54F/74F821 10-Bit D-Type Flip-Flop General Description Features The ’F821 is a 10-bit D-type flip-flop with TRI-STATEÉ true outputs arranged in a broadside pinout. The ’F821 is functionally and pin compatible with the AMD’s Am29821. Y Commercial Y TRI-STATE Outputs Direct replacement for AMD’s Am29821 Package Number Military 74F821SPC 54F821SDM (Note 2) Package Description N24C 24-Lead (0.300× Wide) Molded Dual-In-Line J24F 24-Lead (0.300× Wide) Ceramic Dual-In-Line M24B 24-Lead (0.300× Wide) Molded Small Outline, JEDEC 54F821FM (Note 2) W24C 24-Lead Cerpack 54F821LM (Note 2) E28A 24-Lead Ceramic Leadless Chip Carrier, Type C 74F821SC (Note 1) Note 1: Devices also available in 13× reel. Use suffix e SCX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e SDMQB, FMQB and LMQB. Logic Symbols Connection Diagrams Pin Assignment for DIP, SOIC and Flatpak Pin Assignment for LCC TL/F/9595–1 IEEE/IEC TL/F/9595 – 3 TL/F/9595 – 2 TL/F/9595–5 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/F/9595 RRD-B30M75/Printed in U. S. A. 54F/74F821 10-Bit D-Type Flip-Flop December 1994 Unit Loading/Fan Out 54F/74F Pin Names D0 – D9 OE CP O0 – O9 Description U.L. HIGH/LOW Input IIH/IIL Output IOH/IOL Data Inputs Output Enable TRI-STATE Input Clock Input TRI-STATE Outputs 1.0/1.0 20 mA/b0.6 mA 1.0/1.0 20 mA/b0.6 mA 1.0/1.0 150/40 (33.3) 20 mA/b0.6 mA b 3.0 mA/24 mA (20 mA) Functional Description Function Table The ’F821 consists of ten D-type edge-triggered flip-flops. This device has TRI-STATE true outputs for bus systems organized in a broadside pinning. The buffered Clock (CP) and buffered Output Enable (OE) are common to all flipflops. The flip-flops will store the state of their individual D inputs that meet the setup and hold times requirements on the LOW-to-HIGH CP transition. With the OE LOW the content of the flip-flops are available at the outputs. When the OE is HIGH, the outputs go to the high impedance state. Operation of the OE input does not affect the state of the flip-flops. Internal Output OE Inputs CP D Q O H H H L X X NC NC Z Z Hold Hold H L L H Z Load H L H L Z Load L L L H L Data Available L L H L H Data Available L H X NC NC No Change in Data L L X NC NC No Change in Data Function L e LOW Voltage Level H e HIGH Voltage Level X e Immaterial Z e High Impedance L e LOW-to-HIGH Transition NC e No Change Logic Diagram TL/F/9595 – 4 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. 2 Absolute Maximum Ratings (Note 1) Recommended Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b 65§ C to a 150§ C Ambient Temperature under Bias Junction Temperature under Bias Plastic b 55§ C to a 125§ C Free Air Ambient Temperature Military Commercial b 55§ C to a 125§ C 0§ C to a 70§ C Supply Voltage Military Commercial b 55§ C to a 175§ C b 55§ C to a 150§ C a 4.5V to a 5.5V a 4.5V to a 5.5V VCC Pin Potential to Ground Pin b 0.5V to a 7.0V b 0.5V to a 7.0V Input Voltage (Note 2) b 30 mA to a 5.0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0.5V to VCC Standard Output b 0.5V to a 5.5V TRI-STATE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. DC Electrical Characteristics Symbol 54F/74F Parameter Min VIH Input HIGH Voltage VIL Input LOW Voltage Typ Units 2.0 VCD Input Clamp Diode Voltage VOH Output HIGH Voltage 54F 10% VCC 54F 10% VCC 74F 10% VCC 74F 10% VCC 74F 5% VCC 74F 5% VCC VCC Conditions Max V Recognized as a HIGH Signal 0.8 V Recognized as a LOW Signal b 1.2 V 2.5 2.4 2.5 2.4 2.7 2.7 Min IIN e b18 mA V Min IOH IOH IOH IOH IOH IOH IOL e 20 mA IOL e 24 mA e e e e e e b 1 mA b 3 mA b 1 mA b 3 mA b 1 mA b 3 mA VOL Output