PC957L0NSZ0F Series PC957L0NSZ0F Series High Speed 1Mb/s, High CMR DIP 8 pin ∗OPIC Photocoupler ■ Description ■ Agency approvals/Compliance PC957L0NSZ0F Series contains a LED optically coupled to an OPIC chip. It is packaged in a 8 pin DIP, available in SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0 kV, High speed response (TYP. 1Mb/s) and CMR is MIN. 15 kV/µs. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC957L) 2. Approved by VDE, DIN EN60747-5-2 (∗) (as an option), file No. 40008898 (as model No. PC957L) 3. Package resin : UL flammability grade (94V-0) ■ Features ■ Applications 1. 8 pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. High speed response (tPHL : TYP. 0.2 µs, tPLH : TYP. 0.4 µs) 4. High noise immunity due to high instantaneous common mode rejection voltage (CM H : MIN. 15 kV/µs, CML : MIN. −15 kV/µs) 5. High isolation voltage between input and output (Viso(rms) : 5.0 kV) 6. Lead-free and RoHS directive compliant 1. Programmable controllers 2. Inverter (∗) DIN EN60747-5-2 : successor standard of DIN VDE0884 ∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A06402EN Date Jun. 30. 2005 © SHARP Corporation PC957L0NSZ0F Series ■ Internal Connection Diagram 8 7 6 5 1 2 3 4 1 2 3 NC Anode Cathode NC 5 6 7 8 GND VO (Open collector) NC VCC 4 ■ Outline Dimensions (Unit : mm) 1. Through-Hole [ex. PC957L0NSZ0F] 5 1 2 3 1 Primary side mark 0.26±0.1 0.5±0.1 θ:0 to 13˚ 7.62±0.3 Epoxy resin 0.26±0.1 0.5±0.1 θ θ θ:0 to 13˚ θ Product mass : approx. 0.55g 4. SMT Gullwing Lead-Form (VDE option) [ex. PC957L0YIP0F] 1.2±0.3 SHARP mark "S" 5 8 7 0.85±0.2 6 5 PC957L 6.5±0.5 PC957L Date code 2.54±0.25 0.85±0.2 6 VDE Identification mark 4 Epoxy resin 3. SMT Gullwing Lead-Form [ex. PC957L0NIP0F] 7 3 0.5TYP. 3.4±0.5 3.5±0.5 7.62 Product mass : approx. 0.55g 8 2 Primary side mark ±0.3 θ SHARP mark "S" 5 9.66±0.5 Date code 1.2±0.3 6 4 4 9.66±0.5 2.54±0.25 7 PC957L 6.5±0.5 PC957L 8 0.5 6 6.5±0.5 7 0.85±0.2 TYP. 8 SHARP mark "S" 3.4±0.5 3.5±0.5 SHARP mark "S" 1.2±0.3 0.85±0.2 6.5±0.5 1.2±0.3 2. Through-Hole (VDE option) [ex. PC957L0YSZ0F] 4 VDE Identification mark 1 Date code Primary side mark 0.26±0.1 1.0+0.4 −0 3 9.66±0.5 7.62±0.3 3.5±0.5 2.54±0.25 2 Epoxy resin 4 Date code Primary side mark 7.62±0.3 2.54±0.25 1.0+0.4 −0 1.0+0.4 −0 10.0+0 −0.5 Epoxy resin 0.35±0.25 9.66±0.5 4 0.26±0.1 3 3.5±0.5 2 0.35±0.25 1 1.0+0.4 −0 10.0+0 −0.5 Product mass : approx. 0.51g Product mass : approx. 0.51g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A06402EN 2 PC957L0NSZ0F Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ·· N · Mark P R S T U V W X A B C ·· · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D repeats in a 20 year cycle Country of origin Japan Rank mark There is no rank mark indicator. Sheet No.: D2-A06402EN 3 PC957L0NSZ0F Series ■ Absolute Maximum Ratings (Ta=25˚C) Parameter Symbol Rating 25 Forward current IF Input Reverse voltage VR 5 *2 Power dissipation P 45 −0.5 to +30 VCC Supply voltage Output voltage VO −0.5 to +20 Output Output current IO 8 *3 Power dissipation PO 100 Operating temperature −55 to +85 Topr −55 to +125 Tstg Storage temperature *4 Viso (rms) Isolation voltage 5.0 *5 270 Soldering temperature Tsol *1 Unit mA V mW V V mA mW ˚C ˚C kV ˚C *1 When ambient