NSC LM7332MM

LM7332 Dual Rail-to-Rail Input/Output
30V, Wide Voltage Range, High Output Operational
Amplifier
General Description
Features
The LM7332 is a dual rail-to-rail input and output amplifier with
a wide operating temperature range (−40°C to +125°C) which
meets the needs of automotive, industrial and power supply
applications. The LM7332 has the output current of 100 mA
which is higher than that of most monolithic op amps. Circuit
designs with high output current requirements often need to
use discrete transistors because many op amps have low
current output. The LM7332 has enough current output to
drive many loads directly, saving the cost and space of the
discrete transistors.
The exceptionally wide operating supply voltage range of
2.5V to 32V alleviates any concerns over functionality under
extreme conditions and offers flexibility of use in a multitude
of applications. Most of this device's parameters are insensitive to power supply variations; this design enhancement is
another step in simplifying usage. Greater than rail-to-rail input common mode voltage range allows operation in many
applications, including high side and low side sensing, without
exceeding the input range.
The LM7332 can drive unlimited capacitive loads without oscillations.
The LM7332 is offered in the 8-pin MSOP and SOIC packages.
(VS = ±15V, TA = 25°C, typical values unless specified.)
2.5V to 32V
■ Wide supply voltage range
0.3V beyond rails
■ Wide input common mode voltage
>100 mA
■ Output short circuit current
±70 mA
■ High output current (1V from rails)
21 MHz
■ GBWP
15.2 V/µs
■ Slew rate
Unlimited
■ Capacitive load tolerance
2.0 mA
■ Total supply current
−40°C to +125°C
■ Temperature range
■ Tested at −40°C, +125°C, and 25°C at 5V, ±5V, ±15V
Applications
■
■
■
■
■
■
■
■
MOSFET and power transistor driver
Replaces discrete transistors in high current output circuits
Instrumentation 4-20 mA current loops
Analog data transmission
Multiple voltage power supplies and battery chargers
High and low side current sensing
Bridge and sensor driving
Digital to analog converter output
Key Graphs
Output Swing vs. Sourcing Current
Large Signal Step Response for Various Capacitive Loads
20187534
20187518
© 2008 National Semiconductor Corporation
201875
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LM7332 Dual Rail-to-Rail Input/Output, 30V, Wide Voltage, Range High Output Operational
Amplifier
April 16, 2008
LM7332
Junction Temperature (Note 4)
Soldering Information:
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
ESD Tolerance (Note 2)
Human Body Model
Machine Model
VIN Differential
Output Short Circuit Duration
Supply Voltage (VS = V+ - V−)
Voltage at Input/Output pins
Storage Temperature Range
+150°C
Infrared or Convection (20 sec.)
Wave Soldering (10 sec.)
235°C
260°C
Operating Ratings
2 kV
200V
±10V
(Notes 3, 9)
35V
V+ +0.3V, V− −0.3V
Supply Voltage (VS = V+ - V−)
Temperature Range(Note 4)
2.5V to 32V
−40°C to +125°C
Package Thermal Resistance, θJA, (Note 4)
8-Pin MSOP
8-Pin SOIC
235°C/W
165°C/W
−65°C to +150°C
5V Electrical Characteristics
(Note 5)
Unless otherwise specified, all limits are guaranteed for TA = 25°C, V+ = 5V, V− = 0V, VCM = 0.5V, VO = 2.5V, and
RL > 1 MΩ to 2.5V. Boldface limits apply at the temperature extremes.
