SOD151-SH thru SOD157-SH Surface Mount Glass Passivated Junction Rectifiers Reverse Voltage 50 to 1000V Forward Current 1.5A FEATURES * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * High temperature metallurgically bonded construction * Cavity-free glass passivated junction * Capable of meeting environmental standards of MIL-S-19500 * 1.5 A operation at TA=75°C with no thermal runaway * Typical IR less than 1.0µA * High temperature soldering guaranteed: 260°C/10 seconds Mechanical Data Case: JEDEC SOD123-FL/MINI SMA, molded plastic over glass DIE We declare that the material of product is Terminals: Tin Plated, solderable per Haloggen free (green epoxy compound) MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.0155 g Handling precautin:None Electrical Characteristic 1.Maximum & Thermal Characteristics Ratings Parameter Symbol symbol Device marking code at 25°C ambient temperature unless otherwise specified. SOD 151-SH SOD 152-SH SOD 153-SH SOD 154-SH SOD 155-SH SOD 156-SH SOD 157-SH B1 B2 B3 B4 B5 B6 B7 Unit Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V Maximum average forward rectified current lead length at TA = 75°C (Note 1) IF(AV) 1.5 A Peak forward surge current 8.3ms single half sinewave superimposed on rated load (JEDEC Method) IFSM 60 A 110 40 –55 to +150 °C/W Operating junction temperature range RθJA RθJC TJ storage temperature range TSTG –65 to +175 °C Typical thermal resistance (Note 1) °C Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol SOD 151-SH SOD 152-SH SOD 153-SH SOD 154-SH SOD 155-SH SOD 156-SH SOD 157-SH Unit VF 1.1 V Maximum DC reverse current TJ= 25°C at rated DC blocking voltage TJ = 125°C IR 5.0 50 µA Typical junction capacitance at 4.0V, 1MHz CJ 15.0 PF Maximum instantaneous forward voltage at 1.5A NOTES: 1. 8.0mm2 (.013mm thick) land areas SOD151-SH thru SOD157-SH 2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted ) Fig. 2 – Maximum Non-repetitive Peak Forward Surge Current Average Forward Rectified Current (A) Average Forward Rectified Current (A) Fig. 1 – Forward Current Derating Curve 60 Hz Resistive or Inductive Load 1.5 0.75 0.375" (9.5mm) Lead Length 0 60 30 0 1 0 25 50 75 100 125 150 175 Ambient Temperature, °C Fig 3. – Typical Instantaneous Forward Characteristics 100 100 1.0 0.1 TJ = 25°C Pulse width = 300µs 1% Duty Cycle 0.01 0.001 0.6 0.8 1.0 1.2 1.4 Instantaneous Forward Voltage 10 Tj=75℃ 0.1 Tj=25℃ 0.01 1.6 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Fig 6. – Typical Junction Capacitance 100 Junction Capacitance (pF) 100 10 1.0 0.1 0.01 Tj=125℃ 1.0 Fig 5. –typical transient thermal impedance Transient thermal impedance(°C/W) 10 Number of Cycles at 60Hz Fig 4. – Typical Reverse Characteristics Instantaneous Reverse Current (µA) Instantaneous Forward Current (A) 10 TJ = TJ max 8.3ms Single Half Sine-wave (JEDEC Method) 0.1 1.0 10 t,Pulse duration,sec 100 10 1.0 0.1 TJ = 25°C f = 1.0 MHz Vsig = 50mVp-p 1 10 Reverse Voltage (V) 100 SOD151-SH thru SOD157-SH 3. dimension: SOD123-FL DIM A B C