IS62WV25616DALL/DBLL, IS65WV25616DBLL 256K x 16 LOW VOLTAGE, ULTRA LOW POWER CMOS STATIC SRAM JUNE 2013 FEATURES DESCRIPTION The ISSI IS62WV25616DALL and IS62/65WV25616DBLL • High-speed access time: 35, 45, 55 ns are high-speed, low power, 4M bit SRAMs organized as 256K words by 16 bits. It is fabricated using ISSI's highperformance CMOS technology.This highly reliable process coupled with innovative circuit design techniques, yields high-performance and low power consumption devices. • CMOS low power operation 30 mW (typical) operating 6 µW (typical) CMOS standby • TTL compatible interface levels • Single power supply 1.65V--2.2V Vdd (IS62WV25616DALL) 2.5V--3.6V Vdd (IS62/65WV25616DBLL) When CS1 is HIGH (deselected) or when CS2 is low (deselcted) or when CS1 is LOW, CS2 is HIGH and both LB and UB are HIGH, the device assumes a standby mode at which the power dissipation can be reduced down with CMOS input levels. Easy memory expansion is provided by using Chip Enable and Output Enable inputs.The active LOW Write Enable (WE) controls both writing and reading of the memory. A data byte allows Upper Byte (UB) and Lower Byte (LB) access. • Fully static operation: no clock or refresh required • Three state outputs • Data control for upper and lower bytes • Industrial and Automotive temperature support • Lead-free available The IS62WV25616DALL and IS62/65WV25616DBLL are packaged in the JEDEC standard 44-Pin TSOP (TYPE II) and 48-pin mini BGA (6mmx8mm). • 2 CS option available FUNCTIONAL BLOCK DIAGRAM A0-A17 DECODER 256K x 16 MEMORY ARRAY I/O DATA CIRCUIT COLUMN I/O VDD GND I/O0-I/O7 Lower Byte I/O8-I/O15 Upper Byte CS2 CS1 OE WE UB LB CONTROL CIRCUIT Copyright © 2013 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc. — www.issi.com 1 Rev. D 06/19/2013 IS62WV25616DALL/DBLL, IS65WV25616DBLL PIN CONFIGURATIONS 48- ball mini BGA (6mm x 8mm) (Package Code B) 44-Pin mini TSOP (Type II) (Package Code T) 1 2 3 4 5 6 A LB OE A0 A1 A2 NC B I/O8 UB A3 A4 CSI I/O0 C I/O9 I/O10 A5 A6 I/O1 I/O2 D GND I/O11 A17 A7 I/O3 VDD E VDD I/O12 NC A16 I/O4 GND F I/O14 I/O13 A14 A15 I/O5 I/O6 G I/O15 NC A12 A13 WE I/O7 H NC A8 A9 A10 A11 NC A4 A3 A2 A1 A0 CS1 I/O0 I/O1 I/O2 I/O3 VDD GND I/O4 I/O5 I/O6 I/O7 WE A16 A15 A14 A13 A12 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 A5 A6 A7 OE UB LB I/O15 I/O14 I/O13 I/O12 GND VDD I/O11 I/O10 I/O9 I/O8 NC A8 A9 A10 A11 A17 48-Pin mini BGA (6mm x 8mm)* 2 CS Option (Package Code B2) 1 2 3 4 5 6 A LB OE A0 A1 A2 CS2 B I/O8 UB A3 A4 CS1 I/O0 C I/O9 I/O10 A5 A6 I/O1 I/O2 D GND I/O11 A17 A7 I/O3 VDD E VDD I/O12 NC A16 I/O4 GND F I/O14 I/O13 A14 A15 I/O5 I/O6 G I/O15 NC A12 A13 WE I/O7 H NC A8 A9 A10 A11 NC PIN DESCRIPTIONS A0-A17 I/O0-I/O15 CS1, CS2 OE WE LB UB NC Vdd GND Address Inputs Data Inputs/Outputs Chip Enable Input Output Enable Input Write Enable Input Lower-byte Control (I/O0-I/O7) Upper-byte Control (I/O8-I/O15) No Connection Power Ground *Available upon request 2 Integrated Silicon Solution, Inc. — www.issi.com