temperature goes above 70˚C, the power dissipation goes down at 0.8mA/˚C. (Fig.3) *2 When ambient temperature goes above 70˚C, the power dissipation goes down at 1.5mW/˚C. (Fig.4) *3 When ambient temperature goes above 70˚C, the power dissipation goes down at 1.8mW/˚C. (Fig.4) *4 40 to 60%RH, AC for 1minute, f=60Hz *5 For 10s ■ Electro-optical Characteristics*6 Parameter Forward voltage Reverse current Input Terminal capacitance High level output current (1) High level output current (2) High level output current (3) Output Low level output voltage Low level supply current High level supply current (1) High level supply current (2) Current transfer ratio (1) Current transfer ratio (2) Isolation resistance Floating capacitance Transfer "High→Low" propagation delay time characteristics "Low→High" propagation delay time Instantaneous common mode rejection voltage (High level output) Instantaneous common mode rejection voltage (Low level output) Symbol VF IR Ct IOH (1) IOH (2) IOH (3) VOL ICCL ICCH (1) ICCH (2) CTR (1) CTR (2) RISO Cf tpHL tpLH (Unless otherwise specified Ta=0 to 70˚C) Unit Conditions MIN. TYP. MAX. 1.7 1.95 Ta=25˚C, IF=16mA V − µA 10 − Ta=25˚C, VR=5V − Ta=25˚C, V=0, f=1MHz pF 150 60 − Ta=25˚C, IF=0, VCC=VO=5.5V nA − 3 500 µA Ta=25˚C, IF=0, VCC=VO=15V − 0.01 1 µA IF=0, VCC=VO=15V − − 50 IF=16mA, VCC=4.5V, IO=2.4mA V − 0.4 0.1 IF=16mA, VCC=15V, VO=OPEN µA − − 120 µA Ta=25˚C, IF=0, VCC=15V, VO=OPEN − 1 0.02 µA IF=0, VCC=15V, VO=OPEN − − 2 % 50 19 − Ta=25˚C, IF=16mA, VCC=4.5V, VO=0.4V − − % 15 IF=16mA, VCC=4.5V, VO=0.4V Ta=25˚C, DC500V, 40 to 60%RH 1011 − Ω 5×1010 − 0.6 1 pF Ta=25˚C, V=0, f=1MHz 0.2 − 0.8 µs Ta=25˚C, IF=16mA VCC=5V, RL=1.9Ω 0.4 − 0.8 µs CMH Ta=25˚C, IF=0, VCC=5V VCM=1.0kV(p-p), RL=1.9kΩ 15 30 − kV/µs CML Ta=25˚C, IF=16mA, VCC=5V VCM=1.0kV(p-p), RL=1.9kΩ −15 −30 − kV/µs *6 It shall connect a by-pass capacitor of 0.01µF or more between VCC (pin 8 ) and GND (pin 5 ) near the device, when it measures transfer characteristics and the output side characteristics. Sheet No.: D2-A06402EN 4 PC957L0NSZ0F Series ■ Model Line-up Through-Hole SMT Gullwing Sleeve Taping Package 50pcs/sleeve 1 000pcs/reel −−−−−− Approved −−−−−− Approved DIN EN60747-5-2 Model No. PC957L0NSZ0F PC957L0YSZ0F PC957L0NIP0F PC957L0YIP0F Lead Form Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A06402EN 5 PC957L0NSZ0F Series Fig.1 Test Circuit for Propagation Delay Time Pulse input Pulse width 10µs IF 0 IF Duty ratio1/10 1 8 2 7 3 6 4 IF monitor VO VCC 5V RL 5 1.5V 1.5V VO 0.01 µF VOL CL tPLH tPHL *CL includes the probe and wiring capacitance. 100Ω Fig.2 Test Circuit for Instantaneous Common Mode Rejection Voltage 1.0kV VCM IF GL SW A B 1 8 2 7 3 6 4 5 VFF VCC=5V 10% 90% RL VO 0.01µF CL VCM + 0V 10% 90% CMH VO CML VO − When the switch for LED sets to A. 5V 2V IF=0 0.8V VOL When the switch for LED sets to B. IF=16mA *CL includes the probe and wiring capacitance. Fig.3 Forward Current vs. Ambient Temperature Fig.4 Power Dissipation vs. Ambient Temperature Power dissipation P, PO (mW) Forward current IF (mA) 20 15 10 80 60 P 45 40 20 5 70 0 −55 PO 100 25 0 25 70 85 50 75 100 0 −55 125 Ambient temperature Ta (˚C) 0 25 50 85 75 100 125 Ambient temperature Ta (˚C) Sheet No.: D2-A06402EN 6 PC957L0NSZ0F Series Fig.5 