NSC 74F164ASC

54F/74F164A
Serial-In, Parallel-Out Shift Register
General Description
Features
The ’F164A is a high-speed 8-bit serial-in/parallel-out shift
register. Serial data is entered through a 2-input AND gate
synchronous with the LOW-to-HIGH transition of the clock.
The device features an asynchronous Master Reset which
clears the register, setting all outputs LOW independent of
the clock. The ’F164A is a faster version of the ’F164.
Y
Commercial
Package
Number
Military
74F164APC
N14A
54F164ADM (Note 2)
Y
Y
Y
Y
Y
Typical shift frequency of 90 MHz
Asynchronous Master Reset
Gated serial data input
Fully synchronous data transfers
Guaranteed 4000V min ESD protection
’F164A is a faster version of the ’F164
Package Description
14-Lead (0.300× Wide) Molded Dual-In-Line
J14A
14-Lead Ceramic Dual-In-Line
74F164ASC (Note 1)
M14A
14-Lead (0.150× Wide) Molded Small Outline, JEDEC
74F164ASJ (Note 1)
M14D
14-Lead (0.300× Wide) Molded Small Outline, EIAJ
74F164AFM (Note 2)
W14B
14-Lead Cerpack
74F164ALM (Note 2)
E20A
20-Lead Ceramic Leadless Chip Carrier, Type C
Note 1: Devices also available in 13× reel. Use suffix e SCX and SJX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB.
Logic Symbols
IEEE/IEC
TL/F/10613 – 1
TL/F/10613 – 4
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.
C1995 National Semiconductor Corporation
TL/F/10613
RRD-B30M75/Printed in U. S. A.
54F/74F164A Serial-In, Parallel-Out Shift Register
January 1995
Connection Diagrams
Pin Assignment for
DIP, SOIC and Flatpak
Pin Assignment
for LCC
TL/F/10613–2
TL/F/10613 – 3
Unit Loading/Fan Out
54F/74F
Pin Names
A, B
CP
MR
Q0 – Q7
Description
U.L.
HIGH/LOW
Input IIH/IIL
Output IOH/IOL
Data Inputs
Clock Pulse Input (Active Rising Edge)
Master Reset Input (Active LOW)
Outputs
1.0/1.0
1.0/1.0
1.0/1.0
50/33.3
20 mA/b0.6 mA
20 mA/b0.6 mA
20 mA/b0.6 mA
b 1 mA/20 mA
Functional Description
The ’F164A is an edge-triggered 8-bit shift register with serial data entry and an output from each of the eight stages.
Data is entered serially through one of two inputs (A or B);
either of these inputs can be used as an active HIGH Enable for data entry through the other input. An unused input
must be tied HIGH.
Each LOW-to-HIGH transition on the Clock (CP) input shifts
data one place to the right and enters into Q0 the logical
AND of the two data inputs (A # B) that existed before the
rising clock edge. A LOW level on the Master Reset (MR)
input overrides all other inputs and clears the register asynchronously, forcing all Q outputs LOW.
Mode Select Table
Inputs
Outputs
Operating
Mode
MR
A
B
Q0
Reset (Clear)
L
X
X
L
L-L
Shift
H
H
H
H
l
l
h
h
l
h
l
h
L
L
L
H
q0 –q6
q0 –q6
q0 –q6
q0 –q6
Q1 –Q7
H(h) e HIGH Voltage Levels
L(l) e LOW Voltage Levels
X e Immaterial
qn e Lower case letters indicate the state of the referenced input or output
one setup time prior to the LOW-to-HIGH clock transition.
