NJL5901AR-1 COBP PHOTO REFLECTOR GENERAL DESCRIPTION NJL5901AR-1 is the compact surface mount type photo reflector, which miniaturized outside dimension compared with the current COBP reflector, NJL5901AR. Compared with the NJL5901AR, the mounting area of NJL5901AR-1 is reduced to 54%. Moreover, the output current is 400μA typ. and is raised 180% compared with the NJL5901AR. OUTLINE (typ.) • Miniature, thin package : 1.3mm × 1.6mm × 0.6mm 1.6 • High output : 400μA typ. Unit : mm ±0.1 (0.42) (0.29) C A LED CENTER 0.6 ±0.1 ±0.1 0.2 0.65 0.35 0.65 A : anode K : cathode • Detecting the rotation of various motors C : collector • Paper edge detection and mechanism timing detection of facsimile, copy machine etc (0.07) (0.07) 0.4 0.36 0.4 • Detecting the location of CD/DVD optical pickup head ±0.1 0.45 ±0.1 0.4 1.3 ±0.1 E PT CENTER APPLICATIONS • Detecting the location of Lens unit for Cellular Phone’s camera module K (0.42) • Built-in visible light cut-off filter ±0.1 0.45 (0.07) 0.4 ±0.1 • Pb free solder re-flowing permitted : 260°C, 2times (0.07) (0.92) 0.2 ±0.1 FEATURES E : emitter PCB Pattern ABSOLUTE MAXIMUM RATINGS (Ta=25°C) PARAMETER Emitter Forward Current (Continuous) Reverse Voltage (Continuous) Power Dissipation SYMBOL RATINGS UNIT IF VR PD 30 6 45 mA V mW Detector Collector-Emitter Voltage Emitter-Collector Voltage Collector Current Collector Power Dissipation VCEO VECO IC PC 16 6 10 25 V V mA mW Coupled Total Power Dissipation Operating Temperature Storage Temperature Reflow Soldering Temperature Ptot Topr Tstg Tsol 60 -30 to +85 -40 to +85 260 mW °C °C °C ELECTRO-OPTICAL CHARACTERISTICS (Ta=25°C) PARAMETER Emitter Forward Voltage Reverse Current Capacitance SYMBOL TEST CONDITION MIN TYP MAX UNIT — — 1.3 10 25 — V μA pF — — 0.2 — — 700 5 30 30 — — VF IR Ct IF=4mA VR=6V VR=0V,f=1MHz 0.9 — — Detector Dark Current Collector-Emitter Voltage ICEO VCEO VCE=10V IC=100μA 16 Coupled Output Current Operating Dark Current *1 Rise Time Fall Time IO ICEOD tr tf IF=4mA,VCE=2V,d=0.7mm IF=4mA,VCE=2V IO=100μA,VCE=2V,RL=1KΩ,d=0.7mm IO=100μA,VCE=2V,RL=1KΩ,d=0.7mm — 280 — — — — μA V μA μA μs μs *1 Icoed may increase according to the periphery situation of the surface mounted product. 16-Feb-07 -1– NJL5901AR-1 OUTPUT CURRENT TEST CONDITION DARK CURRENT TEST CONDITION The infrared signal from LED is reflected at the aluminum surface Light Sealed Dark Box Aluminum Evaporation Surface IF Iceod IF Io VCE VCE RESPONSE TIME TEST CONDITION 0.7mm Aluminum Input Evapolation 90% Surface V+ RD P.G IF RL Output 10% OSC tr tf Io EDGE RESPONSE TEST CONDITION l=0mm l=0mm 0.7mm Aluminum Evaporation Surface Aluminum Evaporation Surface Direction X 16-Feb-07 0.7mm Direction Y -2– NJL5901AR-1 Forward Current vs. Temperature 100 50 90 45 80 40 Forward Current IF(mA) Power Dissipation P(mW) Power Dissipation vs. Temperature 70 60 Total Power 50 Dissipation 40 30 20 35 30 25 20 15 10 Collector Power 10 5 Dissipation 0 0 0 20 40 60 80 100 0 20 Ambient Temperature Ta(°C) 40 60 80 100 Ambient Temperature Ta(°C) TYPICAL CHARACTERISTICS Forward Voltage vs. Forward Current Forward Voltage vs. Temperature 100 1.6 Forward Voltage VF(V) Forward Current IF(mA) 1.4 10 IF=30mA 1.2 IF=4mA 1 0.8 1 0 1 -40 2 -20 0 20 40 60 80 100 Ambient Temperature Ta(°C) Forward Voltage VF(V) Dark Current vs. Temperature Operating Dark Current vs. Temperature 10000 10 Operating Dark Current Iceod(μA) Dark Current Iceo(nA) 1000 100 10 VCE=10V 1 0.1 1 IF=4mA , VCE=2V 0.1 0.01 0.001 0.01 -40 -20 0 20 40 60 Ambient Temperature Ta(°C) 16-Feb-07 80 100 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta(°C) -3– NJL5901AR-1 Output Current vs. Forward Current (Ta=25°C) Output Current vs. Temperature 1500 120 1400 Relative Output Current Io/Io(25°C)(%) 1300 1200 Output Current Io(μA) 1100 1000 900 800 700 600 500 400 300 VCE=2V , d=0.7mm 200 100 80 60 40 IF=4mA , VCE=2V 20 100 0 0 0 2 4 6 8 -40 10 -20 Forward Current IF(mA) Output Characteristics (Ta=25°C) 1500 0 20 40 60 80 100 Ambient Temperature Ta(°C) Vce Saturation (Ta=25°C) 0.5 IF=10mA 1400 1300 IF=8mA 1100 Output Current Io(μA) Collector-Emitter Voltage Vce(V) 1200 1000 900 IF=6mA 800 700 600 IF=4mA 500 400 300 IF=2mA 200 0.4 0.3 Io=500μA Io=400μA Io=300μA 0.2 Io=100μA 0.1 100 0 0 0 1 2 3 4 0.1 5 1 10 Forward Current IF(mA) Collector-Emitter Voltage Vce(V) Output Current vs. Distance (Ta=25°C) Output Current vs. Edge Distance (Ta=25°C) 120 120 Relative Output Current Io/Io(max.)