LOW Voltage 54F 10% VCC 74F 10% VCC 0.5 0.5 V Min IIH Input HIGH Current 54F 74F 20.0 5.0 mA Max VIN e 2.7V IBVI Input HIGH Current Breakdown Test 54F 74F 100 7.0 mA Max VIN e 7.0V ICEX Output HIGH Leakage Current 54F 74F 250 50 mA Max VOUT e VCC VID Input Leakage Test V 0.0 IID e 1.9 mA, All Other Pins Grounded IOD Output Leakage Circuit Current 3.75 mA 0.0 VIOD e 150 mV All Other Pins Grounded IIL Input LOW Current b 0.6 mA Max VIN e 0.5V IOZH Output Leakage Current 50 mA Max VOUT e 2.7V IOZL Output Leakage Current IOS Output Short-Circuit Current ICCZ Power Supply Current 74F 4.75 74F b 60 78 3 b 50 mA Max VOUT e 0.5V b 150 mA Max VOUT e 0V 100 mA Max VO e HIGH Z AC Electrical Characteristics Symbol Parameter 74F 54F 74F TA e a 25§ C VCC e a 5.0V CL e 50 pF TA, VCC e Mil CL e 50 pF TA, VCC e Com CL e 50 pF Min Typ fmax Maximum Clock Frequency 100 150 Max Min Max tPLH tPHL Propagation Delay CP to On 2.0 2.0 6.4 6.2 9.5 9.5 2.0 2.0 10.5 10.5 2.0 2.0 10.5 10.5 tPZH tPZL Output Enable Time OE to On 2.0 2.0 5.8 6.3 10.5 10.5 2.0 2.0 13.0 13.0 2.0 2.0 11.5 11.5 tPHZ tPLZ Output Disable Time OE to On 1.5 1.5 3.4 3.5 7.0 7.0 1.0 1.0 7.5 7.5 1.5 1.5 7.5 7.5 60 Min Units Max 70 MHz ns ns AC Operating Requirements Symbol Parameter 74F 54F 74F TA e a 25§ C VCC e a 5.0V TA, VCC e Mil TA, VCC e Com Min Min Min Max Max ts(H) ts(L) Setup Time, HIGH or LOW Dn to CP 2.5 2.5 4.0 4.0 3.0 3.0 th(H) th(L) Hold Time, HIGH or LOW Dn to CP 2.5 2.5 2.5 2.5 2.5 2.5 tw(H) tw(L) CP Pulse Width HIGH or LOW 5.0 5.0 6.0 6.0 6.0 6.0 4 Units Max ns ns Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 821 S Temperature Range Family 74F e Commercial FAST 54F e Military FAST C X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices ship in 13× reel Device Type Package Code SP e Slim Plastic DIP SD e Slim Ceramic DIP Flatpak Fe Le Leadless Chip Carrier (LCC) Se Small Outline (SOIC) Temperature Range C e Commercial (0§ C to a 70§ C) M e Military (b55§ C to a 125§ C) 5 Physical Dimensions inches (millimeters) 28-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E28A 24-Lead (0.300× Wide) Ceramic Dual-In-Line Package (SD) NS Package Number J24F 6 Physical Dimensions inches (millimeters) (Continued) 24-Lead (0.300× Wide) Molded Small Outline Package, JEDEC (S) NS Package Number M24B 24-Lead (0.300× Wide) Molded Dual-In-Line Package (SP) NS Package Number N24C 7 54F/74F821 10-Bit D-Type Flip-Flop Physical Dimensions inches (millimeters) (Continued) 24-Lead Ceramic Flatpak (F) NS Package Number W24C LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation 2900 Semiconductor Drive P.O. Box 58090 Santa Clara, CA 95052-8090 Tel: 1(800) 272-9959 TWX: (910) 339-9240 National Semiconductor GmbH Livry-Gargan-Str. 10 D-82256 F4urstenfeldbruck Germany Tel: (81-41) 35-0 Telex: 527649 Fax: (81-41) 35-1 National Semiconductor Japan Ltd. Sumitomo Chemical Engineering Center Bldg. 7F 1-7-1, Nakase, Mihama-Ku Chiba-City, Ciba Prefecture 261 Tel: (043) 299-2300 Fax: (043) 299-2500 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Hong Kong Ltd. 13th Floor, Straight Block, Ocean Centre, 5 Canton Rd. Tsimshatsui, Kowloon Hong Kong Tel: (852) 2737-1600 Fax: (852) 2736-9960 National Semiconductores Do Brazil Ltda. Rue Deputado Lacorda Franco 120-3A Sao Paulo-SP Brazil 05418-000 Tel: (55-11) 212-5066 Telex: 391-1131931 NSBR BR Fax: (55-11) 212-1181 National Semiconductor (Australia) Pty, Ltd. Building 16 Business Park Drive Monash Business Park Nottinghill, Melbourne Victoria 3168 Australia Tel: (3) 558-9999 Fax: (3) 558-9998 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.