Page No. : 1/11 RS7302 600mA Adjustable & Fixed Voltage LDO Linear Regulator with Enable, Fast Discharge & Soft‐Start General Description The RS7302 series is a low‐dropout linear regulator with ON/OFF control that operates in the input voltage range from +2.4V to +7.0V and delivers 600mA output current. The RS7302 is available fixed output voltage type is preset at an internally trimmed voltage 1.8V, 2.5V, or 3.3V. Other options 1.0V, 1.2V,1.5V, 2.85V, 3.0V and 3.6V are available by special order only. The RS7302 series consists of a 0.95V bandgap reference, an error amplifier, and a P‐channel pass transistor. Other features include soft‐start function, short‐circuit protection and thermal shutdown protection. The RS7302 series devices are available in SOT‐25, SC‐70‐5 & SOP‐8 packages. Features Applications ◎ Operating Voltage Range：+2.4V to +7.0V ◎ Output Voltages：+1.0V to +5.0V (0.1V Step), +1.25V to +5.0V ◎ Dropout Voltage：500mV@600mA (Fixed) ◎ Fast Response in Power‐on：35uS ◎ Low Current Consumption：60μA (Typ.) ◎ Low ESR Capacitor Compatible ◎ High Ripple Rejection：65dB (Typ.) ◎ Short Circuit Protection：200mA (Typ.) ◎ Thermal Overload Shutdown Protection ◎ SOT‐25, SC‐70‐5 and SOP‐8 packages ◎ RoHS Compliant and 100% Lead (Pb)‐Free and Green (Halogen Free with Commercial Standard) ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ Battery‐Powered Equipments Graphic Card, Peripheral Card PCMCIA & New Card Mini PCI & PCI‐Express Cards Digital Still Camera CDMA/GSM Cellular Handsets Laptop, Palmtops, Notebook Computers Portable Information Application Application Circuits Soft‐Start Function This integrated circuit can be damaged by ESD. Orister Corporation recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DS‐RS7302‐02 September, 2009 www.Orister.com Page No. : 2/11 Pin Assignments SOT‐25 SC‐70‐5 SOP‐8 PACKAGE PIN 1 2 3 4 5 SYMBOL VIN GND EN SS VOUT DESCRIPTION Regulator Input Pin Ground Pin or ADJ Pin Enable Pin Soft‐Start Pin Regulator Output Pin PIN 1 2 3 4 5 SYMBOL VIN GND EN SS VOUT DESCRIPTION Regulator Input Pin Ground Pin or ADJ Pin Enable Pin Soft‐Start Pin Regulator Output Pin PIN 1 2 3 4 5, 6, 7, 8 SYMBOL EN VIN VOUT SS GND DESCRIPTION Enable Pin Regulator Input Pin Regulator Output Pin Soft‐Start Pin Ground Pin or ADJ Pin SOT‐25 PACKAGE SC‐70‐5 PACKAGE SOP‐8 Ordering Information DEVICE RS7302‐XX EEE YY Z DEVICE CODE XX is nominal output voltage (for example, AD=ADJ, 18 = 1.8V, 33 = 3.3V, 285 = 2.85V). EEE is CE Input Logic & Discharge Function Selection : (see CE & Discharge Function Selection Table) YY is package designator : NE : SOT‐25 SC : SC‐70‐5 S : SOP‐8 Z is Lead Free designator : P: Commercial Standard, Lead (Pb) Free and Phosphorous (P) Free Package G: Green (Halogen Free with Commercial Standard) DS‐RS7302‐02 September, 2009 www.Orister.com Page No. : 3/11 CE & Discharge Function Selection Table EEE CODE NHF NLF NHN NLN UHF ULF EN Type Type 1 None None None None Pull High Pull High Type 2 High Active Low Active High Active Low Active High Active Low Active EEE CODE UHN ULN DHF DLF DHN DLN Discharge Fast Fast Normal Normal Fast Fast EN Type Type 1 Pull High Pull High Pull Low Pull Low Pull Low Pull Low Type 2 High Active Low Active High Active Low Active High Active Low Active Discharge Normal Normal Fast Fast Normal Normal Block Diagram Absolute Maximum Ratings Parameter Input Voltage VIN to GND Output Current Limit, I(LIMIT) Junction Temperature Thermal Resistance Power Dissipation Symbol VIN ILIMIT TJ SOT‐25 SC‐70‐5 SOP‐8 SOT‐25 SC‐70‐5 SOP‐8 Operating Ambient Temperature Storage Temperature Lead Temperature (soldering, 10sec) θJA PD TOPR TSTG ‐ Ratings 9.0 1.0 +155 155 333 60 350 250 1670 ‐40 ~ +85 ‐55~+150 +260 Units V A o C o C/W mW o C C o C o NOTES： 1 The power dissipation values are based on the condition that junction temperature TJ and ambient temperature TA difference is 100°C. 2 Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and function operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute‐maximum –rated conditions for extended periods may affect device reliability. DS‐RS7302‐02 September, 2009 www.Orister.com Page No. : 4/11 Electrical Characteristics (TA=25°C, VIN=5.0V unless otherwise specified) Symbol VIN Parameter Input Voltage VOUT Output Voltage IMAX Output Current (see NOTE) VDROP Dropout Voltage ΔVLINE ΔVLOAD IQ ISD ISC PSRR eN VIH VIL RDIS TDIS TSS Conditions ‐ VIN=VOUT+1.0V, IOUT=1mA, VOUT≧1.8V Fixed