PC410L0NIP0F Series PC410L0NIP0F Series High Speed 10Mb/s, High CMR Mini-flat Package ∗OPIC Photocoupler ■ Description ■ Agency approvals/Compliance PC410L0NIP0F Series contains a LED optically coupled to an OPIC chip. It is packaged in a 5 pin mini-flat. Input-output isolation voltage(rms) is 3.75 kV. High speed response(TYP. 10 Mb/s) and CMR is MIN. 10 kV/µs. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC410L) 2. Approved by VDE, DIN EN60747-5-2 (∗) (as an option), file No. 40009162 (as model No. PC410L) 3. Package resin : UL flammability grade (94V-0) (∗) DIN EN60747-5-2 : successor standard of DIN VDE0884 ■ Features ■ Applications 1. 5 pin Mini-flat package 2. Double transfer mold package (Ideal for Flow Soldering) 3. High noise immunity due to high instantaneous common mode rejection voltage (CMH : MIN.10 kV/µs, CML : MIN. −10 kV/µs) 4. High speed response (tPHL : TYP. 48 ns, tPLH : TYP. 50 ns) 5. High isolation voltage between input and output (Viso(rms) : 3.75 kV) 6. RoHS directive compliant 1. Programmable controllers 2. Inverter ∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A04802FEN Date Jun. 30. 2005 © SHARP Corporation PC410L0NIP0F Series ■ Internal Connection Diagram 1 6 1 3 4 5 Amp. 5 3 6 Anode Cathode GND VO (Open collector) VCC 4 ■ Outline Dimensions (Unit : mm) 1. Mini-flat Package [ex. PC410L0NIP0F] 2. Mini-flat Package (VDE option) [ex. PC410L0YIP0F] 3.6±0.3 3.6±0.3 ±0.25 1.27 1.27 6 5 1.27±0.25 1.27 4 6 SHARP mark "S" PC4 10L 4.4±0.2 SHARP mark "S" ±0.25 Anode mark 5 4 PC410L Anode mark 4.4±0.2 ±0.25 4 VDE Identification mark Date code 1 3 Date code 1 ±0.1 0.4 Factory identification mark 0.4±0.1 Factory identification mark 5.3±0.3 Epoxy resin 3 5.3±0.3 Epoxy resin 45˚ 6˚ 0.5+0.4 −0.2 7.0+0.2 −0.7 Product mass : approx. 0.1g 0.2±0.05 0.1±0.1 2.6±0.2 0.2±0.05 0.1±0.1 2.6±0.2 45˚ 0.5+0.4 −0.2 6˚ 7.0+0.2 −0.7 Product mass : approx. 0.1g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A04802FEN 2 PC410L0NIP0F Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ·· N · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D Mark P R S T U V W X A B C ·· · repeats in a 20 year cycle Factory identification mark Factory identification Mark Country of origin no mark Japan Indonesia China * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actual status of the production. Rank mark There is no rank mark indicator. Sheet No.: D2-A04802FEN 3 PC410L0NIP0F Series ■ Absolute Maximum Ratings Output Input Parameter Symbol Forward current IF Reverse voltage VR P Power dissipation VCC Supply voltage High level output voltage VOH Low level output current IOL Collector power dissipation PC Operating temperature Topr Storage temperature Tstg *1 Isolation voltage Viso (rms) *2 Soldering temperature Tsol (Ta=25˚C) Rating Unit 20 mA 5 V 40 mW V 7 7 V 50 mA 85 mW −40 to +85 ˚C −40 to +125 ˚C 3.75 kV 260 ˚C *1 40 to 60%RH, AC for 1minute, f=60Hz *2 For 10s ■ Electro-optical Characteristics Symbol VF IR Input Reverse current Terminal capacitance Ct Low level output voltage VOL High level output current IOH Output ICCL Low level supply current ICCH High level supply current "High→Low" input threshold current IFHL Isolation resistance RISO Floating capacitance Cf "High→Low" propagation delay time tPHL "Low→High" propagation delay time tPLH Transfer *3 charac∆tw Distortion of pulse width teristics tr Rise time tf Fall time Response time Parameter Forward voltage (unless otherwise specified Ta=−40 to 85˚C) Conditions MIN. TYP. MAX. Unit − 1.6 V 1.9 Ta=25˚C, IF=10mA − Ta=25˚C, VR=5V 10 µA − − 150 60 Ta=25˚C, V=0, f=1MHz pF IOL=13mA, VCC=5.5V, IF=5mA − 0.4 0.6 V VCC=VO=5.5V, IF=250µA µA − 0.02 100 7 − 13 mA VCC=5.5V, IF=10mA mA VCC=5.5V, IF=0 10 5 − 2.5 5 mA − VCC=5V,VO=0.8V, RL=350Ω 5×1010 1011 − Ω Ta=25˚C, DC500V, 40 to 60%RH − 0.6 − pF Ta=25˚C, V=0, f=1MHz 48 25 75 ns 50 25 75 ns Ta=25˚C, VCC=5V, IF=7.5mA, − − 35 ns RL=350Ω, CL=15pF, − 20 − ns − 10 − ns Instantaneous common mode rejection voltage (High level output) CMH IF=0 VO(MIN.)=2V Instantaneous common mode rejection voltage (Low level output) CML IF=5mA VO(MAX.)