NSC DS90CR215

DS90CR215/DS90CR216
+3.3V Rising Edge Data Strobe LVDS 21-Bit Channel
Link - 66 MHz
General Description
The DS90CR215 transmitter converts 21 bits of CMOS/TTL
data into three LVDS (Low Voltage Differential Signaling)
data streams. A phase-locked transmit clock is transmitted in
parallel with the data streams over a fourth LVDS link. Every
cycle of the transmit clock 21 bits of input data are sampled
and transmitted. The DS90CR216 receiver converts the
LVDS data streams back into 21 bits of CMOS/TTL data. At
a transmit clock frequency of 66 MHz, 21 bits of TTL data are
transmitted at a rate of 462 Mbps per LVDS data channel.
Using a 66 MHz clock, the data throughput is 1.386 Gbit/s
(173 Mbytes/s).
The multiplexing of the data lines provides a substantial
cable reduction. Long distance parallel single-ended buses
typically require a ground wire per active signal (and have
very limited noise rejection capability). Thus, for a 21-bit wide
data and one clock, up to 44 conductors are required. With
the Channel Link chipset as few as 9 conductors (3 data
pairs, 1 clock pair and a minimum of one ground) are
needed. This provides a 80% reduction in required cable
width, which provides a system cost savings, reduces connector physical size and cost, and reduces shielding requirements due to the cables’ smaller form factor.
The 21 CMOS/TTL inputs can support a variety of signal
combinations. For example, five 4-bit nibbles plus 1 control,
or two 9-bit (byte + parity) and 3 control.
Features
n
n
n
n
n
n
n
n
n
n
n
n
n
n
Single +3.3V supply
Chipset (Tx + Rx) power consumption < 250 mW (typ)
Power-down mode ( < 0.5 mW total)
Up to 173 Megabytes/sec bandwidth
Up to 1.386 Gbps data throughput
Narrow bus reduces cable size
290 mV swing LVDS devices for low EMI
+1V common mode range (around +1.2V)
PLL requires no external components
Low profile 48-lead TSSOP package
Rising edge data strobe
Compatible with TIA/EIA-644 LVDS standard
ESD Rating > 7 kV
Operating Temperature: −40˚C to +85˚C
Block Diagrams
DS90CR216
DS90CR215
01290901
Order Number DS90CR215MTD
See NS Package Number MTD48
01290927
Order Number DS90CR216MTD
See NS Package Number MTD48
TRI-STATE ® is a registered trademark of National Semiconductor Corporation.
© 2005 National Semiconductor Corporation
DS012909
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DS90CR215/DS90CR216 +3.3V Rising Edge Data Strobe LVDS 21-Bit Channel Link-66 MHz
August 2005
DS90CR215/DS90CR216
Connection Diagrams
01290921
01290922
DS90CR215
DS90CR216
Typical Application
01290923
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2
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (VCC)
−0.3V to (VCC + 0.3V)
CMOS/TTL Output Voltage
−0.3V to (VCC + 0.3V)
LVDS Receiver Input Voltage
−0.3V to (VCC + 0.3V)
LVDS Driver Output Voltage
−0.3V to (VCC + 0.3V)
Circuit Duration
DS90CR216
1.89 W
DS90CR215
16 mW/˚C above +25˚C
DS90CR216
15 mW/˚C above +25˚C
ESD Rating
> 7 kV
(HBM, 1.5 kΩ, 100 pF)
Recommended Operating
Conditions
LVDS Output Short
Continuous
Junction Temperature
1.98 W
Package Derating
−0.3V to +4V
CMOS/TTL Input Voltage
DS90CR215
Min Nom Max Units
+150˚C
Storage Temperature Range
Supply Voltage (VCC)
−65˚C to +150˚C
3.0
3.3
3.6
V
−40 +25 +85
˚C
Operating Free Air
Lead Temperature
(Soldering, 4 sec.)