Rev. D 06/19/2013 IS62WV25616DALL/DBLL, IS65WV25616DBLL TRUTH TABLE I/O PIN Mode WE CS1CS2 OE LBUB I/O0-I/O7 I/O8-I/O15Vdd Current Not Selected X H X X X X High-Z High-Z Isb1, Isb2 X X L X X X High-Z High-Z Isb1, Isb2 X X X X H H High-Z High-Z Isb1, Isb2 Output Disabled H L H H L X High-Z High-Z Icc H L H H X L High-Z High-Z Icc Read H L H L L H Dout High-ZIcc H L H L H L High-Z Dout H L H L L LDoutDout Write L L H X L H Din High-ZIcc L L H X H L High-Z Din L L H X L LDinDin ABSOLUTE MAXIMUM RATINGS(1) SymbolParameter Vterm Terminal Voltage with Respect to GND Vdd Vdd Relates to GND Tstg Storage Temperature Pt Power Dissipation Value –0.5 to Vdd + 0.5 –0.3 to 4.0 –65 to +150 1.0 Unit V V °C W Notes: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. CAPACITANCE(1,2) Symbol Cin CI/O Parameter Input Capacitance Input/Output Capacitance Conditions Vin = 0V Vout = 0V Max. 6 8 Unit pF pF Notes: 1. Tested initially and after any design or process changes that may affect these parameters. 2. Test conditions: Ta = 25°C, f = 1 MHz, Vdd = 3.3V. Integrated Silicon Solution, Inc. — www.issi.com 3 Rev. D 06/19/2013 IS62WV25616DALL/DBLL, IS65WV25616DBLL AC TEST CONDITIONS Parameter Input Pulse Level Input Rise and Fall Times Input and Output Timing and Reference Level (VRef) Output Load R1 ( Ω ) R2 ( Ω ) Vtm (V) Unit (2.3V-3.6V) 0.4V to Vdd - 0.3V 1V/ ns VDD /2 Unit Unit (3.3V + 5%) (1.65V-2.2V) 0.4V to Vdd - 0.3V 0.4V to Vdd - 0.3V 1V/ ns 1V/ ns VDD + 0.05 0.9V 2 See Figures 1 and 2 See Figures 1 and 2 See Figures 1 and 2 1005 121313500 820 137810800 3.0V 3.3V 1.8V AC TEST LOADS R1 R1 VTM VTM OUTPUT OUTPUT 30 pF Including jig and scope Figure 1. 4 R2 5 pF Including jig and scope R2 Figure 2. Integrated Silicon Solution, Inc. — www.issi.com Rev. D 06/19/2013 IS62WV25616DALL/DBLL, IS65WV25616DBLL DC ELECTRICAL CHARACTERISTICS (Over Operating Range) Vdd = 3.3V + 5% Symbol Voh Vol Vih Vil Ili Ilo Parameter Test Conditions Output HIGH Voltage Vdd = Min., Ioh = –1 mA Output LOW Voltage Vdd = Min., Iol = 2.1 mA Input HIGH Voltage Input LOW Voltage(1) Input Leakage GND ≤ Vin ≤ Vdd Output Leakage GND ≤ Vout ≤ Vdd, Outputs Disabled Min. 2.4 — 2 –0.3 –1 –1 Max. — 0.4 Vdd + 0.3 0.8 1 1 Unit V V V V µA µA Max. — 0.4 Vdd + 0.3 0.8 1 1 Unit V V V V µA µA Note: 1. Vil (min.) = –0.3V DC; Vil (min.) = –2.0V AC (pulse width < 10 ns). Not 100% tested. Vih (max.) = Vdd + 0.3V DC; Vih (max.) = Vdd + 2.0V AC (pulse width < 10 ns). Not 100% tested. DC ELECTRICAL CHARACTERISTICS (Over Operating Range) Vdd = 2.3V-3.6V Symbol Voh Vol Vih Vil Ili Ilo Parameter Test Conditions Output HIGH Voltage Vdd = Min., Ioh = –1.0 mA Output LOW Voltage Vdd = Min., Iol = 2.1 mA Input HIGH Voltage Input LOW Voltage(1) Input Leakage GND ≤ Vin ≤ Vdd Output Leakage GND ≤ Vout ≤ Vdd, Outputs Disabled Min. 1.8 — 2.0 –0.3 –1 –1 Note: 1. Vil (min.) = –0.3V DC; Vil (min.) = –2.0V AC (pulse width < 10 ns). Not 100% tested. Vih (max.) = Vdd + 0.3V DC; Vih (max.) = Vdd + 2.0V AC (pulse width < 10 ns). Not 100% tested. DC ELECTRICAL CHARACTERISTICS (Over Operating Range) Vdd = 1.65V-2.2V Symbol Voh Vol Vih Vil(1) Ili Ilo Parameter Test Conditions Vdd Output HIGH Voltage Ioh = -0.1 mA 1.65-2.2V Output LOW Voltage Iol = 0.1 mA 1.65-2.2V Input HIGH Voltage 1.65-2.2V Input LOW Voltage 1.65-2.2V Input Leakage GND ≤ Vin ≤ Vdd Output Leakage GND ≤ Vout ≤ Vdd, Outputs Disabled Min.Max.Unit 1.4 — V — 0.2 V 1.4 Vdd + 0.2 V –0.2 0.4 V –1 1 µA –1 1 µA Note: 1. Vil (min.) = –0.3V DC; Vil (min.) = –2.0V AC (pulse width < 10 ns). Not 100% tested. Vih (max.) = Vdd + 0.3V DC; Vih (max.) = Vdd + 2.0V AC (pulse width < 10 ns). Not 100% tested. Integrated Silicon Solution, Inc. — www.issi.com 5 Rev. D 06/19/2013 IS62WV25616DALL/DBLL, IS65WV25616DBLL OPERATING RANGE (Vdd) Range Ambient Temperature Commercial 0°C to +70°C Industrial –40°C to +85°C Automotive –40°C to +125°C Vdd 1.65V-2.2V 1.65V-2.2V 1.65V-2.2V Speed 45ns 55ns 55ns OPERATING RANGE (Vdd) Range Ambient Temperature Commercial 0°C to +70°C Industrial –40°C to +85°C Automotive (A1) –40°C to +85°C Vdd (45 ns) 2.3V-3.6V 2.3V-3.6V 2.3V-3.6V Vdd (35 ns) 3.3V+5% 3.3V+5% 3.3V+5% OPERATING RANGE (Vdd) Range Ambient Temperature Automotive (A3) –40°C to +125°C Vdd (45 ns) 2.3V-3.6V POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range) -35 -45 -55 Symbol Parameter Test Conditions Min.Max. Min.Max. Min.Max. Unit Icc Vdd Dynamic Operating Vdd = Max., Com. — 20 — 15 — 15 mA Supply Current Iout = 0 mA, f = fmax Ind./Auto A1 — 25 — 18 — 15 CE = Vil Auto. A3 — 30 — 25 — 25 Vin ≥ Vdd – 0.3V, ortyp.(2) 10 Vin ≤ 0.4V Icc1 Operating Vdd = Max., Com. — 3 — 3 — 3 mA Supply Current Iout = 0 mA, f = 0 Ind./Auto A1 — 3 — 3 — 3 CE = Vil Auto. A3 — 3 — 3 — 3 Vin ≥ Vdd – 0.3V, or Vin ≤ 0.4V Isb2 CMOS Standby Vdd = Max., Com. — 5 — 5 — 5 µA Current (CMOS Inputs) CS1 ≥ Vdd – 0.2V, Ind./Auto A1 — 10 — 10 — 10 CS2 ≤ 0.2V, Auto. A3 —30 — 30 — 30 Vin ≥ Vdd – 0.2V, or typ.(2) 2 Vin ≤ 0.2V, f = 0 OR ULB Control Vdd = Max., CS1 = Vil, CS2=Vih Vin ≤ 0.2V, f = 0; UB / LB = Vdd – 0.2V Note: 1. At f = fmax, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change. 2. Typical values are measured at Vdd = 3.0V, Ta = 25oC and not 100% tested. 6 Integrated Silicon Solution, Inc. — www.issi.com Rev. D 06/19/2013 IS62WV25616DALL/DBLL, IS65WV25616DBLL READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range) Symbol trc taa toha tacs1/tacs2 tdoe thzoe(2) tlzoe(2) thzcs1/thzcs2(2) tlzcs1/tlzcs2(2) Parameter Read Cycle Time Address Access Time Output Hold Time CS1/CS2 Access Time OE Access Time OE to High-Z Output OE to Low-Z Output CS1/CS2 to High-Z Output CS1/CS2 to Low-Z Output 35 ns Min.Max. 35 — — 35 10 — — 35 — 10 0 10 3 — 0 10 5 — 45 ns Min.Max. 45 — — 45 10 — — 45 — 20 0 15 5 — 0 15 5 — 55 ns Min. Max. 55 — — 55 10 — — 55 — 25 0 20 5 — 0 20 10 — tba LB, UB Access Time — 35 — 45 — 55 ns thzb LB, UB to High-Z Output 0 15 0 15 0 20 ns tlzb LB, UB to Low-Z Output 0 — 0 — 0 — ns Unit ns ns ns ns ns ns ns ns ns Notes: 1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 0.9V/1.5V, input pulse levels of 0.4 to Vdd-0.2V/Vdd-0.3V and output loading specified in Figure 1. 