MPS NB650GL

NB650/NB650H
High-Effeciency, Fast-Transient, 6A, 28V
Synchronous Step-Down Converters with 2-Bit VID
The Future of Analog IC Technology
DESCRIPTION
FEATURES
The NB650/NB650H is fully-integrated, highfrequency, synchronous, rectified, step-down,
switch-mode converters with dynamic-output–
voltage control. It offers a very compact solution
to achieve 6A of continuous output current over
a wide input supply range, and has excellent
load and line regulation. The NB650/NB650H
operates at high efficiency over a wide outputcurrent–load range.
•
•
•
•
Constant-On-Time control mode provides fast
transient response and eases loop stabilization.
•
•
•
•
•
2-bit VID inputs support changing the output
voltage on-the-fly.
•
Full protection features include short-circuit
protection, over-current protection, over-voltage
protection, under-voltage protection, and
thermal shut down.
•
•
•
The NB650/NB650H requires a minimal number
of
readily-available
standard
external
components, and is available in a space-saving
3mm×4mm QFN17 package.
Wide 4.5V-to-28V Operating Input Range
6A Output Current
Internal 50mΩ High-Side, 18mΩ Low-Side
Power MOSFETs
Proprietary Switching Loss Reduction
Technique
1% Reference Voltage
Programmable Soft-Start Time
2-bit VID Input
Soft Shutdown
Frequency Programmable from 150kHz to
1MHz
SCP, OCP, OVP, UVP, and Thermal
Shutdown
Optional OCP Protection: Latch-Off Mode
(NB650) and Hiccup Mode (NB650H)
Output Adjustable from 0.6V to 13V
Available in QFN17 (3mm×4mm) Package
APPLICATIONS
•
•
•
•
•
Notebook Systems and I/O Power
Networking Systems
Digital Set Top Boxes
Flat-Panel Televisions and Monitors
Distributed Power Systems
All MPS parts are lead-free and adhere to the RoHS directive. For MPS green
status, please visit MPS website under Quality Assurance. “MPS” and “The
Future of Analog IC Technology” are Registered Trademarks of Monolithic
Power Systems, Inc.
TYPICAL APPLICATION (FOR NOTEBOOK)
VIN
11
C1
R6
R7
ON/OFF
17
5
8
C5
ON/OFF
SW
FREQ
3
1,2
C3
L1
C4
R4
R1
NB650
NB650H
VCC
FB
7
RFB2
VID1
RFB1 15
SS
PGND
9,10
GND
R2B
R2A
14
PG
VID2
C2
13
R2C
6
VOUT
EN
R5
4
ON/OFF
BST
IN
16
C6
12
NB650/NB650H Rev. 1.12
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10/11/2012
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© 2012 MPS. All Rights Reserved.
1
NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
ORDERING INFORMATION
Part Number
Package
NB650GL*
Top Marking
NB650
QFN17 (3 x 4mm)
NB650HGL**
NB650H
* For Tape & Reel, add suffix –Z (e.g. NB650GL–Z)
** For Tape & Reel, add suffix –Z (e.g. NB650HGL–Z)
PACKAGE REFERENCE
TOP VIEW
SW
SW
FREQ
SS
17
16
1
15
14
13
AGND
12
IN
11
IN
GND
10
GND
GND
9
GND
SW
2
3
RFB1 RFB2 FB
SW
4
5
6
7
8
BST PG EN VID1 VID2 VCC
EXPOSED PAD
ON BACKSIDE
QFN17 (3x4mm)
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance
Supply Voltage VIN ....................................... 28V
VSW ........................................-0.3V to VIN + 0.3V
VSW ..............................-3V to VIN + 3V for <30ns
VBST ...................................................... VSW + 6V
All Other Pins ..................................-0.3V to +6V
Continuous Power Dissipation
(TA = +25°C) (2)
QFN17 ….……………………… ……….2.4W
Junction Temperature ...............................150°C
Lead Temperature ....................................260°C
Storage Temperature............... -65°C to +150°C
QFN17(3 x 4mm) ....................52 .... 11 .. °C/W
Recommended Operating Conditions
(3)
Supply Voltage VIN ........................4.5V to 22.5V
Output Voltage VOUT .........................0.6V to 13V
Operating Junction Temp. (TJ). -40°C to +125°C
(4)
θJA
θJC
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ(MAX), the junction-toambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD(MAX)=(TJ(MAX)TA)/ θJA. Exceeding the maximum allowable power dissipation
will cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
NB650/NB650H Rev. 1.12
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© 2012 MPS. All Rights Reserved.
2
NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
ELECTRICAL CHARACTERISTICS
VIN = 12V, TJ = +25°C, unless otherwise noted.