Symbol
Parameter
Condition
Min
(Note 7)
Typ
(Note 6)
Max
(Note 7)
−4
–5
±1.6
+4
+5
VOS
Input Offset Voltage
VCM = 0.5V and VCM = 4.5V
TC VOS
Input Offset Voltage
Temperature Drift
VCM = 0.5V and VCM = 4.5V
(Note 10)
IB
Input Bias Current
(Note 11)
IOS
Input Offset Current
CMRR
Common Mode Rejection Ratio 0V ≤ VCM ≤ 3V
67
65
80
0V ≤ VCM ≤ 5V
62
60
70
78
74
100
PSRR
Power Supply Rejection Ratio
5V ≤ V+ ≤ 30V
CMVR
Input Common Mode Voltage
Range
CMRR > 50 dB
AVOL
Large Signal Voltage Gain
−2.0
−2.5
0.5V ≤ VO ≤ 4.5V
Output Swing
High
Output Swing
Low
ISC
IOUT
Output Short Circuit Current
Output Current
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µV/°C
+2.0
+2.5
µA
20
250
300
nA
5.1
5.0
5.3
70
65
77
dB
dB
−0.1
0.0
60
150
200
RL = 2 kΩ to 2.5V
VID = 100 mV
100
300
350
RL = 10 kΩ to 2.5V
VID = −100 mV
5
150
200
RL = 2 kΩ to 2.5V
VID = −100 mV
20
300
350
Sourcing from V+, VID = 200 mV
(Note 9)
60
90
Sinking to V−, VID = −200 mV
(Note 9)
60
90
2
±55
V
dB
RL = 10 kΩ to 2.5V
VID = 100 mV
VID = ±200 mV, VO = 1V from rails
mV
±1.0
−0.3
RL = 10 kΩ to 2.5V
VO
±2
Units
mV from
either rail
mA
mA
Parameter
Condition
Min
(Note 7)
Typ
(Note 6)
Max
(Note 7)
2.3
2.6
Units
IS
Total Supply Current
No Load, VCM = 0.5V
1.5
SR
Slew Rate (Note 8)
AV = +1, VI = 5V Step, RL = 1 MΩ,
CL = 10 pF
12
V/µs
fu
Unity Gain Frequency
RL = 10 MΩ, CL = 20 pF
7.5
MHz
GBWP
Gain Bandwidth Product
f = 50 kHz
19.3
MHz
en
Input Referred Voltage Noise
f = 2 kHz
14.8
nV/
in
Input Referred Current Noise
f = 2 kHz
1.35
pA/
THD+N
Total Harmonic Distortion
+Noise
AV = +2, RL = 100 kΩ, f = 1 kHz,
VO = 4 VPP
−84
dB
CT Rej.
Crosstalk Rejection
f = 3 MHz, Driver RL = 10 kΩ
68
dB
mA
±5V Electrical Characteristics
(Note 5)
Unless otherwise specified, all limits are guaranteed for TA = 25°C, V+ = +5V, V− = −5V, VCM = 0V, VO = 0V, and
RL > 1 MΩ to 0V. Boldface limits apply at the temperature extremes.
Symbol
Parameter
Condition
Min
(Note 7)
Typ
(Note 6)
Max
(Note 7)
−4
−5
±1.6
+4
+5
VOS
Input Offset Voltage
VCM = −4.5V and VCM = 4.5V
TC VOS
Input Offset Voltage
Temperature Drift
VCM = −4.5V and VCM = 4.5V
(Note 10)
IB
Input Bias Current
(Note 11)
IOS
Input Offset Current
CMRR
Common Mode Rejection Ratio −5V ≤ VCM ≤ 3V
74
75
88
−5V ≤ VCM ≤ 5V
70
65
74
78
74
100
−2.0
−2.5
PSRR
Power Supply Rejection Ration 5V ≤ V+ ≤ 30V, VCM = −4.5V
CMVR
Input Common Mode Voltage
Range
AVOL
Large Signal Voltage Gain
CMRR > 50 dB
−4V ≤ VO ≤ 4V
Output Swing
High
Output Swing
Low
ISC
Output Short Circuit Current
µV/°C
+2.0
+2.5
µA
20
250
300
nA
5.1
5.0
5.3
72
70
80
dB
dB
−5.1
−5
75
250
300
RL = 2 kΩ to 0V
VID = 100 mV
125
350
400
RL = 10 kΩ to 0V
VID = −100 mV
10
250
300
RL = 2 kΩ to 0V
VID = −100 mV
30
350
400
Sourcing from V+, VID = 200 mV
(Note 9)
90
120
Sinking to V−, VID = −200 mV
(Note 9)
90
100
V
dB
RL = 10 kΩ to 0V
VID = 100 mV
3
mV
±1.0
−5.3
RL = 10 kΩ to 0V
VO
±2
Units
mV from
either rail
mA
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LM7332
Symbol
LM7332
Symbol
Parameter
Condition
Min
(Note 7)
Typ
(Note 6)
Max
(Note 7)
Units
IOUT
Output Current
VID = ±200 mV, VO = 1V from rails
±65
IS
Total Supply Current
No Load, VCM = −4.5V
1.5
mA
SR
Slew Rate
(Note 8)
AV = +1, VI = 8V Step, RL = 1 MΩ,
CL = 10 pF
13.2
V/µs
ROUT
Close Loop Output Resistance AV = +1, f = 100 kHz
3
Ω
fu
Unity Gain Frequency
RL = 10 MΩ, CL = 20 pF
7.9
MHz
GBWP
Gain Bandwidth Product
f = 50 kHz
19.9
MHz
en
Input Referred Voltage Noise
f = 2 kHz
14.7
nV/
in
Input Referred Current Noise
f = 2 kHz
1.3
pA/
THD+N
Total Harmonic Distortion
+Noise
AV = +2, RL = 100 kΩ, f = 1 kHz
VO = 8 VPP
−87
dB
CT Rej.
