SUMMIT SMB135_08

SMB135
Programmable Switch-mode, USB/AC Input Li+ Battery Charger with
TurboCharge™ Mode*
FEATURES & APPLICATIONS
INTRODUCTION
The SMB135 is a programmable single-cell lithium-ion/lithium-polymer
battery charger for a variety of portable applications. The device
provides a simple and efficient way to charge high-capacity Li-Ion
batteries via a USB port or an AC adapter. Unlike conventional
devices, the SMB135’s high-efficiency operation eliminates large
internal temperature rise and localized hot spot in handheld equipment.
TM
Summit’s proprietary TurboCharge mode allows a 750mA charge
current from a 500mA USB port, resulting to significantly reduced
charge times.
• Programmable USB/AC Li-Ion battery charger
• TurboChargeTM Mode: 750mA output from 500mA USB
• High-efficiency current-mode PWM controller
•
•
•
•
o
o
750kHz to 1.25MHz switching frequency
0% to 100% duty-cycle
4.35 to 6.5V input voltage range
Small 1.3 x 2.1 uCSPTM-15 package (0.4mm pitch)
High-accuracy output voltage regulation: 1%
Low reverse leakage current
• Digital programming of all major parameters via I2C
interface (with several addresses) and non-volatile
memory
o
o
o
o
o
Charge control includes qualification, trickle-charge, pre-charge,
constant current/constant voltage, and termination/safety settings that
are fully programmable via a serial I2C/SMBus making the device truly
a flexible solution. Fast charge current level (one or five unit loads)
2
can be set via I C or an input pin (USB500/100). An Enable (EN) pin is
also provided for suspending USB charging and allowing the device to
work in parallel with AC charger, which may already be integrated into
a PMIC device. In this case, the SMB135 does not allow current to
flow back to the USB port.
Battery voltage set point
Pre-charge, fast charge, termination current
Fast charge voltage threshold
Temperature limits
Automatic restart threshold
• Status/Fault indicator
• Stability with ceramic capacitors
• Wide range of protection features
o
o
o
o
The SMB135 offers a wide variety of features that protect the battery
pack as well as the charger and input circuitry: over-current,
under/over-voltage and thermal protection. Ultra-precise, 1% accurate,
Kelvin-sensed ADOC™ technology allows accurate control of battery
float voltage and improves battery capacity utilization. Status can be
monitored via the serial port for charge state and fault conditions. In
addition, one LED driver output can be used to signal charge status or
an under-/over-voltage condition. As a protection mechanism, when
the junction temperature approaches approximately 110°C, the PWM
switcher will start to cut back on the duty cycle, to reduce current.
Thermal monitor
Safety timers
Current limit
Input/output over-voltage lockout
Applications
•
•
•
•
•
GSM Handsets
UMTS Handsets
Portable Media & Gaming Players
Digital camcorders/still cameras
Handheld GPS/PDAs
TM
The SMB135 is available in a space-saving 1.3mm x 2.1mm uCSP
package with lead-free balls as well as in a lead-free 5x5 QFN-32
package, and is rated over the -30°C to +85°C temperature range.
SIMPLIFIED APPLICATIONS DRAWING
6.8uH
SMB135
OUT
IN
4.7uF
500-700mA
4.35V-6.5V
10uF
VDDCAP
1uF
SENSEH
50-100mΩ
SENSEL
GND
SDA
BATT
SCL
D+
USB
Controller
USB500/100
D-
Li-Ion
THERM
RLIM
LED
EN
VDC
ADC+ ADC-
COMP
STAT
GND
Ccomp
Rcomp
Figure 1 – Applications block diagram featuring the SMB135 programmable switch-mode battery charger.
* Patent Pending
© SUMMIT Microelectronics, Inc. 2006 • 757 North Mary Avenue • Sunnyvale CA 94085 • Phone 408 523-1000 • FAX 408 523-1266
http://www.summitmicro.com/
2106 3.1 11/4/2008
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SMB135
GENERAL DESCRIPTION
The SMB135 is a fully programmable battery charger for
single-cell Li-Ion and Li-Polymer battery packs. The
device’s high-efficiency, switch-mode operation reduces
heat dissipation and allows for higher current capability
for a given package size. The SMB135 provides four
main charging phases: trickle-charge, pre-conditioning
(pre-charge), constant current and constant voltage.
The overall system accuracy of the SMB135 is 1%,
allowing for a higher capacity utilization versus other
conventional solutions.
When a battery or an external supply is inserted and the
EN (ENABLE) input is asserted, the SMB135 performs
the pre-qualification checks before initiating a charging
cycle. The input voltage needs to be higher than the
UVLO threshold and the cell temperature needs to be
within the temperature limits for the charging cycle to
start. As soon as the input supply is removed, the
SMB135 enters a shutdown mode, thereby saving
battery power. A programmable option also exists that
allows the user to prevent battery charging until an I2C
command has been issued.
If the battery voltage is below 2.0V (trickle-charge to precharge threshold), the device will apply a trickle-charge
current of 10mA (typical). This allows the SMB135 to
reset the protection circuit in the battery pack and bring
the battery voltage to a higher level without
compromising safety.
Once the battery voltage crosses the 2.0V threshold, the
SMB135 enters the pre-charge mode. This mode
replenishes deeply depleted cells and minimizes heat
dissipation during the initial charge cycle.
The
preconditioning current is programmable, with the default
value at C/10. If the battery voltage does not reach the
preconditioning voltage level (programmable) within a
specified amount of time (pre-charge timeout), the safety
timer expires and the charge cycle is terminated.
When the battery voltage reaches the pre-charge to fastcharge voltage level, the SMB135 enters the constant
current (fast charge) mode. The fast charge current
level is programmable in two ways: a) via an external
sense resistor and b) via the corresponding register.
Summit Microelectronics, Inc
Once the final float voltage (programmable) has been
reached, the battery charger will enter a constant voltage
mode in which the battery voltage is kept constant,
allowing the charge current to gradually taper off. The
constant-voltage charging mode will continue until the
charge current drops below the termination current
threshold, or until the fast charge timer has expires. The
termination current threshold is programmable from
25mA to 130mA in 15mA increments.
After the charge cycle has terminated, the SMB135
continues to monitor the battery voltage. If the battery
voltage falls below the recharge threshold (typically
115mV below float voltage), the SMB135 can
automatically top-off the battery.
A wide range of protection features is also included in
the SMB135. These include input and output overvoltage protection, battery missing detector and thermal
monitor for continuous cell temperature monitoring and
pre-qualification.
The following charging parameters can be adjusted
dynamically via the I2C interface, for optimizing battery
management real-time. These parameters can also be
programmed statically via a user-friendly GUI interface:
•
•
•
•
•
•
•
Battery (float) voltage
Fast charge current
Pre-conditioning voltage threshold
Pre-conditioning charge current
Termination current
Safety charge timers
Temperature window
The SMB135 also offers three programmable PWM
switching frequencies ranging from 750kHz to 1250kHz
in 250kHz increments.
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SMB135
INTERNAL BLOCK DIAGRAM
EEPROM
z
Registers
z
Internal
VDD
z
Regulator
SDA
Interface
z
SCL
VDDCAP
Charge
z
Control
USB500/100
EN
SENSEH
IN
SENSEL
BATT
WELL
Control
PWM
Control
Prog.
Float
Voltage
OUT
Internal
Temperature
z
Limit
COMP
VDDCAP
Prog. Cold
Limit
Programmable
Current
THERM
Prog. Hot
Limit
Figure 2 – Internal block diagram of the SMB135 programmable switch-mode battery charger.
Summit Microelectronics, Inc
2106 3.1 11/4/2008
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SMB135
PACKAGE AND PIN DESCRIPTIONS
Ball
Number
(CSP-15)
Pin
Number
(QFN-32)
Pin Name
Pin
Type
A1
1
BATT
I
B1
4
SENSEH
I
C1
5
SENSEL
I
D1
7
COMP
I
E1
A2
10
29
STAT
THERM
O
I/O
B2
27
VDDCAP
PWR
AGND
PWR
Analog Ground – Connect to isolated PCB ground.
GND
PWR
Ground – Connect to isolated PCB ground.