Parameters
Input Supply Current (Shutdown)
Input Supply Current (Quiescent)
Switch Leakage
Current Limit
One-Shot On Time
Minimum Off Time
Fold-back Off Time(5)
OCP hold-off time(5)
Feedback Voltage
Feedback Current
Soft Start Charging Current
Soft Stop Charging Current
EN Input Low Voltage
EN Input High Voltage
EN Input Current
OVP Feedback Threshold
UVP Feedback Threshold(5)
VID Inputs Low Voltage
VID Inputs High Voltage
VID Inputs Current
Equivalent FB Slew Rate During VID
On-The-Fly(5)
VID Switch On Resistance(5)
Power Good Rising Threshold
Power Good Falling Threshold
Power Good Delay
Power Good Sink Current Capability
Power Good Leakage Current
Standby Mode Delay Time(5)
VIN Under Voltage Lockout Threshold
Rising
VIN Under Voltage Lockout Threshold
Hysteresis
Thermal Shutdown(5)
Symbol
IIN
IIN
SWLKG
ILIMIT
tON
tOFF
tFB
tOC
VFB
IFB
ISS
ISS
VILEN
VIHEN
IEN
Condition
VEN = 0V
VEN = 2V, VFB =0.65V
VEN = 0V, VSW = 0V or 12V
tON>200ns
RFREQ=200kΩ, VOUT=1.2V
RFREQ=200kΩ
ILIM=1
ILIM=1
Min
8
594
VFB = 600mV
VSS=0V
VSS=0.6V
Typ
0
400
0
10
200
100
1.2
50
600
10
10
10
Max
1
606
100
0.4
2
VEN = 2V
VEN = 0V
VFB-OV
VFB-UV
VILVID
VIHVID
IVID
1.5
0
0.8
0.4
Units
μA
μA
μA
A
ns
ns
μs
μs
mV
nA
μA
μA
V
V
μA
0
V
V
V
V
μA
SRFB
±20
mV/μs
VIDRDS-ON
PGVth-Hi
PGVth-Lo
PGTd
VPG
IPG_LEAK
tSTANDBY
100
0.9
0.85
0.5
12
Ω
VFB
VFB
ms
V
nA
μs
INUVVth
4
V
INUVHYS
800
mV
TSD
150
°C
0.4
2
Sink 4mA
VPG = 3.3V
0.4
10
Note:
5) Not tested. Not guaranteed.
NB650/NB650H Rev. 1.12
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10/11/2012
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© 2012 MPS. All Rights Reserved.
3
NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
PIN FUNCTIONS
QFN17
Pin #
1,2
Name
SW
3
BST
4
PG
5
EN
6,7
VID1
VID2
8
VCC
9,10
GND
11
IN
12
AGND
13
FB
14,15
RFB2
RFB1
16
SS
17
FREQ
Description
Switch Output. Connect using wide PCB traces.
Bootstrap. Requires a capacitor between SW and BST to form a floating supply across
the high-side switch driver.
Power Good. Output is an open drain and is high if the output voltage exceeds 90% of
the nominal voltage. There is a delay from FB≥90%×Vref to PG goes high.
EN=1 to enable. For automatic start-up, connect to VIN with a 100kΩ resistor.
VID inputs. Control signals for the output-voltage scaling. Acts as the control signals for
the internal VID switches. Usually uses an external resistor in parallel with the low-side
FB resistor. Changing the VID ON/OFF state changes the FB divider scaling and result
in different output voltages.
Internal LDO output. The power supply of the internal control circuits. Decouple with 1μF
capacitor.
System Ground. The reference ground of the regulated output voltage. Layout requires
extra care.
Supply Voltage. Operates from a 4.5V-to-28V input rail. Requires C1 to decouple the
input rail. Connect using wide PCB traces.
Analog Ground.
Feedback. Connect to the tap of an external resistor divider from the output to GND to
set the output voltage.
Drain of the internal VID switches. Typically uses an external resistor in parallel with the
low-side FB resistor along with the internal VID switch to change the ON/OFF state of
the VID switching to change the FB divider scaling and result in different output
voltages.
Soft-Start. Connect an external capacitor to program the soft-start time for the switchmode regulator.
Frequency Set during CCM. The input voltage and the frequency-set resistor between
the IN and FREQ pin determines the ON period. For best results, use an ON period
longer than 200ns. Decouple with a 1nF capacitor.
NB650/NB650H Rev. 1.12
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10/11/2012
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© 2012 MPS. All Rights Reserved.
4
NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
TYPICAL PERFORMANCE CHARACTERISTICS
VIN=12V, VOUT =1.05V, L=1µH, TA=+25°C, unless otherwise noted.
NB650/NB650H Rev. 1.12
www.MonolithicPower.com
10/11/2012
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© 2012 MPS. All Rights Reserved.
5
NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN=12V, VOUT =1.05V, L=1µH, TA=+25°C, unless otherwise noted.
NB650/NB650H Rev. 1.12
www.MonolithicPower.com
10/11/2012
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© 2012 MPS. All Rights Reserved.
6
NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN=12V, VOUT =1.05V, L=1µH, TA=+25°C, unless otherwise noted.
