SHENZHENFREESCALE SUD50N025-09BP

SUD50N025-09BP
N-Channel 25-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
rDS(on) (W)
ID (A)a, e
0.0086 @ VGS = 10 V
62
0.012 @ VGS = 4.5 V
52
VDS (V)
25
D TrenchFETr Power MOSFET
D 100% Rg Tested
D RoHS Compliant
Qg (Typ)
18 5 nC
18.5
RoHS
COMPLIANT
APPLICATIONS
D DC/DC Conversion, High-Side
– Desktop PC
TO-252
D
G
Drain Connected to Tab
G
D
S
Top View
S
N-Channel MOSFET
Ordering Information: SUD50N025-09BP—E3 (Lead (Pb)-free)
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Symbol
Limit
Drain-Source Voltage
Parameter
VDS
25
Gate-Source Voltage
VGS
"20
Continuous Drain Current (TJ = 175_C)
TA = 25_C
51e
ID
26b, c
22b, c
TA = 70_C
Pulsed Drain Current
IDM
Continuous Source-Drain
Source Drain Diode Current
TC = 25_C
TA = 25_C
Avalanche Current Pulse
L=0
0.1
1 mH
Single Pulse Avalanche Energy
TC = 70_C
TA = 25_C
37
IS
6.7b, c
IAS
28
EAS
39.2
mJ
55
39
PD
W
10b, c
7b, c
TA = 70_C
Operating Junction and Storage Temperature Range
A
100
TC = 25_C
Maximum Power Dissipation
V
62e
TC = 25_C
TC = 70_C
Unit
TJ, Tstg
_C
–55 to 175
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb, d
Maximum Junction-to-Case
Symbol
Typical
Maximum
t p 10 sec
RthJA
12
15
Steady State
RthJC
2.2
2.7
Unit
_C/W
Notes:
a. Based on TC = 25_C.
b. Surface mounted on 1” x 1” FR4 board.
c. t = 10 sec
d. Maximum under steady state conditions is 50 _C/W.
e. Calculated based on maximum junction temperature. Package limitation current is 50 A.
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SUD50N025-09BP
N-Channel 25-V (D-S) MOSFET
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VDS
VGS = 0 V, ID = 250 mA
25
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
DVDS/TJ
VDS Temperature Coefficient
DVGS(th)/TJ
Gate-Source Threshold Voltage
VGS(th)
VDS = VGS, ID = 250 mA
IGSS
Gate-Source Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
rDS(on)
Forward Transconductancea
gfs
20
ID = 250 mA
VGS(th) Temperature Coefficient
V
mV/_C
– 6.3
1.2
2.4
V
VDS = 0 V, VGS = "20 V
"100
nA
VDS = 25 V, VGS = 0 V
1
VDS = 25 V, VGS = 0 V, TJ = 55_C
10
VDS w 5 V, VGS = 10 V
100
A
mA
A
VGS = 10 V, ID = 26 A
0.007
0.0086
VGS = 4.5 V, ID = 22 A
0.0096
0.012
VDS = 15 V, ID = 26 A
46
W
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
2020
VDS = 12 V, VGS = 0 V, f = 1 MHz
245
VDS = 12 V, VGS = 10 V, ID = 26 A
VDS = 12 V, VGS = 4.5 V, ID= 26 A
38
57
18.5
28
nC
7
6.5
f = 1 MHz
td(on)
tr
pF
p
485
0.9
1.4
9
14
8
12
20
30
tf
8
12
td(on)
17
26
15
23
17
26
8
12
td(off)
tr
td(off)
VDD = 12 V, RL = 0.54 W
ID ^ 22 A, VGEN = 10 V, Rg = 1 W
VDD = 12 V, RL = 0.54 W
ID ^ 22 A, VGEN = 4.5 V, Rg = 1 W
tf
W
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
IS
Pulse Diode Forward Currenta
ISM
Body Diode Voltage
VSD
TC = 25_C
37
100
IS = 6.7 A
0.9
1.5
A
V
Body Diode Reverse Recovery Time
trr
26
40
ns
Body Diode Reverse Recovery Charge
Qrr
16
24
nC
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
IF = 6
6.7
7A
A, di/dt = 100 A/ms
A/ms, TJ = 25_C
12
14