2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested. Integrated Silicon Solution, Inc. — www.issi.com 7 Rev. D 06/19/2013 IS62WV25616DALL/DBLL, IS65WV25616DBLL AC WAVEFORMS READ CYCLE NO. 1(1,2) (Address Controlled) (CS1 = OE = Vil, CS2 = WE = Vih, UB or LB = Vil) tRC ADDRESS tAA tOHA tOHA DOUT DATA VALID PREVIOUS DATA VALID AC WAVEFORMS READ CYCLE NO. 2(1,3)(CS1, CS2, OE, AND UB/LB Controlled) tRC ADDRESS tAA tOHA OE tHZOE tDOE CS1 tLZOE tACE1/tACE2 CS2 tLZCE1/ tLZCE2 tHZCS1/ tHZCS2 LB, UB tLZB DOUT tBA tHZB HIGH-Z DATA VALID Notes: 1. WE is HIGH for a Read Cycle. 2. The device is continuously selected. OE, CS1, UB, or LB = Vil. CS2=WE=Vih. 3. Address is valid prior to or coincident with CS1 LOW transition. 8 Integrated Silicon Solution, Inc. — www.issi.com Rev. D 06/19/2013 IS62WV25616DALL/DBLL, IS65WV25616DBLL WRITE CYCLE SWITCHING CHARACTERISTICS(1,2) (Over Operating Range) Symbol Parameter 35 ns Min. Max. 45 ns Min. Max. 55 ns Min. Max. Unit twcWrite Cycle Time 35 — 45 — 55 — ns tscs1/tscs2 CS1/CS2 to Write End 25 — 35 — 45 — ns taw Address Setup Time to Write End 25 — 35 — 45 — ns tha Address Hold from Write End 0 — 0 — 0 — ns tsa Address Setup Time 0 — 0 — 0 — ns tpwb LB, UB Valid to End of Write 25 — 35 — 45 — ns tpwe WE Pulse Width 25 — 35 — 40 — ns tsd Data Setup to Write End 20 — 20 — 25 — ns thd Data Hold from Write End 0 — 0 — 0 — ns (3) thzwe WE LOW to High-Z Output — 10 — 20 — 20 ns tlzwe WE HIGH to Low-Z Output 3 — 5 — 5 — ns (3) Notes: 1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 0.9V/1.5V, input pulse levels of 0.4V to Vdd-0.2V/Vdd-0.3V and output loading specified in Figure 1. 2. The internal write time is defined by the overlap of CS1 LOW, CS2 HIGH and UB or LB, and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the write. 3. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested. Integrated Silicon Solution, Inc. — www.issi.com 9 Rev. D 06/19/2013 IS62WV25616DALL/DBLL, IS65WV25616DBLL AC WAVEFORMS WRITE CYCLE NO. 1(1,2) (CS1 Controlled, OE = HIGH or LOW) tWC ADDRESS tHA tSCS1 CS1 tSCS2 CS2 tAW tPWE WE tPWB LB, UB tSA DOUT DATA UNDEFINED tHZWE tLZWE HIGH-Z tSD DIN tHD DATA-IN VALID Notes: 1. WRITE is an internally generated signal asserted during an overlap of the LOW states on the CS1 , CS2 and WE inputs and at least one of the LB and UB inputs being in the LOW state. 2. WRITE = (CS1) [ (LB) = (UB) ] (WE). 