LMBR320FT1G thru LMBR3200FT1G Schottky Barrier Rectifiers Reverse Voltage 20 to 200V Forward Current 3.0A FEATURES * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * Low power loss,high efficiency * For use in low voltage high frequency inverters, free wheeling,and polarity protection applications * Guardring for over voltage protection * High temperature soldering guaranteed: 260°C/10 seconds at terminals Mechanical Data Case: SOD123-FL/MINI SMA molded plastic over sky die Terminals: Tin Plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.0155 g Handling precautin:None We declare that the material of product is Haloggen free (green epoxy compound) 1.Electrical Characteristic Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol device marking code LMBR LMBR LMBR LMBR 320FT1G 330FT1G 340FT1G 350FT1G LMBR 360FT1G LMBR 380FT1G LMBR LMBR LMBR 3100FT1G 3150FT1G 3200FT1G Unit 32 33 34 35 36 38 310 315 320 VRRM 20 30 40 50 60 80 100 150 200 V Maximum RMS voltage VRMS 14 21 28 35 42 56 70 105 140 V Maximum DC blocking voltage VDC 20 30 40 50 60 80 100 150 200 V Maximum repetitive peak reverse voltage Maximum average forward rectified current at TA = 75°C IF(AV) 3.0 A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 80 A RθJA RθJC 110 40 °C/W TJ –55 to +150 °C TSTG –65 to +175 °C Typical thermal resistance (Note 1) Operating junction temperature range storage temperature range Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol LMBR LMBR LMBR LMBR 320FT1G 330FT1G 340FT1G 350FT1G LMBR 360FT1G LMBR 380FT1G LMBR LMBR LMBR 3100FT1G 3150FT1G 3200FT1G Unit Maximum instantaneous forward voltage at 3.0A VF Maximum DC reverse current at rated DC blocking voltage TA = 25℃ Tj = 100℃ IR 0.5 20 mA Typical junction capacitance at 4.0V, 1MHz CJ 160 PF NOTES: 1. 8.0mm2 (.013mm thick) land areas 0.50 0.70 0.85 0.9 0.92 V LMBR320FT1G thru LMBR3200FT1G 2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted ) Fig. 2 – Maximum Non-repetitive Peak Forward Surge Current 60 Hz Resistive or Inductive Load Peak forward surge current (A) Average Forward Rectified Current (A) Fig. 1 – Forward Current Derating Curve 3.0 1.5 80 40 0 0 Fig 4. – Typical Reverse Characteristics TJ = 25°C Pulse width = 300µs 1% Duty Cycle 10 1.0 1.0 0.1 0.1 0.01 0.01 0.2 Fig 5. –typical transient thermal impedance Tj=125 Tj=75 Tj=25 0.001 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Fig 6. – Typical Junction Capacitance 1000 Junction Capacitance (pF) 100 0.4 0.6 0.8 1.0 1.2 Instantaneous Forward Voltage (V) 10 Number of Cycles at 60Hz 10 Instantaneous Reverse Current (mA) Instantaneous Forward Current (A) 100 25 50 75 100 125 150 175 Ambient Temperature, °C Fig 3. – Typical Instantaneous Forward Characteristics 1 0 Transient thermal impedance(°C/W) TJ = TJ max 8.3ms Single Half Sine-wave 10 1.0 TJ = 25°C f = 1.0 MHz Vsig = 100 10 0.1 0.01 0.1 1.0 10 t,Pulse duration,sec 100 0.1 1 Reverse Voltage (V) 10 100 LMBR320FT1G thru LMBR3200FT1G 3. dimension: SOD123-FL DIM A B C D E H J K MILLIMETERS MIN MAX 3.5 3.9 0.75 0.95 2.6 3.0 1.6 2.0 0.45Typ 0.9 1.2 0.12 0.22 0.8Typ INCHES MIN MAX 0.138 0.159 0.029 0.037 0.103 0.119 0.063 0.079 0.018Typ 0.036 0.047 0.005 0.009 0.032Typ Suggested solder pad layout Dimensions in inches and (millimeters) PACKAGE A B C SOD123-FL 0.044(1.10 0.040(1.00) 0.079(2.00) LMBR320FT1G thru LMBR3200FT1G 4.Packing information Unit：mm Item Symbol tolerance SOD123-FL Carrier width A 0.1 2.00 Carrier length B 0.1 3.85 Carrier depth C 0.1 1.10 Sprocket hole d 0.1 1.50 13" Reel outside diameter D 2.0 - 13" Reel inner diameter D1 min - 7" Reel outside diameter D 2.0 178.00 7" Reel inner diameter D1 min 62.00 Feed hole diameter D2 0.5 13.00 Sprocket hole position E 0.1 1.75 Punch hole position F 0.1 3.50 Punch hole pitch P 0.1 4.00 Spocket hole pitch P0 0.1 4.00 Embossment center P1 0.1 2.00 Overall tape thickness T 0.1 0.23 Tape width W 0.3 8.00 Reel width W1 1.0 11.40 LMBR320FT1G thru LMBR3200FT1G Reel packing PACKAGE SOD123-FL REEL SIZE 7" REEL (PCS) 3,000 COMPONENT SPACING (mm) 4.0 BOX INNER BOX REEL DIA. CARTON SIZE CARTON (pcs) (mm) (mm) (mm) (PCS) 30,000 183*183*123 178 382*262*387 240,000 5.Suggested thermal profile for soldering process 1. Storage environment：Temperature=5~40℃ Humidity=55±25% 2. Reflow soldering of surface-mount device 3. Reflow soldering Tsmax to TL - Ramp-up Rate <3sec APPOX. GROSS WEIGHT (kg) 8.7 LMBR320FT1G thru LMBR3200FT1G 6.High reliability test capabilities Item Test Condition Reference Solder Resistance at 260±5℃ for 10±2sec immerse body into solder 1/16" ± 1/32" MIL-STD-750D METHOD-2031 Solderability at 245±5℃ for 5 sec MIL-STD-202F METHOD-208 High Temperature Reverse Bias VR=80% rate at Tj=150℃ for 168hrs MIL-STD-750D METHOD-1038 Forward Operation Life Rated average rectifier current TA=25℃ for 500hrs MIL-STD-750D METHOD-1027 Intermittent Operation Life TA=25℃，IF=IO On state:power on for 5 min. Off state:power off for 5 min. on and off for 500 cycles MIL-STD-750D METHOD-1036 Pressure Cooker 15PSIG at TA=121℃ for 4hrs JESD22-A102 Temperature Cycling -55℃ to +125℃ dwelled for 30 min. and transferred for 5min. Total 10 cycles MIL-STD-750D METHOD-1051 Thermal Shock 0℃ for 5min. Rise to 100℃ for 5min. Total 10 cycles MIL-STD-750D METHOD-1056 Forward Surge 8.3ms single half sine-wave superimposed on rated load,one surge MIL-STD-750D METHOD-4066-2 Humidity at TA=85℃，RH=85% for 1000hrs MIL-STD-750D METHOD-1021 High Temperature Storage Life at 175℃ for 1000hrs MIL-STD-750D METHOD-1031 LMBR320FT1G thru LMBR3200FT1G 7. Update Record 版次 更新记录 更新作者 更新日期 1 第一版 周杰 2013.04.03