LRC LMBR0530FT1G

LMBR0520FT1G thru LMBR0540FT1G
Schottky Barrier Rectifiers
Reverse Voltage 20 to 40V Forward Current 0.5A
FEATURES
* Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
* Low power loss,high efficiency
* For use in low voltage high frequency inverters,
free wheeling,and polarity protection applications
* Guardring for over voltage protection
* High temperature soldering guaranteed:
260°C/10 seconds at terminals
Mechanical Data
Case: SOD123-FL/MINI SMA
molded plastic over sky die
Terminals: Tin Plated, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.0155 g
Handling precautin:None
We declare that the material of product is
Haloggen free (green epoxy compound)
1.Electrical Characteristic
Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbol
symbol
device marking code
LMBR0520FT1G
LMBR0530FT1G
LMBR0540FT1G
052
053
054
30
40
V
Unit
Maximum repetitive peak reverse
voltage
VRRM
20
Maximum RMS voltage
VRMS
14
21
28
V
Maximum DC blocking voltage
VDC
20
30
40
V
Maximum average forward rectified
current at TA = 75°C
IF(AV)
0.5
A
Peak forward surge current 8.3ms
single half sine-wave superimposed on
rated load (JEDEC Method)
IFSM
30
A
RθJA
RθJC
110
40
°C/W
Typical thermal resistance (Note 1)
Operating junction temperature range
storage temperature range
–55 to +125
TJ
–55 to +150
–65 to +175
TSTG
°C
°C
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbol
Maximum instantaneous forward
voltage at(IF = 0.1 A, TJ = 25°C)
(IF = 0.5 A, TJ = 25°C)
Maximum DC reverse current at rated
DC blocking voltage TA = 25℃
Tj = 100℃
Typical junction capacitance at
4.0V, 1MHz
NOTES:
1. 8.0mm2 (.013mm thick) land areas
symbol
LMBR0520FT1G
LMBR130FT1G
LMBR0540FT1G
Unit
VF
0.3
0.385
0.375
0.450
0.55
V
IR
0.25
8
0.130
10
0.04
10
mA
CJ
160
PF
LMBR0520FT1G thru LMBR0540FT1G
2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted )
Fig. 2 – Maximum Non-repetitive Peak
Forward Surge Current
60 Hz
Resistive or
Inductive Load
Peak forward surge current
Average Forward Rectified Current (A)
Fig. 1 – Forward Current Derating Curve
0.5
0.25
TJ = TJ max
8.3ms Single
Half Sine-wave
30
15
0
1
0
10
Tj=100
1.0
Tj=75
0.1
1.0
Tj=25
0.01
0.1
0.001
0.01
0.2
Transient thermal impedance(°C/W)
Instantaneous Reverse Current (mA)
TJ = 25°C
Pulse width = 300µs
1% Duty Cycle
Fig 4. – Typical Reverse Characteristics
10
100
0
20
40
60
80
100
Percent of Rated Peak Reverse Voltage (%)
0.4
0.6
0.8
1.0
1.2
Instantaneous Forward Voltage (V)
Fig 6. – Typical Junction Capacitance
Fig 5. –typical transient thermal
impedance
1000
Junction Capacitance (pF)
Instantaneous Forward Current (A)
0
100
25 50 75 100 125 150 175
Ambient Temperature, °C
Fig 3. – Typical Instantaneous Forward
Characteristics
10
Number of Cycles at 60Hz
10
1.0
TJ = 25°C
f = 1.0 MHz
Vsig =
100
10
0.1
0.1
0.01
0.1
1.0
10
t,Pulse duration,sec
100
1
10
Reverse Voltage (V)
100
LMBR0520FT1G thru LMBR0540FT1G
3. dimension:
SOD123-FL
DIM
A
B
C
D
E
H
J
K
MILLIMETERS