Crosstalk Rejection
f = 3 MHz, Driver RL = 10 kΩ
68
dB
2.4
2.6
mA
±15V Electrical Characteristics
(Note 5)
Unless otherwise specified, all limits are guaranteed for TA = 25°C, V+ = +15V, V− = −15V, VCM = 0V, VO = 0V, and
RL > 1 MΩ to 0V. Boldface limits apply at the temperature extremes.
Symbol
Parameter
Condition
Min
(Note 7)
Typ
(Note 6)
Max
(Note 7)
−5
−6
±2
+5
+6
VOS
Input Offset Voltage
VCM = −14.5V and VCM = 14.5V
TC VOS
Input Offset Voltage
Temperature Drift
VCM = −14.5V and VCM = 14.5V
(Note 10)
IB
Input Bias Current
(Note 11)
IOS
Input Offset Current
CMRR
Common Mode Rejection Ratio −15V ≤ VCM ≤ 12V
74
74
88
−15V ≤ VCM ≤ 15V
72
72
80
78
74
100
−2.0
−2.5
PSRR
Power Supply Rejection Ratio
−10V ≤ V+ ≤ 15V, VCM = −14.5V
CMVR
Input Common Mode Voltage
Range
CMRR > 50 dB
AVOL
Large Signal Voltage Gain
−14V ≤ VO ≤ 14V
Output Swing
High
Output Swing
Low
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µV/°C
+2.0
+2.5
µA
20
250
300
nA
15.1
15
15.3
72
70
80
dB
dB
−15.1
−15
V
dB
RL = 10 kΩ to 0V
VID = 100 mV
100
350
400
RL = 2 kΩ to 0V
VID = 100 mV
200
550
600
RL = 10 kΩ to 0V
VID = −100 mV
20
450
500
RL = 2 kΩ to 0V
VID = −100 mV
25
550
600
4
mV
±1.0
−15.3
RL = 10 kΩ to 0V
VO
±2
Units
mV from
either rail
ISC
Parameter
Output Short Circuit Current
Condition
Min
(Note 7)
Typ
(Note 6)
Sourcing from V+, VID = 200 mV
(Note 9)
140
Sinking to V−, VID = −200 mV
(Note 9)
140
Max
(Note 7)
Units
mA
IOUT
Output Current
VID = ±200 mV, VO = 1V from rails
±70
mA
IS
Total Supply Current
No Load, VCM = −14.5V
2.0
SR
Slew Rate
(Note 8)
AV = +1, VI = 20V Step, RL = 1 MΩ,
CL = 10 pF
15.2
V/µs
fu
Unity Gain Frequency
RL = 10 MΩ, CL = 20 pF
9
MHz
GBWP
Gain Bandwidth Product
f = 50 kHz
21
MHz
en
Input Referred Voltage Noise
f = 2 kHz
15.5
nV/
in
Input Referred Current Noise
f = 2 kHz
1
pA/
THD+N
Total Harmonic Distortion
+Noise
AV = +2, RL = 100 kΩ, f = 1 kHz
VO = 25 VPP
−93
dB
CT Rej.
Crosstalk Rejection
f = 3 MHz, Driver RL = 10 kΩ
68
dB
2.5
3.0
mA
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Rating indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)
Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 150°C.
Note 4: The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) –
TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.
Note 5: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating
of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ >
TA.
Note 6: Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will
also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
Note 7: All limits are guaranteed by testing or statistical analysis.
Note 8: Slew rate is the slower of the rising and falling slew rates. Connected as a Voltage Follower.
