Cat.No.070910>
x
y
x
y
x
y
Rank e2
0.4053 0.4255
0.3907 0.4000
0.3822
0.3580
0.3897
0.3823
0.4255
0.4000
Rank f3
0.4390 0.4680
0.4310 0.4385
0.4129
0.3725
Rank f5
0.4255 0.4519
0.4000 0.4086
0.4129
0.3725
0.4519
0.4086
0.3954
0.3642
x
y
0.4355
0.3785
x
y
0.4519
0.4086
Rank f4
0.4680 0.4970
0.4385 0.4466
0.4770
0.4137
0.4355
0.3785
Rank f6
0.4519 0.4770
0.4086 0.4137
0.4588
0.3838
½ Color Coordinates Measurement allowance is ± 0.01.
½ Basically, a shipment shall consist of the LEDs of a combination of the above ranks.
The percentage of each rank in the shipment shall be determined by Nichia.
Correspondence table of Color Coordinates – Luminous Flux ranks
Ranking by Luminous Flux
Ranking by Color Coordinates
P12
P13
P14
P15
d1, d2, e1, e2
f3, f4, f5, f6
½ Shaded ranks are available.
2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure’s page.
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure’s page.
Material as follows ; Package
Encapsulating Resin
Electrodes
:
:
:
Heat-Resistant Polymer
Silicone Resin (with Phosphor)
Ag Plating Copper Alloy
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to figure’s page.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
{
¯¯¯¯ - Uz
{ - Year
( 6 for 2006, 7 for 2007 )
- Month ( 1 for Jan., 9 for Sep., A for Oct.,
¯¯¯¯ - Nichia's Product Number
U - Ranking by Color Coordinates
- Ranking by Luminous Flux
z - Ranking by Forward Voltage
-2-
B for Nov. )
Nichia STSE-CC7138A
<Cat.No.070706>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Temperature Cycle
Moisture Resistance Cyclic
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Standard
Test Method
JEITA ED-4701
300 301
JEITA ED-4701
300 303
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Steady State Operating Life
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Note
2 times
Number of
Damaged
0/22
Tsld=215 ± 5°C, 3sec.
(Lead Solder)
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=100°C
1 time
over 95%
100 cycles
0/22
10 cycles
0/22
1000 hrs.
0/22
Ta=60°C, RH=90%
1000 hrs.
0/22
Ta=-40°C
1000 hrs.
0/22
Ta=25°C, IF=350mA
1000 hrs.
0/22
1000 hrs.
0/22
500 hrs.
0/22
1000 hrs.
0/22
48min.
0/22
1 time
0/22
1 time
0/22
3 times
0/22
0/50
Tested with Nichia standard circuit board.
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Vibration
Ta=85°C, IF=160mA
Tested with Nichia standard circuit board.
60°C, RH=90%, IF=250mA
Tested with Nichia standard circuit board.
Ta=-30°C, IF=300mA
Tested with Nichia standard circuit board.
JEITA ED-4701
400 403
Substrate Bending
JEITA ED-4702
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s2
3directions, 4cycles
3mm, 5 ± 1 sec.
Adhesion Strength
JEITA ED-4702
5N,
Electrostatic Discharges
JEITA ED-4701
300 304
R=1.5kΩ, C=100pF
Test Voltage=2kV
10 ± 1 sec.
Negative/Positive
Thermal resistance of LED with Nichia standard circuit board : Rja ≒ 65°C/W
Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Min.
Max.
Item
Symbol Test Conditions
Forward Voltage
VF
IF=300mA
Initial Level
Luminous Flux
φv
IF=300mA
Initial Level 0.7
The test is performed after the board is cooled down to the room temperature.
-3-
1.1
Nichia STSE-CC7138A
<Cat.No.070706>
7.CAUTIONS
The LEDs are devices which are materialized by combining Blue LEDs and special phosphors.
Consequently, the color of the LEDs is changed a little by an operating current.
Care should be taken after due consideration when using LEDs.
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag. A package of
a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within
a year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in the moisture proof packages, such as sealed containers with packages of moisture
absorbent material (silica gel).
It is also recommended to return the LEDs to the original
moisture proof bag and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following condition.
Baking treatment : more than 24 hours at 65 ± 5°C
· Nichia LED electrodes, leadframes and Die Heat sink are silver plated copper alloy.
The silver surface may be affected by environments which contain corrosive substances.
Please avoid conditions which may cause the LED to corrode, tarnish or discolor.
This corrosion or
discoloration might lower solderability or might affect on optical characteristics. There is a possibility
of accelerate corrosion if the LEDs are exposed to corrosive substances in high temperature.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
(3) Recommended circuit
· In designing a circuit, the current through each LED must not exceed its absolute maximum rating.
It is recommended to use Circuit B which regulates the current flowing through each LED.
In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the current through
the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the worst case,
some LED may be subjected to stresses in excess of the absolute maximum rating.