C2
D2
3, 8, 18,
20, 22, 30,
32
3, 8, 18,
20, 22, 30,
32
E2
12
IN
I
A3
25
EN
I
B3
24
USB500/100
I
C3
D3
E3
21
19
14
SDA
SCL
OUT
I/O
I
O
N/A
33
GND
PWR
N/A
2, 6, 9, 11,
13, 15, 16,
17, 23, 26,
28, 31
NC
N/A
Summit Microelectronics, Inc
Pin Description
Battery Voltage Sense – Connect directly to positive terminal
of battery.
Charge Current Sense – Connect to high-side of charge
current sense resistor.
Charge Current Sense – Connect to low-side of charge
current sense resistor (allows for higher accuracy).
Primary Compensation – Connect to R/C compensation
network.
Status and Fault Indicator.
Battery Thermistor Sense.
VDD Bypass – Connect to VDD bypass capacitor with 1µF or
greater capacitor.
USB (+4.35V to +5.5V) or Adaptor Input (+4.35V to +6.5V) –
Bypass with a 1µF or greater capacitor.
Enable Input (active low) – A logic low signal on this pin
powers-up the device and allows a battery charge cycle to
occur. A logic high signal on this pin forces IN to a highimpedance, low-current state, and the internal VDD regulator
is powered down. If unused, this pin should be tied to GND.
Charge Current Regulation Setting – Connect to logic high for
500mA or low for 100mA charge current setting. This charging
current can be overridden by I2C but only for values less than
500mA and 100mA respectively. The actual charging values
are (500-IOFFSET) mA and (100-IOFFSET) mA respectively, with
IOFFSET being the device’s total active current (Note 1). When
unused, this pin should be tied to VDDCAP or GND (do not
leave floating).
I2C Bus Data.
I2C Bus Clock.
Charge Current Output – Connect to inductor.
Exposed metal (thermal) Pad on bottom of SMB135. The
thermal pad of the SMB135 package must be connected to
the PCB GND.
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SMB135
PACKAGE AND PIN DESCRIPTIONS (CONT.)
A1
A2
A3
SMB135
B1
B2
B3
lead-free
C1
D1
C2
C3
uCSPTM-15
D2
D3
1.3mm x 2.1mm
E1
E2
E3
Summit Microelectronics, Inc
GND
NC
GND
THERM
NC
VDD_CAP
NC
EN
15-Ball Ultra CSPTM
Bottom View
32
31
30
29
28
27
26
25
BATT
1
24
USB500/100
NC
2
23
NC
GND
3
22
GND
SENSEH
4
21
SDA
SENSEL
5
20
GND
NC
6
19
SCL
COMP
7
18
GND
GND
8
17
NC
11
12
13
14
STAT
NC
IN
NC
OUT
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15
16
NC
10
NC
9
NC
SMB135
5mm x 5mm QFN-32
5
SMB135
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
Temperature Under Bias ...................... -55°C to 155°C
Storage Temperature............................ -55°C to 125°C
Terminal Voltage with Respect to GND:
VIN ................................................... -0.3V to +10V
All Others ........................................... -0.3V to +6V
Output Short Circuit Current ............................... 100mA
Lead Solder Temperature (10 s).......................... 300°C
Junction Temperature.......................…….....…...150°C
HBM ESD Rating per JEDEC…………………..…4000V
MM ESD Rating per JEDEC………………….….…200V
CDM ESD Rating per JEDEC……………………..1000V
Latch-Up testing per JEDEC………..…....……±100mA
Industrial Temperature Range ……… … -30°C to +85°C
VIN ..........................................................+4.35V to +6.5V
Package Thermal Resistance (θJA)
uCSPTM-15…………………………..………….....55°C/W
5x5 QFN-32 (thermal pad connected to PCB).37.2°C/W
RELIABILITY CHARACTERISTICS
Data Retention…………………………..…..100 Years
Endurance…………………….……….100,000 Cycles
Note – The device is not guaranteed to function outside its
operating rating. Stresses listed under Absolute Maximum
Ratings may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions outside those listed in the
operational sections of the specification is not implied.
Exposure to any absolute maximum rating for extended
periods may affect device performance and reliability.
Devices are ESD sensitive. Handling precautions are
recommended.
DC OPERATING CHARACTERISTICS
TA= -30°C to +85°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND.
Symbol
Parameter
Conditions
Min
VFLT = 4.2V, ICHG=100mA
VFLT = 4.2V
+4.35
IDD-ACTIVE
IOFFSET
Input supply voltage
Under-voltage lockout voltage
Under-voltage lockout
hysteresis
Input over-voltage lockout
voltage
Battery over-voltage lockout
voltage
Automatic shutdown
threshold voltage
Active supply current
Active supply current
IDD-SHDN
Shutdown supply current
Input voltage present
ILK
Reverse leakage current
VIN < VBATT (no adapter),
T=0oC to +70oC
TREG
Thermal regulation
temperature
Typ
Max
Unit
+6.5
+3.5
V
V
10
mV
+7.0
V
VFLT+0.1
V
VIN – VBATT
130
mV
PWM not switching
PWM switching
0.8
5
4
mA
mA
7
20
µA
2
µA
General
VIN
VUVLO
VUVLO-HYS
VOVLO
VBOV
VASHDN
Summit Microelectronics, Inc
VFLT = 4.2V
110
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C
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SMB135
DC OPERATING CHARACTERISTICS (CONTINUED)
TA= -30°C to +85°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Switch-mode Controller
RRDSON
FET On-resistance
VIN = 5.0V
550
ILIMIT
Current limit
D.C.
Duty cycle
fOSC=1.25MHz, VBATT=3.0V
Maximum
Minimum
1000
100
0
mΩ
mA
%
%
Logic Inputs/Output
VIL
VIH
VILEN
VIHEN
VOL
Input low level
Input high level
Input low level
Input high level
SDA/STAT Output low level
IBIAS
ISINK
Input bias current
STAT sink current
All inputs except EN
All inputs except EN
600
1.4
400
1.2
ISINK=3mA
300
mV
V
mV
V
mV
5
µA
mA
52.5
mV
2.0
V
1
Battery Charger
Fast-charge mode, maximum
voltage across sense resistor
VPRECHG
Constant current sense
voltage
Trickle-charge to pre-charge
voltage threshold
Trickle-charge current
Pre-charge to fast-charge
voltage threshold
IPRECHG
Nominal pre-charge current
∆IPRECHG
Pre-charge current tolerance
12.5mA steps, RSENSE = 0.1Ω
IPRECHG = 100mA, RSENSE =
0.1Ω, T=0oC to +70oC
IFCHG
Nominal Fast charge current
ICHG
Nominal charge current
∆ICHG
Fast charge current tolerance
VFLT
Float voltage range
∆VFLT
Float voltage tolerance
ITERM
Charge termination current
∆ITERM
Termination current tolerance
VSENSE
VTRICKLECHG
ITRICKLECHG
10
100mV steps
16 steps, RSENSE = 0.1Ω
USB500/100=VIN, Note 1
USB500/100=GND, Note 1
IFCHG = 525mA, RSENSE =
0.1Ω, T=0oC to +70oC
20mV steps
T=+10oC to +50oC, VFLT =
4.2V
2.400
3.100
mA
V
25
212.5
mA
125
mA
525
mA
75
100
47.5
495
75
525
100
555
125
mA
mA
495
525
555
mA
4.020
4.620
V
-1
+1
%
15mA steps, RSENSE = 0.1Ω
25
130
mA
ITERM = 55mA, RSENSE = 0.1Ω,
T=0oC to +70oC
25
85
mA
Note 1: The ACTUAL charging current always equals the nominal values given in the register tables minus IOFFSET, where IOFFSET is the device’s total
active current. The 525mA nominal value shown here is with the hex value F in register h00[7:4]. For USB1, the nominal value is the lower of the one
selected in the register and 100mA.
Note 2: Voltage, current and frequency accuracies are only guaranteed for factory-programmed settings. Changing any of these parameters from the
values reflected in the customer specific CSIR code will result in inaccuracies exceeding those specified above.
Note 3: The SMB135 device is not intended to function as a battery pack protector. Battery packs used in conjunction with this device need to provide
adequate internal protection and to comply with the corresponding battery pack specifications.
