GMM 3x120-0075X2 Three phase full Bridge VDSS = 75V = 110A ID25 RDSon typ. = 4.0mW with Trench MOSFETs in DCB isolated high current package L1+ L2+ G1 G3 G5 S1 S3 S5 L1 L2 G4 G6 G2 S2 L3+ L3 S4 S6 L1- L2- L3- Applications Symbol Conditions Maximum Ratings VDSS TVJ = 25°C to 150°C ID25 ID90 TC = 25°C TC = 90°C IF25 IF90 TC = 25°C (diode) TC = 90°C (diode) Symbol Conditions 75 V ± 20 V 110 85 A A 110 80 A A iv VGS Characteristic Values (TVJ = 25°C, unless otherwise specified) on chip level at VGS = 10 V TVJ = 25°C TVJ = 125°C VGS(th) VDS = 20 V; ID = 1 mA IDSS VDS = VDSS; VGS = 0 V IGSS VGS = ± 20 V; VDS = 0 V Qg Qgs Qgd VGS = 10 V; VDS = 36 V; ID = 25 A RthJC RthJH 1) 4.0 7.2 4.9 8.4 a t mW mW 4.0 V 1 µA µA 0.2 µA 50 115 30 30 nC nC nC 130 100 500 100 ns ns ns ns 0.20 0.50 0.01 mJ mJ mJ n inductive load VGS = 10 V; VDS = 30 V ID = 80 A; RG = 39 Ω; TJ = 125°C e Eon Eoff Erecoff max. 2.0 TVJ = 25°C TVJ = 125°C with heat transfer paste (IXYS test setup) t td(on) tr td(off) tf typ. t min. RDSon 1) AC drives • in automobiles -electric power steering -starter generator • in industrial vehicles -propulsion drives -fork lift drives • in battery supplied equipment e MOSFETs 1.3 1.0 1.6 Features • MOSFETs in trench technology: -low RDSon -optimized intrinsic reverse diode • package: -high level of integration -high current capability -aux. terminals for MOSFET control -terminals for soldering or welding connections -isolated DCB ceramic base plate with optimized heat transfer •Space and weight savings K/W K/W VDS = ID·(RDS(on) + 2RPin to Chip) IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved 20110307 1-4 GMM 3x120-0075X2 Source-Drain Diode Symbol Conditions Characteristic Values (TJ = 25°C, unless otherwise specified) min. typ. max. VSD (diode) IF = 80 A; VGS = 0 V 0.9 trr QRM IRM IF = 80 A; -diF/dt = 800 A/µs; VR = 30 V 55 0.9 30 1.2 V ns µC A Component Conditions Maximum Ratings IRMS per pin in main current paths (P+, N-, L1, L2, L3) may be additionally limited by external connections 2 pins for output L1, L2, L3 TJ Tstg VISOL IISOL < 1 mA, 50/60 Hz, f = 1 minute FC mounting force with clip Symbol Conditions min. -55...+175 -55...+125 °C °C 1000 V~ 50 - 250 N typ. max. tbd mW 160 pF 25 g iv coupling capacity between shorted pins and back side metallization Weight VDS = ID·(RDS(on) + 2RPin to Chip) t e n t a t 1) A Characteristic Values Rpin to chip 1) CP 75 e Symbol IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved 20110307 2-4 t e n t a t iv e GMM 3x120-0075X2 Leads SMD Ordering Standard Part Name & Packing Unit Marking Part Marking GMM 3x120-0075X2 - SMD GMM 3x120-0075X2 IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved Delivering Mode Base Qty. Ordering Code Blister 28 507 508 20110307 3-4 t e n t a t iv e GMM 3x120-0075X2 IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved 20110307 4-4