Temperature (TA)
+260˚C
Receiver Input Range
Maximum Package Power Dissipation @ +25˚C
0
Supply Noise Voltage (VCC)
MTD48 (TSSOP) Package:
2.4
V
100 mVPP
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Units
CMOS/TTL DC SPECIFICATIONS
VIH
High Level Input Voltage
VIL
Low Level Input Voltage
VOH
High Level Output Voltage
I
VOL
Low Level Output Voltage
I
VCL
Input Clamp Voltage
I
IIN
Input Current
V
2.0
GND
OH
= −0.4 mA
OL
= 2 mA
CL
= −18 mA
IN
2.7
= VCC, GND,
VCC
V
0.8
V
3.3
V
0.06
0.3
V
−0.79
−1.5
V
± 5.1
± 10
µA
-60
−120
mA
290
450
mV
35
mV
2.5V or 0.4V
IOS
Output Short Circuit Current
V
OUT
R
L
= 0V
LVDS DRIVER DC SPECIFICATIONS
VOD
Differential Output Voltage
∆VOD
Change in V OD between
Complimentary Output States
VOS
Offset Voltage (Note 4)
∆VOS
Change in V OSbetween
Complimentary Output States
IOS
Output Short Circuit Current
Output TRI-STATE ® Current
250
1.125
V
R
IOZ
= 100Ω
OUT
L
= 0V,
1.25
1.375
V
35
mV
−3.5
−5
mA
±1
± 10
µA
= 100Ω
PWR DWN = 0V,
V
OUT
V
CM
= 0V or VCC
LVDS RECEIVER DC SPECIFICATIONS
VTH
Differential Input High Threshold
VTL
Differential Input Low Threshold
I IN
Input Current
= +1.2V
+100
−100
V
V
IN
= +2.4V, VCC = 3.6V
IN
= 0V, VCC = 3.6V
3
mV
mV
± 10
± 10
µA
µA
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DS90CR215/DS90CR216
Absolute Maximum Ratings (Note 1)
DS90CR215/DS90CR216
Electrical Characteristics
(Continued)
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Units
TRANSMITTER SUPPLY CURRENT
ICCTW
Transmitter Supply Current Worst
Case (with Loads)
Transmitter Supply Current Power
Down
ICCTZ
RL = 100Ω,
CL = 5 pF,
Worst Case
Pattern
(Figures 1, 2)
, TA = −10˚C to
+70˚C
f = 32.5 MHz
31
45
mA
f = 37.5 MHz
32
50
mA
f = 66 MHz
37
55
mA
RL = 100Ω,
CL = 5 pF,
Worst Case
Pattern
(Figures 1, 2)
, TA = −40˚C to
+85˚C
f = 40 MHz
38
51
mA
f = 66 MHz
42
55
mA
10
55
µA
PWR DWN = Low
Driver Outputs in TRI-STATE
under Powerdown Mode
RECEIVER SUPPLY CURRENT
Receiver Supply Current Worst
Case
ICCRW
ICCRZ
Receiver Supply Current Power
Down
CL = 8 pF,
Worst Case
Pattern
(Figures 1, 3)
, TA = −10˚C to
+70˚C
f = 32.5 MHz
49
65
mA
f = 37.5 MHz
53
70
mA
f = 66 MHz
78
105
mA
CL = 8 pF,
Worst Case
Pattern
(Figures 1, 3)
, TA = −40˚C to
+85˚C
f = 40 MHz
55
82
mA
f = 66 MHz
78
105
mA
PWR DWN = Low
Receiver Outputs Stay Low during
Powerdown Mode
10
55
µA
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Typical values are given for VCC = 3.3V and TA = +25˚C.
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise
specified (except VOD and ∆VOD).
Note 4: VOS previously referred as VCM.
