APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet RoHS Specification SSC-SZA05A0A September 2012 1 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet SZA05A0A SZA05A0A Description Features • Super high Flux output The Z-Power series is designed for and high Luminance • Designed for high high current operation and high flux current operation output applications. • SMT solderable It incorporates state of the art SMD • Lead Free product • RoHS compliant design and low thermal resistant material. The Z Power LED is ideal light sources for general illumination applications, custom designed solutions, large backlights and high performance torches. Applications • General Torch • Architectural lighting • Projector light source • Traffic signals • Task lighting • Decorative / Pathway lighting • Remote / Solar powered lighting • Automotive interior / exterior lighting • Automotive signal / forward lighting * The appearance and specifications of the product can be changed for improvement without notice. September 2012 3 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet [ Contents ] 1. Full code of Z5 Series 2. Outline dimensions 3. Characteristics of SZA05A0A (Amber) 4. Characteristic diagrams 5. Bin Code Description 6. Labeling 7. Packing 8. Recommended solder pad 9. Soldering 10. Precaution for use 11. Handling of Silicone Resin LEDs September 2012 3 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 1. Full code of Z5 series Full code form : X1 X2 X3X4 X5X6 X7X8 1. Part Number X1 Company X2 Z-Power LED series number X3X4 Color Specification A0 Amber X5 PKG Series 5 Z5 series X6 Lens type X7 PCB Type 2. Internal Number X8 Revision No. September 2012 4 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 2. Outline dimensions Notes : [1] All dimensions are in millimeters. [2] Scale : none [3] Undefined tolerance is ± 0.1mm September 2012 5 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 3. Characteristics of SZA05A0A (Amber) Amber 1-1 Electro-Optical characteristics at 350mA Parameter Luminous Flux Value Symbol Ф [1] Ф V [2] (Tj=100 λD Dominant Wavelength[3] Forward Voltage V [4] ℃) VF 2 ℃, RH30%) Unit Min Typ Max 32 46 54 - 12 - 585 592 595 nm 2.0 2.3 3.0 V RθJ-S Thermal resistance (J to S) View Angle (Ta=25 Θ½ lm 9.0 K /W 123 deg. 1-2 Absolute Maximum Ratings Parameter Symbol Value Unit Forward Current IF 700 mA Reverse Voltage Vr 5 V Power Dissipation Pd 2.3 W Junction Temperature Tj 125(@ IF ≤ 700mA) ºC Operating Temperature Topr -40 ~ +100 ºC Storage Temperature Tstg -40 ~ +100 ºC - 2 kV ESD Sensitivity(HBM) [6] *Notes : [1] SSC maintains a tolerance of ±7% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integrating sphere. [3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color coordinate : ±0.005, CCT ±5% tolerance. [4] Tolerance is ±0.06V on forward voltage measurements [5] A zener diode is included to protect the product from ESD. [6] Tolerance is ±2.0 on CRI measurements September 2012 6 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 4. Characteristic diagrams Color Spectrum (IF=350mA, Ta=25 ℃, RH30%) Relative Spectral Power Distribution 1.0 0.8 0.6 0.4 0.2 0.0 400 500 600 700 800 Wavelength [nm] September 2012 7 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet Forward Current Characteristics Forward Voltage vs. Forward Current, Ta=25 ℃ 0.8 SZA05A0A Forward Current[A] 0.6 0.4 0.2 0.0 1 2 3 4 5 Forward Voltage[V] Forward Current vs. Normalized Relative Luminous Flux, Ta=25 ℃ 2.0 Relative Luminous Flux [X100,%] SZA05A0A 1.5 1.0 0.5 0.0 0.0 0.2 0.4 0.6 0.8 Forward Current [A] September 2012 8 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet Forward Current vs Wavelength Shift, Ta=25 ℃ 8 SZA05A0A Dominant Wavelength Shift [nm] 6 4 2 0 -2 -4 -6 -8 0.0 0.2 0.4 0.6 0.8 Forward Current [mA] September 2012 9 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet Junction Temperature Characteristics Junction Temperature vs. Relative Light Output at IF=350mA SZA05A0A Relative Luminous Flux [X100,%] 1.0 0.8 0.6 0.4 0.2 0.0 40 60 80 100 120 o Junction Temperature[ C] Junction Temperature