PC910L0NSZ0F Series

PC910L0NSZ0F Series
PC910L0NSZ0F
Series
High Speed 10Mb/s, High CMR
DIP 8 pin ∗OPIC
Photocoupler
■ Description
■ Agency approvals/Compliance
PC910L0NSZ0F Series contains a LED optically
coupled to an OPIC chip.
It is packaged in a 8 pin DIP.
Input-output isolation voltage(rms) is 5.0kV, High
speed response (TYP. 10 Mb/s) and CMR is MIN.
10 kV/µs.
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC910L)
2. Approved by VDE, DIN EN60747-5-2 (∗) (as an
option), file No. 40008898 (as model No. PC910L)
3. Package resin : UL flammability grade (94V-0)
(∗)
■ Features
DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Applications
1. DIP 8 pin package
2. Double transfer mold package
(Ideal for Flow Soldering)
3. High speed response
(tPHL : TYP. 48 ns, tPLH : TYP. 50 ns)
4. Low input current drive (IFHL : MAX. 5 mA)
5. Instantaneous common mode rejection voltage
(CMH : MIN.10 kV/µs, CML : MIN. −10 kV/µs)
6. TTL and LSTTL compatible output
7. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
8. Lead-free and RoHS directive compliant
1. High speed interfaces for computer peripherals
2. Programmable controllers
3. Inverter
∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A05602EN
Date Jun. 30. 2005
© SHARP Corporation
PC910L0NSZ0F Series
■ Internal Connection Diagram
1
1
8
2
7
3
6
4
5
2
3
4
NC
Anode
Cathode
NC
5
6
7
8
GND
VO (Open collector)
VE (Enable)
VCC
■ Truth table
Input
H
L
H
L
Enable
H
H
L
L
Output
L
H
H
H
L: Logic (0)
H: Logic (1)
■ Outline Dimensions
(Unit : mm)
1. Through-Hole [ex. PC910L0NSZ0F]
6
PC910L
1
2
3
SHARP
mark
"S"
5
4
6
5
2
3
4
VDE Identification mark
9.66±0.5
Date code
Primary side
mark
7.62±0.3
Epoxy resin
0.26±0.1
0.5±0.1
θ
θ:0 to 13˚
Date code
3.4±0.5 3.5±0.5
0.5TYP.
3.4±0.5 3.5±0.5
2.54±0.25
7
PC910L
4
1
9.66±0.5
Primary side
mark
8
2.54±0.25
7.62±0.3
0.5
7
0.85±0.2
TYP.
8
1.2±0.3
0.85±0.2
6.5±0.5
SHARP
mark
"S"
2. Through-Hole (VDE option) [ex. PC910L0YSZ0F]
6.5±0.5
1.2±0.3
Epoxy resin
0.26±0.1
0.5±0.1
θ
θ
Product mass : approx. 0.55g
θ:0 to 13˚
θ
Product mass : approx. 0.55g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D2-A05602EN
2
PC910L0NSZ0F Series
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
1st digit
Year of production
A.D
Mark
2002
A
2003
B
2004
C
2005
D
2006
E
2007
F
2008
H
2009
J
2010
K
2011
L
2012
M
··
N
·
Mark
P
R
S
T
U
V
W
X
A
B
C
··
·
2nd digit
Month of production
Month
Mark
January
1
February
2
March
3
April
4
May
5
June
6
July
7
August
8
September
9
October
O
November
N
December
D
repeats in a 20 year cycle
Country of origin
Japan
Rank mark
There is no rank mark indicator.
Sheet No.: D2-A05602EN
3
PC910L0NSZ0F Series
Output
Input
■ Absolute Maximum Ratings
*2
*3
(Ta=25°C)
Parameter
Symbol
Rating
IF
20
Forward current
VR
5
Reverse voltage
P
Power dissipation
40
VCC
Supply voltage
7
*1 Enable voltage
VE
5.5
High level output voltage VOH
7
IOL
Low level output current
50
PC
Collector power dissipation
85
Topr
− 40 to +85
Operating temperature
Tstg
Storage temperature
−55 to +125
Viso (rms)
Isolation voltage
5.0
Tsol
270
Soldering temperature
Unit
mA
V
mW
V
V
V
mA
mW
˚C
˚C
kV
˚C
*1 Shall not exceed 500mV from supply voltage (VCC)
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
■ Electro-optical Characteristics*4
Input
Parameter
Forward voltage
Reverse current
Terminal capacitance
High level output voltage
Low level output voltage
Output
(unles otherwise specified Ta=−40 to 85˚C)
MIN.
Symbol
TYP. MAX.
