MPS MP1496DJ

MP1496
High-Efficiency, 2A, 16V, 500kHz
Synchronous, Step-Down Converter
The Future of Analog IC Technology
DESCRIPTION
FEATURES
The MP1496 is a high-frequency, synchronous,
rectified, step-down, switch-mode converter
with built-in power MOSFETs. It offers a very
compact solution to achieve a 2A continuous
output current with excellent load and line
regulation over a wide input supply range. The
MP1496 has synchronous mode operation for
higher efficiency over the output-current–load
range.
•
•
•
•
•
•
Current-mode operation provides a fast
transient response and eases loop stabilization.
•
•
•
•
•
Protective
features
include
over-current
protection and thermal shut down and external
SS control.
The MP1496 requires a minimal number of
readily-available standard external components,
and is available in a space-saving 8-pin
TSOT23 package.
Wide 4.5V to 16V Operating Input Range
100mΩ/40mΩ Low-RDS(ON) Internal Power
MOSFETs
Proprietary Switching-Loss–Reduction
Technique
High-Efficiency Synchronous Mode
Operation
Fixed 500kHz Switching Frequency
Can Synchronize with a 200kHz-to-2MHz
External Clock
Externally Programmable Soft-Start
OCP Protection and Hiccup
Thermal Shutdown
Output Adjustable Starting from 0.8V
Available in an 8-pin TSOT-23 Package
APPLICATIONS
•
•
•
•
Notebook Computers and I/O Power
Digital Set-Top Boxes
Flat-Panel Television and Monitors
Distributed Power Systems
All MPS parts are lead-free and adhere to the RoHS directive. For MPS green
status, please visit MPS website under Products, Quality Assurance page.
“MPS” and “The Future of Analog IC Technology” are registered trademarks of
Monolithic Power Systems, Inc.
TYPICAL APPLICATION
2
VIN
IN
4.5V-16V C1
BST
C4
MP1496
22
6
EN/SYNC
5
SW
3.3V/2A
3
L1
EN
7
FB
C3
0.1
1
C5
22 F
MP1496 Rev. 1.05
12/26/2012
VCC
SS
GND
4
8
R3
33k
R1
40.2k
C2
R2
13k
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1
MP1496 – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
ORDERING INFORMATION
Part Number*
MP1496DJ
Package
TSOT-23-8
Top Marking
ACT
*For Tape & Reel, add suffix –Z (e.g. MP1496DJ–Z);
For RoHS compliant packaging, add suffix –LF (e.g. MP1496DJ–LF–Z)
PACKAGE REFERENCE
TOP VIEW
SS
1
8
FB
IN
2
7
VCC
SW
3
6
EN/SYNC
GND
4
5
BST
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance
VIN ..................................................-0.3V to 17V
VSW ...-0.3V (-5V for <10ns) to 17V (19V for 5ns)
VBS ......................................................... VSW+6V
(2)
All Other Pins ................................ -0.3V to 6V
(3)
Continuous Power Dissipation (TA = +25°C)
........................................................... 1.25W
Junction Temperature ...............................150°C
Lead Temperature ....................................260°C
Storage Temperature................. -65°C to 150°C
TSOT-23-8............................. 100 ..... 55... °C/W
Recommended Operating Conditions
(4)
Supply Voltage VIN ...........................4.5V to 16V
Output Voltage VOUT ..................... 0.8V to VIN-3V
Operating Junction Temp. (TJ). -40°C to +125°C
MP1496 Rev. 1.05
12/26/2012
(5)
θJA
θJC
Notes:
1) Exceeding these ratings may damage the device.
2) About the details of EN pin’s ABS MAX rating, please refer to
Page 9, Enable section.
3) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-toambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
4) The device is not guaranteed to function outside of its
operating conditions.
5) Measured on JESD51-7, 4-layer PCB.
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2
MP1496 – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
ELECTRICAL CHARACTERISTICS
VIN = 12V, TA = 25°C, unless otherwise noted.