Note 9: Short circuit test is a momentary test. Output short circuit duration is infinite for VS ≤ 6V at room temperature and below. For VS > 6V, allowable short
circuit duration is 1.5 ms.
Note 10: Offset voltage temperature drift determined by dividing the change in VOS at temperature extremes into the total temperature change.
Note 11: Positive current corresponds to current flowing in the device.
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LM7332
Symbol
LM7332
Connection Diagrams
8-Pin MSOP
8-Pin SOIC
20187502
20187501
Top View
Top View
Ordering Information
Package
Part Number
Package Marking
LM7332MM
8-Pin MSOP
LM7332MME
AA5A
LM7332MMX
8-Pin SOIC
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LM7332MA
LM7332MAX
Transport Media
NSC Drawing
1k Unit Tape and Reel
250 Units Tape and Reel
MUA08A
3.5k Unit Tape and Reel
LM7332MA
6
95 Units/Rail
2.5k Unit Tape and Reel
M08A
LM7332
Typical Performance Characteristics
Unless otherwise specified, TA = 25°C.
VOS Distribution
VOS vs. VCM (Unit 1)
20187503
20187551
VOS vs. VCM (Unit 2)
VOS vs. VCM (Unit 3)
20187505
20187504
VOS vs. VCM (Unit 1)
VOS vs. VCM (Unit 2)
20187507
20187506
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LM7332
VOS vs. VCM (Unit 3)
VOS vs. VS (Unit 1)
20187508
20187524
VOS vs. VS (Unit 2)
VOS vs. VS (Unit 3)
20187525
20187526
IBIAS vs. VCM
IBIAS vs. Supply Voltage
20187527
20187528
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8
LM7332
IS vs. VCM
IS vs. VCM
20187514
20187515
IS vs. VCM
IS vs. Supply Voltage
20187512
20187516
IS vs. Supply Voltage
Output Swing vs. Sinking Current
20187530
20187513
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LM7332
Output Swing vs. Sinking Current
Output Swing vs. Sourcing Current
20187531
20187517
Output Swing vs. Sourcing Current
Positive Output Swing vs. Supply Voltage
20187522
20187518
Positive Output Swing vs. Supply Voltage
Negative Output Swing vs. Supply Voltage
20187519
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20187520
10
LM7332
Negative Output Swing vs. Supply Voltage
Open Loop Frequency Response with
Various Capacitive Loads
20187521
20187540
Open Loop Frequency Response with
Various Capacitive Loads
Open Loop Frequency Response with
Various Capacitive Loads
20187541
20187542
Open Loop Frequency Response vs. with
Various Resistive Loads
Open Loop Frequency Response vs. with
Various Supply Voltages
20187539
20187537
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LM7332
Open Loop Frequency Response at Various Temperatures
Phase Margin vs. Capacitive Load
20187543
20187538
Phase Margin vs. Capacitive Load
CMRR vs. Frequency
20187545
20187544
+PSRR vs. Frequency
−PSRR vs. Frequency
20187546
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20187547
12
LM7332
Step Response for Various Amplitudes
Step Response for Various Amplitudes
20187533
20187532
Large Signal Step Response for Various Capacitive Loads
Input Referred Noise Density vs. Frequency
20187534
20187548
Input Referred Noise Density vs. Frequency
Input Referred Noise Density vs. Frequency
20187549
20187550
13
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LM7332
THD+N vs. Output Amplitude (VPP)
THD+N vs. Output Amplitude (VPP)
20187552
20187553
THD+N vs. Output Amplitude (VPP)
Crosstalk vs. Frequency
20187536
20187554
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14
ADVANTAGES OF THE LM7332
Wide Operating Voltage Range
The LM7332 has an operating voltage from 2.5V to 32V which
makes it suitable for industrial and automotive applications.
RRIO with 100 mA Output Current
The LM7332 takes advantages of National Semiconductor’s
VIP3 process which enables high current driving from the
rails. Rail-to-rail output swing provides the maximum possible
output dynamic range. The LM7332 eliminates the need to
use extra transistors when driving large capacitive loads,
therefore reducing the application cost and space.
-40°C to 125°C Operating Temperature Range
The LM7332 has an operating temperature ranging from -40°
C to 125°C, which is Automotive Grade 1, and also meets
most industrial requirements.