(B)
(A)
...
...
-4-
Nichia STSE-CC7138A
<Cat.No.070706>
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Pre-heat
Pre-heat time
Peak
temperature
Soldering time
Condition
Reflow Soldering
Lead Solder
Lead-free Solder
180 ~ 200°C
120 ~ 150°C
120 sec. Max.
120 sec. Max.
240°C Max.
260°C Max.
Hand Soldering
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
10 sec. Max.
10 sec. Max.
refer to
refer to
Temperature - profile 1. Temperature - profile 2.
(N2 reflow is recommended.)
Although the recommended soldering conditions are specified in the above table, reflow or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
<1 : Lead Solder>
<2 : Lead-free Solder>
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec.
Pre-heating
120 ~ 150°C 60sec.Max.
Above 200°C
1 ~ 5°C / sec.
240°C Max.
10sec. Max.
1 ~ 5°C / sec.
Pre-heating
180 ~ 200°C 60sec.Max.
260°C Max.
10sec. Max.
Above 220°C
120sec.Max.
120sec.Max.
[Recommended soldering pad design]
Use the following conditions shown in the figure.
(9.5)
Die Heat Sink
2.05
1.05
3.9
(4.3)
Thin line boxes：Solder resist opening
Thick line boxes：Land pattern
Make sure the die heat sink is electrically
connected to the cathode(K).
1.1
K
A
4.5
8
(Unit : mm)
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow.
It is recommended that the User use the nitrogen reflow method.
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
top of package.
The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a hot plate should be used.
It should be confirmed beforehand whether the characteristics of the LEDs
will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· Die Heat sink is to be soldered.
If not, please use the heat conductive adhesive.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
-5-
Nichia STSE-CC7138A
<Cat.No.070706>
(5) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.
When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic.
When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
(6) Static Electricity
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions
be taken against surge voltage to the equipment that mounts the LEDs.
· When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not.
It is easy to find
static-damaged LEDs by a light-on test or a VF test at a lower current (below 6mA is recommended).
· Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower,
or the LEDs do not light at the low current.
Criteria : (VF > 2.0V at IF=3mA)
(7) Heat Generation
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· Please determine the operating current with consideration of the ambient temperature local to the LED
and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS
in this specifications. Please also take measures to remove heat from the area near the LED (heat sink)
to improve the operational characteristics of the LED.
· The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation
between Tj and Ts.
Tj=Ta + Rja W
1
Tj=Ts + Rjs W
2
Tj = Dice Temperature : °C, Ta = Ambient Temperature : °C,
Ts = Solder Temperature (Cathode Side) : °C,
Rja = Heat resistance from Dice to Ambient temperature : °C /W,
Rjs = Heat resistance from Dice to Ts measuring point ≒ 10°C /W,
W = Inputting Power (IF VF) : W
-6-
Nichia STSE-CC7138A
<Cat.No.070706>
(8) Others
· NS6L083A-H1 complies with RoHS Directive.
· The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent
looking directly at the LEDs with unaided eyes for more than a few seconds.
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had LEDs
incorporated into it.
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such
as office equipment, communications equipment, measurement instruments and household appliances).
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor
control systems, automobiles, traffic control equipment, life support systems and safety devices).
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written
consent from Nichia.
When defective LEDs are found, the User shall inform Nichia directly before
disassembling or analysis.
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.
· The appearance and specifications of the product may be modified for improvement without notice.
-7-
Nichia STSE-CC7138A
<Cat.No.070706>
ICI Chromaticity Diagram
0.9
520
530
0.8
540
510
550
0.7
560
0.6
570
500
0.5
580
y
e1
f3 f4
590
d1
0.4
600
e2
f5 f6
610
620
d2
0.3 490
630
0.2
480
0.1
470
460
0
0
0.1
0.2
0.3
0.4
x
½ Color Coordinates Measurement allowance is ± 0.01.
-8-
0.5
0.6
0.7
0.8
Ta=25°C
2.0
1.5
1.0
0.5
0
3.0 3.5 4.0 4.5 5.0
Forward Voltage VF (V)
0 100 200 300 400 500 600 700
Forward Current IFP (mA)
Ambient Temperature vs.
Forward Voltage
Ambient Temperature vs.
Relative Luminous Flux
5.0
2.0
-9-
IFP=300mA
4.5
4.0
3.5
3.0
2.5
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Allowable Forward Current IFP (mA)
100
1000
2.5
IFP=300mA
1.0
0.5
0.2
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Ta=25°C
600
350
200
100
1
5 10 20
50 100
Duty Ratio (%)
Ambient Temperature vs.
Allowable Forward Current
Allowable Forward Current IF (mA)
Relative Luminous Flux (a.u.)
300
10
2.5
Forward Voltage VF (V)
Ta=25°C
Relative Luminous Flux (a.u.)
Forward Current IFP (mA)
1000
600
Duty Ratio vs.