MIN
MAX
3.5
3.9
0.75
0.95
2.6
3.0
1.6
2.0
0.45Typ
0.9
1.2
0.12
0.22
0.8Typ
INCHES
MIN
MAX
0.138
0.159
0.029
0.037
0.103
0.119
0.063
0.079
0.018Typ
0.036
0.047
0.005
0.009
0.032Typ
Suggested solder pad layout
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SOD123-FL
0.044(1.10
0.040(1.00)
0.079(2.00)
LMBR0520FT1G thru LMBR0540FT1G
4.Packing information
Unit:mm
Item
Symbol
tolerance
SOD123-FL
Carrier width
A
0.1
2.00
Carrier length
B
0.1
3.85
Carrier depth
C
0.1
1.10
Sprocket hole
d
0.1
1.50
13" Reel outside diameter
D
2.0
-
13" Reel inner diameter
D1
min
-
7" Reel outside diameter
D
2.0
178.00
7" Reel inner diameter
D1
min
62.00
Feed hole diameter
D2
0.5
13.00
Sprocket hole position
E
0.1
1.75
Punch hole position
F
0.1
3.50
Punch hole pitch
P
0.1
4.00
Spocket hole pitch
P0
0.1
4.00
Embossment center
P1
0.1
2.00
Overall tape thickness
T
0.1
0.23
Tape width
W
0.3
8.00
Reel width
W1
1.0
11.40
LMBR0520FT1G thru LMBR0540FT1G
Reel packing
PACKAGE
SOD123-FL
REEL SIZE
7"
REEL
COMPONENT
(PCS)
SPACING
3,000
(mm)
4.0
BOX
INNER BOX
REEL DIA.
CARTON SIZE
CARTON
(pcs)
(mm)
(mm)
(mm)
(PCS)
30,000
183*183*123
178
382*262*387
240,000
5.Suggested thermal profile for soldering process
1. Storage environment:Temperature=5~40℃ Humidity=55±25%
2. Reflow soldering of surface-mount device
3. Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(TL to TP)
<3℃/sec
Preheat
- Temperature Min(Tsmin)
- Temperature Max(Tsmax)
- Time(min to max)(ts)
150℃
200℃
60~120sec
Tsmax to TL
- Ramp-up Rate
<3sec
Time maintained above:
- Temperature (TL)
217℃
- Time(tL)
60-260sec
Peak Temperature(TP)
255 -0/+5℃
Time within 5℃ of actual Peak
Temperature(TP)
Ramp-down Rate
Time 25℃ to Peak Temperature
10~30sec
<6℃/sec
<6minutes
APPOX.
GROSS WEIGHT
(kg)
8.7
LMBR0520FT1G thru LMBR0540FT1G
6.High reliability test capabilities
Item Test
Condition
Reference
Solder Resistance
at 260±5℃ for 10±2sec immerse
body into solder 1/16" ± 1/32"
Solderability
at 245±5℃ for 5 sec
High Temperature Reverse Bias
VR=80% rate at Tj=150℃ for 168hrs
MIL-STD-750D METHOD-1038
Forward Operation Life
Rated average rectifier current
TA=25℃ for 500hrs
MIL-STD-750D METHOD-1027
Intermittent Operation Life
TA=25℃,IF=IO
On state:power on for 5 min.
Off state:power off for 5 min.
on and off for 500 cycles
MIL-STD-750D METHOD-1036
Pressure Cooker
15PSIG at TA=121℃ for 4hrs
JESD22-A102
Temperature Cycling
-55℃ to +125℃ dwelled for 30 min.
and transferred for 5min. Total 10
cycles
MIL-STD-750D METHOD-1051
Thermal Shock
0℃ for 5min. Rise to 100℃ for 5min.
Total 10 cycles
MIL-STD-750D METHOD-1056
Forward Surge
8.3ms single half sine-wave
superimposed on rated load,one
surge
Humidity
at TA=85℃,RH=85% for 1000hrs
MIL-STD-750D METHOD-1021
High Temperature Storage Life
at 175℃ for 1000hrs
MIL-STD-750D METHOD-1031
MIL-STD-750D METHOD-2031
MIL-STD-202F METHOD-208
MIL-STD-750D METHOD-4066-2
LMBR0520FT1G thru LMBR0540FT1G
7. Update Record
版次
更新记录
更新作者
更新日期
1
第一版
周杰
2013.04.03