CPC2014N

CPC2014N
60V Dual Normally-Open Single-Pole
8-Pin SOIC OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
LED Current to operate
Rating
60
400
2
2
Units
VP
mArms / mADC

mA
Features
• Designed for use in Security Systems Complying
with EN50130-4
• 1500Vrms Input/Output Isolation
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Immune to Radiated EM Fields
• Wave Solderable
• Tape & Reel Version Available
• Small 8-Pin SOIC Package
Description
The CPC2014N is a miniature device with two
independent normally-open (1-Form-A) solid state
relays in an 8-pin SOIC package that employs
optically coupled MOSFET technology to provide
1500Vrms of input to output isolation.
Optically coupled outputs that use the patented
OptoMOS architecture are controlled by a highly
efficient infrared LED.
The CPC2014N uses IXYS Integrated Circuits
Division’s state of the art, double-molded vertical
construction packaging to produce one of the world’s
smallest relays. The CPC2014N offers substantial
board space savings over the competitor’s larger 8-pin
SOIC relay.
Approvals
Applications
• Security
• Passive Infrared Detectors (PIR)
• Data Signalling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Medical Equipment—Patient/Equipment Isolation
• Aerospace
• Industrial Controls
• UL Recognized Component: File E76270
• CSA Approval Pending
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 13 12 82667 003
Ordering Information
Part #
CPC2014N
CPC2014NTR
Description
8-Pin SOIC (50/tube)
8-Pin SOIC (2000/reel)
Pin Configuration
8
1
+ Control
Load
7
2
– Control
Load
6
3
+ Control
Load
4
5
– Control
Load
Switching Characteristics
of Normally-Open (Form A) Devices
Form-A
IF
90%
10%
ILOAD
ton
DS-CPC2014N-R04
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1
INTEGRATED CIRCUITS DIVISION
CPC2014N
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
Total Power Dissipation 1
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Ratings
60
5
50
1
70
600
1500
-40 to +85
-40 to +125
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Typical values are characteristic of the device at +25ºC, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
Derate linearly 5mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous 1
Peak
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Capacitance, Input to Output
Input Characteristics
Input Control Current to Activate 3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
1
2
3
2
Conditions
Symbol
Min
Typ
Max
Units
IF=2mA
t <10ms
IL=400mA
VL=60VP
IL
ILPK
RON
ILEAK
-
-
400
±1
2
1
mArms / mADC
AP