Transmitter Switching Characteristics
Over recommended operating supply and −40˚C to +85˚C ranges unless otherwise specified
Symbol
Parameter
Min
Typ
Max
Units
LLHT
LVDS Low-to-High Transition Time (Figure 2)
0.5
1.5
ns
LHLT
LVDS High-to-Low Transition Time (Figure 2)
0.5
1.5
ns
TCIT
TxCLK IN Transition Time (Figure 4)
TCCS
TxOUT Channel-to-Channel Skew (Figure 5)
TPPos0
Transmitter Output Pulse Position for Bit0
(Note 7) (Figure 16)
TPPos1
TPPos2
5
250
−0.4
0
0.4
ns
Transmitter Output Pulse Position for Bit1
3.1
3.3
4.0
ns
Transmitter Output Pulse Position for Bit2
6.5
6.8
7.6
ns
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f = 40 MHz
ns
ps
4
(Continued)
Over recommended operating supply and −40˚C to +85˚C ranges unless otherwise specified
Min
Typ
Max
Units
TPPos3
Symbol
Transmitter Output Pulse Position for Bit3
Parameter
10.2
10.4
11.0
ns
TPPos4
Transmitter Output Pulse Position for Bit4
13.7
13.9
14.6
ns
TPPos5
Transmitter Output Pulse Position for Bit5
17.3
17.6
18.2
ns
TPPos6
Transmitter Output Pulse Position for Bit6
TPPos0
Transmitter Output Pulse Position for Bit0
(Note 6) (Figure 16)
TPPos1
21.0
21.2
21.8
ns
−0.4
0
0.3
ns
Transmitter Output Pulse Position for Bit1
1.8
2.2
2.5
ns
TPPos2
Transmitter Output Pulse Position for Bit2
4.0
4.4
4.7
ns
TPPos3
Transmitter Output Pulse Position for Bit3
6.2
6.6
6.9
ns
TPPos4
Transmitter Output Pulse Position for Bit4
8.4
8.8
9.1
ns
TPPos5
Transmitter Output Pulse Position for Bit5
10.6
11.0
11.3
ns
TPPos6
Transmitter Output Pulse Position for Bit6
12.8
13.2
13.5
ns
TCIP
TxCLK IN Period (Figure 6)
15
T
50
ns
TCIH
TxCLK IN High Time (Figure 6)
0.35T
0.5T
0.65T
ns
TCIL
TxCLK IN Low Time (Figure 6)
0.35T
0.5T
0.65T
ns
TSTC
TxIN Setup to TxCLK IN (Figure 6)
2.5
ns
THTC
TxIN Hold to TxCLK IN (Figure 6)
0
ns
TCCD
TxCLK IN to TxCLK OUT Delay @ 25˚C,VCC=3.3V (Figure
3
f = 66 MHz
3.7
5.5
ns
8)
TPLLS
Transmitter Phase Lock Loop Set (Figure 10)
10
ms
TPDD
Transmitter Powerdown Delay (Figure 14)
100
ns
Receiver Switching Characteristics
Over recommended operating supply and −40˚C to +85˚C ranges unless otherwise specified
Symbol
Parameter
Min
Typ
Max
Units
2.2
5.0
ns
ns
CLHT
CMOS/TTL Low-to-High Transition Time (Figure 3)
CHLT
CMOS/TTL High-to-Low Transition Time (Figure 3)
RSPos0
Receiver Input Strobe Position for Bit 0 (Note 7)(Figure 17)
RSPos1
Receiver Input Strobe Position for Bit 1
RSPos2
Receiver Input Strobe Position for Bit 2
8.1
8.5
9.15
ns
RSPos3
Receiver Input Strobe Position for Bit 3
11.6
11.9
12.6
ns
RSPos4
Receiver Input Strobe Position for Bit 4
15.1
15.6
16.3
ns
RSPos5
Receiver Input Strobe Position for Bit 5
18.8
19.2
19.9
ns
RSPos6
Receiver Input Strobe Position for Bit 6
22.5
22.9
23.6
ns
RSPos0
Receiver Input Strobe Position for Bit 0 (Note 6)(Figure 17)
0.7
1.1
1.4
ns
RSPos1
Receiver Input Strobe Position for Bit 1
2.9
3.3
3.6
ns
RSPos2
Receiver Input Strobe Position for Bit 2
5.1
5.5
5.8
ns
RSPos3
Receiver Input Strobe Position for Bit 3
7.3
7.7
8.0
ns
RSPos4
Receiver Input Strobe Position for Bit 4
9.5
9.9
10.2
ns
RSPos5
Receiver Input Strobe Position for Bit 5
11.7
12.1
12.4
ns
RSPos6
Receiver Input Strobe Position for Bit 6
13.9
14.3
14.6
ns
RSKM
RxIN Skew Margin (Note 5) (Figure 18)