Summit Microelectronics, Inc
2106 3.1 11/4/2008
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SMB135
DC OPERATING CHARACTERISTICS (CONTINUED)
TA= -30°C to +85°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Battery Charger
VRECH
Recharge threshold voltage
CMR
Common mode range
THI
Charge cutoff temp (high)
TLO
Charge cutoff temp (low)
115
Current Sense Amplifier,
Note 4
Adjustable, conditions per
typical application
Adjustable, conditions per
typical application
mV
2
VBATT
30
65
o
-20
15
o
V
C
C
Note 4: Guaranteed by Design.
AC OPERATING CHARACTERISTICS
TA= -30°C to +85°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND.
Symbol
Description
Conditions
Min
250kHz steps (3 settings)
fOSC=1.25MHz (default), T=0oC to
+70oC
Note 5
Disabled
Enabled
Short
Long
750
Typ
Max
Unit
1250
kHz
1.375
MHz
Oscillator
fOSC
Frequency range
∆fOSC
Frequency accuracy
tSTART
Start-up time
tGLITCH
Glitch filter
tHOLDOFF
Hold-off time
tFCTO
Fast-charge Timeout
tFCTO = 350min
tFCTO = 699min
1.125
1.250
20
0
250
0
1
256
ms
msec
msec
msec
msec
-15
tFCTO
+15
%
-15
tPCTO
+15
%
tFCTO = 1398min
tPCTO = 44min
tPCTO
Pre-charge Timeout
tPCTO = 87min
tPCTO = 175min
Note 5: This is the time it takes for the device to be ready for I2C communication or charging after power-up (including coming out of shutdown).
When charging is enabled, actual charging begins after the hold-off timer has expired.
Summit Microelectronics, Inc
2106 3.1 11/4/2008
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SMB135
CHARGING ALGORITHM (500mA)
Charge Algorithm (CC-CV) vs. Time
4.50
1
Battery Voltage
Charge Current
Input current
Float Voltage
Vfloat (prog)
Battery Voltage (V)
3.50
3.00
0.1
Fast-charge
Vbat<Vfloat
Ichg (prog)
Trickle charge
Vbat<2.00V
Itrickle = 10mA
Taper-charge
Vbat=Vfloat
Charge
termination
(prog)
0.01
2.50
Pre-charge
Vbat<Vprechg
Iprechg (prog)
Log Current (A)
4.00
Pre-charge to
fast-charge
transition (prog)
2.00
Trickle to pre-charge
transition (fixed 2.00V)
1.50
0.001
Time
Figure 3 – Typical SMB135 Charging Algorithm)
Summit Microelectronics, Inc
2106 3.1 11/4/2008
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SMB135
I2C-2 WIRE SERIAL INTERFACE AC OPERATING CHARACTERISTICS – 400 kHz
TA= 0°C to +85°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND.
400kHz
Symbol
Description
fSCL
SCL clock frequency
TLOW
Clock low period
1.3
µs
THIGH
Clock high period
0.6
µs
tBUF
Bus free time between a STOP
and a START condition
1.3
µs
tSU:STA
Start condition setup time
0.6
µs
tHD:STA
Start condition hold time
0.6
µs
tSU:STO
Stop condition setup time
0.6
tAA
Clock edge to data valid
SCL low to valid SDA (cycle n)
0.2
tDH
Data output hold time
SCL low (cycle n+1) to SDA
change
0.2
tR
SCL and SDA rise time
Note 6
20 +
0.1Cb
300
ns
tF
SCL and SDA fall time
Note 6
20 +
0.1Cb
300
ns
tSU:DAT
Data in setup time
100
tHD:DAT
Data in hold time
0
TI
Noise filter SCL and SDA
Noise suppression
tWR_CONFIG
Write cycle time config
Configuration registers
10
ms
tWR_EE
Write cycle time EE
Memory array
5
ms
Conditions
Min
Typ
0
Before new transmission – Note
6
Max
Units
400
kHz
µs
0.9
µs
µs
ns
0.9
140
µs
ns
Note 6: Guaranteed by Design.
I2C TIMING DIAGRAMS
tR
tF
tSU:STA
tHD:STA
tHIGH
tWR (For Write Operation Only)
tLOW
SCL
tHD:DAT
tSU:DAT
tSU:STO
tBUF
SDA (IN)
tAA
tDH
SDA (OUT)
Figure 4 – I2C Timing Diagrams
Summit Microelectronics, Inc
2106 3.1 11/4/2008
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SMB135
EFFICIENCY GRAPHS
Figure 5: SMB135 QFN Efficiency vs Voltage
VIN=5V, IFCHG=500mA, F=1.25MHz, TA=25°C
Efficiency (%)
100
95
90
Taiyo Y 4.7uH
TDK 6.8uH
85
80
75
3
3.2
3.4
3.6
3.8
4
4.2
VBATT (V)
Figure 6: SMB135 QFN Efficiency vs Voltage
VIN=5V, IFCHG=500mA, L=6.8uH (TDK:VLF4012), TA=25°C
Efficiency (%)
100
95
90
1.25MHz
1MHz
85
750kHz
80
75
3
3.2
3.4
3.6
3.8
4
4.2
VBATT (V)
Summit Microelectronics, Inc
2106 3.1 11/4/2008
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SMB135
OUTPUT CURRENT GRAPH
Figure 7: Output Current vs. Battery Voltage
VIN=5V, IFCHG=1000mA, RSENSE=50mOhm, F=1.25MHz,
VFLOAT=4.2V,TA=25°C
IBATT (mA)
1100
1000
900
800
700
3.00
3.50
4.00
4.50
VBATT (V)
Summit Microelectronics, Inc
2106 3.1 11/4/2008
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SMB135
APPLICATIONS INFORMATION
DEVICE OPERATION
The SMB135 is a fully programmable battery charger
for single-cell Li-Ion and Li-Polymer battery packs. The
device’s
high-efficiency,
switch-mode
operation
reduces heat dissipation and allows for higher current
capability for a given package size. The SMB135
provides four main charging phases: trickle-charge,
pre-conditioning (pre-charge), constant (fast-charge)
current and constant voltage. The overall system
accuracy of the SMB135 is 1%, allowing for a higher
capacity utilization versus other conventional solutions.
Furthermore, the main battery charging parameters are
programmable, allowing for high design flexibility and
sophisticated battery management.
Power Supply
The SMB135 can be powered from an input voltage
between +4.35 and +6.5 Volts applied between the IN
pin and ground. The voltage on the IN pin is monitored
by Under-Voltage (UVLO) and Over-Voltage Lockout
(OVLO) circuits, which prevent the charger from turning
on when the voltage at this node is less than the UVLO
threshold (+3.5V), or greater than the OVLO threshold
(+7.0V). The IN pin also supplies an internal +2.5V
VDD regulator, filtered by an external capacitor
attached between the VDDCAP pin and ground; this
filtered voltage is then used as an internal VDD supply.
When the input supply is removed, the SMB135 enters
a low-power shutdown mode, exhibiting a very low
discharge leakage current (2µA), thereby extending
battery life.
Pre-qualification Mode
When an external wall adaptor or a USB cable is
connected, the SMB135 performs a series of prequalification tests before initiating the first charge cycle.
The input voltage level needs to be higher than the
UVLO threshold, lower than the OVLO threshold and
130mV greater than the battery voltage; the ENABLE
input needs to be asserted or the appropriate I2C
command needs to be asserted; and the cell
temperature needs to be within the specified
temperature limits for the charging cycle to start. The
pre-qualification parameters are continuously monitored
and charge cycle is suspended when one of them is
outside the limits.
Trickle-charge Mode
Once all pre-qualification conditions are met, the device
checks the battery voltage to decide if trickle-charging
is required (Figure 3). If the battery voltage is below
approximately 2.0V, a charging current of 10mA
(typical) is applied on the battery cell. This allows the
SMB135 to reset the protection circuit in the battery
Summit Microelectronics, Inc
pack and bring the battery voltage to a higher level
without compromising safety.
Pre-charge Mode
Once the battery voltage crosses the 2.0V level, the
SMB135 pre-charges the battery to safely charge the
deeply discharged cells (Figure 3). The pre-charge
(pre-conditioning) current is programmable from 25mA
to 212.5mA in 12.5mA steps, assuming a sense
resistor of 100mΩ (Register 00h).
