Page No. : 1/9 RS7213 300mA High Speed, Low Noise LDO with Fast Enable and Fast Discharge Function General Description The RS7213 series is a low‐dropout linear regulator with ON/OFF control that operates in the input voltage range from +1.8V to +5.5V and delivers 300mA output current. The fixed output voltage is preset at an internally trimmed voltage 1.8V, 2.5V, or 3.3V. Other options 1.0V, 1.2V, 1.5V, 2.2V, 3.0V and 3.6V are available by special order only. The RS7213 consists of a 0.87V bandgap reference, an error amplifier, and a P‐channel pass transistor. Other features include short‐circuit protection, thermal shutdown protection, fast respond and fast discharge functions. The RS7213 series devices are available in SOT‐25 & SC‐70‐5 packages. Features Applications ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● Operating Voltage Range：+1.8V to +5.5V Output Voltages：+0.9V to +5.0V (0.1V Step) Dropout Voltage：90mV@100mA (Typ.) Fast Response in Power‐on Transient：35μS (Typ.) Low Current Consumption：30μA (Typ.) Shutdown Current：0.7μA (Typ.) ±2% Output Voltage Accuracy (special ±1%highly accurate), VOUT≧1.8V Low ESR Capacitor Compatible High Ripple Rejection：70dB (Typ.) Output Current Limit Protection：500mA (Typ.) Short Circuit Protection：70mA (Typ.) Thermal Overload Shutdown Protection Control Output ON/OFF Function SOT‐25 & SC‐70‐5 Packages RoHS Compliant and 100% Lead (Pb)‐Freeand Green (Halogen Free with Commercial Standard) Battery‐powered equipment Voltage regulator for microprocessor Voltage regulator for LAN cards Wireless Communication equipment Audio/Video equipment Post Regulator for Switching Power Home Electric/Electronic Appliance CDMA/GSM Cellular Handsets Laptop, Palmtops, Notebook Computers Portable Information Application Application Circuits This integrated circuit can be damaged by ESD. Orister Corporation recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DS‐RS7213‐02 September, 2009 www.Orister.com Page No. : 2/9 Pin Assignment SOT‐25 SC‐70‐5 PACKAGE SOT‐25 PIN 1 2 3 4 5 SYMBOL VIN GND EN NC VOUT DESCRIPTION Regulator Input Pin Ground Pin Chip Enable Pin No Connection Regulator Output Pin PIN 1 2 3 4 5 SYMBOL VIN GND EN NC VOUT DESCRIPTION Regulator Input Pin Ground Pin Chip Enable Pin No Connection Regulator Output Pin PACKAGE SC‐70‐5 Ordering Information DEVICE RS7213‐XX EEE YY Z DEVICE CODE XX is nominal output voltage (for example, 18 = 1.8V, 33 = 3.3V, 285 = 2.85V). EEE is CE Input Logic & Discharge Function Selection : (see CE & Discharge Function Selection Table) YY is package designator : NE : SOT‐25 SC : SC‐70‐5 Z is Lead Free designator : P: Commercial Standard, Lead (Pb) Free and Phosphorous (P) Free Package G: Green (Halogen Free with Commercial Standard) CE & Discharge Function Selection Table EEE CODE NHF NLF NHN NLN UHF ULF EN Type Type 1 None None None None Pull High Pull High Type 2 High Active Low Active High Active Low Active High Active Low Active Discharge Fast Fast Normal Normal Fast Fast EEE CODE UHN ULN DHF DLF DHN DLN EN Type Type 1 Pull High Pull High Pull Low Pull Low Pull Low Pull Low Type 2 High Active Low Active High Active Low Active High Active Low Active Discharge Normal Normal Fast Fast Normal Normal DS‐RS7213‐02 September, 2009 www.Orister.com Page No. : 3/9 Block Diagram Absolute Maximum Ratings Parameter Input Voltage VIN to GND Output Current Limit, I(LIMIT) Junction Temperature Thermal Resistance Power Dissipation Symbol VIN ILIMIT TJ SOT‐25 SC‐70‐5 SOT‐25 SC‐70‐5 Operating Ambient Temperature Storage Temperature Lead Temperature (soldering, 10sec) θJA PD TOPR TSTG ‐ Ratings 6.0 0.5 +155 250 333 400 200 ‐40 ~ +125 ‐55~+150 +260 Units V A o C o C/W mW o C C o C o NOTES： 1 The power dissipation values are based on the condition that junction temperature