vs. Forward Voltage at IF=350mA 0.0 Forward Voltage Shift [V] SZA05A0A -0.2 -0.4 -0.6 -0.8 -1.0 40 60 80 100 120 o Junction Temperature[ C] September 2012 10 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet Junction Temperature Characteristics Junction Temperature vs. Dominant Wavelength at IF=350mA 16 Dominant Wavelength Shift [nm] SZA05A0A 12 8 4 0 40 60 80 100 120 o Junction Temperature [ C] September 2012 11 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet Characteristic diagrams Ambient Temperature vs. Allowable Forward Current (Tjmax = 125 ℃, @0.7A) 800 Forward Current [mA] 700 ℃ R j-a=20℃/W 600 R j-a=15 /W 500 400 300 200 100 0 0 20 40 60 80 120 125 100 Ambient Temperature [C] Radiation pattern at 350mA 0 1.0 30 Relative Luminous Flux 0.8 0.6 60 0.4 0.2 90 0.0 -80 -60 -40 -20 0 Angle [deg] September 2012 12 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 5. Bin Code Description Bin Code Radiant Power (mW) @ IF = 350mA Dominant Wavelength (nm) @ IF = 350mA Forward Voltage (V) @ IF = 350mA R AA3 E Radiant Power (mW) Dominant Wavelength (nm) Forward Voltage (V) @ IF = 350mA @ IF = 350mA @ IF = 350mA Bin Code Min. Max. Bin Code Min. Max. Bin Code Min. Max. Q 32.0 41.5 AA1 585 587.5 D 2.00 2.25 R 41.5 54.0 AA2 587.5 590.0 E 2.25 2.50 AA3 590.0 592.5 F 2.50 2.75 AA4 592.5 595.0 September 2012 13 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 6. Labeling X10X11X12X13 1000 ############### SZA05A0A SZA05A0A Full code form X1X2X3X4X5X6X7X8 -X1 : Company -X2 : Z-Power LED series number -X3 X4 : Color Specification -X5 : PKG Series -X6 : Lens Type -X7 : PCB Type -X8 : Revision No. Rank X10X11X12X13 -X10 : Luminous Flux : LF [lm] -X11X12: Dominant Wavelength [nm] -X13 : Forward Voltage : VF [V] Lot No #1#2#3#4#5#6 - #7#8#9#10 - #11#12#13 - #1 #2 : Year - #7 #8 #9 #10 : Mass order - #3 #4 : Month - #11 #12 #13 : Tray No. - #5 #6 : Day September 2012 14 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 7. Packing CATHODE MARK 22 13 September 2012 15 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 7. Packing Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) a c b 245 220 102 7inch 245 220 142 TYPE 1 SIDE c 1 QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX b PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. a September 2012 16 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 8. Recommended solder pad Notes : [1] All dimensions are in millimeters. [2] Scale : none [3] This drawing without tolerances are for reference only [4] Undefined tolerance is ± 0.1mm September 2012 17 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 9. Soldering IPC/JEDEC J-STD-020 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215 260 Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. ℃ ℃ * Caution 1. Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. 2. Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. September 2012 18 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 10. Precaution for use (1) Storage To avoid the moisture penetration, we recommend storing Z5 Series (Z Power) LEDs ℃ to 30℃ in a dry box with a desiccant . The recommended storage temperature range is 5 and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40 ℃ Humidity : less than RH30% b. If the package has been opened more than 1 year (MSL 2) or the color of ±℃ the desiccant changes, components should be dried for 10-12hr at 60 5 (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. September 2012 19 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 10. Precaution for use (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14) The slug is isolated from anode electrically. Therefore, we recommend that you don’t isolate the heat sink. (15) Attaching LEDs, do not use adhesives that outgas organic vapor. (16) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. September 2012 20 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 11. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (7) Avoid leaving fingerprints on silicone resin parts. September 2012 21 www.seoulsemicon.com 서식번호 : SSC- QP- 7- 07- 12 (Rev.00)