The SMB135
remains in this mode until the battery voltage reaches
the pre-charge to fast-charge voltage threshold
(programmable from +2.4V to +3.1V in 100mV steps).
If the pre-charge to fast-charge voltage threshold is not
exceeded before the pre-charge timer expires, the
charge cycle is terminated and a corresponding timeout
fault signal is asserted (“Pre-charge Timeout” in register
36h).
Constant Current Mode
When the battery voltage exceeds the pre-charge to
fast-charge voltage threshold, the device enters the
constant current (fast charge) mode. During this mode,
the fast charge current level is set by either the
USB500/100 input (see below) or the corresponding
register. The fast charge current is programmable from
47.5mA to 525mA (16 steps), assuming a sense
resistor of 100mΩ (Register 00h).
Constant Voltage Mode
When the battery voltage reaches the pre-defined float
voltage, the fast-charge current starts diminishing. The
float voltage is programmable from +4.00V to +4.62V in
20mV steps and is ±1% accurate over the 0°C to +70°C
temperature range. The higher float voltage settings of
the SMB135 enable the charging of modern battery
packs with a required float voltage of 4.3V, 4.4V, and
4.5V. Furthermore, the ability to dynamically adjust the
float voltage allows the implementation of sophisticated
battery charging and control algorithms.
Charge Completion
The charge cycle is considered complete when the
charge current reaches the programmed termination
current threshold.
The termination current is
programmable from 25mA to 130mA in 15mA steps,
assuming a sense resistor of 100mΩ (Register 01h). If
the termination current threshold is not met before the
fast-charge timer expires, the charge cycle is
terminated and a corresponding timeout fault signal is
asserted (“Fast-charge Timeout” in register 36h).
2106 3.1 11/4/2008
13
SMB135
APPLICATIONS INFORMATION (CONTINUED)
EN (ENABLE)
EN is a logic input pin (active low) for enabling/disabling
the device and/or restarting a charge cycle. When EN is
held at a high logic level, IN goes into a high
impedance state, the internal VDD regulator is powered
down, no communication can occur over the I2C bus,
and no charge cycles may proceed. EN must be held
low in order to get any functionality out of the device. If
unused, this pin should be tied to GND.
Charge Enable
The initiation of a charge cycle is controlled via the
state of the volatile command register (Register 31, bit
4) and Register 0F bit 7. Bit 0F[7] controls the polarity
of the command bit 31[4]; if 0F[7] is low, then a 0 at
31[4] will cause a charge cycle to start. Since the
volatile register always powers-up to all 0’s, then 0F[7]
determines whether a charge cycle may begin on
power up, or whether an I2C command must be issued
to initiate charging.
USB500/100
USB500/100 is a logic input that allows the user to
select a maximum fast charge current of 100mA or
500mA. When a logic high signal is applied on this pin,
the charge current level may be as high as 500mA.
When a logic low signal is applied on this input, the
charge current level is limited to 100mA. In all cases, a
lower register value setting will impose an overriding
current limit. When the USB500/100 input is not
used, this pin should be tied to VDDCAP or GND (do
not leave floating). The USB500/100 functionality can
also be controlled over the I2C interface (ignoring the
state of the pin), allowing for full software control of
charge current levels. This function is accomplished
via register 31 bit 3, when Register 7 bit 0 is
programmed high.
Automatic Battery Recharge
The SMB135 allows the battery to be automatically
recharged (topped off) when the battery voltage falls by
a value of VRECH (115mV typical) below the
programmed float voltage. Provided that the input
power supply is still present, charging remains enabled
and all the pre-qualification parameters are still met, a
new charging cycle will be initiated. This ensures that
the battery capacity remains high, without the need to
manually re-start a charging cycle. The automatic
battery recharging can be disabled if not required by
the application (Register 03h).
Safety Timers
The integrated safety timers provide protection in case
of a defective battery pack. The pre-charge timer starts
after the pre-qualification check is completed and
Summit Microelectronics, Inc
resets when the transition to the constant current mode
happens. At that point, the fast charge timer is initiated.
The fast charge timer expires and charge cycle is
terminated if the termination current level is not reached
within the pre-determined duration. Each safety timer
has three programmable timeout periods, which
eliminates the need for external timing capacitors and
allows for maximum design flexibility. In addition, each
timer can be disabled by the appropriate bit selection in
Register 05h.
Thermal Monitor
A temperature sensing I/O (THERM) is provided to
prevent excessive battery temperatures during
charging. The battery temperature is measured by
sensing the voltage between the THERM pin and
ground. The voltage is created by injecting a current
into the parallel combination of Negative Temperature
Coefficient (NTC) thermistor and a resistor. This
voltage is then compared to two predetermined
voltages representing the maximum and minimum
temperature settings of the battery. The purpose of the
resistor in parallel to the NTC thermistor is to linearize
the resistance of the thermistor. The table below,
shows the 1% resistor that should be placed in parallel
with the corresponding thermistor.
If the temperature limits are exceeded, battery charging
will be suspended until the temperature level has fallen
within the safe operating range. The over-temperature
limit is programmable from 30°C to 65°C, and the
under-temperature limit is programmable from −20°C to
15°C, each in 5°C increments using Register 04h. In
addition, the user can easily select the required bias
current, based on the value of the negative temperature
coefficient (NTC) thermistor located in the battery pack:
10k, 25k, 100k (Register 04h). Disabling the thermal
monitor is also possible by selecting the appropriate
bits in Register 04h.
As the temperature changes, the resistance of the
thermistor changes creating a voltage proportional to
temperature. The temperature coefficient or Beta (Β) of
the thermistor must be as close to 4400 as possible to
achieve the maximum temperature accuracy.
NTC THERMISTOR
RESISTANCE
10K
24.9K
25K
61.9K
100K
249K
Table: NTC values and associated parallel
resistances.
2106 3.1 11/4/2008
14
SMB135
APPLICATIONS INFORMATION (CONTINUED)
Frequency Selection
The SMB135 can operate at three different switching
frequencies (750kHz, 1MHz, 1.25MHz), which are
selectable via an I2C command (Register 08h).
STAT Output
The STAT is an open-drain output that indicates battery
charge status or an input under-voltage/over-voltage
(UV/OV) condition. The type of indication can be
selected via the corresponding bit in Register 07h.
STAT has two modes of operation, as determined by
Register 05h[7]: in Mode 0, STAT is asserted low
whenever the battery is charging and de-asserted at all
other times; in Mode 1, STAT is de-asserted when the
charger is disabled, blinks during charging, and
remains continuously asserted when the charge cycle
has completed. A pull-up resistor should be applied on
this pin for interfacing to a microcontroller or other logic
IC.
Programmable Battery Charging
A unique feature of the SMB135 is the ability to modify
all of the important charger parameters via internally
programmable EEPROM, found in Registers 00-07.
Once the device has been configured correctly, the
EEPROM may be locked, preventing any further
changes. Additionally, these registers may also be
configured so that they may be updated in RAM
(volatile), even if the underlying EEPROM is locked.
This feature is useful if it is desired to actively manage
the charging profile without making changes to the nonvolatile defaults. Use Register 0E to control locking
and volatile access. Before writing to Registers 00-07
in a volatile manner, Register 31[7] must first be set
high.
Glitch Filter
The SMB135 features a glitch filter to ensure that short
violations in the UV or OV settings will not result in a
fault-triggered action.
The glitch filter is userprogrammable (Register 05h) and may be set to 0msec
(glitch filer disabled) or to 250msec. Enabling the glitch
filter will delay “automatic recharge” and “current
termination” by 250msec.
Hold-off Timer
The SMB135 features a hold-off timer that defines the
amount of time from enabling the charger output until
current begins flowing (trickle charge is excluded from
this condition). Two choices (short & long) are
available: <1msec or 256msec. The short timer is
asynchronous and could be any value between 0msec
and 1msec.
Internal Thermal Protection
When the die temperature of the SMB135 reaches
approximately 110°C, the PWM switcher will cut back
on the duty cycle to reduce current and prevent further
die heating. This internal thermal protection circuit
helps to improve device (and consequently, system)
reliability.