VIN=VOUT+1.0V, IOUT=1mA, VOUT＜1.8V, VIN Type ＞2.4V VIN=VOUT+1.2V, IOUT=1mA, VOUT≧1.8V ADJ VIN=VOUT+1.2V, IOUT=1mA, VOUT＜1.8V, VIN Type ＞2.4V VOUT+1.0V≦VIN≦7.0V, VOUT≧2.4V IOUT=100mA, VOUT>3.0V IOUT=600mA, VOUT>3.0V VOUT+1.0V≦VIN≦7V, IOUT=1mA VIN=VOUT+1V, 1mA≦IOUT≦100mA ILOAD=0mA to 1.0A, VIN=VOUT+1.0V VIN=VOUT+1V, EN=0V, No Load ‐ IOUT=30mA, F=1KHz, COUT=3.3uF IOUT=100mA , F=1KHz, COUT=3.3uF VIN≦5.0V VIN≦5.0V VEN=0V, For Fixed Voltage Type VOUT=3.3V to 0V, COUT=1uF, For Fixed Voltage Type VOUT=3.3V, CSS=47nF, CIN=COUT=1uF Min. 2.4 ‐2% Typ. ‐ ‐35 ‐2% VOUT ‐50 600 ‐ ‐ ‐ ‐ ‐ ‐ ‐ ‐ 1.6 ‐ ‐ ‐ ‐ ‐ 100 500 0.2 0.01 60 0.7 250 65 40 ‐ ‐ 30 70 10 Max. 7.0 +2% Unit V V +35 mV +2% V +50 mV ‐ ‐ ‐ 0.3 0.02 ‐ ‐ ‐ ‐ ‐ ‐ 0.3 100 100 ‐ mA mV Line Regulation %/V Load Regulation %/mA Ground Pin Current uA Shutdown Current uA Short Circuit Current mA Ripple Rejection dB Output Noise uV(rms) EN Pin Input Voltage “H” V EN Pin Input Voltage “L” V Discharge Resistor Ω Discharge Time us Soft‐Start Time ms Thermal Shutdown o TSD ‐ ‐ 150 ‐ C Temperature o THYS Thermal Shutdown Hysteresis ‐ ‐ 20 ‐ C NOTE：Measured using a double sided board with 1” x 2” square inches of copper area connected to the GND pins for “heat spreading”. DS‐RS7302‐02 September, 2009 www.Orister.com Page No. : 5/11 Detail Description The RS7302 is a low‐dropout linear regulator. The device provides preset 1.8V, 2.5V and 3.3V output voltages for output current up to 600mA. Other mask options for special output voltages are also available. As illustrated in function block diagram, it consists of a 0.95V bandgap reference, an error amplifier, a P‐channel pass transistor and an internal feedback voltage divider. The 0.95V bandgap reference is connected to the error amplifier, which compares this reference with the feedback voltage and amplifies the voltage difference. If the feedback voltage is lower than the reference voltage, the pass‐transistor gate is pulled lower, which allows more current to pass to the output pin and increases the output voltage. If the feedback voltage is too high, the pass transistor gate is pulled up to decrease the output voltage. The output voltage is feedback through an internal resistive divider connected to VOUT pin. Additional blocks include an output current limiter, thermal sensor, and shutdown logic. Internal P‐channel Pass Transistor The RS7302 features a P‐channel MOSFET pass transistor. Unlike similar designs using PNP pass transistors, P‐channel MOSFETs require no base drive, which reduces quiescent current. PNP‐based regulators also waste considerable current in dropout when the pass transistor saturates, and use high base‐drive currents under large loads. The RS7302 does not suffer from these problems and consumes only 60μA (Typ.) of current consumption under heavy loads as well as in dropout conditions. Enable Function EN pin starts and stops the regulator. When the EN pin is switched to the power off level, the operation of all internal circuit stops, the build‐in P‐channel MOSFET output transistor between pins VIN and VOUT is switched off, allowing current consumption to be drastically reduced. The VOUT pin enters the GND level through the internal discharge path between VOUT and GND pins. Soft Start Function The capacitor can be connected between the BYPASS pin and GND. This capacitor can be a low cost Polyester Film variety. A larger capacitor improves the AC ripple rejection, but also makes the output come up slowly. This "Soft" turn‐on is desirable in some applications to limit turn‐on surges. Fast Discharge Function The RS7302 fixed type has fast discharge Function on EN pin disable. When user turns off the device, its internal pull‐low resistor will discharge output capacitor charge. It’ll avoid other device to arise wrong motions. Output Voltage Selection For fixed voltage type of RS7302, the output voltage is preset at an internally trimmed voltage. The first two digits of part number suffix identify the output voltage (see Ordering Information). For example, the RS7302‐33 has a preset 3.3V output voltage. Current Limit The RS7302 also includes a fold back current limiter. It monitors and controls the pass transistor’s gate voltage, estimates the output current, and limits the output current within 1.0A (Typ.) Thermal Overload Protection Thermal overload protection limits total power dissipation in the RS7302. When the junction temperature exceeds TJ=+165°C, a thermal sensor turns off the