RCOP
RxCLK OUT Period (Figure 7)
RCOH
RxCLK OUT High Time (Figure 7)
RCOL
RxCLK OUT Low Time (Figure 7)
5
f = 40 MHz
f = 66 MHz
2.2
5.0
1.0
1.4
2.15
ns
4.5
5.0
5.8
ns
f = 40 MHz
490
ps
f = 66 MHz
400
ps
15
T
f = 40 MHz
6.0
10.0
ns
f = 66 MHz
4.0
6.1
ns
f = 40 MHz
10.0
13.0
ns
f = 66 MHz
6.0
7.8
ns
50
ns
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DS90CR215/DS90CR216
Transmitter Switching Characteristics
DS90CR215/DS90CR216
Receiver Switching Characteristics
(Continued)
Over recommended operating supply and −40˚C to +85˚C ranges unless otherwise specified
Symbol
RSRC
Parameter
RxOUT Setup to RxCLK OUT (Figure 7)
RHRC
RxOUT Hold to RxCLK OUT (Figure 7)
RCCD
RxCLK IN to RxCLK OUT Delay (Figure 9)
Min
Typ
f = 40 MHz
6.5
14.0
Max
Units
f = 66 MHz
2.5
8.0
ns
f = 40 MHz
6.0
8.0
ns
f = 66 MHz
2.5
4.0
f = 40 MHz
4.0
6.7
8.0
ns
f = 66 MHz
5.0
6.6
9.0
ns
ns
ns
RPLLS
Receiver Phase Lock Loop Set (Figure 11)
10
ms
RPDD
Receiver Powerdown Delay (Figure 15)
1
µs
Note 5: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account for transmitter pulse positions (min
and max) and the receiver input setup and hold time (internal data sampling window). This margin allows LVDS interconnect skew, inter-symbol interference (both
dependent on type/length of cable), and clock jitter less than 250 ps.
Note 6: The min. and max. limits are based on the worst bit by applying a −400ps/+300ps shift from ideal position.
Note 7: The min. and max. are based on the actual bit position of each of the 7 bits within the LVDS data stream across PVT.
AC Timing Diagrams
01290902
FIGURE 1. “Worst Case” Test Pattern
01290903
01290904
FIGURE 2. DS90CR215 (Transmitter) LVDS Output Load and Transition Times
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6
DS90CR215/DS90CR216
AC Timing Diagrams
(Continued)
01290905
01290906
FIGURE 3. DS90CR216 (Receiver) CMOS/TTL Output Load and Transition Times
01290907
FIGURE 4. D590CR215 (Transmitter) Input Clock Transition Time
01290908
Note 8: Measurements at VDIFF = 0V
Note 9: TCCS measured between earliest and latest LVDS edges
Note 10: TxCLK Differential Low→High Edge
FIGURE 5. D590CR215 (Transmitter) Channel-to-Channel Skew
7
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DS90CR215/DS90CR216
AC Timing Diagrams
(Continued)
01290909
FIGURE 6. D590CR215 (Transmitter) Setup/Hold and High/Low Times
01290910
FIGURE 7. D590CR216 (Receiver) Setup/Hold and High/Low Times
01290929
FIGURE 8. DS90CR215 (Transmitter) Clock In to Clock Out Delay
01290912
FIGURE 9. D590CR216 (Receiver) Clock In to Clock Out Delay
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DS90CR215/DS90CR216
AC Timing Diagrams
(Continued)
01290913
FIGURE 10. DS90CR215 (Transmitter) Phase Lock Loop Set Time
01290914
FIGURE 11. DS9OCR216 (Receiver) Phase Lock Loop Set Time
01290915
FIGURE 12. Seven Bits of LVDS in Once Clock Cycle
9
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DS90CR215/DS90CR216
AC Timing Diagrams
(Continued)
01290916
FIGURE 13. 21 Parallel TTL Data Inputs Mapped to LVDS Outputs (DS90CR215)
01290917
FIGURE 14. Transmitter Powerdown Delay
01290918
FIGURE 15. Receiver Powerdown Delay
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10