Parameter
Symbol
Supply Current (Shutdown)
Supply Current (Quiescent)
HS-Switch ON Resistance
LS-Switch ON Resistance
Switch Leakage
Current Limit (6)
Oscillator Frequency
Fold-back Frequency
Maximum Duty Cycle
Minimum ON Time (6)
Sync Frequency Range
IIN
Iq
HSRDS-ON
LSRDS-ON
SWLKG
ILIMIT
fSW
fFB
DMAX
τON_MIN
fSYNC
Feedback Voltage
VFB
Feedback Current
EN Rising Threshold
EN Falling Threshold
IFB
EN Input Current
EN Turn-Off Delay
VIN Under-Voltage Lockout
Threshold-Rising
VIN Under Voltage Lockout
Threshold-Hysteresis
VCC Regulator
VCC Load Regulation
Soft-Start Current
Thermal Shutdown (6)
Thermal Hysteresis (6)
Condition
VEN = 0V
VEN = 2V, VFB = 1V
VBST-SW=5V
VCC=5V
VEN = 0V, VSW =12V
Under 40% Duty Cycle
VFB=750mV
VFB<400mV
VFB=700mV
TA=25°C
-40°C<TA<85°C (7)
VFB=820mV
VEN_RISING
VEN_FALLING
IEN
Min
Typ
0.7
100
40
Max
Units
1
1
μA
mA
mΩ
mΩ
μA
A
kHz
fSW
%
ns
MHz
1
3
440
90
0.2
791
787
1.2
1.1
500
0.25
95
60
807
807
10
1.4
1.25
580
2
823
827
50
1.6
1.4
mV
nA
V
V
VEN=2V
2
μA
VEN=0
0
μA
8
μs
ENTd-off
3.7
INUVVth
3.9
4.1
V
INUVHYS
650
mV
VCC
5
3
11
150
20
V
%
μA
°C
°C
ICC=5mA
ISS
Notes:
6) Guaranteed by design.
7) Not tested in production and guaranteed by over-temperature correlation.
MP1496 Rev. 1.05
12/26/2012
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3
MP1496 – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
TYPICAL PERFORMANCE CHARACTERISTICS
Performance waveforms are tested on the evaluation board in the Design Example section.
TA = 25°C, unless otherwise noted.
MP1496 Rev. 1.05
12/26/2012
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4
MP1496 – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Performance waveforms are tested on the evaluation board in the Design Example section.
TA = 25°C, unless otherwise noted.
MP1496 Rev. 1.05
12/26/2012
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5
MP1496 – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Performance waveforms are tested on the evaluation board in the Design Example section.
TA = 25°C, unless otherwise noted.
MP1496 Rev. 1.05
12/26/2012
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6
MP1496 – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
PIN FUNCTIONS
Package
Pin #
1
2
3
4
5
6
7
8
Name
Description
Soft-Start. Connect an external capacitor to program the soft start time for the switch
mode regulator.
Supply Voltage. The MP1496 operates from a 4.5V-to-16V input rail. C1 decouples the
IN
input rail. Use wide PCB trace to make the connection.
SW
Switch Output. Connect using a wide PCB trace.
System Ground. Reference ground of the regulated output voltage. Use special care in
GND
PCB layout: Connect to GND with copper and vias.
Bootstrap. Connect a capacitor between SW and BST pins to form a floating supply
BST
across the high-side switch driver. A 10Ω resistor placed between SW and BST cap. is
strongly recommended to reduce SW spike voltage.
Enable/Synchronize. EN high to enable the MP1496. Apply an external clock to
EN/SYNC
EN/SYNC pin to change the switching frequency.
Bias Supply. Decouple with 0.1μF-to-0.22μF cap. The capacitance should not exceed
VCC
0.22μF. VCC capacitor should be put closely to VCC pin and GND pin.
Feedback. Connect to the tap of an external resistor divider from the output to GND to set
the output voltage. The frequency fold-back comparator lowers the oscillator frequency
FB
when the FB voltage is below 400mV to prevent current-limit runaway during a shortcircuit fault.
