F-213 QSE–028–01–F–D–DP–A ® QSE–060–01–F–D–A QSE–020–01–L–D–A (0,80 mm) .0315" QSE SERIES HIGH SPEED GROUND PLANE SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QSE Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27 µm) Ni Current Rating: Contacts: 1.3A per contact @ 95°C Ground Plane: 10.1A per ground plane @ 95°C Operating Temp Range: -55°C to +125°C Voltage Rating: 225 VAC (5 mm Stack Height) Max Cycles: 100 RoHS Compliant: Yes Processing: Lead–Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (020-060) Board Stacking: For applications requiring more than two connectors per board contact [email protected] *Note: –C Plating passes 10 year MFG testing Note: Some lengths, styles and options are non-standard, non-returnable. ® Cable Mates: EQCD, EQSD, EQDP, EQRF (See Application Specific note) fina l i nch.com TM s ocol Prot orted Supp EXTENDED LIFE PRODUCT 10 year Mixed Flowing Gas with 50µ" Gold Call Samtec for maximum cycles mated with QTE 100 GbE XAUI ® PCI Express SATA t I/O) MGT (Rocke ™ d an iB fin In Rated @ 3dB Insertion Loss with PCB effects* w/o PCB effects** Single-Ended Signaling –D 9 GHz / 18 Gbps 9 GHz / 18 Gbps Differential Pair Signaling –D 8 GHz / 16 Gbps 14 GHz / 28 Gbps Differential Pair Signaling –DP 8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps *Performance data includes effects of a non-optimized PCB. **Test board losses de-embedded from performance data. Performance data for other stack heights and complete test data available at www.samtec.com?QSE or contact [email protected] QTE/QSE 5 mm Stack Height Type PINS PER ROW NO. OF PAIRS QSE 01 notes at Download app ppnote om/a c.c te m sa w. ww @ samtec.com Contact SIG on protocols ns for questio PLATING OPTION TYPE A OTHER OPTION –F APPLICATION SPECIFIC OPTION • 14 mm, 15 mm, 22 mm and 30 mm stack height (Caution: Some automatic placement/inspection machines may have component height restrictions. Please consult machinery specifications.) • 30µ" (0,76 µm) Gold (Specify -H plating for Data Rate cable mating applications.) • Edge Mount • 56 (-DP), 80, 100 positions per row • Guide Posts and Friction Lock options. • Retention Option Call Samtec. Integral metal plane for power or ground Blade & Beam Design Board Mates: QTE = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails –020, –040, –060 (40 total pins per bank = –D) –014, –028, –042 (14 pairs per bank = –D–DP) –L –D–DP = (No. of Positions per Row/14) x (20,00) .7875 + (1,27) .050 = 10µ" (0,25 µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails –D = (No. of Positions per Row/20) x (20,00) .7875 + (1,27) .050 02 (20,00) .7875 (7,24) .285 01 (3,05) .120 (0,80) .0315 (0,15) .006 –K = (8,25 mm) .325" DIA Polyimide Film Pick & Place Pad –D–DP = Differential Pair (–01 only) –C* = Electro-Polished QTE MATED Selective LEAD HEIGHT (7,49) 50µ" (1,27 µm) min STYLE WITH QSE* .295 Au over 150µ" –01 (5,00) .197 (3,81 µm) Ni on Signal Pins in contact area, –02 (8,00) .315 10µ" (0,25 µm) min –03 (11,00) .433 Au over 50µ" (1,27 µm) (3,25) (16,00) .630 –04 Ni on Ground Plane .128 –05 (19,00) .748 in contact area, Matte Tin over 50µ" –07 (25,00) .984 (1,27 µm) min Ni on *Processing all solder tails conditions will –TR = Tape & Reel Packaging (N/A on 56 & 80 positions) –L = Latching Option (N/A on 42, 56, 60 & 80 positions) affect mated height. (0,76) .030 (0,89) .035 DIA –D = SingleEnded (0,64) .025 –L WWW.SAMTEC.COM ALSO AVAILABLE Board Spacing Standoffs. See SO Series.