Start-Up Through EN
Start-Up Through EN
Shutdown Through EN
IOUT = 0A
IOUT = 6A
IOUT = 0A
VOUT
500mV/div.
VOUT
500mV/div.
VEN
5V/div.
VSW
10V/div.
IL
2A/div.
VEN
5V/div.
VSW
10V/div.
VOUT
500mV/div.
VEN
5V/div.
VSW
10V/div.
IL
10A/div.
VOUT(AC)
50mV/div.
VSW
10V/div.
VOUT
500mV/div.
VEN
5V/div.
VSW
10V/div.
IL
2A/div.
IL
10A/div.
Shutdown Through EN
Short Circuit Protection
OCP Protection
IOUT = 6A
NB650, Latch-Off Version
NB650, Latch-Off Version
VOUT
500mV/div.
VSW
10V/div.
VOUT
500mV/div.
VSW
10V/div.
IL
5A/div.
IL
5A/div.
VID On-the-fly
VID On-the-fly
IOUT = 0.3A
FVID1 = 1kHz, FVID2 = 0.5kHz,
VOUT = 1.05V/1.1V/1.15V/1.2V
IOUT = 6A
FVID1 = 1kHz, FVID2 = 0.5kHz,
VOUT = 1.05V/1.1V/1.15V/1.2V
VID1
5V/div.
VID1
5V/div.
VID2
5V/div.
VID2
5V/div.
VOUT(AC)
100mV/div.
VOUT(AC)
100mV/div.
IL
5A/div.
NB650/NB650H Rev. 1.12
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10/11/2012
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© 2012 MPS. All Rights Reserved.
7
NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
FUNCTIONAL BLOCK DIAGRAM
IN
Current Sense
Amplifer
FREQ
+
-
5V LDO
VCC
Over-Current
Timer
REFERENCE
EN
ILIM
+
-
HS Ilimit
Comparator
BST
BSTREG
OFF
Timer
xS Q
HS
Driver
PWM
HS_MOS
0.8V
0
SS
Refresh
Timer
0.4V
1M E G
RSEN
OC
xR
0.6V
LOGIC
SW
SOFT
START/STOP
VCC
+
+
-
FB
START
ON
Timer
LS_MOS
LS
Driver
Loop
Comparator
PGOOD
Current
Modulator
+
+
-
-
PGOOD
Comparator
VID1
GND
UV Detect
Comparator
0
DRAIN1
UV
+
MUX1
1
OV
-
AGND
0
OV Detect
Comparator
2
0
DRAIN2
VID2
MUX2
1
2
0
VIDSL
Figure 1: Functional Block Diagram
NB650/NB650H Rev. 1.12
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10/11/2012
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NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
OPERATION
PWM Operation
The NB650/NB650H is a fully-integrated,
synchronous, rectified, step-down, switch-mode
converter with dynamic output voltage control. It
offers a very compact solution to achieve a 6A
continuous output current over a wide input
supply range, with excellent load and line
regulation. The NB650/NB650H operates at high
efficiency over a wide output current load range.
Constant-on-time (COT) provides a fast transient
response and easy loop stabilization. At the
beginning of each cycle, the high-side MOSFET
(HS-FET) turns on when the feedback voltage
(VFB) falls below the reference voltage (VREF),
which indicates an insufficient output voltage.
The input voltage and the frequency-set resistor
determine the ON as follows:
t ON (ns) =
9.6 × RFREQ (kΩ)
+ tDELAY1(ns)
VIN (V) − 0.4
(1)
Where tDELAY1 is the 20ns delay of a comparator
in the tON module.
For best results, select tON ≥120ns.
After the ON period elapses, the HS-FET turns
off to enter the OFF state. The part turns ON
again when VFB drops below VREF. By repeating
this operation, the converter regulates the output
voltage. The integrated low-side MOSFET (LSFET) turns on when the HS-FET is OFF to
minimize conduction loss. There is a dead short
between input and GND (shoot-through) if both
HS-FET and LS-FET turn on at the same time.
An internally-generated dead-time (DT) between
HS-FET OFF and LS-FET ON, or LS-FET OFF
and HS-FET OFF avoids shoot-through.
Figure 2: Heavy-Load Operation
Light-Load Operation
When the load current decreases, the
NB650/NB650H automatically reduces the
switching frequency to maintain high efficiency.
Figure 3 shows the light-load operation. VFB does
not reach VREF when the inductor current
approaches zero. As the output current drops
from heavy-load condition, the inductor current
also decreases and eventually approaches zero.
The LS-FET driver enters a tri-state (high-Z)
whenever the inductor current reaches zero. A
current modulator takes control of the LS-FET
and limits the inductor current to less than 600μA
to slowly discharge the output capacitors to GND
through LS-FET as well as R1 and R2A, R2B
and R2C. The HS-FET does not turn ON as
frequently as in heavy-load condition. As a result,
the efficiency at light-load condition increases
greatly. This operation mode is also called skip
mode.