SOIC and MSOP Packages
The LM7332 are offered in both the standard SOIC package
and the space saving MSOP package. Please refer to the
Physical Dimensions on page 17 for details.
OUTPUT VOLTAGE SWING CLOSE TO V−
The LM7332’s output stage design allows voltage swings to
within millivolts of either supply rail for maximum flexibility and
improved useful range. Because of this design architecture,
with output approaching either supply rail, the output transistor Collector-Base junction reverse bias will decrease. With
output less than a Vbe from either rail, the corresponding output transistor operates near saturation. In this mode of operation, the transistor will exhibit higher junction capacitance
and lower ft which will reduce phase margin. With the Noise
Gain (NG = 1 + RF/RG, RF and RG are external gain setting
resistors) of 2 or higher, there is sufficient phase margin that
this reduction in phase margin is of no consequence. However, with lower Noise Gain (<2) and with less than 150 mV
to the supply rail, if the output loading is light, the phase margin reduction could result in unwanted oscillations.
In the case of the LM7332, due to inherent architectural
specifics, the oscillation occurs only with respect to the output
transistor at V− when output swings to within 150 mV of V−.
However, if this output transistor's collector current is larger
than its idle value of a few microamps, the phase margin loss
becomes insignificant. In this case, 300 μA is the required
output transistor's collector current to remedy this situation.
Therefore, when all the aforementioned critical conditions are
present at the same time (NG < 2, VOUT < 150 mV from supply
rails, & output load is light) it is possible to ensure stability by
adding a load resistor to the output to provide the output transistor the necessary minimum collector current (300 μA).
For 12V (or ±6V) operation, for example, add a 39 kΩ resistor
from the output to V+ to cause 300 µA output sinking current
and ensure stability. This is equivalent to about 15% increase
in total quiescent power dissipation.
20187579
FIGURE 1. Settling Time and Slew Rate vs. Capacitive
Load
ESTIMATING THE OUTPUT VOLTAGE SWING
It is important to keep in mind that the steady state output
current will be less than the current available when there is
an input overdrive present. For steady state conditions, Figure 2 and Figure 3 plots can be used to predict the output
swing. These plots also show several load lines corresponding to loads tied between the output and ground. In each case,
the intersection of the device plot at the appropriate temperature with the load line would be the typical output swing
possible for that load. For example, a 600Ω load can accommodate an output swing to within 100 mV of V− and to 250
mV of V+ (VS = ±5V) corresponding to a typical 9.65 VPP unclipped swing.
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LM7332
DRIVING CAPACITIVE LOADS
The LM7332 is specifically designed to drive unlimited capacitive loads without oscillations. In addition, the output current handling capability of the device allows for good slewing
characteristics even with large capacitive loads as shown in
Figure 1. The combination of these features is ideal for applications such as TFT flat panel buffers, A/D converter input
amplifiers and power transistor driver.
However, as in most op amps, addition of a series isolation
resistor between the op amp and the capacitive load improves
the settling and overshoot performance.
Output current drive is an important parameter when driving
capacitive loads. This parameter will determine how fast the
output voltage can change. Referring to Figure 1, two distinct
regions can be identified. Below about 10,000 pF, the output
Slew Rate is solely determined by the op amp’s compensation
capacitor value and available current into that capacitor. Beyond 10 nF, the Slew Rate is determined by the op amp’s
available output current. An estimate of positive and negative
slew rates for loads larger than 100 nF can be made by dividing the short circuit current value by the capacitor.
Application Information
LM7332
offset, or the output AC average current is non-zero, or if the
op amp operates in a single supply application where the output is maintained somewhere in the range of linear operation.