DS90CR215/DS90CR216
AC Timing Diagrams
(Continued)
01290919
FIGURE 16. Transmitter LVDS Output Pulse Position Measurement
11
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DS90CR215/DS90CR216
AC Timing Diagrams
(Continued)
01290928
FIGURE 17. Receiver LVDS Input Strobe Position
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12
DS90CR215/DS90CR216
AC Timing Diagrams
(Continued)
01290920
C — Setup and Hold Time (Internal data sampling window) defined by Rspos (receiver input strobe position) min and max
Tppos — Transmitter output pulse position (min and max)
RSKM ≥ Cable Skew (type, length) + Source Clock Jitter (cycle to cycle) (Note 11) + ISI (Inter-symbol interference) (Note 12)
Cable Skew — typicaIIy 10 ps–40 ps per foot, media dependent
Note 11: Cycle-to-cycle jitter is less than 250 ps
Note 12: ISI is dependent on interconnect length; may be zero
FIGURE 18. Receiver LVDS Input Skew Margin
2.
Transmitter input and control inputs except 3.3V TTL/
CMOS levels. They are not 5V tolerant.
3. The receiver powerdown feature when enabled wilI lock
receiver output to a logic low. However, the 5V/66 MHz
receiver maintain the outputs in the previous state when
powerdown occurred.
Applications Information
The DS90CR215 and DS90CR216 are backward compatible
with the existing 5V Channel Link transmitter/receiver pair
(DS90CR213, DS90CR214). To upgrade from a 5V to a 3.3V
system the following must be addressed:
1. Change 5V power supply to 3.3V. Provide this supply to
the VCC, LVDS VCC and PLL V CC.
DS90CR215 Pin Descriptions — Channel Link Transmitter
Pin Name
I/O
No.
Description
TxIN
I
21
TTL level input.
TxOUT+
O
3
Positive LVDS differential data output.
TxOUT−
O
3
Negative LVDS differential data output.
TxCLK IN
I
1
TTL level clock input. The rising edge acts as data strobe. Pin name TxCLK IN.
TxCLK OUT+
O
1
Positive LVDS differential clock output.
TxCLK OUT−
O
1
Negative LVDS differential clock output.
PWR DWN
I
1
TTL level input. Assertion (low input) TRI-STATEs the outputs, ensuring low current at power
down.
V CC
I
4
Power supply pins for TTL inputs.
GND
I
5
Ground pins for TTL inputs.
PLL V CC
I
1
Power supply pins for PLL.
PLL GND
I
2
Ground pins for PLL.
LVDS V CC
I
1
Power supply pin for LVDS outputs.
LVDS GND
I
3
Ground pins for LVDS outputs.
DS90CR216 Pin Descriptions — Channel Link Receiver
Pin Name
RxIN+
I/O
No.
I
3
Description
Positive LVDS differential data inputs.
RxIN−
I
3
Negative LVDS differential data inputs.
RxOUT
O
21
TTL level data outputs.
RxCLK IN+
I
1
Positive LVDS differential clock input.
RxCLK IN−
I
1
Negative LVDS differential clock input.
13
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DS90CR215/DS90CR216
Applications Information
(Continued)
DS90CR216 Pin Descriptions — Channel Link Receiver (Continued)
I/O
No.
RxCLK OUT
Pin Name
O
1
TTL level clock output. The rising edge acts as data strobe. Pin name RxCLK OUT.
Description
PWR DWN
I
1
TTL level input. When asserted (low input) the receiver outputs are low.
V CC
I
4
Power supply pins for TTL outputs.
GND
I
5
Ground pins for TTL outputs.
PLL V CC
I
1
Power supply for PLL.
PLL GND
1
2
Ground pin for PLL.
LVDS V CC
I
1
Power supply pin for LVDS inputs.