SS
MP1496 Rev. 1.05
12/26/2012
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MP1496 – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
BLOCK DIAGRAM
IN
VCC
+
-
VCC
Regulator
RSEN
Currrent Sense
Amplifer
Bootstrap
Regulator
SS
Oscillator
HS
Driver
+
1pF
EN
6.5V
FB
Reference
1MEG
50pF
400k
BST
Current Limit
Comparator
Comparator
On Time Control
Logic Control
+
+
-
SW
VCC
LS
Driver
Error Amplifier
GND
Figure 1: Functional Block Diagram
MP1496 Rev. 1.05
12/26/2012
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MP1496 – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
OPERATION
The MP1496 is a high-frequency, synchronous,
rectified, step-down, switch-mode converter with
built-in power MOSFETs. It offers a very compact
solution to achieve 2A continuous output current
with excellent load and line regulation over a
wide input supply range,
The MP1496 operates in a fixed-frequency,
peak-current–control mode to regulate the output
voltage. An internal clock initiates a PWM cycle.
The integrated high-side power MOSFET turns
on and remains on until its current reaches the
value set by the COMP voltage. When the power
switch is off, it remains off until the next clock
cycle starts. If the current in the power MOSFET
does not reach the COMP set current value
within 95% of one PWM period, the power
MOSFET turns off.
Internal Regulator
The 5V internal regulator powers most of the
internal circuitries. This regulator takes the VIN
input and operates in the full VIN range. When VIN
exceeds 5.0V, the output of the regulator is in full
regulation. When VIN is less than 5.0V, the output
decreases and requires a 0.1µF ceramic
decoupling capacitor.
Error Amplifier
The error amplifier compares the FB pin voltage
against the internal 0.8V reference (REF) and
outputs a COMP voltage, which controls the
power MOSFET current. The optimized internal
compensation network minimizes the external
component counts and simplifies the control loop
design.
Enable/SYNC Control
EN is a digital control pin that turns the regulator
on and off. Drive EN high to turn on the regulator,
drive it low to turn it off. An internal 1MΩ resistor
from EN to GND allows EN to float to shut down
the chip.
A 6.5V-series Zener diode clamps the EN pin
internally as shown in Figure 2. The EN input pin
can then connect through a pullup resistor to any
voltage connected to the IN pin: The pullup
resistor limits the EN input current to less than
100µA.
For example, with VIN=12V, RPULLUP≥[(12V – 6.5V)
÷ 100µA = 55kΩ].
MP1496 Rev. 1.05
12/26/2012
Directly connecting the EN pin a voltage source
without any pullup resistor requires limiting the
voltage source amplitude to below 6.5V to
prevent damaging the Zener diode.
EN/SYNC
Zener
6.5V-typ
EN LOGIC
GND
Figure 2: Zener Diode Circuit
For external clock synchronization, connect a
clock with a frequency range between 200kHz
and 2MHz 2ms after setting the output voltage:
The internal clock’s rising edge synchronizes with
the external clock rising edge. Select an external
clock signal with a pulse width less than 1.7μs.
Under-Voltage Lockout
Under-voltage lockout (UVLO) protects the chip
from operating at an insufficient supply voltage.
The MP1496 UVLO comparator monitors the
output voltage of the internal regulator, VCC. The
UVLO rising threshold is about 3.9V while its
falling threshold is 3.25V.
External Soft-Start
Adjust the soft-start time by connecting a
capacitor from SS pin to ground. When the softstart begins, an internal 11µA current source
charges the external capacitor. During soft-start,
the soft-start capacitor connects to the noninverting input of the error amplifier. The soft-start
period continues until the voltage on the soft-start
capacitor exceeds the 0.8V reference. Then the
non-inverting amplifier uses the reference voltage
takes as the input. Use the following equation to
calculate the soft-start time:
t SS (ms) =
0.8V × Css(nF)
11μA
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9
MP1496 – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
Over-Current Protection and Hiccup
The MP1496 has a cycle-by-cycle over-current
limit when the inductor current peak exceeds the
set current-limit threshold. Meanwhile, output
voltage drops until FB falls below the undervoltage (UV) threshold—typically 50% below the
reference. Once UV triggers, the MP1496 enters
hiccup mode to periodically restart the part. This
protection mode is especially useful when the
output is dead-shorted to ground. This greatly
reduces the average short circuit current,
alleviates thermal issues, and protects the
regulator. The MP1496 exits hiccup mode once
the over current condition is removed.