pass transistor, allowing the IC to cool down. The thermal sensor turns the pass transistor on again after the junction temperature cools down by 20°C, resulting in a pulsed output during continuous thermal overload conditions. Thermal overload protection is designed to protect the RS7302 in the event of fault conditions. For continuous operation, the absolute maximum operating junction temperature rating of TJ=+125°C should not be exceeded. DS‐RS7302‐02 September, 2009 www.Orister.com Page No. : 6/11 Operating Region and Power Dissipation Maximum power dissipation of the RS7302 depends on the thermal resistance of the case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The power dissipation across the devices is P=IOUT x (VIN‐VOUT). The resulting maximum power dissipation is: PMAX = (TJ − TA ) (TJ − TA) = θJC + θCA θJA Where (TJ‐TA) is the temperature difference between the RS7301 die junction and the surrounding air, θJC is the thermal resistance of the package chosen, and θCA is the thermal resistance through the printed circuit board, copper traces and other materials to the surrounding air. For better heat‐sinking, the copper area should be equally shared between the VIN, VOUT, and GND pins. Dropout Voltage A regulator’s minimum input‐output voltage differential, or dropout voltage, determines the lowest usable supply voltage. In battery‐powered systems, this will determine the useful end‐of‐life battery voltage. The RS7302 use a P‐channel MOSFET pass transistor, its dropout voltage is a function of drain‐to‐source on‐resistance RDS(ON) multiplied by the load current. VDROPOUT = VIN − VOUT = RDS (ON ) × IOUT DS‐RS7302‐02 September, 2009 www.Orister.com Page No. : 7/11 SOT‐25 Dimension NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. D. Falls within JEDEC MO‐193 variation AB (5 pin). DS‐RS7302‐02 September, 2009 www.Orister.com Page No. : 8/11 SC‐70‐5 Dimension NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. D. Falls within JEDEC MO‐203 variation AA. DS‐RS7302‐02 September, 2009 www.Orister.com Page No. : 9/11 SOP‐8 Dimension NOTES: A. All linear dimensions are in millimeters (inches). B. This drawing is subject to change without notice. C. Body length does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.006 (0.15) per end. D. Body width does not include interlead flash. Interlead flash shall not exceed 0.017 (0.43) per side. E. Falls within JEDEC MS‐012 variation AA. DS‐RS7302‐02 September, 2009 www.Orister.com Page No. : 10/11 Soldering Methods for Orister’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface‐mount devices Figure 1: Temperature profile tP Critical Zone TL to TP TP Ramp-up TL tL Temperature Tsmax Tsmin tS Preheat 25 Ramp-down t 25oC to Peak Time Profile Feature Average ramp‐up rate (TL to TP) Sn‐Pb Eutectic Assembly o <3 C/sec Preheat Pb‐Free Assembly <3oC/sec ‐ Temperature Min (Tsmin) 100oC 150oC ‐ Temperature Max (Tsmax) 150oC 200oC 60~120 sec 60~180 sec ‐ Time (min to max) (ts) Tsmax to TL ‐ Ramp‐up Rate o <3 C/sec <3 C/sec Time maintained above: ‐ Temperature (TL) ‐ Time (tL) o 217oC 183 C 60~150 sec Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp‐down Rate Time 25oC to Peak Temperature o o o 60~150 sec 240 C +0/‐5 C 260oC +0/‐5oC 10~30 sec 20~40 sec <6oC/sec <6oC/sec <6 minutes <8 minutes Peak temperature Dipping time 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb‐Free devices. o o 245 C ±5 C o o 260 C +0/‐5 C 5sec ±1sec 5sec ±1sec DS‐RS7302‐02 September, 2009 www.Orister.com Page No. : 11/11 Important Notice: © Orister Corporation Orister cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an Orister product. No circuit patent licenses, copyrights, mask work rights, or other intellectual property rights are implied. Orister reserves the right to make changes to their products or specifications or to discontinue any product or service without notice. Except as provided in Orister’s terms and conditions of sale, Orister assumes no liability whatsoever, and Orister disclaims any express or implied warranty relating to the sale and/or use of Orister products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. Testing and other quality control techniques are utilized to the extent Orister deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed. Orister and the Orister logo are trademarks of Orister Corporation. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. DS‐RS7302‐02 September, 2009 www.Orister.com