LVDS GND
I
3
Ground pins for LVDS inputs.
The Channel Link devices are intended to be used in a wide
variety of data transmission applications. Depending upon
the application the interconnecting media may vary. For
example, for lower data rate (clock rate) and shorter cable
lengths ( < 2m), the media electrical performance is less
critical. For higher speed/long distance applications the media’s performance becomes more critical. Certain cable constructions provide tighter skew (matched electrical length
between the conductors and pairs). Twin-coax for example,
has been demonstrated at distances as great as 5 meters
and with the maximum data transfer of 1.38 Gbit/s. Additional applications information can be found in the following
National Interface Application Notes:
AN = ####
also employ an overall shield surrounding all cable pairs
regardless of the cable type. This overall shield results in
improved transmission parameters such as faster attainable
speeds, longer distances between transmitter and receiver
and reduced problems associated with EMS or EMI.
The high-speed transport of LVDS signals has been demonstrated on several types of cables with excellent results.
However, the best overall performance has been seen when
using Twin-Coax cable. Twin-Coax has very low cable skew
and EMI due to its construction and double shielding. All of
the design considerations discussed here and listed in the
supplemental application notes provide the subsystem communications designer with many useful guidelines. It is recommended that the designer assess the tradeoffs of each
application thoroughly to arrive at a reliable and economical
cable solution.
Topic
AN-1041
Introduction to Channel Link
AN-1035
PCB Design Guidelines for LVDS and
Link Devices
AN-806
Transmission Line Theory
AN-905
Transmission Line Calculations and
Differential Impedance
AN-916
Cable Information
BOARD LAYOUT
To obtain the maximum benefit from the noise and EMI
reductions of LVDS, attention should be paid to the layout of
differential lines. Lines of a differential pair should always be
adjacent to eliminate noise interference from other signals
and take full advantage of the noise canceling of the differential signals. The board designer should also try to maintain
equal length on signal traces for a given differential pair. As
with any high speed design, the impedance discontinuities
should be limited (reduce the numbers of vias and no 90
degree angles on traces). Any discontinuities which do occur
on one signal line should be mirrored in the other line of the
differential pair. Care should be taken to ensure that the
differential trace impedance match the differential impedance of the selected physical media (this impedance should
also match the value of the termination resistor that is connected across the differential pair at the receiver’s input).
Finally, the location of the CHANNEL LINK TxOUT/RxIN pins
should be as close as possible to the board edge so as to
eliminate excessive pcb runs. All of these considerations will
limit reflections and crosstalk which adversely effect high
frequency performance and EMI.
CABLES
A cable interface between the transmitter and receiver needs
to support the differential LVDS pairs. The 21-bit CHANNEL
LINK chipset (DS90CR215/216) requires four pairs of signal
wires and the 28-bit CHANNEL LINK chipset (DS90CR285/
286) requires five pairs of signal wires. The ideal cable/
connector interface would have a constant 100Ω differential
impedance throughout the path. It is also recommended that
cable skew remain below 150 ps (@ 66 MHz clock rate) to
maintain a sufficient data sampling window at the receiver.
In addition to the four or five cable pairs that carry data and
clock, it is recommended to provide at least one additional
conductor (or pair) which connects ground between the
transmitter and receiver. This low impedance ground provides a common mode return path for the two devices. Some
of the more commonly used cable types for point-to-point
applications include flat ribbon, flex, twisted pair and TwinCoax. All are available in a variety of configurations and
options. Flat ribbon cable, flex and twisted pair generally
perform well in short point-to-point applications while TwinCoax is good for short and long applications. When using
ribbon cable, it is recommended to place a ground line
between each differential pair to act as a barrier to noise
coupling between adjacent pairs. For Twin-Coax cable applications, it is recommended to utilize a shield on each
cable pair. All extended point-to-point applications should
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UNUSED INPUTS
All unused inputs at the TxIN inputs of the transmitter must
be tied to ground. All unused outputs at the RxOUT outputs
of the receiver must then be left floating.