Logic Diagram
TL/F/10613 – 5
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
2
Absolute Maximum Ratings (Note 1)
Recommended Operating
Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Storage Temperature
b 65§ C to a 150§ C
Ambient Temperature under Bias
Junction Temperature under Bias
Plastic
b 55§ C to a 125§ C
Free Air Ambient Temperature
Military
Commercial
b 55§ C to a 125§ C
0§ C to a 70§ C
Supply Voltage
Military
Commercial
b 55§ C to a 175§ C
b 55§ C to a 150§ C
a 4.5V to a 5.5V
a 4.5V to a 5.5V
VCC Pin Potential to
Ground Pin
b 0.5V to a 7.0V
b 0.5V to a 7.0V
Input Voltage (Note 2)
b 30 mA to a 5.0 mA
Input Current (Note 2)
Voltage Applied to Output
in HIGH State (with VCC e 0V)
b 0.5V to VCC
Standard Output
b 0.5V to a 5.5V
TRI-STATEÉ Output
Current Applied to Output
in LOW State (Max)
twice the rated IOL (mA)
ESD Last Passing Voltage (Min)
4000V
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
Symbol
54F/74F
Parameter
Min
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
VCD
Input Clamp Diode Voltage
VOH
Output HIGH
Voltage
54F 10% VCC
74F 10% VCC
74F 5% VCC
VOL
Output LOW
Voltage
54F 10% VCC
74F 10% VCC
IIH
Input HIGH
Current
IBVI
Typ
Units
VCC
Conditions
Max
2.0
V
Recognized as a HIGH Signal
0.8
V
b 1.2
V
Min
IIN e b18 mA
V
Min
IOH e b1 mA
IOH e b1 mA
IOH e b1 mA
0.5
0.5
V
Min
IOL e 20 mA
IOL e 20 mA
54F
74F
20.0
5.0
mA
Max
VIN e 2.7V
Input HIGH Current
Breakdown Test
54F
74F
100
7.0
mA
Max
VIN e 7.0V
ICEX
Output HIGH
Leakage Current
54F
74F
250
50
mA
Max
VOUT e VCC
VID
Input Leakage
Test
74F
V
0.0
IID e 1.9 mA
All other pins grounded
IOD
Output Leakage
Circuit Current
74F
3.75
mA
0.0
VIOD e 150 mV
All other pins grounded
IIL
Input LOW Current
IOS
Output Short-Circuit Current
ICC
Power Supply Current
2.5
2.5
2.7
4.75
b 60
35
3
Recognized as a LOW Signal
b 0.6
mA
Max
VIN e 0.5V
b 150
mA
Max
VOUT e 0V
55
mA
Max
CP e HIGH
MR e GND, A, B e GND
AC Electrical Characteristics
Symbol
Parameter
74F
54F
74F
TA e a 25§ C
VCC e a 5.0V
CL e 50 pF
TA, VCC e Mil
CL e 50 pF
TA, VCC e Com
CL e 50 pF
Max
Min
Max
Min
Typ
fmax
Maximum Clock Frequency
80
120
tPLH
tPHL
Propagation Delay
CP to Qn
3.0
3.5
4.8
5.0
7.5
8.0
2.5
3.0
9.0
8.5
3.0
3.5
7.5
8.0
ns
tPHL
Propagation Delay
MR to Qn
5.0
7.0
10.0
4.0
12.5
5.0
10.5
ns
60
Min
Units
Max
80
MHz
AC Operating Requirements
Symbol
Parameter
74F
54F
74F
TA e a 25§ C
VCC e a 5.0V
TA, VCC e Mil
TA, VCC e Com
Min
Min
Min
Max
Max
Units
Max
ts(H)
ts(L)
Setup Time, HIGH or LOW
A or B to CP
4.5
4.0
5.5
4.0
4.5
4.0
th(H)
th(L)
Hold Time, HIGH or LOW
A or B to CP
1.0
1.0
1.0
1.0
1.0
1.0
tw(H)
tw(L)
CP Pulse Width
HIGH or LOW
4.0
7.0
4.0
7.0
4.0
7.0
ns
tw(L)
MR Pulse Width, LOW
4.0
5.0
4.0
ns
trec
Recovery Time
MR to CP
5.0
6.5
5.0
ns
ns
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F
164A
S
Temperature Range Family
74F e Commercial
54F e Military
C
X
Special Variations
QB e Military grade device with
environmental and burn-in
processing
X e Devices shipped in 13× reel
Device Type
Package Code
P e Plastic DIP
D e Ceramic DIP
S e Small Outline Package SOIC JEDEC
SJ e Small Outline SOIC EIAJ
L e Package Leadless Chip Carrier (LCC)
F e Flatpak
Temperature Range
C e Commercial (0§ C to a 70§ C)
M e Military (b55§ C to a 125§ C)
4
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier, Type C (L)
NS Package Number E20A
14-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J14A
5
Physical Dimensions inches (millimeters) (Continued)
14-Lead (0.150× Wide) Molded Small Outline Package, JEDEC (S)
NS Package Number M14A
6
Physical Dimensions inches (millimeters) (Continued)
14-Lead (0.300× Wide) Molded Small Outline Package, EIAJ (SJ)
NS Package Number M14D
14-Lead (0.300× Wide) Plastic Dual-In-Line Package (P)
NS Package Number N14A
7
54F/74F164A Serial-In, Parallel-Out Shift Register
Physical Dimensions inches (millimeters) (Continued)
14-Lead Cerpack (F)
NS Package Number W14B
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