IF=0mA, VL=50V, f=1MHz
VIO=0V, f=1MHz
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COUT
CIO
-
0.47
0.22
25
1
2
1
-
IL=400mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.1
0.9
-
0.25
0.2
1.2
-
2
1.4
10
IF=5mA, VL=10V
µA
ms
pF
pF
mA
mA
V
µA
Load current derates linearly from 400mA @ 25oC to 200mA @80oC, and must be derated for both poles operating simultaneously.
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 4mA is recommended.
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INTEGRATED CIRCUITS DIVISION
CPC2014N
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)*
15
10
5
15
10
5
20
15
10
5
1.255 1.260 1.265 1.270
LED Forward Voltage (V)
Typical IF for Switch Operation
(N=50, IL=400mA)
25
0
0.35
1.275
Device Count (N)
15
10
5
0
0.45 0.50 0.55 0.60
Turn-On Time (ms)
0.65
0.55
Typical IF for Switch Dropout
(N=50, IL=400mA)
25
20
0.40
20
15
10
5
0
0.16
0.18
0.20 0.22 0.24
LED Current (mA)
0.26
0.65
0.75
0.85
0.95
Turn-Off Time (ms)
1.05
Typical On-Resistance Distribution
(N=50, IF=1mA, IL=400mA)
25
Device Count (N)
1.250
Device Count (N)
25
20
0
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mA)
30
Device Count (N)
20
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
25
Device Count (N)
Device Count (N)
25
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
20
15
10
5
0
0.28
0.16
0.18
0.20
0.22
0.24
LED Current (mA)
0.26
0.505 0.510 0.515 0.520 0.525 0.530 0.535
On-Resistance (:)
Typical Blocking Voltage Distribution
(N=50)
35
Device Count (N)
30
25
20
15
10
5
0
63.5
0.7
IF=20mA
1.4
1.3
1.2
1.1
1.0
-40
IF=10mA
IF=5mA
IF=2mA
Turn-On Time (ms)
1.5
66.5
0.6
Turn-Off Time (ms)
LED Forward Voltage (V)
IF=50mA
64.5 65.0 65.5 66.0
Blocking Voltage (VP)
Typical Turn-Off Time
vs. LED Forward Current
(IL=80mA)
Typical LED Forward Voltage Drop
vs. Temperature
1.6
64.0
0.5
0.4
0.3
0.2
0.1
0
-20
0
20
40
60
Temperature (ºC)
80
100
0
5
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
Typical Turn-On Time
vs. LED Forward Current
(IL=80mA)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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INTEGRATED CIRCUITS DIVISION
CPC2014N
IF=10mA
LED Current (mA)
0.36
-20
0
20
40
60
80
100
IF=10mA
-20
0
20
40
60
80
Steady State
0.6
0.5
0.4
0.3
-40
100
-20
0
20
40
60
80
100
Temperature (ºC)
Typical IF for Switch Operation
vs. Temperature
(IL=200mA)
Typical IF for Switch Dropout
vs. Temperature
(IL=200mA)
Typical Load Current vs. Load Voltage
with One Pole Operating
(IF=2mA)
0.36
0.24
0.20
0.32
0.28
0.24
0.20
0.16
-20
0
20
40
60
Temperature (ºC)
80
100
-40
Maximum Load Current vs. Temperature
with One Pole Operating
(IF=2mA)
Blocking Voltage (VP)
400
300
200
100
-20
0
20
40
60
Temperature (ºC)
80
100
72
0.016
70
0.014
68
0.012
66
64
62
0
20
40
60
Temperature (ºC)
Output Capacitance (pF)
200
80
100
0.1
0.2
0.3
Typical Leakage vs. Temperature
Measured Across Pins 5&6 and 7&8
(VL=60V)
0.010
0.008
0.006
-40
-20
0
20
40
60
80
100
0
-40
-20
Temperature (ºC)
150
125
100
75
50
25
0
20
30
Load Voltage (V)
40
50
0
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
(IF=2mA)
175
10
0.0
0.002
Output Capacitance vs. Load Voltage
(IF=0mA, f=1MHz)
0
-0.1
0.004
60
Load Current (mA)
-20
-0.2
Load Voltage (V)
58
0
500
400
300
200
100
0
-100
-200
-300
-400
-500
-0.3
Typical Blocking Voltage
vs. Temperature
500
Load Current (mA)
IF=5mA
IF=10mA
0.7
Temperature (ºC)
0.28
-40
IF=5mA
Temperature (ºC)
0.32
0.16
-40
Typical On-Resistance vs. Temperature
(IL=200mA)
0.8
Load Current (mA)
-40
0.9
On-Resistance (:)
IF=5mA
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
-40
Leakage (µA)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Typical Turn-Off Time vs. Temperature
(IL=80mA)
Turn-Off Time (ms)
Typical Turn-On Time vs. Temperature
(IL=80mA)
LED Current (mA)
Turn-On Time (ms)
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)*
1100
1000
900
800
700
600
500
400
300
200
100
0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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INTEGRATED CIRCUITS DIVISION
CPC2014N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC2014N
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
Maximum Reflow Cycles
CPC2014N
260ºC for 30 seconds
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Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after soldering processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
CPC2014N
MECHANICAL DIMENSIONS
CPC2014N
1.016 ± 0.025
(0.040 ± 0.001)
9.347 ± 0.203
(0.368 ± 0.008)
Pin 1
2.184 MAX
(0.086 MAX)
PCB Land Pattern
5.60
(0.22)
1.30
(0.051)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.051
(0.150 ± 0.002)
2.540 TYP
(0.100 TYP)
0.203 ± 0.025
(0.008 ± 0.001)
0.432 ± 0.127
(0.017 ± 0.005)
2.54
(0.100)
0.55
(0.022)
Pin to Package Standoff
MIN 0.0254 (0.001)
(MAX 0.102 (0.004)
0.838 ± 0.102
(0.033 ± 0.004)
Dimensions
mm
(inches)
0.381 ± 0.051
(0.015 ± 0.002)
CPC2014NTR Tape & Reel
1.75 ± 0.10
330.2 DIA.
(13.00 DIA.)
4.00 ± 0.10
8.00 ± 0.10
2.00 ± 0.10
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
1.20
7.50 ± 0.10
Ø1.50
+0.1, -0
6.50 9.65 ± 0.10
16.00 ± 0.30
Embossed Carrier
3.50
6.55 ± 0.10
Ø1.50 MIN
Embossment
2.35 ± 0.10
NOTES:
1. All dimensions in millimeters
2. 10 sprocket hole pitch cumulative tolerance ± 0.20.
3. Carrier camber is within 1mm in 250mm.
2.85 ± 0.10
4. Tape material : Black Conductive Polystyrene Alloy.
5. All dimensions meet EIA-481-C requirements.
6. Thickness : 0.30 ± 0.05mm.
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC2014N-R04
©Copyright 2014, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
11/19/2014