FAULT and STATUS Indicators
A large number of battery charging conditions and
parameters are monitored and corresponding fault and
status indications are available to the user via the I2C
compatible registers. These include the following:
•
Charging status
•
Safety timer timeout
•
Over-temperature alarm
•
Under-temperature alarm
•
Over-voltage alarm
•
Under-voltage alarm
•
Missing battery detection
Summit Microelectronics, Inc
2106 3.1 11/4/2008
15
SMB135
APPLICATIONS INFORMATION (CONTINUED)
EXTERNAL COMPONENTS (Figure 9)
Input and Output Capacitors
The input capacitor needs to absorb all reflected input
switching ripple current generated by the SMB135
device during charging, so that no ripple current will be
seen on the input supply. The RMS value of input ripple
current in buck type charger is given by,
Irms = Ibat
Vbat ⋅ (Vin − Vbat )
.
Vin
A 4.7uF ceramic capacitor, X5R or X7R rated, with the
0603 size and low ESR sufficiently accommodates the
above RMS current.
The output capacitor needs to ensure stability of the
charger and low output ripple voltage. A 10uF ceramic
capacitor, X5R or X7R rated, with the 0603 size and
low ESR can make operations of the SMB135 device
stable and absorb all AC portion of the inductor
switching ripple current, since the RMS value of the
output ripple current is much smaller than that of the
input ripple current.
Inductor
The inductor in a buck type charger should be selected
so that all its form-factor, cost, switching ripple and
efficiency conform to the system requirement, or
constitute the best compromise. Small dimensions,
higher inductance value usually suggests higher DCR
value. High DCR generates high conduction loss.
Lower inductance value has less DCR but creates
larger switching ripple current, which produces higher
AC loss in the magnetic core and the windings. Setting
the peak-to-peak ripple current approximately 30% of
the maximum charge current is a commonly used
method. Thus,
∆I L =
Vinmax − Vbat
Vbat
,
⋅
L
Vin max ⋅ fs
and,
Diode
The rectifying diode circulates the inductor current
when the internal top FET is turned off. This causes the
forward voltage drop across the diode. Thus the diode
power loss is,
PLOSS _ DIODE = VFD ⋅ Ibat ⋅
Vin − Vbat
.
Vin
Minimize the diode power loss by choosing a low
forward voltage diode. The reverse blocking voltage
rating that is considerably higher than the input voltage
withstands any spike voltage that might appear across
the diode. Be cautious of the reverse leakage current
that constantly bleeds a small power out the battery
cells when the battery cells aren’t charged.
BOARD LAYOUT RECOMMENDATIONS
The SMB135 only requires an inductor, a rectifying
diode, an input capacitor, an output capacitor, a sense
resistor and some bypass components, the high
side FET is internal (Figures 9, 10 and 11, Table 1).
Place an input capacitor close to the IC. Place an
inductor, a rectifying diode, and an output capacitor
close to each other. Place a VDD cap, a COMP
capacitor and a COMP resistor close to the pins. Pour
sufficiently large copper shapes on both sides of the
sense resistor, toward the output capacitor and toward
the battery cells. Pour large copper shapes on the “IN”,
“OUT” and “GND” nodes as well. If it is necessary to
route from these nodes to the other side of the board,
place enough number of vias. Accuracy of current
measurements and therefore accuracy of charge
current control are at maximum only if both the
SENSEH trace and the SENSEL trace are directly
connected to each side of the resistor pads without
contacting any shapes on their ways. Make the two
routes a differential pair if possible. Internal ground
planes and power planes quickly sink heat generated
by the SMB135, the rectifying diode, and the inductor,
furthermore reduce noise concern for the IC by
providing shielding.
∆I L = 30% ⋅ Ibat max ,
where, L is inductance, fs is the switching frequency.
Summit Microelectronics, Inc
2106 3.1 11/4/2008
16
SMB135
APPLICATIONS INFORMATION (CONTINUED)
POR
Divide I(charge)
settings by 5
Standby Mode
(Pause Charge)
NO
Vin >
Vbat+130mV ?
(Always
Monitored)
HUB
YES
Vbat>2.0V?
T(hi)>T>T(lo)?
(Always
Monitored)
NO
NO
3mA trickle charge
(timers off)
YES
Precharge Mode
Reset t(precharge)
YES
YES
Vbat <Vprechg?
Default
100mA USB Mode
Wait for USB
Controller
Regulate Current to
I(precharge)
(<Imax-in)
HOST
USB TYPE
Host/Hub
NO
NO
Normal Charge Mode
Reset t(charge)
Vbat <Vprechg?
NO
YES
t(precharge)
expired?
NO
NO
Vbat < Vfloat?
Regulate Voltage to
Vfloat
YES
YES
YES
Regulate Current to
I(charge)
(See Current
Boosting)
YES
I(charge) <
I(terrm)?
Battery Fault
NO
NO
t(charge) expired?
YES
Terminate Charge
Standby Mode
t(charge) expired?
NO
Vbat <Vprechg?
NO
Terminate Charge
Standby Mode
YES
Vbat < Vfloat100mV?
YES
Figure 8 – Functional flow chart.
Summit Microelectronics, Inc
2106 3.1 11/4/2008
17
SMB135
APPLICATIONS INFORMATION (CONTINUED)
Figure 9 – Typical applications schematic. The USB device has internal pull up resistors for SDA and SCL.
Summit Microelectronics, Inc
2106 3.1 11/4/2008
18
SMB135
APPLICATIONS INFORMATION (CONTINUED)
Table 1: Recommended Bill of Material.
Item
Description
Vendor / Part Number
Qty
Ref. Des.
Resistors
1
15kohm, 1%, 0402
Vishay# CRCW04021502F
1
R3
2
10kohm, 1%, 0402
Vishay# CRCW04021002F
3
R4, R12, R13
3
100mohm, 1%, 0402, 1/6W
Susumu# RP1005S-R10-F-C
1
R5
4
24.9kohm, 1%, 0402
Vishay# CRCW04022492F
1
R11
5
10kohm, Thermistor, 0402
TDK# NTCG103JF103FT
1
RT1
1
C5
1
C1
1
C2
Capacitors
6
8
1uF, 0402, X5R, 10V, Ceramic
TDK# C1608X5R0J106M
Murata#
GRM40X5R475K16D520
Panasonic# ECJ-0EB1A105M
9
2200pF, 0402, X5R, 25V, Ceramic
Vishay# VJ0402Y222KXXA
1
C3
10
0.1uF, 0402, X7R, 16V, Ceramic
Kemet#
C0402C104K4RACTU
3
C7, C8, C9
1
D1
7
10uF, 0603, X5R, 6.3V, Ceramic
4.7uF, 0805, X5R, 16V, Ceramic
Semiconductors
11
RB551V-30, SOD-323, 30V, 0.5A, 0.47Vf ROHM# RB551V-30TE-17
LED, Red, SMD, 0805
Lumex# SML-LXT0805SRW
1
D2
13
Cypress CY7C63001A USB to I2C Micro
Delcom Engineering #802200
1
U1
14
Crystal Oscillator, SMT, 6MHz
SMB135E
Digikey# 300-6112-1-ND
Summit Microelectronics
1
1
Y1
U2
6.8uH, 0.96A (saturation), 0.97A (dc)
TDK# VLF4012AT-6R8MR96
1
L1
4.7uH, 1.02A (saturation), 1.04A (dc)
Taiyo Yuden # NR3015T4R7M
1
L1 (Alternate)
1
J1
12
15
Magnetics
16
Hardware
Digi-Key, H2960CT-ND
17
Connector Receptacle Mini USB type B 2.0
Hirose Electric USA UX60-MB5S8 H2960CT
Summit Microelectronics, Inc
2106 3.1 11/4/2008
19
SMB135
LAYOUT – TOP SIDE
Figure 10 – Example Layout. The top side layout provides space (U2) for an SMB135 device packaged in a
leadless QFN package (Not to Scale).
LAYOUT – BOTTOM SIDE
Figure 11 – Example Layout. The bottom side layout provides space (U3) for a SMB135E device packaged in a
CSP package.
Summit Microelectronics, Inc
2106 3.1 11/4/2008
20
SMB135
DEVELOPMENT HARDWARE & SOFTWARE
The SMX3202 system consists of a USB programming
Dongle, cable and WindowsTM GUI software. It can be
ordered on the website or from a local representative.
The latest revisions of all software and an application
brief describing the SMX3202 is available from the
website (www.summitmicro.com).
