F-215 (Rev 02JUL15) HSC8–050–02–19–DP RU8–160–25–SE–L–DV–BL (0.80 mm) .0315" RU8, HSC8 SERIES HIGH SPEED RISER CARD KIT SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?RU8 RU8 Connector: Insulator Material: Black LCP Contact: BeCu Plating: Au or Sn over 50µ" (1.27 µm) Ni Current Rating: 3.1 A per pin (6 adjacent pins powered) Operating Temp: -55°C to +125°C 1 POSITIONS PER ROW STACK HEIGHT ® –SE –19 40, 50, 60 = (19 mm) .748" = SingleEnded –25 –DP = (25 mm) .984" Kit contains two connectors and one card. Assembly required. –30 PLATING OPTION SIGNAL ROUTING = Differential Pair = (30 mm) 1.180" (1.60) .062 Processing: Lead-Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (40-60) RoHS Compliant: Yes A –SE OTHER OPTION BL –L –BL Leave blank for Trays = 10µ" (0.25 µm) Gold on contact, Matte Tin on tail (Plating for connectors) Plating for Card is Hard Gold = Board Locks (Bottom Socket only) (Not available on –19 stack height) = (5.50 mm) .217" DIA Polyimide Film Pick & Place Pad –K Note: Other Gold plating options available. Contact Samtec. NO. OF POSITIONS PER SIDE –DP RECOGNITIONS 40 50 60 (7.01) .276 For complete scope of recognitions see www.samtec.com/quality DV –TR = Tape & Reel –SE –DP TOTAL TOTAL SIGNAL SIGNAL LINES PAIRS (39.80) 1.567 (51.05) 2.010 40 26 (47.80) 1.882 (59.05) 2.325 50 32 (55.80) 2.197 (67.05) 2.640 60 38 A B (7.98) .314 (–19 Only) Note: While optimized for 50Ω applications, this connector with alternative signal/ground patterns may also perform well in certain 75Ω applications. Contact Samtec for further information. Note: Some lengths, styles and options are non-standard, non-returnable. Mates with: HSEC8 RU8 Rated @ 3dB Insertion Loss* 25 mm Stack Height Single-Ended Signaling 7.5 GHz / 15 Gbps Differential Pair Signaling 7.5 GHz / 15 Gbps *Performance data includes effects of a non-optimized PCB. Performance data for other stack heights and complete test data available at www.samtec.com?RU8 or contact [email protected] (12.51) .492 B –BL (Required with –25 & –30) NUMBER OF POSITIONS PER SIDE HSC8 STACK HEIGHT CARD STYLE SIGNAL ROUTING SPECIFICATIONS For complete specifications see www.samtec.com?HSC8 –DP –SE NO. OF TOTAL TOTAL POSITIONS SIGNAL SIGNAL PER SIDE LINES PAIRS –040 40 26 –050 50 32 –060 60 38 = (1.60 mm) .062" thick card –040, –050, –060 –SE = (19 mm) .748" = Single-Ended –25 = Differential Pair –DP = (25 mm) .984" No. of Positions per Side x (0.80) .0315 + (4.45) .175 –30 A Signal (1.60) .062 01 Note: Some sizes, styles and options are non-standard, non-returnable. –19 –02 Conductor: 1 /2 oz Copper Contact Area: Hard Gold Plated Insulator: FR-4 RoHS Compliant: Yes Signal Ground –SE Ground –DP WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. = (30 mm) 1.180" STACK HEIGHT –19 –25 –30 A (14.84) .584 (20.84) .820 (25.84) 1.017