Heavy-Load Operation
As shown in Figure 2, the HS-FET and LS-FET
repeatedly turn on/off when the output current is
high, and the inductor current never goes to zero.
It’s called continuous-conduction-mode (CCM)
operation. In CCM operation, the switching
frequency (fSW) is fairly constant.
Figure 3: Light-Load Operation
As the output current increases from the lightload condition, the time period within which the
current modulator regulates becomes shorter.
As the part exits light-load mode, the HS-FET
turns on more frequently to increase the switching
frequency. The output current reaches critical
when the current modulator time is zero. The
NB650/NB650H Rev. 1.12
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NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
following equation determines the critical level of
the output current:
IOUT =
(VIN − VOUT ) × VOUT
2 × L × fSW × VIN
(2)
When the output current exceeds the critical level,
light load mode turns into PWM mode, and the
switching frequency stays fairly constant over the
output current range.
Switching Frequency
The NB650/NB650H uses constant-on-time
(COT) control, and has no dedicated internal
oscillator. The input voltage is feed-forwarded to
the on-time one-shot timer through the resistor
RFREQ. The duty ratio is kept as VOUT/VIN. Hence,
the switching frequency is fairly constant over the
input voltage range. The switching frequency can
be set as follows:
⎡⎛ 9.6 × R FREQ (kΩ )
⎞ ⎤
+ t DELAY1 (ns) ⎟⎟ ×⎥
⎢⎜⎜
−
0
4
V
(
V
)
.
⎠ ⎥
IN
f SW (kHz ) = ⎢⎝
⎢ V (V)
⎥
⎢ IN
⎥
+ t DELAY 2 (ns)
⎣⎢ VOUT ( V )
⎦⎥
Jitter and FB Ramp Slope
Figure 5 and Figure 6 show jitter in both PWM
and skip modes. When there is noise in the VFB
downward slope, the ON time of HS-FET
deviates from its intended level and produces
jitter. There is a relationship between a system’s
stability and the steepness of the VFB ripple’s
downward slope: The steepness of the VFB
ripple’s slope dominates in noise immunity. The
magnitude of the VFB ripple doesn’t directly affect
the noise immunity.
−1
× 10
6
(3)
Figure 5: Jitter in PWM Mode
Where tDELAY2 is another comparator delay of
about 40ns.
Figure 6: Jitter in Skip Mode
Ramp with Large ESR Cap
When using POSCAPs or other types of
capacitors with larger ESR as output capacitors.
the ESR ripple dominates the output ripple, and
the slope on the FB is ESR-related. Figure 7
shows an equivalent circuit in PWM mode with
the HS-FET off and without an external ramp
circuit. The application section includes design
steps for large ESR capacitors.
Figure 4: Plot of VOUT as a Function of RFREQ and
the Frequency
NB650/NB650H is optimized to operate at high
switching frequencies at high efficiency. Higher
switching frequencies allow for smaller LC filter
components to reduce system PCB space.
NB650/NB650H Rev. 1.12
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NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
And R2 is the equivalent resistor from FB to GND
that varies with VID input, the ramp on the VFB
can then be estimated as:
VRAMP =
Figure 7: Simplified Circuit in PWM Mode without
External Ramp Compensation
To realize the stability without the use of an
external ramp, select an ESR value as follows:
RESR
t SW
t
+ ON
≥ 0.7 × π 2
COUT
(4)
VIN − VO
R1 // R2
× t ON ×
R 4 × C4
R1 // R2 + R9
Usually R9 is set to 0Ω, then equation 7 can be
simplified as:
VRAMP =
Ramp with Small ESR Capacitor
The ESR ripple when using ceramic output
capacitors is not high enough to stabilize the
system and requires an external compensation
ramp. The application section includes a
description of designing with small ESR
capacitors.
( VIN − VO ) × τ ON
R 4 × C4
(8)
The downward slope of the VFB ripple then
follows
VSLOPE1 =
Where tSW is the switching period.
(7)
− VOUT
− VRAMP
=
t off
R 4 × C4
(9)
As shown in equation 8, if there is instability in
PWM mode, we can reduce either R4 or C4. If
C4 can not be reduced further due to limitations
from equation 5, then we can only reduce R4.
For a stable PWM operation, the Vslope1 should be
designed as follows.
t SW
t
+ ON -RESRCOUT
Io ×10−3
(10)
-Vslope1 ≥ 0.7 × π 2
VOUT +
2 × L × COUT
t SW -t on
Where IO is the load current.
In skip mode, the downward slope of the VFB
ripple is almost the same with or without the
external ramp. Figure 9 shows the simplified
circuit of the skip mode when both HS-FET and
LS-FET are off.
