Technical Data Sheet Specification SSC-FCW302 SSC Drawn Approval Customer Approval Rev. 00 September 2009 www.acriche .com www.acriche.com Technical Data Sheet [ Contents ] 1. Features 2. Absolute maximum ratings 3. Electro-optical characteristics 4. Graphs 5. Soldering profile 6. Outline dimension 7. Reel dimension 8. Precaution for use Rev. 00 September 2009 www.acriche .com www.acriche.com Technical Data Sheet 1. Features • Package : 3.5 × 2.8 × 0.85 mm • Applications : Mobile Handset Flash Light 2. Absolute maximum ratings (Ta=25℃) Parameter Symbol Value Unit Power Dissipation Pd 1020 mW Forward Current IF 300 mA Peak Forward Current IFM *1 1000 mA Reverse Voltage VR 5 V Operation Temperature Topr. -30 ~ 80 ℃ Storage Temperature Tstg. -40 ~ 100 ℃ *1 IFM conditions: Pulse width Tw≤300ms and Duty ratio≤1/10 3. Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Condition Min Typ Max Unit Forward Voltage VF IF=300㎃ - 3.4 - V Zener Forward Voltage VF(z) IF=10㎃ 0.6 - 1.5 V IF=300 ㎃ 48 60 - IF=1000 ㎃ (Flash mode)2 130 160 - IF=300 ㎃ 63 79 - IF=1000 ㎃ (Flash mode)2 180 190 - FCW302A Luminous Flux*1 LF FCW302B lm X IF=300 ㎃ - 0.3226 - Y IF=300 ㎃ - 0.3306 - Color Temperature CCT IF=300 ㎃ - 5900 - K Viewing Angle 2θ1/2 IF=300㎃ - 120 - ˚ Chromaticity Coordinates *1 Luminous Flux is measured in integrating sphere *2 Flash mode is Pulse width Tw ≤ 300ms, Duty Ratio 1/10 [Note] ( Tolerance : IV±10%, color coordinate ±0.01, VF ±0.1 ) Rev. 00 September 2009 www.acriche .com www.acriche.com Technical Data Sheet 4. Graphs Forward Current vs. Forward Voltage Forward Current Derate Curve Luminous Intensity vs. Forward Current Forward Current vs. Chromaticity Coordinate Rev. 00 September 2009 www.acriche .com www.acriche.com Technical Data Sheet Radiation Diagram Y Y Spectrum Rev. 00 September 2009 www.acriche .com www.acriche.com Technical Data Sheet 5. Soldering Profile Reflow Soldering Conditions/ Profile (1) Lead Solder • Preliminary heating to be at 150℃max. for 2 minutes max. • Soldering heat to be at 240℃max. for 5 seconds max. LED Surface temperature °C Operation heating 240 150 Temperature rise: 5°C/sec. Pre-heating Cooling: -5°C/sec. ~ 120 0 60 to 120 sec. 5sec. max (2) Lead-Free Solder • Preliminary heating to be at 150℃max. for 2 minutes max. • Soldering heat to be at 260℃max. for 10 seconds max. LED Surface temperature °C Operation heating 260 150 Pre-heating Temperature rise: 5°C/sec.[Max] Cooling: -5°C/sec. ~ 120 0 60 to 120 sec. 10 sec. (3) Hand Soldering Condition • Not more than 1 seconds @MAX280℃, under Soldering iron. [Note] In case the soldered products are reused in soldering process, Seoul Semiconductor can not guarantee the performance of the products. Rev. 00 September 2009 www.acriche .com www.acriche.com Tolerance: ±0.1, Unit: ㎜ 2.80 0.85 2.30 K K : CATHODE Optical center 0.975 2.10 2.10 0.50 2.25 3.05 3.50 2.2025 A : ANODE A [TOP VIEW] [SIDE VIEW] [BOTTOM VIEW] [INNER CIRCUIT] * Recommend solder pad pattern 3.00 K 1.63 0.50 2.73 Y Technical Data Sheet 6. Outline Demension A X Soldering Area Heat dissipation Area (Cu) Rev. 00 September 2009 www.acriche .com www.acriche.com Tolerance: ±0.2, Unit: ㎜ Marking Direction 180 11.4 +0 -3 9 ±0.3 +0.2 -0 2 ±0.2 60 Technical Data Sheet 7. Reel Dimension 22 13 ±0.2 Tolerance: ±0.2, Unit: ㎜ Label 1) Quantity : 2000pcs/Reel 2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm 3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10℃ angle to be the carrier tape 4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev. 00 September 2009 www.acriche .com www.acriche.com Technical Data Sheet 8. Precaution for Use 1. Storage To avoid absorption of moisture, it is recommended to store parts in a dry box (or desiccator) with a desiccant. Otherwise, storage in the following environment is recommended. Temperature : 5℃~30℃ Humidity : 60%HR max. 2. Parts stored more than one week after opening or if desiccant indicator shower color changes, it is highly recommended that LED’s should be baked for 10~ 12 hours at 60˚C±5˚C 3. LEDs must be stored at clean atmosphere. If the LEDs are stored for 3 months or more after shipment from SSC, storage in a sealed container with a nitrogen is recomented. 4. If the LED is considered to be wet, it is highly recommended that the LED should be dried for 100Hr at 80±5℃ or 12Hr at 100±5℃. 5. Any mechanical force or excess vibration should be avoided during temperature cooling process to normal temperature after reflow 6. Rapid cooling should be avoided 7. LED should not be placed on a flexible area of the PCB 8. This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA should be used. 9. When the LED is operating in DC mode, the driving current should be determined after considering the thermal properties of the application and maximum ambient temperature requirements 10. Damage prevention from ESD or Surge. 1. It is highly recommended to use the wrist-band or anti electrostatic gloves when handling the LED’s 2. All devices, equipments and machines mush be properly grounded Rev. 00 September 2009 www.acriche .com www.acriche.com