Therefore:
PTOTAL = PQ + PDC + PAC
PQ = IS · VS
Op Amp Quiescent Power
Dissipation
DC Load Power
PDC = IO · (Vr - Vo)
PAC = See Table 1 below
AC Load Power
where:
IS: Supply Current
VS: Total Supply Voltage (V+ − V−)
VO: Average Output Voltage
Vr: V+ for sourcing and V− for sinking current
Table 1 below shows the maximum AC component of the load
power dissipated by the op amp for standard Sinusoidal, Triangular, and Square Waveforms:
20187590
FIGURE 2. Steady State Output Sourcing Characteristics
with Load Lines
TABLE 1. Normalized AC Power Dissipated in the Output
Stage for Standard Waveforms
PAC (W.Ω/V2)
Sinusoidal
Triangular
Square
50.7 x 10−3
46.9 x 10−3
62.5 x 10−3
The table entries are normalized to VS2/RL. To figure out the
AC load current component of power dissipation, simply multiply the table entry corresponding to the output waveform by
the factor VS2/RL. For example, with ±12V supplies, a 600Ω
load, and triangular waveform power dissipation in the output
stage is calculated as:
PAC = (46.9 x 10−3) · [242/600] = 45.0 mW
The maximum power dissipation allowed at a certain temperature is a function of maximum die junction temperature (TJ
(MAX)) allowed, ambient temperature TA, and package thermal
resistance from junction to ambient, θJA.
20187591
FIGURE 3. Steady State Output Sinking Characteristics
with Load Lines
OUTPUT SHORT CIRCUIT CURRENT AND DISSIPATION
ISSUES
The LM7332 output stage is designed for maximum output
current capability. Even though momentary output shorts to
ground and either supply can be tolerated at all operating
voltages, longer lasting short conditions can cause the junction temperature to rise beyond the absolute maximum rating
of the device, especially at higher supply voltage conditions.
Below supply voltage of 6V, the output short circuit condition
can be tolerated indefinitely.
With the op amp tied to a load, the device power dissipation
consists of the quiescent power due to the supply current flow
into the device, in addition to power dissipation due to the load
current. The load portion of the power itself could include an
average value (due to a DC load current) and an AC component. DC load current would flow if there is an output voltage
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For the LM7332, the maximum junction temperature allowed
is 150°C at which no power dissipation is allowed. The power
capability at 25°C is given by the following calculations:
For MSOP package:
For SOIC package:
16
For MSOP package:
APPLICATION HINTS ON SUPPLY DECOUPLING
The use of supply decoupling is mandatory in most applications. As with most relatively high speed/high output current
op amps, best results are achieved when each supply line is
decoupled with two capacitors; a small value ceramic capacitor (∼0.01 µF) placed very close to the supply lead in addition
to a large value Tantalum or Aluminum capacitor (> 4.7 µF).
The large capacitor can be shared by more than one device
if necessary. The small ceramic capacitor maintains low supply impedance at high frequencies while the large capacitor
will act as the charge “bucket” for fast load current spikes at
the op amp output. The combination of these capacitors will
provide supply decoupling and will help keep the op amp oscillation free under any load.
For SOIC package:
Figure 4 shows the power capability vs. temperature for
MSOP and SOIC packages. The area under the maximum
thermal capability line is the operating area for the device.
When the device works in the operating area where PTOTAL is
less than PD(MAX), the device junction temperature will remain
below 150°C. If the intersection of ambient temperature and
package power is above the maximum thermal capability line,
the junction temperature will exceed 150°C and this should
be strictly prohibited.
SIMILAR HIGH CURRENT OUTPUT DEVICES
The LM6172 has a higher GBW of 100 MHz and over 80 mA
of current output. There is also a single version, the LM6171.
The LM7372 has 120 MHz of GBW and 150 mA of current
output. The LM7372 is available in a small pin LLP package,
an 8-pin PSOP, and 16-pin SOIC packages with higher power
dissipation.
The LME49600 buffer has 250 mA of current out and a 110
MHz bandwidth. The LME49600 is available in a TO-263
package for higher power dissipation.
The LM7322 is a rail-to-rail input and output part with a slightly
higher GBW of 20 MHz. It has current capability of 40 mA
sourcing and 65 mA sinking, and can drive unlimited capacitive loads. The LM7322 is available in both MSOP and SOIC
packages.
Detailed information on these parts can be found at
www.national.com.
20187555
FIGURE 4. Power Capability vs. Temperature
17
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LM7332
When high power is required and ambient temperature can't
be reduced, providing air flow is an effective approach to reduce thermal resistance therefore to improve power capability.
Similarly, the power capability at 125°C is given by:
LM7332
Physical Dimensions inches (millimeters) unless otherwise noted
8-Pin MSOP
NS Package Number MUA08A
8-Pin SOIC
NS Package Number M08A
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18
LM7332
19
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LM7332 Dual Rail-to-Rail Input/Output, 30V, Wide Voltage, Range High Output Operational
Amplifier
Notes
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