Figure 8: Simplified Circuit in PWM Mode with
External Ramp Compensation
Figure 7 shows a simplified equivalent circuit in
PWM mode with the HS-FET OFF and an
external ramp compensation circuit (R4, C4). The
external ramp is derived from the inductor ripple
current. If one chooses C4, R9, R1 and R2 to
meet the following condition:
1
2π × fSW × C4
<
⎞
1 ⎛ R1 × R 2
×⎜
+ R9 ⎟
5 ⎝ R1 + R 2
⎠
(5)
Where:
IR4 = IC4 + IFB ≈ IC4
(6)
Figure 9: Simplified Circuit in Skip Mode
The downward slope of the VFB ripple in skip
mode can be determined as:
VSLOPE2 =
− VREF
((R1 + R2 ) // Ro) × COUT
NB650/NB650H Rev. 1.12
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(11)
11
NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
Where RO is the equivalent load resistor.
As described in Figure 6, VSLOPE2 in skip mode is
smaller than VSLOPE1 in PWM mode, so the jitter in
the skip mode is larger. For less jitter during
ultra-light–load conditions, select smaller VFB
resistors, though at the cost of light-load
efficiency.
VID Input
Typically, R1 and R2 set the output voltage with
VFB=0.6V. R2, in this case, is a combination of
R2A, R2B, and R2C depends on the VID, which
is active low. The NB650/NB650H can
dynamically track VID codes as they change. As
a result, the converter output voltage can change
without the need to reset either the controller or
the value of R1 and R2A. As shown in Figure 1,
R2B and R2C are parallel with R2A. The
equivalent value of R2 can change due to
different VID codes. One can get four VOUT
values depending on the VID codes with the
details in the application information. The VID
logic and equivalent R2s are shown in Table 1.
Table 1: VID Logic
VID2
VID1
R2
1
1
R2 = R2A
1
0
R2 = R2A // R2B
0
1
R2 = R2A // R2C
0
0
R 2 = R 2A // R 2B // R 2C
Enable Control
The NB650/NB650H has a dedicated Enable
control pin (EN). Pulling this pin high or low
enables or disables the IC. Tie EN to VIN through
a resistor for automatic start-up.
Soft Start/Stop
The NB650/NB650H employs a soft-start/stop
(SS) mechanism to ensure smooth output during
power-up and power shutdown. When the EN pin
goes high, an internal current source (10μA)
charges up the SS capacitor. The SS capacitor
voltage then acts as the VREF voltage to the PWM
comparator. The output voltage smoothly ramps
up with the SS voltage. Once the SS voltage
reaches the same level as the REF voltage, it
continues ramping up while the REF voltage
becomes the reference to the PWM comparator.
At this point, the soft-start finishes and it enters
steady-state operation.
When the EN pin goes low, a 10µA internal
current source discharges the SS capacitor.
Once the SS voltage reaches the REF voltage,
acts as the reference to the PWM comparator.
The output voltage decreases smoothly with the
SS voltage until it reaches zero level. Determine
the SS capacitor as follows:
C SS (nF) =
t SS (ms ) × ISS (μA )
VREF ( V )
(12)
If the output capacitors have large capacitance
values, avoid setting a short SS time. Use a
minimum value of 4.7nF if the output capacitance
value exceeds 330µF.
Power Good
The NB650/NB650H has power-good (PG)
output. The PG pin is the open drain of a
MOSFET. Connect to VCC or another voltage
source through a resistor (e.g. 100kΩ). The
MOSFET turns ON after the application of the
input voltage so that the PG pin is pulled to GND
before the SS is ready. After the FB voltage
reaches 90% of the reference voltage, the PG pin
is pulled high after a delay.
The PG delay is determined as follows:
t PG (ms ) =
4 × t SS (ms )
9
(13)
When the FB voltage drops to 90% of the
reference voltage, the PG pin is pulled low.
Over-Current Protection and Short-Circuit
Protection
The NB650/NB650H has cycle-by-cycle overcurrent limit control. The inductor current is
monitored during the ON state. Once the inductor
current hits the current limit, the HS-FET turns off.
At the same time, the over-current protection
(OCP) timer starts. The OCP timer is set as 50μs.
If the current limit is hit for every cycle within that
50μs period, then OCP will trigger.
When the output is shorted to ground, the device
hits its current limit and the FB voltage is less
than 0.4V. The device treats this as a dead-short
NB650/NB650H Rev. 1.12
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NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
on the output and triggers OCP immediately. This
is short circuit protection (SCP).
Under OCP/SCP condition, NB650 will latch off.
The converter needs power cycle to restart.
NB650H will try to recover from OCP/SCP fault
with hiccup mode. That means in OCP/SCP
protection, the NB650H will disable the output
power stage, discharge soft-start capacitor and
then automatically try to start again. If the overcurrent condition still holds after soft-start ends,
the NB650H repeats this operation cycle till overcurrent fault is removed and output rises back to
regulation level.
