Company URL for Additional Information http://www.national.com/quality/green/ National Semiconductor Contact Gloria Gordon Title Engineering Project Manager Part Number Document Date Email [email protected] MSL Rating Peak Body Temp C MaxTime (Sec) Cycles 1 260 40 4 Weight (mg) Unit Type TP3071N-G 23-Sep-2007 Phone 1-408-721-8435 Contains Lead(Pb) and is NOT European RoHS Compliant. NOT China RoHS Compliant 1,430.000 Each Homogeneous Material Composition Declaration for Electronic Products Item Weight (mg) Plastic Component 1,004.710 SiO2 Epoxy Resin Sb2O3 Brominated Epoxy Leadframe Ext. LeadFinish Chip CAS# Weight (mg) 60676-86-0 25928-94-3 1309-64-4 40039-93-8 695.460 291.366 9.042 Item-ppm 692,200 290,000 9,000 Part-ppm 486,336 203,752 6,323 8.841 8,800 6,183 379.080 Cu 7440-50-8 369.413 974,500 258,331 Fe 7439-89-6 9.098 24,000 6,362 Zn 7440-66-6 0.455 1,200 318 P 7723-14-0 0.114 300 80 41.240 Sn 7440-31-5 35.054 850,000 24,513 Pb 7439-92-1 6.186 150,000 4,326 3.300 Si 7440-21-3 3.280 994,000 2,294 Al 7429-90-5 0.020 6,000 14 Wires 0.810 Au 7440-57-5 0.810 1,000,000 566 Int. LeadFinish 0.500 Ag 7440-22-4 0.500 1,000,000 350 Die Attach 0.360 Ag 7440-22-4 0.270 750,000 189 Epoxy Resin 25928-94-3 0.090 250,000 63 Note: The device content disclosed herewith is approximate and is based on engineering estimates only. It has not been verified through analytical testing. Additionally, the following should be noted: 1. One or more dopant materials may be present in the silicon die at sub-ppm levels to provide semiconductor properties. 2. Epoxy resin components listed are generic and may or may not be the specific compound used, which is considered proprietary. RoHS Material Composition Declaration RoHS Directive 2002/95/EC RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material for Cadmium Subject to the limitations below, National Semiconductor Corporation (“National”) certifies the following information as of the document date. 1. National products with lead-free solder comply with the European Union’s Directive on the Restriction of the Use of Hazardous Substances 2002/95/EC (“RoHS”). These products do not contain homogeneous materials with Joint Industry Guide (JIG) -101 Level A materials above Level A threshold levels, except lead in RoHS exempt applications 5, 7a and 7c. 2. National products with lead-containing solder do not comply with RoHS, because they contain lead in a non-exempt application. These products do not contain other RoHS restricted substances or homogeneous materials with JIG-101 Level A materials above Level A threshold levels, except lead in solder and RoHS exempt applications 5, 7a and 7c. 3. National products are manufactured in conformance with National specifications (SC) CSP-9-111C1 Supplier Environmental Requirements for Materials and Products and (SC) CSP-9-111S2 National’s List of Banned and Reportable Substances, which are available at www.national.com/quality/green/. 4. National products do not contain and are not manufactured with ozone depleting substances subject to The Montreal Protocol on Substances that Deplete the Ozone Layer and U.S. Clean Air Act, Title VI. National has taken commercially reasonable steps to provide representative and accurate information but may not have independently verified information provided by others or conducted testing or chemical analysis on incoming materials and chemicals. Information provided in this document is derived from default values associated with internal process information and may not be representative of all or actual materials used in the product (e.g. the default may indicate a particular material, while an equivalent compliant material from the same or alternate supplier was actually used). Material concentrations are the maximum expected concentration of the substances in the device and may not represent the actual concentration. National and National suppliers consider certain limited information to be confidential and thus CAS numbers and other limited information may not be available for release. National’s standard warranty and limitation of liability provisions of National’s Standard Terms and Conditions of Sale apply to any issues arising out of or in connection with the information provided herein unless otherwise provided by a written contract signed by both parties. NATIONAL ACCEPTS NO DUTY TO NOTIFY USERS OF THIS DECLARATION OF UPDATES OR CHANGES TO THIS DECLARATION. Gerry Fields Vice President Quality National Semiconductor Page 1 of 3 Banned Substance Monitoring Part Number TP3071N-G Document Date 23-Sep-2007 Contains Lead(Pb) and is NOT European RoHS Compliant. Use Material Device Cd CrVl Pb CHIP <1 <1 <1 EXTLF <2 <2 149000 FRAME <100 <1000 <1000 WIRE <2 <5 <5 * Cd: Cadmium, CrVI: Hexavalent Chromium, Pb: Lead, Hg: Mercury, ND: Not Detected * Unless otherwise noted, units are in PPM (parts-per-million) Ref # 1000 56 75 9990 NOT China RoHS Compliant Hg PBB PBDE Ref # <1 <2 <1000 <1 <1 NA <1000 <10 <1 NA <1000 <10 1000 56 9990 75 3rd Party Analysis (available upon request, subject to a non-disclosure agreement) Analysis on 04/17/2007 by Balazs Analytical Services-Freemont CA per Report# 07-01051-07 Analysis on 04/27/2007 by SGS per Report# LPCI/07440/07 Analysis on 05/16/2007 by ALS per Report# ATJB/3490BS/2007 Analysis pending National Semiconductor Page 2 of 3 美国国家半导体 《电子信息产品污染控制管理办法》的声明 "Electronic Information Products Pollution Control Measures" Statement China RoHS Declaration 产品名称 Product Name TP3071N-G 有毒有害物质或元素 Toxic and harmful substances or elements 部件名称 铅 汞 镉 六价铬 多溴联苯 多溴二苯醚 Part (Pb) (Hg) (Cd) (Cr6+) (PBB) (PBDE) X O O O O O 集成电路 Integrated Circuit O：表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T 11363-2006 标准规定的限量要求以下。 O：Indicates that this hazardous substance contained in all homogeneous materials of this part is below the limit requirement in SJ/T 11363-2006. X：表示该有毒有害物质至少在该部件的某一均质材料中的含量超出 SJ/T 11363-2006 标准规定的限量要求。 X：Indicates that this hazardous substance contained in at least one of the homogeneous materials of this part is above the limit requirement in SJ/T 11363-2006. 美国国家半导体的产品不会含有镉、汞、六价铬、多溴联苯(PBB) 和二苯醚(PBDE)。 National Semiconductor's products will not contain cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBBs) and diphenyl ether (PBDE). 环保使用期限(epup) 是指以符号在这里展出. 环保使用期限(epup) 的有效期只有当产品使用范围以内的数据表中的规格. The Environmental Protection Use Period (EPUP) is defined by the symbol shown here. The Environmental Protection Use Period (EPUP) is valid only when product is used within the limits of the data sheet specifications.