If both VIN and EN exceed their appropriate
thresholds, the chip starts. The reference block
starts first, generating stable reference voltages
and currents, and then the internal regulator is
enabled. The regulator provides stable supply for
the remaining circuitries.
Three events can shut down the chip: EN low, VIN
low, and thermal shutdown. In shutdown, the
signaling path is first blocked to avoid any fault
triggering. The COMP voltage and the internal
supply rail are then pulled down. The floating
driver is not subject to this shutdown command.
Thermal Shutdown
Thermal shutdown prevents the chip from
operating at exceedingly high temperatures.
When the silicon die temperature exceeds 150°C,
the whole chip shuts down. When the
temperature drops below its lower threshold—
typically 130°C—the chip is enabled again.
Floating Driver and Bootstrap Charging
An external bootstrap capacitor powers the
floating power MOSFET driver. This floating
driver has its own UVLO protection with a rising
threshold of 2.2V and a hysteresis of 150mV.
The bootstrap capacitor voltage is regulated
internally by VIN through D1, M1, C4, L1 and C2
(see Figure 3). If (VIN-VSW) exceeds 5V, U1 will
regulate M1 to maintain a 5V BST voltage across
C4. A 10Ω resistor placed between SW and BST
cap. is strongly recommended to reduce SW
spike voltage.
Figure 3: Internal Bootstrap Startup and Shutdown
Charging Circuit
MP1496 Rev. 1.05
12/26/2012
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10
MP1496 – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
APPLICATION INFORMATION
Setting the Output Voltage
The external resistor divider sets the output
voltage (see the Typical Application on page 1).
The feedback resistor R1—in conjunction with
the internal compensation capacitor—also sets
the feedback loop bandwidth. R2 is then given
by:
R2 =
R1
VOUT
0.807V
−1
The T-type network shown in Figure 4 is highly
recommended.
FB
R1
RT
8
VOUT
R2
Figure 4: T-Type Network
Table 1 lists the recommended T-type resistor
values for common output voltages.
Table 1: Resistor Selection for Common Output
Voltages
VOUT (V)
R1 (kΩ)
R2 (kΩ)
Rt (kΩ)
1.0
20.5
82
82
1.2
30.1
60.4
82
1.8
40.2
32.4
56
2.5
40.2
19.1
33
3.3
40.2
13
33
5
40.2
7.68
33
Selecting the Inductor
Use a 1µH-to-10µH inductor with a DC current
rating of at least 25% percent higher than the
maximum load current for most applications.
Select an inductor with a DC resistance less
than 15mΩ for highest efficiency. For most
designs, the inductance value can be derived
from the following equation.
L1 =
VOUT × (VIN − VOUT )
VIN × ΔIL × fOSC
Where ΔIL is the inductor ripple current.
MP1496 Rev. 1.05
12/26/2012
Choose an inductor ripple current to be
approximately 30% of the maximum load
current. The maximum inductor peak current is:
IL(MAX ) = ILOAD +
ΔI L
2
Use a larger inductance for improved light-load
efficiency.
Selecting the Input Capacitor
The input current to the step-down converter is
discontinuous, and therefore requires a
capacitor to supply the AC current to the stepdown converter while maintaining the DC-input
voltage. Use low-ESR capacitors for best
performance, especially ceramic capacitors with
X5R or X7R dielectrics for their low ESR and
small temperature coefficients. For most
applications, use a 22µF capacitor.
Since the input capacitor (C1) absorbs the input
switching current, it requires an adequate ripple
current rating. Estimate the RMS current in the
input capacitor with:
I C1 = ILOAD ×
VOUT ⎛⎜ VOUT
× 1−
VIN ⎜⎝
VIN
⎞
⎟
⎟
⎠
The worse case condition occurs at VIN = 2VOUT,
where:
IC1 =
ILOAD
2
For simplification, choose an input capacitor
with an RMS current rating greater than half the
maximum load current.