Over/Under-Voltage Protection
The NB650/NB650H monitors the output voltage
through the FB voltage to detect overvoltage and
under voltage on the output. When the FB
voltage exceeds 0.8V, the over-voltage
protection (OVP) triggers. Once OVP triggers,
the LS-FET is always on while the HS-FET is
always off. The device needs to power cycle to
power up again. Under-voltage protection (UVP)
triggers when the FB voltage is below 0.4V.
Usually, UVP accompanies hitting the current
limit, which results in SCP.
UVLO Protection
The NB650/NB650H has under-voltage lockout
(UVLO) protection. When VIN exceeds the UVLOrising threshold voltage, the NB650/NB650H
powers up. It shuts off when VIN falls below the
UVLO-falling threshold voltage. This is non-latch
protection.
Thermal Shutdown
The NB650/NB650H employs thermal shutdown
by internally monitoring the temperature of the
junction. If the junction temperature exceeds the
threshold value (typically 150°C), the converter
shuts off. This is non-latch protection. There is
about 25°C hysteresis. Once the junction
temperature drops to around 125°C, it initiates a
soft-start.
NB650/NB650H Rev. 1.12
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NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
APPLICATION INFORMATION
Setting the Output Voltage-Large ESR Caps
A resistor divider from the output voltage to the
FB pin sets the output voltage. Changing the VID
codes for the NB650/NB650H accomplishes the
same thing.
When there is no external ramp, the output
voltages are set by feedback resistors R1 and
R2A, R2B and R2C. First, choose R1 within 5kΩto-100kΩ to ensure stable operation. VOUT1, VOUT2,
VOUT3 and VOUT4 are the voltages at different VID
codes, arranged from low to high. Then
determine R2A, R2B and R2C as follows:
R2A =
R2B =
R2C =
VREF
× R1
VOUT1 − ΔVOUT − VREF
1
2
VOUT2 − 21 ΔVOUT2
VREF
1
− VREF
×
R2B =
1
1
+
) × (VOUT1 − VFB(AVG) )
R1 R4 + R9
VOUT2 − VFB(AVG)
VFB(AVG)
R2C =
VOUT3 − VFB(AVG)
VFB(AVG)
(19)
1
1
1
1
×( +
)−
R1 R4 + R9 R2A
(20)
1
1
1
1
×( +
)−
R1 R4 + R9 R2A
And VOUT4 also can be calculated with equation
17.
(15)
The VFB(AVG) is the average value on FB. VFB(AVG)
varies with the VIN, VO, and load condition; its
value in skip mode is lower than in PWM mode,
which means the load regulation is strictly related
to the VFB(AVG). Also the line regulation is related
to the VFB(AVG); use a lower VRAMP that meets the
conditions of equation 10 for better load or line
regulation.
(16)
VOUT4 can be calculated as:
VOUT4 =
(
(14)
1
1
−
R1 R2A
1
VOUT3 − 21 ΔVOUT3 − VREF 1
1
×
−
VREF
R1 R2A
Choose R1 within 5kΩ-to-100kΩ. The value of
R2 then is determined as follows:
VFB(AVG)
(18)
R2A =
VREF × (R1 + R2A // R2B // R2C) 1
+ 2 ΔVOUT4 (17)
R2A // R2B // R2C
Where ΔVOUT x is the output ripple determined by
equation 30.
Setting the Output Voltage-Small ESR Caps
For PWM operation, estimate VFB(AVG) from the
following equation:
VFB(AVG) = VREF +
When using a low-ESR ceramic capacitor on the
output, add an external voltage ramp to FB
through resistor R4 and capacitor C4. The ramp
voltage, VRAMP, influences the output voltage
besides the resistor divider shown in Figure 10.
Equation 7 calculates VRAMP.
(21)
Usually, R9 is set to 0Ω, and it can also be set
following equation 22 for better noise immunity.
Set the value to <(1/5)×R1//R2 to minimize its
influence on VRAMP.
R9 ≤
Figure 10: Simplified Ceramic Capacitor Circuit
R1//R2
1
VRAMP×
R1//R2 + R9
2
1
2π × C4 × 2f SW
(22)
Using equations 18 through 20 to calculate the
output voltage can be complicated. Furthermore,
as VRAMP changes due to changes in VOUT and VIN,
VFB also varies. To improve the output voltage
accuracy and simplify the R2A, R2B and R2C
calculations, add a DC-blocking capacitor (CDC)
to filter the DC influence from R4 and R9. Figure
11 shows a simplified circuit with external ramp
compensation and a DC-blocking capacitor. The
addition of this capacitor simplifies the R2A, R2B
and R2C calculations, as per equations 23-25.