D E H J K MILLIMETERS MIN MAX 3.5 3.9 0.75 0.95 2.6 3.0 1.6 2.0 0.45Typ 0.9 1.2 0.12 0.22 0.8Typ INCHES MIN MAX 0.138 0.159 0.029 0.037 0.103 0.119 0.063 0.079 0.018Typ 0.036 0.047 0.005 0.009 0.032Typ Suggested solder pad layout Dimensions in inches and (millimeters) PACKAGE A B C SOD123-FL 0.044(1.10 0.040(1.00) 0.079(2.00) SOD151-SH thru SOD157-SH 4.Packing information Unit：mm Item Carrier width Symbol tolerance SOD123-FL A 0.1 2.00 Carrier length B 0.1 3.85 Carrier depth C 0.1 1.10 Sprocket hole d 0.1 1.50 - 13" Reel outside diameter D 2.0 13" Reel inner diameter D1 min - 7" Reel outside diameter D 2.0 178.00 7" Reel inner diameter D1 min 62.00 Feed hole diameter D2 0.5 13.00 Sprocket hole position E 0.1 1.75 Punch hole position F 0.1 3.50 Punch hole pitch P 0.1 4.00 Spocket hole pitch P0 0.1 4.00 Embossment center P1 0.1 2.00 Overall tape thickness T 0.1 0.23 Tape width W 0.3 8.00 Reel width W1 1.0 11.40 SOD151-SH thru SOD157-SH Reel packing COMPONEN PACKAGE SOD123-FL REEL SIZE 7" REEL T BOX INNER BOX REEL DIA. (PCS) SPACING (pcs) (mm) (mm) 3,000 (mm) 4.0 30,000 183*183*123 178 5.Suggested thermal profile for soldering process 1. Storage environment：Temperature=5~40℃ Humidity=55±25% 2. Reflow soldering of surface-mount device 3. Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(TL to TP) <3℃/sec Preheat - Temperature Min(Tsmin) - Temperature Max(Tsmax) - Time(min to max)(ts) Tsmax to TL - Ramp-up Rate 150℃ 200℃ 60~120sec <3sec Time maintained above: - Temperature (TL) - Time(tL) 217℃ 60-260sec Peak Temperature(TP) 255 -0/+5℃ Time within 5℃ of actual Peak Temperature(TP) 10~30sec Ramp-down Rate <6℃/sec Time 25℃ to Peak Temperature <6minutes CARTON SIZE (mm) 382*262*387 APPOX. CARTON GROSS (PCS) WEIGHT 240,000 (kg) 8.7 SOD151-SH thru SOD157-SH 6.High reliability test capabilities Item Test Condition Reference Solder Resistance at 260±5℃ for 10±2sec immerse body into solder 1/16" ± 1/32" MIL-STD-750D METHOD-2031 Solderability at 245±5℃ for 5 sec MIL-STD-202F METHOD-208 High Temperature Reverse Bias VR=80% rate at Tj=150℃ for 168hrs MIL-STD-750D METHOD-1038 Forward Operation Life Rated average rectifier current TA=25℃ for 500hrs MIL-STD-750D METHOD-1027 Intermittent Operation Life TA=25℃，IF=IO On state:power on for 5 min. Off state:power off for 5 min. on and off for 500 cycles MIL-STD-750D METHOD-1036 Pressure Cooker 15PSIG at TA=121℃ for 4hrs JESD22-A102 Temperature Cycling -55℃ to +125℃ dwelled for 30 min. MIL-STD-750D METHOD-1051 and transferred for 5min. Total 10 cycles Thermal Shock 0℃ for 5min. Rise to 100℃ for 5min. Total 10 cycles MIL-STD-750D METHOD-1056 Forward Surge 8.3ms single half sine-wave superimposed on rated load,one surge MIL-STD-750D METHOD-4066-2 Humidity at TA=85℃，RH=85% for 1000hrs MIL-STD-750D METHOD-1021 High Temperature Storage Life at 175℃ for 1000hrs MIL-STD-750D METHOD-1031 SOD151-SH thru SOD157-SH 7. Update Record 更新记录 更新作者 更新日期 1 第一版 周杰 2012.12.05 2 因为所有SOD123系列均为无卤塑料，所以取消印字下 划线 周杰 2013.01.04 3 将封装SOD-123S修正为SOD123-FL 周杰 2013.03.20 版次