TERMINATION
Use of current mode drivers requires a terminating resistor
across the receiver inputs. The CHANNEL LINK chipset will
normally require a single 100Ω resistor between the true and
complement lines on each differential pair of the receiver
input. The actual value of the termination resistor should be
14
as PECL. Surface mount resistors are recommended to
avoid the additional inductance that accompanies leaded
resistors. These resistors should be placed as close as
possible to the receiver input pins to reduce stubs and
effectively terminate the differential lines.
(Continued)
selected to match the differential mode characteristic impedance (90Ω to 120Ω typical) of the cable. Figure 19 shows an
example. No additional pull-up or pull-down resistors are
necessary as with some other differential technologies such
01290924
FIGURE 19. LVDS Serialized Link Termination
nect skew (∆t of one differential pair to another) and clock
jitter will all reduce the available window for sampling the
LVDS serial data streams. Care must be taken to ensure that
the clock input to the transmitter be a clean low noise signal.
Individual bypassing of each VCC to ground will minimize the
noise passed on to the PLL, thus creating a low jitter LVDS
clock. These measures provide more margin for channel-tochannel skew and interconnect skew as a part of the overall
jitter/skew budget.
DECOUPLING CAPACITORS
Bypassing capacitors are needed to reduce the impact of
switching noise which could limit performance. For a conservative approach three parallel-connected decoupling capacitors (Multi-Layered Ceramic type in surface mount form factor) between each VCC and the ground plane(s) are
recommended. The three capacitor values are 0.1 µF,
0.01µF and 0.001 µF. An example is shown in Figure 20. The
designer should employ wide traces for power and ground
and ensure each capacitor has its own via to the ground
plane. If board space is limiting the number of bypass capacitors, the PLL VCC should receive the most filtering/
bypassing. Next would be the LVDS VCC pins and finally the
logic VCC pins.
COMMON MODE vs. DIFFERENTIAL MODE NOISE
MARGIN
The typical signal swing for LVDS is 300 mV centered at
+1.2V. The CHANNEL LINK receiver supports a 100 mV
threshold therefore providing approximately 200 mV of differential noise margin. Common mode protection is of more
importance to the system’s operation due to the differential
data transmission. LVDS supports an input voltage range of
Ground to +2.4V. This allows for a ± 1.0V shifting of the
center point due to ground potential differences and common
mode noise.
POWER SEQUENCING AND POWERDOWN MODE
Outputs of the CNANNEL LINK transmitter remain in TRISTATE until the power supply reaches 2V. Clock and data
outputs will begin to toggle 10 ms after VCC has reached 3V
and the Powerdown pin is above 1.5V. Either device may be
placed into a powerdown mode at any time by asserting the
Powerdown pin (active low). Total power dissipation for each
device will decrease to 5 µW (typical).
The CHANNEL LINK chipset is designed to protect itself
from accidental loss of power to either the transmitter or
receiver. If power to the transmit board is lost, the receiver
clocks (input and output) stop. The data outputs (RxOUT)
retain the states they were in when the clocks stopped.
When the receiver board loses power, the receiver inputs are
shorted to V CC through an internal diode. Current is limited
(5 mA per input) by the fixed current mode drivers, thus
avoiding the potential for latchup when powering the device.
01290925
FIGURE 20. CHANNEL LINK
Decoupling Configuration
CLOCK JITTER
The CHANNEL LINK devices employ a PLL to generate and
recover the clock transmitted across the LVDS interface. The
width of each bit in the serialized LVDS data stream is
one-seventh the clock period. For example, a 66 MHz clock
has a period of 15 ns which results in a data bit width of 2.16
ns. Differential skew (∆t within one differential pair), intercon-
15
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DS90CR215/DS90CR216
Applications Information
DS90CR215/DS90CR216
Applications Information
(Continued)
01290926
FIGURE 21. Single-Ended and Differential Waveforms
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16
inches (millimeters) unless otherwise noted
Order Number DS90CR215MTD or DS90CR216MTD
NS Package Number MTD48
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
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DS90CR215/DS90CR216 +3.3V Rising Edge Data Strobe LVDS 21-Bit Channel Link-66 MHz
Physical Dimensions