The Windows GUI software will generate the data and
send it in I2C serial bus format so that it can be directly
downloaded to the SMB135 via the programming
Dongle and cable. An example of the connection
interface is shown in Figure 12.
When design prototyping is complete, the software can
generate a HEX data file that should be transmitted to
Summit for approval. Summit will then assign a unique
customer ID to the HEX code and program production
devices before the final electrical test operations. This
will ensure proper device operation in the end
application.
The SMX3202 programming Dongle/cable interfaces
directly between a PC’s USB port and the target
application. The device is then configured on-screen via
an intuitive graphical user interface employing dropdown menus.
Top view of straight 0.1" x 0.1" closed-side
connector. SMX3202 interface connector.
Pin 10, USB500/100
Pin 8, EN
Pin 6, MR#
Pin 4, SDA
Pin 2, SCL
IN
USB500/100
EN
SMB135
SDA
SCL
10
8
6
4
2
9
7
5
3
1
Pin 9, 5.0V
Pin 7, 10V
Pin 5, Reserved
Pin 3, GND
Pin 1, GND
0.1µF
GND
Figure 12 – SMX3202 Programmer I2C serial bus connections to program the SMB135. Only SDA and SCL
connections are necessary for programming purposes, the other 2 pins are control options provided by the
SMX3202 and Windows GUI, see pin descriptions
Summit Microelectronics, Inc
2106 3.1 11/4/2008
21
SMB135
I2C PROGRAMMING INFORMATION
SERIAL INTERFACE
Access to the configuration registers, command and
status registers is carried out over an industry
standard 2-wire serial interface (I2C). SDA is a bidirectional data line and SCL is a clock input (Figure
4). Data is clocked in on the rising edge of SCL and
clocked out on the falling edge of SCL. All data
transfers begin with the MSB. During data transfers,
SDA must remain stable while SCL is high. Data is
transferred in 8-bit packets with an intervening clock
period in which an Acknowledge is provided by the
device receiving data. The SCL high period (tHIGH) is
used for generating Start and Stop conditions that
precede and end most transactions on the serial bus.
A high-to-low transition of SDA while SCL is high is
considered a Start condition while a low-to-high
transition of SDA while SCL is high is considered a
Stop condition.
The interface protocol allows operation of multiple
devices and types of devices on a single bus through
unique device addressing.
The address byte is
comprised of a 7-bit device type identifier (slave
address). The remaining bit indicates either a read or
a write operation. Refer to Table 1 for a description of
the address bytes used by the SMB135.
The device type identifier for the configuration
registers and the command and status registers are
accessible with the same slave address. The slave
address can be can be programmed to any seven bit
number 0000000BIN through 1111111BIN. Table 2.
WRITE
Writing to a configuration register is illustrated in
Figures 13 and 14. A Start condition followed by the
slave address byte is provided by the host; the
SMB135 responds with an Acknowledge; the host then
responds by sending the memory address pointer or
configuration register address pointer; the SMB135
responds with an acknowledge; the host then clocks in
one byte of data. For configuration register writes, up
to 15 additional bytes of data can be clocked in by the
host to write to consecutive addresses within the same
page.
Slave Address
ANY
After the last byte is clocked in and the host receives
an Acknowledge, a Stop condition must be issued to
initiate the nonvolatile write operation.
READ
The address pointer for the non-volatile configuration
registers and memory registers as well as the volatile
command and status registers must be set before data
can be read from the SMB135. This is accomplished
by issuing a dummy write command, which is a write
command that is not followed by a Stop condition. A
dummy write command sets the address from which
data is read. After the dummy write command is
issued, a Start command followed by the address byte
is sent from the host. The host then waits for an
Acknowledge and then begins clocking data out of the
slave device. The first byte read is data from the
address pointer set during the dummy write command.
Additional bytes can be clocked out of consecutive
addresses with the host providing an Acknowledge
after each byte. After the data is read from the desired
registers, the read operation is terminated by the host
holding SDA high during the Acknowledge clock cycle
and then issuing a Stop condition. Refer to Figure 15
for an illustration of the read sequence.
CONFIGURATION REGISTERS
Writing and reading the configuration registers is
shown in Figures 13, 14 and 15. A description of the
configuration registers is shown in Table 3 through
Table 12.
GRAPHICAL USER INTERFACE (GUI)
Device configuration utilizing the Windows based
SMB135 graphical user interface (GUI) is highly
recommended. The software is available from the
Summit website (www.summitmicro.com). Using the
GUI in conjunction with this datasheet, simplifies the
process of device prototyping and the interaction of
the various functional blocks. A programming Dongle
(SMX3202) is available from Summit to communicate
with the SMB135. The Dongle connects directly to the
USB port of a PC and programs the device through a
cable using the I2C bus protocol. See Figure 12 and
the SMX3202 Data Sheet.
Register Type
Configuration Registers are located in 00 HEX thru
05 HEX , 08 HEX and 0F HEX
Table 2 – Address bytes used by the SMB135.
Summit Microelectronics, Inc
2106 3.1 11/4/2008
22
SMB135
I2C PROGRAMMING INFORMATION (CONTINUED)
M aster
S
T
A
R
T
Configuration
Register Address
Bus Address
S
A
3
S
A
2
S
A
1
S
A
0
A
2
A
1
A
0
C
6
C
7
W
C
5
C
4
C
3
Data
C
2
C
1
C
0
D
7
A
C
K
Slave
S
T
O
P
D
6
D
5
D
4
D
3
D
2
D
1
D
0
A
C
K
A
C
K
Figure 13 – Configuration Register Byte Write
S
T
A
R
T
M aster
Configuration
Register Address
Bus Address
S
A
3
S
A
2
S
A
1
S
A
0
A
2
A
1
A
0
C
6
C
7
W
C
5
C
4
C
3
Data (1)
C
2
C
1
C
0
D
7
A
C
K
Slave
D
6
D
7
D
6
D
5
D
4
D
4
D
3
D
2
D
1
D
0
A
C
K
A
C
K
S
T
O
P
Data (16)
Data (2)
M aster
D
5
D
3
D
2
D
1
D
0
D
7
D
6
D
5
D
2
D
1
D
0
D
7
A
C
K
Slave
D
6
D
5
D
4
D
3
D
2
D
1
D
0
A
C
K
A
C
K
Figure 14 – Configuration Register Page Write
M aster
S
T
A
R
T
Configuration
Register Address
Bus Address
S
A
3
S
A
2
S
A
1
S
A
0
A
2
A
1
A
0
S
T
A
R
T
C
7
W
C
6
C
5
C
4
C
3
C
2
C
1
C
0
A
C
K
Slave
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
A
1
S
A
0
A
2
A
1
A
0
R
A
C
K
A
C
K
D
7
S
A
2
A
C
K
A
C
K
Data (1)
M aster
Bus Address
S
A
3
D
6
D
5
D
2
D
1
D
0
N
A
C
K
Data (n)
D
7
D
6
D
5
D
4
D
3
D
2
D
1
S
T
O
P
D
0
Slave
Figure 15 – Configuration Register Read
Summit Microelectronics, Inc
2106 3.1 11/4/2008
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SMB135
CONFIGURATION REGISTERS
The following tables (Tables 3 to 15) describe the user-programmable registers of the SMB135 programmable battery
charger. Locations 00-0F are non-volatile, EEPROM registers; however, registers 00-07, which contain the battery
charging parameters, may also be configured to be programmable in RAM. Locations 31-3F contain volatile status and
command registers. To lock all of the configuration registers, set 0E[2]=1; please note that this operation cannot be
undone. To allow volatile access to locations 00-07, set 0E[0]=1; then after every power-on, 31[7] must also be set
high. It is prohibited to write to any location, not specifically mentioned in the tables below7. Default register
settings are in BOLD.