Unit
Conditions
1.9
1.6
Ta=25˚C, IF=10mA
VF
V
−
−
10
µA
IR
Ta=25˚C, VR=5V
−
60
150
Ta=25˚C, V=0, f=1MHz
pF
Ct
−
VCC=VO=5.5V, VE=2.0V, IF=250µA
IOH
−
0.02
100
µA
VCC=5.5V, VE=2.0V,
V
VOL
−
0.4
0.6
IF=5mA, IOL=13mA
High level enable current
Low level enable current
IEH
IEL
High level supply current
ICCH
Low level supply current
ICCL
"High→Low" input threshold
current
IFHL
Response time
Isolation resistance
Floating capacitance
"High→Low" propagation delay time
"Low→High" propagation delay time
Rise time
Fall time
*5
Distortion of pulse width
Transfer
charac"High→Low" enable
teristics
propagation delay time
"Low→High" enable
propagation delay time
VCC=5.5V, VE=2.0V
VCC=5.5V, VE=0.5V
VCC=5.5V, VE=2.0V, IF=0
VCC=5.5V, VE=0.5V, IF=0
VCC=5.5V, VE=2.0V, IF=10mA
VCC=5.5V, VE=0.5V, IF=10mA
VCC=5V,VE=2.0V,
VO=0.8V, RL=350Ω
−
−
−
−
−
−
−0.5
−0.7
5
5
7
5.5
−1.6
−1.6
10
−
13
−
mA
mA
mA
mA
mA
mA
−
2.5
5
mA
RISO
Cf
tPHL
tPLH
tr
tf
∆tw
Ta=25˚C, DC500V, 40 to 60%RH
Ta=25˚C, V=0, f=1MHz
5×1010
−
25
25
−
−
−
1011
0.6
48
50
10
20
−
−
5
75
75
−
−
35
Ω
pF
ns
ns
ns
ns
ns
tEHL
Ta=25˚C, IF=7.5mA, VCC=5V,
RL=350Ω, CL=15pF, VEH=3V
VEL=0.5V
−
15
−
ns
−
10
−
ns
tELH
Ta=25˚C, IF=7.5mA,
VCC=5V, RL=350Ω,
CL=15pF,
Instantaneous common mode
rejection voltage
(High level output)
CMH
Ta=25˚C, IF=0, VCC=5V,
VCM=1kV(P-P),
RL=350Ω, VO (Min)=2V
10
20
−
kV/µs
Instantaneous common mode
rejection voltage
(Low level output)
CML
Ta=25˚C, IF=5mA, VCC=5V,
VCM=1kV(P-P),
RL=350Ω, VO (Max)=0.8V
−10
−20
−
kV/µs
*4 It shall connect a by-pass capacitor of 0.01µF or more between VCC (pin 8 ) and GND (pin 5 ) near the device, when it measures the transfer characteristics and the output side
characteristics
*5 Distortion of pulse width ∆tw= | tPHL− tPLH |
Sheet No.: D2-A05602EN
4
PC910L0NSZ0F Series
■ Model Line-up
Through-Hole
Sleeve
Package
50pcs/sleeve
−−−−−−
Approved
DIN EN60747-5-2
Model No.
PC910L0NSZ0F PC910L0YSZ0F
Lead Form
SMT Gullwing
Taping
1 000pcs/reel
−−−−−−
Approved
−−−−−−
PC910L0YIP0F
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A05602EN
5
PC910L0NSZ0F Series
Fig.1 Test Circuit for Propagation Delay Time and Rise Time, Fall Time
7.5mA
IF
8
2
7
3
6
3.75mA
5V
0.1µF
0mA
IF
Pulse input
1
tPHL
350Ω
VO
4
5V
90%
CL
47Ω
tPLH
VO
5
1.5V
10%
*CL includes the probe
and wiring capacitance.
VOL
tr
tf
Fig.2 Test Circuit for Enable Propagation Delay Time
VE
3V
Pulse input
VE
1
8
2
7
3
6
1.5V
5V
0.1µF
0.5V
IF=7.5mA
tEHL
350Ω
5V
VO
CL
4
tELH
VO
5
1.5V
VOL
*CL includes the probe
and wiring capacitance.
Fig.3 Test Circuit for Instantaneous Common Mode Rejection Voltage
1kV
B
IF
A
1
8
2
7
3
6
4
5
5V
VCM
0V
0.1µF
GL SW
350Ω
CL
VCM
VO
(IF=0)
5V
VO(MIN.)
When the switch for
LED sets to A
VO(MAX.) When the switch for
LED sets to B
V
VO
(IF=5mA)
OL
*CL includes the probe and wiring capacitance.
Sheet No.: D2-A05602EN
6
PC910L0NSZ0F Series
Fig.4 Forward Current vs. Ambient
Temperature
Fig.5 Collector Power Dissipation vs.