(%) Relative Output Current Io/Io(max.)(%) IF=4mA , VCE=2V , d=0.7mm 100 IF=4mA , VCE=2V 80 60 40 20 0 80 Direction X 60 40 Direction Y 20 0 0 1 2 3 Reflector Distance d(mm) 16-Feb-07 100 4 5 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 Edge Distance l(mm) -4– NJL5901AR-1 Switching Time vs. Load Resistance (Ta=25°C) Spectral Response (Ta=25°C) 1000 120 100 tr Switching Time t(μs) Relative Response (%) VCE=2V 80 60 40 100 tf td 10 20 VCE=2V , Io=100μA 0 500 1 600 700 800 Wavelength λ(nm) 16-Feb-07 900 1000 0.1 1 10 Load Resistance RL(kΩ) -5– NJL5901AR-1 PRECAUTION FOR HANDLING 1. Soldering to actual circuit board Soldering condition The surface temperature of plastic package is lower than 260 °C. Soldering Method 1) Reflow Method Soldering to be done within twice under the recommended condition mentioned below f 260°C e 230°C 220°C d 180°C 150°C a : Temperature ramping rate b : Pre-heating temperature time c : Temperature ramping rate d : 220°C or higher time e : 230°C or higher time f : Peak temperature : 1 to 4°C/s : 150 to 180°C : 60 to 120s : 1 to 4°C /s : Shorter than 60s : Shorter than 40s g : Temperature ramping rate : 1 to 6°C /s : Lower than 260°C The temperature of the surface of mold package Room Temp. a b c g 2) Reflow Method (In case of infrared heating) The temperature profile is same as the above Avoid direct irradiation to the plastic package because it may absorb the Infrared Radiation and its surface temperature will be higher than the lead. 3) The other method Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method (VPS). Solder the device in short time as soon as possible. If the device is heated and kept in high temperature for longer time, its reliability would be affected. 2. Cleaning Avoid washing the device after soldering by reflow method. 3. Attention in handling 1) 2) 3) 4) Treat not to touch the lens surface. Avoid dust and any other foreign materials on the lens surface such as paint, bonding material, etc. Never to apply reverse voltage (VEC) of more than 6V on the photo transistor when measuring the characteristics or adjusting the system. If applied, it causes to lower the sensitivity. When mounting, special care has to be taken on the mounting position and tilting of the device because it is very important to place the device to the optimum position to the object. 4. Storage Mount the device as soon as possible after opening the envelope. In order to prevent from degradation by the moisture at the reflow process, the device is contained in deaeration packaging. 16-Feb-07 -6– NJL5901AR-1 NJL5901AR-1 Taping Specification (TE1) 1. Taping Size 1) Carrier tape is used with Polycarbonate. 2) Cover tape is used with electro statistically prevention treated Polyester type tape. 3) Product taping direction is to place the index mark against the pull out direction of the tape as in the drawing. Pull out direction of tape φ 1.5 4.0 0.25 UNIT : mm 8.0 3.5 1.8 1.75 2.0 1.45 0.85 Cover Tape 4.0 Carrier Tape 2. Taping Strength Pull up the cover tape from the carrier tape, and when the opening angle comes around 10 to 15°, and the peeling-off strength is to be within the power of 20 to 70g. 3. Packaging 1) The taped products are to be rolled up on the taping reel as on the drawing. 2) Rolling up specification 2-1) Start rolling : Carrier tape open space more than 20 Pieces. 2-2) End of rolling : Carrier tape open space more than 20 Pieces, and 2 round of reel space at the cover tape only. 3) Taping quantity : 2,000 Pieces. 4) Seal off after putting each reels in a damp proof bag with silica gel. 8.5 φ 180 φ 60 φ 13 Label [CAUTION] The specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. The application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights. 16-Feb-07 -7– Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: NJR: NJL5901AR-1-TE1