10 Integrated Silicon Solution, Inc. — www.issi.com Rev. D 06/19/2013 IS62WV25616DALL/DBLL, IS65WV25616DBLL AC WAVEFORMS WRITE CYCLE NO. 2 (WE Controlled: OE is HIGH During Write Cycle) tWC ADDRESS OE tHA tSCS1 CS1 tSCS2 CS2 tAW t PWE WE LB, UB tSA DOUT DATA UNDEFINED tHZWE tLZWE HIGH-Z tSD DIN tHD DATA-IN VALID Integrated Silicon Solution, Inc. — www.issi.com 11 Rev. D 06/19/2013 IS62WV25616DALL/DBLL, IS65WV25616DBLL AC WAVEFORMS WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle) tWC ADDRESS OE tHA tSCS1 CS1 tSCS2 CS2 tAW t PWE WE LB, UB tSA DOUT DATA UNDEFINED tHZWE tLZWE HIGH-Z tSD DIN 12 tHD DATA-IN VALID Integrated Silicon Solution, Inc. — www.issi.com Rev. D 06/19/2013 IS62WV25616DALL/DBLL, IS65WV25616DBLL AC WAVEFORMS WRITE CYCLE NO. 4 (UB/LB Controlled) t WC ADDRESS t WC ADDRESS 1 ADDRESS 2 OE t SA CS1 LOW CS2 HIGH t HA t SA WE UB, LB t HA t PBW t PBW WORD 1 WORD 2 t HZWE DOUT t LZWE HIGH-Z DATA UNDEFINED t HD t SD DIN DATAIN VALID t HD t SD DATAIN VALID UB_CSWR4.eps Integrated Silicon Solution, Inc. — www.issi.com 13 Rev. D 06/19/2013 IS62WV25616DALL/DBLL, IS65WV25616DBLL DATA RETENTION SWITCHING CHARACTERISTICS Symbol Parameter Test Condition Min. VdrVdd for Data Retention See Data Retention Waveform 1.2 Idr Data Retention Current Vdd = 1.2V, CS1 ≥ Vdd – 0.2V Com. — Ind. — Auto. — typ.(1)1 tsdr Data Retention Setup Time See Data Retention Waveform 0 — trdr Recovery Time See Data Retention Waveform trc — o Note: 1. Typical values are measured at Vdd = 3.0V, Ta = 25 C and not 100% tested. Max. 3.6 3 7 20 Unit V µA ns ns DATA RETENTION WAVEFORM (CS1 Controlled) Data Retention Mode tSDR tRDR VDD VDR CS1 ≥ VDD - 0.2V CS1 GND DATA RETENTION WAVEFORM (CS2 Controlled) Data Retention Mode VDD CE2 tSDR tRDR VDR 0.4V CS2 ≤ 0.2V GND 14 Integrated Silicon Solution, Inc. — www.issi.com Rev. D 06/19/2013 IS62WV25616DALL/DBLL, IS65WV25616DBLL ORDERING INFORMATION IS62WV25616DALL (1.65V-2.2V) Commercial Range: 0°C to +70°C Speed (ns) 70 Order Part No. IS62WV25616DALL-55TL Package TSOP, Lead-free Industrial Range: –40°C to +85°C Speed (ns) 55 55 Order Part No. IS62WV25616DALL-55TI IS62WV25616DALL-55TLI IS62WV25616DALL-55BI IS62WV25616DALL-55BLI Package TSOP TSOP, Lead-free mini BGA (6mmx8mm) mini BGA (6mmx8mm), Lead-free IS62WV25616DBLL (2.3V - 3.6V) Industrial Range: –40°C to +85°C Speed (ns) 45 45 55 Order Part No. IS62WV25616DBLL-45TI IS62WV25616DBLL-45TLI IS62WV25616DBLL-45BI IS62WV25616DBLL-45BLI IS62WV25616DBLL-55TLI Package TSOP TSOP, Lead-free mini BGA (6mmx8mm) mini BGA (6mmx8mm), Lead-free TSOP, Lead-free IS65WV25616DBLL (2.3V - 3.6V) Automotive (A1) Range: –40°C to +85°C Speed (ns) 45 Order Part No. Package IS65WV25616DBLL-45CTLA1 TSOP, Lead-free, Copper Leadframe Automotive (A3) Range: –40°C to +125°C Speed (ns) 55 Order Part No. Package IS65WV25616DBLL-55CTLA3 TSOP, Lead-free, Copper Leadframe Integrated Silicon Solution, Inc. — www.issi.com 15 Rev. D 06/19/2013 16 Θ Package Outline 06/04/2008 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION. 2. DIMENSION D AND E1 DO NOT INCLUDE MOLD PROTRUSION. 1. CONTROLLING DIMENSION : MM NOTE : Θ IS62WV25616DALL/DBLL, IS65WV25616DBLL Integrated Silicon Solution, Inc. — www.issi.com Rev. D 06/19/2013 08/12/2008 Package Outline 1. CONTROLLING DIMENSION : MM . 2. Reference document : JEDEC MO-207 NOTE : IS62WV25616DALL/DBLL, IS65WV25616DBLL Integrated Silicon Solution, Inc. — www.issi.com 17 Rev. D 06/19/2013