Forward Current vs. Forward Voltage Fig.6 Relative Current Transfer Ratio vs. Forward Current 200 Relative current transfer ratio (%) Forward current IF (mA) 100 10 Ta=25˚C Ta=0˚C Ta=50˚C Ta=−25˚C 1 Ta=70˚C VCC=4.5V VO=0.4V Ta=25˚C 150 100 50 Ta=−55˚C 0.1 1.0 1.2 1.4 1.6 CTR=100% at IF=16mA 1.8 0 0.1 2.0 1 Fig.7 Output Current vs. Output Voltage Fig.8 Relative Current Transfer Ratio vs. Ambient Temperature 18 150 Ta=25˚C 16 VCC=5V Dotted line shows pulse characteristics Relative current transfer ratio (%) Output current IO (mA) 12 10 IF=25mA 8 IF=20mA IF=15mA IF=10mA 4 IF=5mA 2 2 4 6 8 10 12 14 16 18 130 120 110 100 90 80 70 60 0 0 IF=16mA VCC=4.5V VO=0.4V 140 14 6 CTR=100% at Ta=25˚C 50 −55 −40 20 Output voltage VO (V) 0 20 40 60 80 100 Fig.10 Propagation Delay Time vs. Ambient Temperature 800 1 000 Propagation delay time tPHL, tPLH (ns) IF=0 100 VCC=VO=5.5V 10 VCC=VO=15V 0.1 −25 −20 Ambient temperature Ta (˚C) Fig.9 High Level Output Current vs. Ambient Temperature 1 100 Forward current IF (mA) Forward voltage VF (V) High level output current IOH (nA) 10 VCC=VO=30V 0 25 50 75 IF=16mA VCC=5V RL=1.9kΩ 600 tPLH 400 200 0 −55 −40 100 tPHL −20 0 20 40 60 80 100 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A06402EN 7 PC957L0NSZ0F Series ■ Design Considerations ● Recommended operating conditions Parameter Input current Supply voltage Fan out (TTL load) Operating temperature Symbol IF VCC N Topr MIN. 7 − − 0 MAX. 16 − 5 +70 TYP. − 5 − − Unit mA V − ˚C ● Notes about static electricity Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. ● Design guide In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01µF or more between VCC and GND near the device. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through LED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of LED. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent LED. ● Degradation In general, the emission of the LED used in photocouplers will degrade over time. In the case of long term operation, please take the general LED degradation (50% degradation over 5 years) into the design consideration. ● Recommended Foot Print (reference) 1.7 2.54 2.54 2.54 8.2 2.2 (Unit : mm) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A06402EN 8 PC957L0NSZ0F Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ( package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 150 to 180˚C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A06402EN 9 PC957L0NSZ0F Series ● Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A06402EN 10 PC957L0NSZ0F Series ■ Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 ±2 5.8 10.8 520 6.7 (Unit : mm) Sheet No.: D2-A06402EN 11 PC957L0NSZ0F Series ● Tape and Reel package Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F J D E G MA X. H H A B C I Dimensions List A B 16.0±0.3 7.5±0.1 H I ±0.1 10.4 0.4±0.05 5˚ K C 1.75±0.1 J 4.2±0.1 D 12.0±0.1 K 10.2±0.1 E 2.0±0.1 (Unit : mm) F G +0.1 4.0±0.1 φ1.5−0 Reel structure and Dimensions e d c g Dimensions List a b 330 17.5±1.5 e f 23±1.0 2.0±0.5 f a b c (Unit : mm) d 100±1.0 g 2.0±0.5 13±0.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D2-A06402EN 12 PC957L0NSZ0F Series ■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E237] Sheet No.: D2-A06402EN 13