Table 3 – Charge current – 8-bit (address: 00h) – Non-Volatile & Volatile (mirror)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Fast Charge Current
RSENSE=100mΩ
RSENSE=50mΩ
47.5mA
95mA
62.5mA
125mA
65.0mA
130mA
67.5mA
135mA
195mA
390mA
225mA
450mA
255mA
510mA
285mA
570mA
315mA
630mA
345mA
690mA
375mA
750mA
405mA
810mA
435mA
870mA
465mA
930mA
495mA
990mA
525mA
1050mA
Pre-charge current
RSENSE=100mΩ
X
X
X
X
0
0
0
0
25mA
X
X
X
X
0
0
0
1
37.5mA
X
X
X
X
0
0
1
0
50mA
X
X
X
X
0
0
1
1
62.5mA
X
X
X
X
0
1
0
0
75mA
X
X
X
X
0
1
0
1
87.5mA
X
X
X
X
0
1
1
0
100mA
X
X
X
X
0
1
1
1
112.5mA
X
X
X
X
1
0
0
0
125mA
X
X
X
X
1
0
0
1
137.5mA
X
X
X
X
1
0
1
0
150mA
X
X
X
X
1
0
1
1
162.5mA
X
X
X
X
1
1
0
0
175mA
X
X
X
X
1
1
0
1
187.5mA
X
X
X
X
1
1
1
0
200mA
X
X
X
X
1
1
1
1
212.5mA
Note 7: Never Write to Reserved bits. Note 8: Charge current can be limited by internal current limit under certain conditions.
Summit Microelectronics, Inc
2106 3.1 11/4/2008
RSENSE=50mΩ
50mA
75mA
100mA
125mA
150mA
175mA
200mA
225mA
250mA
275mA
300mA
325mA
350mA
375mA
400mA
425mA
24
SMB135
CONFIGURATION REGISTERS (CONT.)
Table 4 – Termination current – 8-bit (address: 01h) – Non-Volatile & Volatile (mirror)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
X
X
X
X
X
0
0
X
X
X
X
X
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Termination Current
RSENSE=100mΩ
RSENSE=50mΩ
0
25mA
50mA
0
1
40mA
80mA
0
1
0
55mA
110mA
X
0
1
1
70mA
140mA
X
1
0
0
85mA
170mA
X
X
1
0
1
100mA
200mA
X
X
X
1
1
0
115mA
230mA
X
X
X
1
1
1
130mA
260mA
Note 7: Never Write to Reserved bits.
Summit Microelectronics, Inc
2106 3.1 11/4/2008
25
SMB135
CONFIGURATION REGISTERS (CONT.)
Table 5 – Float Voltage – 8-bit (address: 02h) – Non-Volatile & Volatile (mirror)
Bit7
Bit6
Bit5
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Note 7: Never Write to Reserved bits.
Summit Microelectronics, Inc
Bit4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Bit3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
Bit2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
Bit1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
2106 3.1 11/4/2008
Bit0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Float Voltage
3.850V
4.020V
4.040V
4.060V
4.080V
4.100V
4.120V
4.140V
4.160V
4.180V
4.200V
4.220V
4.240V
4.260V
4.280V
4.300V
4.320V
4.340V
4.360V
4.380V
4.400V
4.420V
4.440V
4.460V
4.480V
4.500V
4.520V
4.540V
4.560V
4.580V
4.600V
4.620V
26
SMB135
CONFIGURATION REGISTERS (CONT.)
Table 6 – Other Charging Parameters – 8-bit (address: 03h) – Non-Volatile & Volatile (mirror)
Bit7
0
1
Bit7
X
X
Bit6
X
X
Bit6
0
1
Bit5
X
X
Bit5
X
X
Bit4
X
X
Bit4
X
X
Bit3
X
X
Bit3
X
X
Bit2
X
X
Bit2
X
X
Bit1
X
X
Bit1
X
X
Bit0
X
X
Bit0
X
X
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
X
X
X
X
X
X
X
X
Bit7
X
X
X
X
X
X
X
X
X
X
Bit6
X
X
0
0
0
0
1
1
1
1
Bit5
X
X
0
0
1
1
0
0
1
1
Bit4
X
X
0
1
0
1
0
1
0
1
Bit3
X
X
X
X
X
X
X
X
X
X
Bit2
X
X
X
X
X
X
X
X
X
X
Bit1
0
1
X
X
X
X
X
X
X
X
Bit0
X
X
Automatic Recharge
Enabled
Disabled
Current Termination
Enabled
Disabled
Pre-charge to Fast-charge Voltage
Threshold
2.4V
2.5V
2.6V
2.7V
2.8V
2.9V
3.0V
3.1V
Hold-off Timer
<1msec (short)
256msec (long)
Table 7 – Cell temperature monitor – 8-bit (address: 04h) – Non-Volatile & Volatile (mirror)
Bit7
0
Bit6
0
Bit5
X
Bit4
X
Bit3
X
Bit2
X
Bit1
X
Bit0
X
0
1
X
X
X
X
X
X
40µA (25k NTC)
1
0
X
X
X
X
X
X
10µA (100k NTC)
1
Bit7
X
1
Bit6
X
X
Bit5
0
X
Bit4
0
X
Bit3
0
X
Bit2
X
X
Bit1
X
X
Bit0
X
0µA (Disabled)
Low Temperature Alarm Trip Point
X
X
0
0
1
X
X
X
-15°C
X
X
0
1
0
X
X
X
-10°C
X
X
0
1
1
X
X
X
-5°C
X
X
1
0
0
X
X
X
0°C
X
X
1
0
1
X
X
X
+5°C
X
X
1
1
0
X
X
X
+10°C
X
Bit7
X
X
Bit6
X
1
Bit5
X
1
Bit4
X
1
Bit3
X
X
Bit2
0
X
Bit1
0
X
Bit0
0
+15°C
High Temperature Alarm Trip Point
X
X
X
X
X
0
0
1
+35°C
X
X
X
X
X
0
1
0
+40°C
X
X
X
X
X
0
1
1
+45°C
X
X
X
X
X
1
0
0
+50°C
X
X
X
X
X
1
0
1
+55°C
X
X
X
X
X
1
1
0
+60°C
X
X
1
1
1
+65°C
X
X
X
Note 7: Never Write to Reserved bits.
Summit Microelectronics, Inc
2106 3.1 11/4/2008
Thermistor Current
100µA (10k NTC)
-20°C
+30°C
27
SMB135
CONFIGURATION REGISTERS (CONT.)
Table 8 – Battery charging control – 8-bit (address: 05h) – Non-Volatile & Volatile (mirror)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
0
X
X
X
X
X
X
X
1
X
X
X
X
X
X
X
Bit7
X
X
Bit7
X
X
X
X
Bit7
X
X
X
X
Bit6
X
X
Bit6
X
X
X
X
Bit6
X
X
X
X
Bit5
0
1
Bit5
X
X
X
X
Bit5
X
X
X
X
Bit4
X
X
Bit4
X
X
X
X
Bit4
X
X
X
X
Bit3
X
X
Bit3
0
0
1
1
Bit3
X
X
X
X
Bit2
X
X
Bit2
0
1
0
1
Bit2
X
X
X
X
Bit1
X
X
Bit1
X
X
X
X
Bit1
0
0
1
1
Bit0
X
X
Bit0
X
X
X
X
Bit0
0
1
0
1
Status Output
STAT is active low while charging, active high
all other times
STAT blinks while charging, is active low
when finished, active high when disabled
Glitch Filter
Glitch filter enabled
Glitch filter disabled
Fast-charge Timeout
350 min
699 min
1398 min
Disabled
Pre-charge Timeout
44 min
87 min
175 min
Disabled
Table 9 – STAT and USB500/100 Settings – 8-bit (address: 07h) – Non-Volatile
Bit7
X
X
Bit7
X
X
Bit7
X
X
Bit6
X
X
Bit6
X
X
Bit6
X
X
Bit5
X
X
Bit5
X
X
Bit5
X
X
Bit4
X
X
Bit4
X
X
Bit4
X
X
Bit3
X
X
Bit3
X
X
Bit3
X
X
Bit2
0
1
Bit2
X
X
Bit2
X
X
Bit1
X
X
Bit1
0
1
Bit1
X
X
Bit0
X
X
Bit0
X
X
Bit0
0
1
STAT Output Indicator
Battery charge status
Input over-voltage or input under-voltage
Battery over-voltage Behavior
Charger is not shutdown
Charger is shutdown
USB500/100 Control
USB500/100 input pin
USB500/100 register (address 31h)
Bit0
X
X
X
X
Switching Frequency
750kHz
1000kHz
1250kHz
1250kHz
Table 10 – Frequency Selection – 8-bit (address: 08h) – Non-Volatile
Bit7
Bit6
Bit5
0
0
X
0
1
X
1
0
X
1
1
X
Note 7: Never Write to Reserved bits.