TJ and ambient temperature TA difference is 100°C. 2 Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and function operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute‐maximum –rated conditions for extended periods may affect device reliability. DS‐RS7213‐02 September, 2009 www.Orister.com Page No. : 4/9 Electrical Characteristics (VIN=5V, TA=25°C, unless otherwise specified) Symbol VIN Parameter Input Voltage IMAX VDROP ΔVLINE ΔVLOAD IQ ISD ISC PSRR eN VIH VIL RDIS TDIS Output Current (see NOTE 1) Dropout Voltage Line Regulation Load Regulation Ground Pin Current Shutdown Current Short Circuit Current Ripple Rejection Output Noise EN Pin Input Voltage “H” EN Pin Input Voltage “L” Discharge Resistor Discharge Time Conditions ‐ VIN=VOUT+1.0V, IOUT=1mA, VOUT≧1.8V VIN=VOUT+1.0V, IOUT=1mA, VOUT＜1.8V, VIN＞2.4V VOUT+1.0V≦VIN≦5.5V, VIN≧2.4V IOUT=300mA, VOUT＞2.0V VOUT+1.0V≦VIN≦5.5V, IOUT=1mA VIN=VOUT+1V, 1mA≦IOUT≦100mA ILOAD=0mA to 300mA, VIN=VOUT+1V VIN=VOUT+1V, EN=0V, No Load ‐ IOUT=30mA, F=1KHz, COUT=1uF IOUT=100mA , F=1KHz, COUT=1uF VIN≦5.0V VIN≦5.0V VEN=0V VOUT=3.3V to 0V, COUT=1uF VOUT Output Voltage TC Temperature Characteristics IOUT=1mA, ‐25°C≦TOPR≦+85°C Min. 1.8 Typ. ‐ ‐2% Max. 5.5 Unit V +2% V +35 mV mA mV %/V %/mA uA uA mA dB uV(rms) V V Ω us ppm/ o C o C o C VOUT ‐35 300 ‐ ‐ ‐ ‐ ‐ ‐ ‐ ‐ 1.6 ‐ ‐ ‐ ‐ 300 0.2 0.01 30 0.7 70 70 40 ‐ ‐ 30 70 ‐ 500 0.3 0.02 50 1.0 ‐ ‐ ‐ ‐ 0.3 100 100 ‐ ±100 ‐ TSD Thermal Shutdown Temperature ‐ ‐ 150 ‐ THYS Thermal Shutdown Hysteresis ‐ ‐ 30 ‐ NOTES： 1 Measured using a double sided board with 1” x 2” square inches of copper area connected to the GND pins for “heat spreading”. DS‐RS7213‐02 September, 2009 www.Orister.com Page No. : 5/9 Detail Description The RS7213 is a low‐dropout linear regulator. The device provides preset 1.8V, 2.5V and 3.3V output voltages for output current up to 300mA. Other mask options for special output voltages are also available. As illustrated in function block diagram, it consists of a 0.87V bandgap reference, an error amplifier, a P‐channel pass transistor and an internal feedback voltage divider. The bandgap reference for is connected to the error amplifier, which compares this reference with the feedback voltage and amplifies the voltage difference. If the feedback voltage is lower than the reference voltage, the pass transistor’s gate is pulled lower, which allows more current to pass to the output pin and increases the output voltage. If the feedback voltage is too high, the pass transistor’s gate is pulled up to decrease the output voltage. The output voltage is feed back through an internal resistor divider connected to VOUT pin. Additional blocks include an output current limiter, thermal sensor, and shutdown logic. Internal P‐channel Pass Transistor The RS7213 features a P‐channel MOSFET pass transistor. Unlike similar designs using PNP pass transistors, P‐channel MOSFETs require no base drive, which reduces quiescent current. PNP‐based regulators also waste considerable current in dropout when the pass transistor saturates, and use high base‐drive currents under large loads. The RS7213 does not suffer from these problems and consumes only 30μA (Typ.) of current consumption under heavy loads as well as in dropout conditions. Enable Function EN pin starts and stops the regulator. When the EN pin is switched to the power off level, the operation of all internal circuit stops, the build‐in P‐channel MOSFET output transistor between pins VIN and VOUT is switched off, allowing current consumption to be drastically reduced. The VOUT pin enters the GND level through the internal discharge path between VOUT and GND pins. Operating Region and Power Dissipation Maximum power dissipation of the RS7213 depends on the thermal resistance of the