=0.8V Ta=25˚C, VCC=5V VCM=1kV(P-P), RL=350Ω 10 20 − kV/µs −10 −20 − kV/µs *3 Distortion of pulse width ∆tw= | tPHL− tPLH | Sheet No.: D2-A04802FEN 4 PC410L0NIP0F Series ■ Model Line-up Taping 3 000pcs/reel DIN EN60747-5-2 −−−−−− Approved Model No. PC410L0NIP0F PC410L0YIP0F Package Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A04802FEN 5 PC410L0NIP0F Series Fig.1 Test Circuit for Propagation Delay Time and Rise Time, Fall Time 7.5mA IF IF Pulse input 1 3.75mA 5V 6 0mA 350Ω 3 tPLH VO 0.1µF Amp. 5 tPHL 4 5V 90% CL VO 1.5V 10% VOL 47Ω tf tr *CL includes the probe and wiring capacitance. Fig.2 Test Circuit for Instantaneous Common Mode Rejection Voltage IF GL SW 5V 6 1 1kV 350Ω VO 5 3 0.1µF A Amp. B 4 VCM 0V CL VO VCM + − 5V (IF=0) *CL includes the probe and wiring capacitance. VO(MIN.) VO(MAX.) When the switch for LED sets to B V VO OL (IF=5mA) Fig.3 Forward Current vs. Ambient Temperature Fig.4 Collector Power Dissipation vs. Ambient Temperature 100 Collector power dissipation PC (mW) Forward current IF (mA) 25 20 15 10 5 70 0 −40 −25 When the switch for LED sets to A 0 25 85 80 60 40 20 85 50 75 100 70 0 −40 −25 125 Ambient temperature Ta (°C) 0 25 50 85 75 100 125 Ambient temperature Ta (°C) Sheet No.: D2-A04802FEN 6 PC410L0NIP0F Series Fig.5 Forward Current vs. Forward Voltage Fig.6 High Level Output Current vs. Ambient Temperature 100 100 10 High level output current IOH (µA) Forward current IF (mA) Ta=50˚C Ta=25˚C T =0˚C a Ta=85˚C Ta=−20˚C 1 Ta=−40˚C 0.1 1 1.2 1.4 1.6 1.8 IF=250µA VCC=5.5V VO=5.5V 10 1 0.1 0.01 0.001 −40 −25 2 0 Forward voltage VF (V) Output voltage VO (V) Low level output voltage VOL (V) 0.6 IO=16.0mA IO=12.8mA 0.4 VCC=5.0V VO=0.8V Ta=25˚C 5 IO=9.6mA 4 3 2 RL=1kΩ IO=6.4mA 1 RL=350Ω RL=4kΩ 0 0 25 50 75 0 100 1 2 3 4 5 Fig.9 Input Threshold Current vs. Ambient Temperature Fig.10 Propagation Delay time vs. Forward Current 6 100 Propagation delay time tPHL, tPLH (ns) VCC=5V VO=0.8V RL=350Ω 5 6 Forward current IF (mA) Ambient temperature Ta (˚C) Input threshold current IFHL (mA) 100 6 IF=5.0mA VCC=5.5V 4 3 2 1 0 −40 −25 75 Fig.8 Output Voltage vs. Forward Current 0.8 0 −40 −25 50 Ambient temperature Ta (˚C) Fig.7 Low Level Output Voltage vs. Ambient Temperature 0.2 25 Ta=25˚C VCC=5.0V RL=350Ω 80 60 tPLH 40 tPHL 20 0 0 25 50 75 100 5 Ambient temperature Ta (˚C) 10 15 20 Forward current IF (mA) Sheet No.: D2-A04802FEN 7 PC410L0NIP0F Series Fig.11 Propagation Delay Time vs. Ambient Temperature Propagation delay time tPHL, tPLH (ns) 100 IF=7.5mA VCC=5.0V RL=350Ω 80 60 tPLH 40 tPHL 20 0 −40 −25 0 25 50 75 100 Ambient temperature Ta (˚C) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A04802FEN 8 PC410L0NIP0F Series ■ Design Considerations ● Recommended operating conditions Parameter Low level input current High level input current Supply voltage Fan out (TTL load) Operating temperature Symbol IFL IFH VCC N Topr MIN. 0 8 4.5 − −40 MAX. 250 15 5.5 5 +70 TYP. − − − − − Unit µA mA V − ˚C ● Notes about static electricity Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. ● Design guide In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01µF or more between VCC and GND near the device. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through LED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of LED. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent LED. ● Degradation In general, the emission of the LED used in photocouplers will degrade over time. In the case of long term operation, please take the general LED degradation (50% degradation over 5 years) into the design consideration. Please decide the input current which become 2 times of MAX. IFHL. ● Recommended Foot Print (reference) 1.5 0.8 1.27 1.27 6.3 (Unit : mm) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A04802FEN 9 PC410L0NIP0F Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ( package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 150 to 180˚C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 260˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A04802FEN 10 PC410L0NIP0F Series ● Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A04802FEN 11 PC410L0NIP0F Series ■ Package specification ● Tape and Reel package Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F E G D J MAX . H H A B C I Dimensions List A B 12.0±0.3 5.5±0.1 H I 7.4±0.1 0.3±0.05 5˚ K C 1.75±0.1 J 3.1±0.1 D 8.0±0.1 K 4.0±0.1 E 2.0±0.1 (Unit : mm) F G +0.1 4.0±0.1 φ1.5−0 Reel structure and Dimensions e d c g Dimensions List a b 370 13.5±1.5 e f ±1.0 21 2.0±0.5 f a b (Unit : mm) c d ±1.0 80 13±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 3 000pcs/reel] Sheet No.: D2-A04802FEN 12 PC410L0NIP0F Series ■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E250] Sheet No.: D2-A04802FEN 13