Summit Microelectronics, Inc
Bit4
X
X
X
X
Bit3
X
X
X
X
Bit2
X
X
X
X
Bit1
X
X
X
X
2106 3.1 11/4/2008
28
SMB135
CONFIGURATION REGISTERS (CONT.)
Table 11 – Configuration and User Memory Lock – 8-bit (address: 0Eh) – Non-Volatile
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
X
X
X
X
X
0
X
X
X
X
X
X
X
1
X
X
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
X
X
X
X
X
X
0
X
X
X
X
X
X
X
1
X
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
1
Configuration Lock
Unlocked – user can write to non-volatile
Configuration bits
Locked – user cannot write to non-volatile
Configuration bits
User-Memory Lock
Unlocked – user can write to general
purpose EE bits (h20-h2F)
Locked – user cannot write to general
purpose EE bits (h20-h2F)
Volatile Writes Permission
Do not allow volatile writes to registers h00h07
Allow volatile writes to registers h00-h07
(even if h0E[2]=1)
Table 12 – EN Polarity & I2C Bus/Slave Address – 8-bit (address: 0Fh) – Non-Volatile
Bit7
0
1
Bit7
X
X
X
X
X
X
X
X
Bit7
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Bit6
X
X
Bit6
0
0
0
0
1
1
1
1
Bit6
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Bit5
X
X
Bit5
0
0
1
1
0
0
1
1
Bit5
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Bit4
X
X
Bit4
0
1
0
1
0
1
0
1
Bit4
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Bit3
X
X
Bit3
X
X
X
X
X
X
X
X
Bit3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
Bit2
X
X
Bit2
X
X
X
X
X
X
X
X
Bit2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
Bit1
X
X
Bit1
X
X
X
X
X
X
X
X
Bit1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
Bit0
X
X
Bit0
X
X
X
X
X
X
X
X
Bit0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
EN (Enable) Polarity (Register 31[4])
Active Low
Active High
2
I C Bus Address
000
001
010
011
100
101
110
111
2
I C Slave Address
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
Note 7: Never Write to Reserved bits.
Summit Microelectronics, Inc
2106 3.1 11/4/2008
29
SMB135
CONFIGURATION STATUS REGISTERS
Table 13 – Volatile Configuration & Charger Enable – 8-bit (address: 31h) – Volatile
Bit7
0
Bit6
X
Bit5
X
Bit4
X
Bit3
X
Bit2
X
Bit1
X
Bit0
X
1
X
X
X
X
X
X
X
Bit7
X
X
Bit6
X
X
Bit5
X
X
Bit4
0
1
Bit3
X
X
Bit2
X
X
Bit1
X
X
Bit0
X
X
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
X
X
X
X
X
X
X
X
0
1
X
X
X
X
X
X
Volatile Configuration
Volatile writes to h00-h07 are disabled
Volatile writes to h00-h07 are enabled
(if CFG h0E[0]=1)
Charger Enable
Enabled if 0F[7]=0; Disabled if 0F[7]=1
Disabled if 0F[7]=0; Enabled if 0F[7]=1
USB500/100 Select
(This bit only has an effect when CFG
07[0]=1)
USB 100mA current level
USB 500mA current level
Table 14 – Battery status register A – 8-bit (address: 36h) – Volatile (read only)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
1
X
X
X
X
X
X
X
X
1
X
X
X
X
X
X
Bit7
X
X
X
Bit7
X
Bit7
X
X
X
X
Bit7
X
Bit6
X
X
X
Bit6
X
Bit6
X
X
X
X
Bit6
X
Bit5
0
0
1
Bit5
X
Bit5
X
X
X
X
Bit5
X
Bit4
0
1
0
Bit4
X
Bit4
X
X
X
X
Bit4
X
Bit3
X
X
X
Bit3
1
Bit3
X
X
X
X
Bit3
X
Bit2
X
X
X
Bit2
X
Bit2
0
0
1
1
Bit2
X
Bit1
X
X
X
Bit1
X
Bit1
0
1
0
1
Bit1
X
Bit0
X
X
X
Bit0
X
Bit0
X
X
X
X
Bit0
1
Charging Status
Charger has completed at least 1 successful
charge since being enabled
Charger has completed at least 1 re-charge
cycle since being enabled
Timeout Status
No timeouts have occurred
Pre-charge timeout
Fast-charge timeout
Temperature Fault
Charger paused – temperature fault
Charging Status
Idle
Pre-charging
Fast-charging
Taper-charging
Charging Status
Charger is enabled
Table 15 – Battery status register B – 8-bit (address: 37h) – Volatile (read only)
Bit7
1
X
X
X
X
X
X
Bit6
X
1
X
X
X
X
X
Bit5
X
X
1
X
X
X
X
Bit4
X
X
X
1
X
X
X
Bit3
X
X
X
X
1
X
X
Bit2
X
X
X
X
X
1
X
Bit1
X
X
X
X
X
X
1
Bit0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
Fault Output
Battery missing
Charging error
Battery over-voltage condition
Charger over-voltage condition
Charger under-voltage condition
Over-temperature alarm
Under-temperature alarm
Termination Detect Current Threshold has
been hit
Note 7: Never Write to Reserved bits.
Summit Microelectronics, Inc
2106 3.1 11/4/2008
30
SMB135
DEFAULT CONFIGURATION REGISTER SETTINGS – SMB135E-470V
Register
Content
Register
Content
Register
Content
Register
Content
R00
F6
R04
E4
R08
80
R0C
01
R01
00
R05
0F
R09
00
R0D
E1
R02
0A
R06
00
R0A
00
R0E
01
R03
F0
R07
01
R0B
C8
R0F
80
Table 16 - The default device ordering number is SMB135E-470V. It is programmed with the register contents as
shown above and guaranteed over the industrial temperature range. The ordering number is derived from the
customer supplied hex file. New device suffix numbers (nnn) are assigned to non-default requirements. Default
register settings are shown in the register Tables 3 through 15 as BOLD.
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SMB135
PACKAGE DRAWING
15-Ball Ultra CSPTM
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SMB135
PACKAGE DRAWING (CONT.)
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SMB135
PART MARKING
Summit
Part Number
Ball A1
Identifier
Note: Subject to
change at any time
during production
Lead-free (CSP)
Status Tracking
Code (Summit Use)
135VSS
01AYWW
Date Code (YWW)
Multiple Lot Designator
Drawing
not
to scale
X is the sequential number per wafer
(1 for first wafer, 2 for second wafer, etc.)
ORDERING INFORMATION
Summit
Part
Number
SMB135
E
nnn V
Lead Free
Package
E = 15-Ball Ultra CSPTM
N = 32-Pad QFN
L = RoHS compliant QFN package
V = RoHS compliant CSP package
Part Number Suffix
Specific requirements are contained in the suffix (Table 16)
NOTICE
NOTE 1 – This is a data sheet that describes a Summit that is in production.
SUMMIT Microelectronics, Inc. reserves the right to make changes to the products contained in this publication in order to improve design,
performance or reliability. SUMMIT Microelectronics, Inc. assumes no responsibility for the use of any circuits described herein, conveys no license
under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained herein
reflect representative operating parameters, and may vary depending upon a user’s specific application. While the information in this publication has
been carefully checked, SUMMIT Microelectronics, Inc. shall not be liable for any damages arising as a result of any error or omission.
SUMMIT Microelectronics, Inc. does not recommend the use of any of its products in life support or aviation applications where the failure or
malfunction of the product can reasonably be expected to cause any failure of either system or to significantly affect their safety or effectiveness.
Products are not authorized for use in such applications unless SUMMIT Microelectronics, Inc. receives written assurances, to its satisfaction, that: (a)
the risk of injury or damage has been minimized; (b) the user assumes all such risks; and (c) potential liability of SUMMIT Microelectronics, Inc. is
adequately protected under the circumstances.
Revision 3.1 – This document supersedes all previous versions. Please check the Summit Microelectronics Inc. web site at www.summitmicro.com
for data sheet updates.
© Copyright 2006 SUMMIT MICROELECTRONICS, Inc.
PROGRAMMABLE POWER FOR A GREEN PLANET™
I2C is a trademark of Philips Corporation
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