NSC TP3071N-G

Company
URL for Additional Information
http://www.national.com/quality/green/
National Semiconductor
Contact
Gloria Gordon
Title
Engineering Project Manager
Part Number
Document Date
Email
[email protected]
MSL Rating
Peak Body Temp C
MaxTime (Sec)
Cycles
1
260
40
4
Weight (mg)
Unit Type
TP3071N-G
23-Sep-2007
Phone
1-408-721-8435
Contains Lead(Pb) and is NOT European RoHS Compliant.
NOT China RoHS Compliant
1,430.000
Each
Homogeneous Material Composition Declaration for Electronic Products
Item
Weight (mg)
Plastic
Component
1,004.710 SiO2
Epoxy Resin
Sb2O3
Brominated Epoxy
Leadframe
Ext. LeadFinish
Chip
CAS#
Weight (mg)
60676-86-0
25928-94-3
1309-64-4
40039-93-8
695.460
291.366
9.042
Item-ppm
692,200
290,000
9,000
Part-ppm
486,336
203,752
6,323
8.841
8,800
6,183
379.080 Cu
7440-50-8
369.413
974,500
258,331
Fe
7439-89-6
9.098
24,000
6,362
Zn
7440-66-6
0.455
1,200
318
P
7723-14-0
0.114
300
80
41.240 Sn
7440-31-5
35.054
850,000
24,513
Pb
7439-92-1
6.186
150,000
4,326
3.300 Si
7440-21-3
3.280
994,000
2,294
Al
7429-90-5
0.020
6,000
14
Wires
0.810 Au
7440-57-5
0.810
1,000,000
566
Int. LeadFinish
0.500 Ag
7440-22-4
0.500
1,000,000
350
Die Attach
0.360 Ag
7440-22-4
0.270
750,000
189
Epoxy Resin
25928-94-3
0.090
250,000
63
Note: The device content disclosed herewith is approximate and is based on engineering estimates only. It has not been verified through analytical testing.
Additionally, the following should be noted:
1. One or more dopant materials may be present in the silicon die at sub-ppm levels to provide semiconductor properties.
2. Epoxy resin components listed are generic and may or may not be the specific compound used, which is considered proprietary.
RoHS Material Composition Declaration
RoHS Directive
2002/95/EC
RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent
Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass
(100 PPM) of homogeneous material for Cadmium
Subject to the limitations below, National Semiconductor Corporation (“National”) certifies the following information as of the document date.
1. National products with lead-free solder comply with the European Union’s Directive on the Restriction of the Use of Hazardous Substances
2002/95/EC (“RoHS”). These products do not contain homogeneous materials with Joint Industry Guide (JIG) -101 Level A materials above Level A
threshold levels, except lead in RoHS exempt applications 5, 7a and 7c.
2. National products with lead-containing solder do not comply with RoHS, because they contain lead in a non-exempt application. These products do
not contain other RoHS restricted substances or homogeneous materials with JIG-101 Level A materials above Level A threshold levels, except lead in
solder and RoHS exempt applications 5, 7a and 7c.
3. National products are manufactured in conformance with National specifications (SC) CSP-9-111C1 Supplier Environmental Requirements for
Materials and Products and (SC) CSP-9-111S2 National’s List of Banned and Reportable Substances, which are available at
www.national.com/quality/green/.
4. National products do not contain and are not manufactured with ozone depleting substances subject to The Montreal Protocol on Substances that
Deplete the Ozone Layer and U.S. Clean Air Act, Title VI.
National has taken commercially reasonable steps to provide representative and accurate information but may not have independently verified information
provided by others or conducted testing or chemical analysis on incoming materials and chemicals. Information provided in this document is derived from
default values associated with internal process information and may not be representative of all or actual materials used in the product (e.g. the default
may indicate a particular material, while an equivalent compliant material from the same or alternate supplier was actually used). Material concentrations
are the maximum expected concentration of the substances in the device and may not represent the actual concentration. National and National suppliers
consider certain limited information to be confidential and thus CAS numbers and other limited information may not be available for release. National’s
standard warranty and limitation of liability provisions of National’s Standard Terms and Conditions of Sale apply to any issues arising out of or in
connection with the information provided herein unless otherwise provided by a written contract signed by both parties.
NATIONAL ACCEPTS NO DUTY TO NOTIFY USERS OF THIS DECLARATION OF UPDATES OR CHANGES TO THIS DECLARATION.
Gerry Fields
Vice President Quality
National Semiconductor
Page 1 of 3
Banned Substance Monitoring
Part Number
TP3071N-G
Document Date
23-Sep-2007
Contains Lead(Pb) and is NOT European RoHS Compliant.
Use
Material
Device
Cd
CrVl
Pb
CHIP
<1
<1
<1
EXTLF
<2
<2
149000
FRAME
<100
<1000
<1000
WIRE
<2
<5
<5
* Cd: Cadmium, CrVI: Hexavalent Chromium, Pb: Lead, Hg: Mercury, ND: Not Detected
* Unless otherwise noted, units are in PPM (parts-per-million)
Ref #
1000
56
75
9990
NOT China RoHS Compliant
Hg
PBB
PBDE
Ref #
<1
<2
<1000
<1
<1
NA
<1000
<10
<1
NA
<1000
<10
1000
56
9990
75
3rd Party Analysis (available upon request, subject to a non-disclosure agreement)
Analysis on 04/17/2007 by Balazs Analytical Services-Freemont CA per Report# 07-01051-07
Analysis on 04/27/2007 by SGS per Report# LPCI/07440/07
Analysis on 05/16/2007 by ALS per Report# ATJB/3490BS/2007
Analysis pending
National Semiconductor
Page 2 of 3
美国国家半导体
《电子信息产品污染控制管理办法》的声明
"Electronic Information Products Pollution Control Measures" Statement
China RoHS Declaration
产品名称
Product Name
TP3071N-G
有毒有害物质或元素
Toxic and harmful substances or elements
部件名称
铅
汞
镉
六价铬
多溴联苯
多溴二苯醚
Part
(Pb)
(Hg)
(Cd)
(Cr6+)
(PBB)
(PBDE)
X
O
O
O
O
O
集成电路
Integrated Circuit
O:表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T 11363-2006
标准规定的限量要求以下。
O:Indicates that this hazardous substance contained in all homogeneous materials of this part is below the limit
requirement in SJ/T 11363-2006.
X:表示该有毒有害物质至少在该部件的某一均质材料中的含量超出
SJ/T 11363-2006 标准规定的限量要求。
X:Indicates that this hazardous substance contained in at least one of the homogeneous materials of this part is
above the limit requirement in SJ/T 11363-2006.
美国国家半导体的产品不会含有镉、汞、六价铬、多溴联苯(PBB)
和二苯醚(PBDE)。
National Semiconductor's products will not contain cadmium, mercury, hexavalent chromium, polybrominated
biphenyls (PBBs) and diphenyl ether (PBDE).
环保使用期限(epup) 是指以符号在这里展出. 环保使用期限(epup)
的有效期只有当产品使用范围以内的数据表中的规格.
The Environmental Protection Use Period (EPUP) is defined by the symbol shown here.
The Environmental Protection Use Period (EPUP) is valid only when product is used within
the limits of the data sheet specifications.