Ambient Temperature
100
Collector power dissipation PC (mW)
Forward current IF (mA)
25
20
15
10
5
70
0
−40 −25
0
25
85
80
60
40
20
70
85
50
100
75
0
−40 −25
125
0
Fig.6 Forward Current vs. Forward Voltage
75
100
125
Fig.7 High Level Output Current vs.
Ambient Temperature
100
100
Ta=0˚C
High level output current IOH (µA)
Ta=25˚C
Forward current IF (mA)
50
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
Ta=50˚C
10
Ta=85˚C
Ta=−20˚C
1
Ta=−40˚C
1
1.2
1.4
1.6
1.8
2
IF=250µA
VCC=5.5V
VO=5.5V
VE=2.0V
10
1
0.1
0.01
0.001
−50
0.1
−25
Fig.8 Low Level Output Voltage vs. Ambient
Temperature
25
50
75
100
Fig.9 Input Threshold Current vs.
Ambient Temperature
6
0.8
Input threshold current IFHL (mA)
IF=5.0mA
VCC=5.5V
VE=2.0V
0.6
IO=16.0mA
IO=12.8mA
0.4
IO=9.6mA
0.2
IO=6.4mA
0
−50
0
Ambient temperature Ta (˚C)
Forward voltage VF (V)
Low level output voltage VOL (V)
25
85
−25
0
25
50
75
4
3
2
1
0
−50
100
VCC=5V
VO=0.8V
VE=2.0V
RL=350Ω
5
−25
0
25
50
75
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Sheet No.: D2-A05602EN
7
PC910L0NSZ0F Series
Fig.10 Output Voltage vs. Forward Current
Fig.11 Propagation Delay Time vs. Forward
Current
100
6
Output voltage VO (V)
5
Propagation delay time tPHL, tPLH (ns)
VCC=5.0V
VO=0.8V
VE=2.0V
Ta=25˚C
4
3
2
RL=1kΩ
1
RL=350Ω
RL=4kΩ
0
Ta=25˚C
VCC=5.0V
RL=350Ω
80
60
tPLH
40
tPHL
20
0
0
1
2
3
4
5
6
5
Forward current IF (mA)
10
15
20
Forward current IF (mA)
Fig.12 Propagation Delay Time vs.
Ambient Temperature
Propagation delay time tPHL, tPLH (ns)
100
IF=7.5mA
VCC=5.0V
RL=350Ω
80
60
tPLH
40
tPHL
20
0
−50
−25
0
25
50
75
100
Ambient temperature Ta (˚C)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A05602EN
8
PC910L0NSZ0F Series
■ Design Considerations
● Recommended operating conditions
Parameter
Low level input current
High level input current
High level enable input voltage
Low level enable input voltage
Supply voltage
Fan out (TTL load)
Operating temperature
Symbol
IFL
IFH
VEH
VEL
VCC
N
Topr
MIN.
0
8
2.0
0
4.5
−
−40
TYP.
−
−
−
−
−
−
−
MAX.
250
15
VCC
0.8
5.5
8
70
Unit
µA
mA
V
V
V
−
˚C
● Notes about static electricity
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute
design.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Design guide
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between VCC and GND near the device.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through LED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of LED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent LED.
● Degradation
In general, the emission of the LED used in photocouplers will degrade over time.
In the case of long term operation, please take the general LED degradation (50% degradation over 5 years)
into the design consideration.
Please decide the input current which become 2 times of MAX. IFHL.
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A05602EN
9
PC910L0NSZ0F Series
■ Manufacturing Guidelines
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A05602EN
10
PC910L0NSZ0F Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D2-A05602EN
11
PC910L0NSZ0F Series
■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
±2
5.8
10.8
520
6.7
(Unit : mm)
Sheet No.: D2-A05602EN
12
PC910L0NSZ0F Series
● Tape and Reel package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
J
D
E
G
MA
X.
H
H
A
B
C
I
5˚
K
Dimensions List
A
B
16.0±0.3
7.5±0.1
H
I
±0.1
10.4
0.4±0.05
C
1.75±0.1
J
4.2±0.1
D
12.0±0.1
K
10.2±0.1
E
2.0±0.1
(Unit : mm)
F
G
+0.1
4.0±0.1
φ1.5−0
Reel structure and Dimensions
e
d
c
g
Dimensions List
a
b
330
e
23±1.0
f
a
b
17.5±1.5
f
2.0±0.5
(Unit : mm)
c
d
±1.0
100
13±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A05602EN
13
PC910L0NSZ0F Series
■ Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
[E235]
Sheet No.: D2-A05602EN
14