NB650/NB650H Rev. 1.12
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NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
1
VRAMP
2
R2A =
1
1
× (VOUT1 − VREF − VRAMP )
R1
2
VREF +
(24)
1
R2B =
1
×
R1
(VOUT2 − VREF −
current of the converter. The input ripple current
can be estimated as:
VOUT
V
ICIN = IOUT ×
× (1 − OUT )
(26)
VIN
VIN
The worst-case condition occurs at:
1
VRAMP )
1
2
−
R2A
ICIN =
1
VREF + VRAMP
2
(25)
1
R2C =
1
×
R1
(23)
(VOUT3 − VREF −
VREF +
1
VRAMP )
1
2
−
R2A
1
VRAMP
2
Select CDC>10×C4 for better DC blocking, but
select a value less than 0.47µF when considering
start up performance. For larger CDC values for
better FB noise immunity, combine with reduced
R1 and R2 to limit the CDC to a reasonable value
without affecting system start-up. Note that even
with CDC, the load and line regulation are still
related to VRAMP.
IOUT
2
(27)
For simplification, choose an input capacitor
whose RMS current rating is greater than half of
the maximum load current.
The input capacitance value determines the input
voltage ripple of the converter. If the system
requires a specific input voltage ripple, choose
the input capacitor that meets the specification.
The input voltage ripple can be estimated as:
ΔVIN =
IOUT
V
V
× OUT × (1 − OUT )
fSW × CIN
VIN
VIN
(28)
The worst-case condition occurs at VIN = 2VOUT,
where:
ΔVIN =
I
1
× OUT
4 fSW × CIN
(29)
Output Capacitor
The output capacitor maintains the DC output
voltage. Use ceramic or POSCAP capacitors.
The output voltage ripple can be estimated as:
Figure 11: Simplified Circuit with Ceramic DCBlocking Capacitor
Input Capacitor
The input current to the step-down converter is
discontinuous, and therefore requires a capacitor
to supply the AC current to the step-down
converter while maintaining the DC input voltage.
Use ceramic capacitors for best performance.
The capacitance varies significantly over
temperature. Capacitors with X5R and X7R
ceramic dielectrics are recommended because
they are fairly stable over temperature.
In the layout, place the input capacitors as close
to the IN pin as possible.
The capacitors must also have a ripple current
rating greater than the maximum input ripple
For POSCAP capacitors, the ESR dominates the
impedance at the switching frequency. The ramp
ΔVOUT =
VOUT
V
1
× (1 − OUT ) × (RESR +
) (30)
fSW × L
VIN
8 × fSW × COUT
Where RESR is the equivalent series resistance
(ESR) of the output capacitor.
For ceramic capacitors, the capacitance
dominates the impedance at the switching
frequency, and causes the majority of the output
voltage ripple. For simplification, the output
voltage ripple can be estimated as:
ΔVOUT =
VOUT
V
× (1 − OUT )
VIN
8 × fSW × L × COUT
2
(31)
The output voltage ripple caused by ESR is very
small, and therefore requires an external ramp to
stabilize the system. The external ramp can be
generated through resistor R4 and capacitor C4
following equations 5, 9 and 10.
voltage generated from the ESR is high enough
to stabilize the system. Therefore, an external
NB650/NB650H Rev. 1.12
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NB650/NB650H – 6A, 28V, FAST TRANSIENT SYNCHRONOUS STEP-DOWN CONVERTER
ramp is not needed. A minimum ESR value of
12mΩ is required to ensure stable operation of
the converter. For simplification, the output ripple
can be approximated as:
ΔVOUT =
VOUT
V
× (1 − OUT ) × RESR
fSW × L
VIN
(32)
Inductor
The inductor supplies constant current to the
output load while being driven by the switching
input voltage. A larger value inductor results in
less ripple current, which results in lower output
ripple voltage. However, a larger value inductor is
physically larger, has a higher series resistance,
and/or lower saturation current. To determine the
inductor value, allow the inductor peak-to-peak
ripple current to reach approximately 30% to 40%
of the maximum switch current limit. Make sure
that the peak inductor current is below the
maximum switch current limit. The inductance
value can be calculated as:
VOUT
V
L=
× (1 − OUT )
(33)
fSW × ΔIL
VIN
Where ΔIL is the peak-to-peak inductor ripple cur
rent.