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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SUD50N025-09BP
N-Channel 25-V (D-S) MOSFET
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
100
20
I D – Drain Current (A)
I D – Drain Current (A)
VGS = 10 V thru 5 V
80
4V
60
40
20
0.5
1.0
1.5
2.0
TC = –55_C
12
TC = 25_C
8
TC =125_C
4
3V
0
0.0
16
2.5
0
1.0
3.0
1.5
VDS – Drain-to-Source Voltage (V)
2.0
3.0
3.5
VGS – Gate-to-Source Voltage (V)
Capacitance
On-Resistance vs. Drain Current
0.0200
3000
0.0175
2500
C – Capacitance (pF)
rDS(on) – On-Resistance (W)
2.5
0.0150
0.0125
VGS = 4.5 V
0.0100
Ciss
2000
1500
1000
Coss
0.0075
500
VGS = 10 V
Crss
0
0.0050
0
20
40
60
80
0
100
5
ID – Drain Current (A)
15
20
VDS – Drain-to-Source Voltage (V)
On-Resistance vs. Junction Temperature
Gate Charge
10
1.8
ID = 20 A
ID = 26 A
1.6
rDS(on) – On-Resistance
(Normalized)
8
VDS = 12 V
VGS (V)
10
6
VDS = 18 V
4
2
1.4
VGS = 4.5 V, 10 V
1.2
1.0
0.8
0
0
10
20
Qg (nC)
3/7
30
40
0.6
–50
–25
0
25
50
75
100
125
TJ – Junction Temperature
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150
175
SUD50N025-09BP
N-Channel 25-V (D-S) MOSFET
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
rDS(on) vs VGS vs. Temperature
100
0.024
rDS(on) On-Resistance (W)
I S – Source Current (A)
ID = 20 A
TJ = 150_C
10
TJ = 25_C
0.018
TA = 125_C
0.012
0.006
TA = 25_C
0.000
1
0.3
0.6
0.9
0
1.2
2
VSD – Source-to-Drain Voltage (V)
4
6
8
10
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
2.3
720
2.1
600
1.9
480
Power (W)
1.5
1.3
TA = 25_C
360
240
1.1
0.9
120
0.7
0.5
–50
–25
0
25
50
75
100
125
150
0
0.001
175
0.01
TJ – Temperature (_C)
0.1
1
10
100
Time (sec)
Safe Operating Area
1000
*Limited by rDS(on)
100
1 ms
10
ID (A)
VGS(th) – (V)
ID = 250 mA
1.7
10 ms
100 ms
1
1
10
DC
0.10
0.01
0.001
0.1
TA = 25_C
Single Pulse
1
10
100
VDS (V)
*VGS u minimum VGS at which rDS(on) is specified
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1000
SUD50N025-09BP
N-Channel 25-V (D-S) MOSFET
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Current De-Rating
Power De-Rating
16
3.0
2.5
2.0
Power
Drain Current (A)
12
8
1.5
1.0
4
0.5
0
0.0
0
25
50
75
100
125
150
175
TC – Case Temperature (_C)
50
75
100
125
150
TC – Case Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
25
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 70_C/W
3. TJM – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10–4
5/7
10–3
10–2
10–1
1
Square Wave Pulse Duration (sec)
10
100
600
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175
SUD50N025-09BP
N-Channel 25-V (D-S) MOSFET
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Case
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10–4
6/7
10–3
10–2
10–1
Square Wave Pulse Duration (sec)
1
10
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SUD50N025-09BP
N-Channel 25-V (D-S) MOSFET
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freestyle Intertechnology, Inc. hereby certi fies that all its products that are id entified as RoHS-Compliant fulfill the
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