case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The power dissipation across the devices is P = IOUT x (VIN‐VOUT). The resulting maximum power dissipation is: PMAX = ( TJ − TA ) ( TJ − TA ) = θJC + θCA θJA Where (TJ‐TA) is the temperature difference between the RS7213 die junction and the surrounding air, θJC is the thermal resistance of the package chosen, and θCA is the thermal resistance through the printed circuit board, copper traces and other materials to the surrounding air. For better heat‐sinking, the copper area should be equally shared between the VIN, VOUT, and GND pins. The thermal resistance θJA of SOT‐25 package of RS7213 is 250°C/W. Based on a maximum operating junction temperature 125°C with an ambient of 25°C, the maximum power dissipation will be: PMAX = ( TJ − TA ) (125 − 25) = = 0.40W θJC + θCA 250 Thermal characteristics were measured using a double sided board with 1”x2” square inches of copper area connected to the GND pin for “heat spreading”. Dropout Voltage A regulator’s minimum input‐output voltage differential, or dropout voltage, determines the lowest usable supply voltage. In battery‐powered systems, this will determine the useful end‐of‐life battery voltage. The RS7213 use a P‐ channel MOSFET pass transistor, its dropout voltage is a function of drain‐to‐source on‐resistance RDS(ON) multiplied by the load current. VDROPOUT = VIN − VOUT = RDS ( ON) × IOUT DS‐RS7213‐02 September, 2009 www.Orister.com Page No. : 6/9 SOT‐25 Dimension NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. D. Falls within JEDEC MO‐193 variation AB (5 pin). DS‐RS7213‐02 September, 2009 www.Orister.com Page No. : 7/9 SC‐70‐5 Dimension NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. D. Falls within JEDEC MO‐203 variation AA. DS‐RS7213‐02 September, 2009 www.Orister.com Page No. : 8/9 Soldering Methods for Orister’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface‐mount devices Figure 1: Temperature profile tP Critical Zone TL to TP TP Ramp-up TL tL Temperature Tsmax Tsmin tS Preheat 25 Ramp-down t 25oC to Peak Time Profile Feature Average ramp‐up rate (TL to TP) Sn‐Pb Eutectic Assembly o <3 C/sec Preheat Pb‐Free Assembly <3oC/sec ‐ Temperature Min (Tsmin) 100oC 150oC ‐ Temperature Max (Tsmax) 150oC 200oC 60~120 sec 60~180 sec ‐ Time (min to max) (ts) Tsmax to TL ‐ Ramp‐up Rate o <3 C/sec <3 C/sec Time maintained above: ‐ Temperature (TL) ‐ Time (tL) o 217oC 183 C 60~150 sec Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp‐down Rate Time 25oC to Peak Temperature o o o 60~150 sec 240 C +0/‐5 C 260oC +0/‐5oC 10~30 sec 20~40 sec <6oC/sec <6oC/sec <6 minutes <8 minutes Peak temperature Dipping time 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb‐Free devices. o o 245 C ±5 C o o 260 C +0/‐5 C 5sec ±1sec 5sec ±1sec DS‐RS7213‐02 September, 2009 www.Orister.com Page No. : 9/9 Important Notice: © Orister Corporation Orister cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an Orister product. No circuit patent licenses, copyrights, mask work rights, or other intellectual property rights are implied. Orister reserves the right to make changes to their products or specifications or to discontinue any product or service without notice. Except as provided in Orister’s terms and conditions of sale, Orister assumes no liability whatsoever, and Orister disclaims any express or implied warranty relating to the sale and/or use of Orister products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. Testing and other quality control techniques are utilized to the extent Orister deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed. Orister and the Orister logo are trademarks of Orister Corporation. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. DS‐RS7213‐02 September, 2009 www.Orister.com