GMM3x60-015X2 Three phase full Bridge VDSS =150V = 57A ID25 RDSon typ. = 17mW with Trench MOSFETs in DCB isolated high current package L1+ L2+ G1 G3 G5 S1 S3 S5 L1 L2 G4 G6 G2 S2 L3+ L3 S4 S6 L1- L2- L3- Applications MOSFETs Conditions Maximum Ratings VDSS TVJ = 25°C to 150°C VGS 150 V ± 20 V TC = 25°C TC = 90°C TC = 110°C 57 45 43 IF25 IF90 IF110 TC = 25°C (diode) TC = 90°C (diode) TC = 110°C (diode) tbd tbd tbd Symbol Conditions A A A A A A iv ID25 ID90 ID110 Characteristic Values (TVJ = 25°C, unless otherwise specified) min. RDSon 1) on chip level at VGS = 10 V VGS(th) VDS = 20 V; ID = 1 mA IDSS VDS = VDSS; VGS = 0 V IGSS VGS = ± 20 V; VDS = 0 V Qg Qgs Qgd VGS = 10 V; VDS = 65 V; ID = 50 A RthJC RthJH 17 36 22 mW mW 4.5 V 1 µA mA 0.2 µA t max. t a TVJ = 25°C TVJ = 125°C inductive load VGS = 10 V; VDS = 96 V ID = 50 A; RG = 33 Ω; TJ = 125°C with heat transfer paste (IXYS test setup) 0.1 tbd tbd tbd nC nC nC tbd tbd tbd tbd ns ns ns ns tbd tbd tbd mJ mJ mJ 1.3 1.0 1.6 Features • MOSFETs in trench technology: -low RDSon -optimized intrinsic reverse diode • package: -high level of integration -high current capability -aux. terminals for MOSFET control -terminals for soldering or welding connections -isolated DCB ceramic base plate with optimized heat transfer •Space and weight savings K/W K/W VDS = ID·(RDS(on) + 2RPin to Chip) t 1) typ. 2.5 n Eon Eoff Erecoff TVJ = 25°C TVJ = 125°C e td(on) tr td(off) tf AC drives • in automobiles -electric power steering -starter generator • in industrial vehicles -propulsion drives -fork lift drives • in battery supplied equipment e Symbol IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved 20110307 1-3 GMM3x60-015X2 Source-Drain Diode Symbol Conditions Characteristic Values (TJ = 25°C, unless otherwise specified) min. typ. max. VSD (diode) IF = 50 A; VGS = 0 V 0.9 trr QRM IRM IF = 50 A; -diF/dt = 800 A/µs; VR = 96 V tbd tbd tbd 1.2 V ns µC A Component Symbol Conditions Maximum Ratings IRMS per pin in main current paths (P+, N-, L1, L2, L3) may be additionally limited by external connections 2 pins for output L1, L2, L3 TJ Tstg VISOL IISOL < 1 mA, 50/60 Hz, f = 1 minute FC mounting force with clip Symbol Conditions °C °C 1000 V~ 50 - 250 N max. coupling capacity between shorted pins and back side metallization e typ. tbd 1) Weight mW 160 pF VDS = ID·(RDS(on) + 2RPin to Chip) 25 g t e n t a t 1) -55...+175 -55...+125 iv CP A Characteristic Values min. Rpin to chip 75 IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved 20110307 2-3 e n t a t iv e GMM3x60-015X2 Ordering Part Name & Packing Unit Marking Part Marking Delivering Mode Base Qty. Ordering Code Standard GMM 3x60-015X2 - SMD GMM 3x60-015X2 Blister 28 510635 t Leads SMD IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved 20110307 3-3