Choose an inductor that will not saturate under
the maximum inductor peak current. The peak
inductor current can be calculated as:
VOUT
V
ILP = IOUT +
× (1 − OUT )
(34)
2fSW × L
VIN
NB650/NB650H Rev. 1.1
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NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
TYPICAL APPLICATION
11
VIN
R7
205k
R5
100k
17
C7
1nF
5
8
R10
1Meg
BST
IN
FREQ
EN
3
4.7
1, 2
SW
NB650
NB650H
R6
100k
R11
1Meg
4
6
R1
12.1k
R2C
73.2k
14
RFB2
PG
VOUT
13
FB
VCC
R3
R2B
143k
R2A
16.5k
15
RFB1
VID1
7 VID2
SW1
16
SS
PGND
9, 10
C6
100nF
GND
12
Figure 12: Typical Application Circuit with No External Ramp
VIN = 12V, VOUT = 1.05/1.15/1.20V, IOUT = 6A, fSW = 550kHz
11
VIN
R7
205k
R5
100k
17
C7
1nF
5
8
R10
1Meg
BST
IN
FREQ
EN
SW
NB650
NB650H
FB
VCC
R6
100k
R11
1Meg
4
6
RFB2
PG
RFB1
R3
4.7
1, 2
R4
274k 330pF
R9
0
13
14
R2C
69.8k
VOUT
C4
R2B
140k
R1
12.1k
R2A
16k
15
VID1
7 VID2
SW1
3
PGND
9, 10
SS
GND
12
16
C6
100nF
Figure 13: Typical Application with Low-ESR Ceramic Capacitor
VIN = 12V, VOUT = 1.05/1.10/1.15/1.20V, IOUT = 6A, fSW = 550kHz
NB650/NB650H Rev. 1.12
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NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
11
VIN
R7
205k
R5
100k
17
C7
1nF
5
8
R10
1Meg
BST
IN
FREQ
EN
SW
NB650
NB650H
FB
VCC
R6
100k
R11
1Meg
4
6
RFB2
PG
RFB1
3
R3
4.7
1, 2
R4
274k 330pF
Cdc
100nF
13
R2B
147k
R2C
73.2k
14
VOUT
C4
R1
12.1k
R2A
16.9k
15
VID1
7 VID2
SW1
SS
PGND
9, 10
16
C6
100nF
GND
12
Figure 14: Typical Application Circuit with Low-ESR Ceramic Capacitor and DC-Blocking Capacitor
VIN =12V, VOUT = 1.05/1.10/1.15/1.20V, IOUT = 6A, fSW = 550kHz
11
VIN
R7
300k
R5
100k
17
C7
1nF
5
8
R10
1Meg
R11
1Meg
BST
IN
FREQ
EN
SW
NB650
NB650H
FB
VCC
R6
100k
4
6
RFB2
PG
RFB1
R3
4.7
1, 2
R4
13
14
R2C
23.2k
VOUT
C4
340k 330pF
R9
0
R1
5.76k
R2B
34.8k
R2A
97.6k
15
VID1
7 VID2
SW1
3
PGND
9, 10
SS
GND
12
16
C6
100nF
Figure 15: Typical Application Circuit
VIN = 19V, VOUT = 0.65/0.75/0.80/0.90V, IOUT = 6A
NB650/NB650H Rev. 1.12
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NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
LAYOUT RECOMMENDATIONS
1. Place the high current paths (GND, IN, and
SW) as close to the device as possible with
direct, short, and wide traces.
2. Use a 0.1μF input decoupling capacitor to
connect the IN and GND pins. Put the input
decoupling capacitor and input capacitors as
close to the IN and GND pins as possible.
3. Put the VCC decoupling capacitor as close to
the VCC and GND pins as possible.
4. Keep the switching node SW short and away
from the feedback network.
5. Place the external feedback resistors next to
the FB pin. Make sure that there is no via on
the FB trace.
6. Keep the BST voltage path (BST, CBST, and
SW) as short as possible.
7. Connect the bottom IN and SW pads to large
copper areas to achieve better thermal
performance.
8. Use a four-layer layout to achieve better
thermal performance.
R3
C4
R3
R1
R3
R4
Inner1 Layer
SW
L1
SW
SS
RFB1
17
16
15
RFB2
FB
14
13
AGND
12
IN
11
IN
PGND
10
PGND
PGND
9
PGND
Inner2 Layer
SW
1
C1
SW
FREQ
R3
R2A
R3
R2C
R3
R7
R2B
R3
GND
SW
2
R3
C5
R3
C3
4
5
6
7
8
PG
EN
VID1
VID2
VCC
R3
R5
3
BST
GND
VOUT
VIN
SW1
C2
Top Layer
Bottom Layer
Figure 16: PCB Layout Guide
NB650/NB650H Rev. 1.12
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NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS
PACKAGE INFORMATION
QFN17 (3 x 4mm)
1.00
BSC
0.35
0.45
2.90
3.10
0.50
0.70
17
12
PIN 1 ID
MARKING
0.20
0.30
11
1
3.90
4.10
PIN 1 ID
INDEX AREA
0.80
BSC
0.80
BSC
2
9
0.35
0.45
8
TOP VIEW
0.20
0.30
3 0.50
BSC
BOTTOM VIEW
0.80
1.00
0.20 REF
0.00
0.05
SIDE VIEW
2.90
1.00
NOTE:
0.80
0.80
3.90
0.25
1) ALL DIMENSIONS ARE IN MILLIMETERS.
2) EXPOSED PADDLE SIZE DOES NOT
INCLUDE MOLD FLASH.
3) LEAD COPLANARITY SHALL BE 0.10
MILLIMETER MAX.
4) JEDEC REFERENCE IS MO-220.
5) DRAWING IS NOT TO SCALE.
0.70
0.70
0.25
0.60
0.50
RECOMMENDED LAND PATTERN
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not
assume any legal responsibility for any said applications.
NB650/NB650H Rev. 1.12
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20