The input capacitor can be electrolytic, tantalum
or ceramic. When using electrolytic or tantalum
capacitors, place a small, high quality ceramic
capacitor—e.g. 0.1μF—as close to the IC as
possible. When using ceramic capacitors, make
sure that they have enough capacitance to
provide sufficient charge to prevent excessive
voltage ripple at input. The input voltage ripple
caused by capacitance can be estimated by:
ΔVIN =
⎛
⎞
ILOAD
V
V
× OUT × ⎜ 1 − OUT ⎟
fS × C1 VIN ⎝
VIN ⎠
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11
MP1496 – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
Selecting the Output Capacitor
The output capacitor (C2) maintains the DC
output voltage. Use ceramic, tantalum, or low
ESR electrolytic capacitors. For best results,
use low-ESR capacitors to keep the output
voltage ripple low. The output voltage ripple can
be estimated by:
ΔVOUT
⎞
⎛ V ⎞ ⎛
V
1
= OUT × ⎜ 1 − OUT ⎟ × ⎜ RESR +
⎟
fS × L1 ⎝
VIN ⎠ ⎝
8 × fS × C2 ⎠
Figure 5: Optional External Bootstrap Diode to
Enhance Efficiency
Where L1 is the inductor value, and RESR is the
ESR value of the output capacitor.
The recommended external BST diode is
IN4148, and the BST capacitor value is 0.1µF
to 1μF.
For ceramic capacitors, the capacitance
dominates the impedance at the switching
frequency, and causes most of the output
voltage ripple. For simplification, the output
voltage ripple can be estimated by:
PC Board Layout (8)
PCB layout is very important to achieve stable
operation especially for VCC capacitor and
input capacitor placement. For best results,
follow these guidelines:
ΔVOUT =
⎛ V ⎞
VOUT
× ⎜ 1 − OUT ⎟
2
VIN ⎠
8 × fS × L1 × C2 ⎝
For tantalum or electrolytic capacitors, the ESR
dominates the impedance at the switching
frequency. For simplification, the output ripple
can be approximated to:
ΔVOUT =
VOUT ⎛
V
× ⎜ 1 − OUT
fS × L1 ⎝
VIN
⎞
⎟ × RESR
⎠
The characteristics of the output capacitor also
affect the stability of the regulation system. The
MP1496 can be optimized for a wide range of
capacitance and ESR values.
External Bootstrap Diode
An external bootstrap diode can improve the
regulator efficiency, given the following
applicable conditions:
z
VOUT is 5V or 3.3V; and
V
z Duty cycle is high: D= OUT >65%
VIN
1) Use large ground plane directly connect to
GND pin. Add vias near the GND pin if bottom
layer is ground plane.
2) Place the VCC capacitor to VCC pin and
GND pin as close as possible. Make the trace
length of VCC pin-VCC capacitor anode-VCC
capacitor cathode-chip GND pin as short as
possible.
3) Place the ceramic input capacitor close to IN
and GND pins. Keep the connection of input
capacitor and IN pin as short and wide as
possible.
4) Route SW, BST away from sensitive analog
areas such as FB. It’s not recommended to
route SW, BST trace under chip’s bottom side.
5) Place the T-type feedback resistor R9 close
to chip to ensure the trace which connects to
FB pin as short as possible
Notes:
8) The recommended layout is based on the Figure 6 Typical
Application circuit on the last page.
In these cases, use an external BST diode from
the VCC pin to BST pin, as shown in Figure 5.
MP1496 Rev. 1.05
12/26/2012
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12
MP1496 – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
GND
R1
C3
R3
C4
SW
7
6
5
2
3
4
R4
8
1
R9
C5
R2
C6
R6
R5
L1
C1
C1A
Vin
C2
Vout
C2A
GND
GND
EN/SYNC
BST
SW
GND
MP1496 Rev. 1.05
12/26/2012
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13
MP1496 – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
TYPICAL APPLICATION CIRCUITS
VIN 4.5-16V
2
C1A
NS
7
IN
1
C5
22nF
R4
10
MP1496
VCC
SW
R5
28.7k
3.3V
3
SS
R1
40.2k
6
R6
11k
BST 5
EN/SYNC
FB
8
R9
33k
GND
4
C3
15pF
R3
0
R2
13k
Figure 6: 12VIN, 3.3V/2A
MP1496 Rev. 1.05
12/26/2012
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14
MP1496 – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
PACKAGE INFORMATION
TSOT23-8
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not
assume any legal responsibility for any said applications.
MP1496 Rev. 1.05
12/26/2012
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15