Allowable Forward Current
Forward Current vs.
Relative Luminous Flux
Forward Voltage vs.
Forward Current
500
Thermal resistance
Rja=35°C/W
400
350
270
Thermal resistance
Rja=65°C/W
100 Typical measuring PWB
160
0
0
20
40
60
80 100
Ambient Temperature Ta (°C)
NICHIA CORPORATION
NS6L083A-H1
Title
CHARACTERISTICS
No.
070703768151
Nichia STSE-CC7138A
<Cat.No.070706>
Model
Spectrum
Forward Current vs.
Chromaticity Coordinate
Relative Emission Intensity (a.u.)
0.41
Ta=25°C
y
0.40
600mA
400mA
300mA
100mA
20mA
0.39
0.38
0.37
0.38
0.39
0.40
0.41
0.42
x
Ambient Temperature vs.
Chromaticity Coordinate
Ta=25°C
IFP=300mA
0.8
0.6
0.4
0.2
0
400
500
600
700
Wavelength λ (nm)
Relative Illuminance (a.u.)
-10-
0.40
-30°C
0°C
25°C
50°C
0.39
85°C
0.38
0.39
0.40
x
0.41
800
0°
1.0
IFP=300mA
y
1.0
Directivity
0.41
0.37
0.38
1.2
0.42
10° 20°
30°
Ta=25°C
IFP=300mA
40°
50°
60°
0.5
70°
80°
0
90°
60°
30°
Radiation Angle
0°
0.5
NICHIA CORPORATION
NS6L083A-H1
Title
CHARACTERISTICS
No.
070703768161
Nichia STSE-CC7138A
<Cat.No.070706>
Model
90°
1.0
4.3
3.2
3.4
1.6
5
3.5
K
4.3
A
Die Heatsink
Cathode
Internal Circuit
Protection device
Cathode mark
C 1.5
6.5
Die Heatsink
0.6
4.85
Anode
1.35
0.25
-11-
5
0.175
3.4
MATERIALS
PACKAGE
ENCAPSULATING RESIN
ELECTRODES
Heat-Resistant Polymer
Silicone Resin (with Phosphor)
Ag Plating Copper Alloy
½ NS6L083x-H1 has a protection device built in as a protection
circuit against static electricity.
Model
NICHIA CORPORATION
Title
No.
NS6L083x-H1
OUTLINE DIMENSIONS
070702761592
Unit
mm
7/1
Scale
Allow
±0.2
Nichia STSE-CC7138A
<Cat.No.070706>
ITEM
φ 180+0
-3
Reel part
1.75±0.1
Taping part
4±0.1
φ 1.5+0.1
-0
2±0.05
15.4±1
13+1
-0
0.2±0.05
φ 60+1
-0
φ2
1 ±0.8
6.7±0.1
12+0.3
- 0.1
5.5±0.05
Cathode mark
±0.2
φ 13
8±0.1
φ1.5 +0.2
-0
1.55±0.1
Label
WARM WHITE LED
TYPE NS6L083xT-H1
LOT xxxxxx-Uz
QTY
pcs
RoHS
5.2±0.1
Reel end of tape
No LEDs
LEDs mounting part
No LEDs
-12Pull direction
Top cover
tape
Embossed carrier tape
Reel Lead Min.160mm (No LEDs)
Reel Lead Min.100mm (No LEDs)
Reel Lead Min.400mm
Model
Taping is based on the JIS C 0806 : Packaging of Electronic
Components on Continuous Tapes.
NICHIA CORPORATION
Title
No.
NS6L083xT-H1
TAPING DIMENSIONS
070702761602
Unit
mm
Scale
Allow
Nichia STSE-CC7138A
<Cat.No.070706>
1,400pcs/Reel
Nichia STSE-CC7138A
<Cat.No.070706>
The reel and moisture absorbent material are put in the moisture proof foil bag
and then heat sealed.
Reel
Label
NICHIA
Seal
WARM WHITE LED
TYPE
LOT
QTY
NS6L083xT-H1
xxxxxx-Uz
RoHS
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture proof foil bag
Moisture
absorbent material
The box is partitioned with the
cardboard.
Label
NICHIA
Nichia
WARM WHITE LED
LED
TYPE
RANK
QTY
NS6L083xT-H1
Uz
RoHS
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Moisture proof foil bag
Cardboard box
Cardboard box S
Cardboard box M
Cardboard box L
Reel/bag
1reel
Quantity/bag (pcs)
1,400 MAX.
Dimensions (mm)
291¯237¯120¯8t
259¯247¯243¯5t
444¯262¯259¯8t
Reel/box
5reel MAX.
10reel MAX.
20reel MAX.
Model
NICHIA CORPORATION
-13-
Quantity/box (pcs)
7,000 MAX.
14,000 MAX.
28,000 MAX.
NS6L083xT-H1
Title
PACKING
No.
070702761612