SMB135 Programmable Switch-mode, USB/AC Input Li+ Battery Charger with TurboCharge™ Mode* FEATURES & APPLICATIONS INTRODUCTION The SMB135 is a programmable single-cell lithium-ion/lithium-polymer battery charger for a variety of portable applications. The device provides a simple and efficient way to charge high-capacity Li-Ion batteries via a USB port or an AC adapter. Unlike conventional devices, the SMB135’s high-efficiency operation eliminates large internal temperature rise and localized hot spot in handheld equipment. TM Summit’s proprietary TurboCharge mode allows a 750mA charge current from a 500mA USB port, resulting to significantly reduced charge times. • Programmable USB/AC Li-Ion battery charger • TurboChargeTM Mode: 750mA output from 500mA USB • High-efficiency current-mode PWM controller • • • • o o 750kHz to 1.25MHz switching frequency 0% to 100% duty-cycle 4.35 to 6.5V input voltage range Small 1.3 x 2.1 uCSPTM-15 package (0.4mm pitch) High-accuracy output voltage regulation: 1% Low reverse leakage current • Digital programming of all major parameters via I2C interface (with several addresses) and non-volatile memory o o o o o Charge control includes qualification, trickle-charge, pre-charge, constant current/constant voltage, and termination/safety settings that are fully programmable via a serial I2C/SMBus making the device truly a flexible solution. Fast charge current level (one or five unit loads) 2 can be set via I C or an input pin (USB500/100). An Enable (EN) pin is also provided for suspending USB charging and allowing the device to work in parallel with AC charger, which may already be integrated into a PMIC device. In this case, the SMB135 does not allow current to flow back to the USB port. Battery voltage set point Pre-charge, fast charge, termination current Fast charge voltage threshold Temperature limits Automatic restart threshold • Status/Fault indicator • Stability with ceramic capacitors • Wide range of protection features o o o o The SMB135 offers a wide variety of features that protect the battery pack as well as the charger and input circuitry: over-current, under/over-voltage and thermal protection. Ultra-precise, 1% accurate, Kelvin-sensed ADOC™ technology allows accurate control of battery float voltage and improves battery capacity utilization. Status can be monitored via the serial port for charge state and fault conditions. In addition, one LED driver output can be used to signal charge status or an under-/over-voltage condition. As a protection mechanism, when the junction temperature approaches approximately 110°C, the PWM switcher will start to cut back on the duty cycle, to reduce current. Thermal monitor Safety timers Current limit Input/output over-voltage lockout Applications • • • • • GSM Handsets UMTS Handsets Portable Media & Gaming Players Digital camcorders/still cameras Handheld GPS/PDAs TM The SMB135 is available in a space-saving 1.3mm x 2.1mm uCSP package with lead-free balls as well as in a lead-free 5x5 QFN-32 package, and is rated over the -30°C to +85°C temperature range. SIMPLIFIED APPLICATIONS DRAWING 6.8uH SMB135 OUT IN 4.7uF 500-700mA 4.35V-6.5V 10uF VDDCAP 1uF SENSEH 50-100mΩ SENSEL GND SDA BATT SCL D+ USB Controller USB500/100 D- Li-Ion THERM RLIM LED EN VDC ADC+ ADC- COMP STAT GND Ccomp Rcomp Figure 1 – Applications block diagram featuring the SMB135 programmable switch-mode battery charger. * Patent Pending © SUMMIT Microelectronics, Inc. 2006 • 757 North Mary Avenue • Sunnyvale CA 94085 • Phone 408 523-1000 • FAX 408 523-1266 http://www.summitmicro.com/ 2106 3.1 11/4/2008 1 SMB135 GENERAL DESCRIPTION The SMB135 is a fully programmable battery charger for single-cell Li-Ion and Li-Polymer battery packs. The device’s high-efficiency, switch-mode operation reduces heat dissipation and allows for higher current capability for a given package size. The SMB135 provides four main charging phases: trickle-charge, pre-conditioning (pre-charge), constant current and constant voltage. The overall system accuracy of the SMB135 is 1%, allowing for a higher capacity utilization versus other conventional solutions. When a battery or an external supply is inserted and the EN (ENABLE) input is asserted, the SMB135 performs the pre-qualification checks before initiating a charging cycle. The input voltage needs to be higher than the UVLO threshold and the cell temperature needs to be within the temperature limits for the charging cycle to start. As soon as the input supply is removed, the SMB135 enters a shutdown mode, thereby saving battery power. A programmable option also exists that allows the user to prevent battery charging until an I2C command has been issued. If the battery voltage is below 2.0V (trickle-charge to precharge threshold), the device will apply a trickle-charge current of 10mA (typical). This allows the SMB135 to reset the protection circuit in the battery pack and bring the battery voltage to a higher level without compromising safety. Once the battery voltage crosses the 2.0V threshold, the SMB135 enters the pre-charge mode. This mode replenishes deeply depleted cells and minimizes heat dissipation during the initial charge cycle. The preconditioning current is programmable, with the default value at C/10. If the battery voltage does not reach the preconditioning voltage level (programmable) within a specified amount of time (pre-charge timeout), the safety timer expires and the charge cycle is terminated. When the battery voltage reaches the pre-charge to fastcharge voltage level, the SMB135 enters the constant current (fast charge) mode. The fast charge current level is programmable in two ways: a) via an external sense resistor and b) via the corresponding register. Summit Microelectronics, Inc Once the final float voltage (programmable) has been reached, the battery charger will enter a constant voltage mode in which the battery voltage is kept constant, allowing the charge current to gradually taper off. The constant-voltage charging mode will continue until the charge current drops below the termination current threshold, or until the fast charge timer has expires. The termination current threshold is programmable from 25mA to 130mA in 15mA increments. After the charge cycle has terminated, the SMB135 continues to monitor the battery voltage. If the battery voltage falls below the recharge threshold (typically 115mV below float voltage), the SMB135 can automatically top-off the battery. A wide range of protection features is also included in the SMB135. These include input and output overvoltage protection, battery missing detector and thermal monitor for continuous cell temperature monitoring and pre-qualification. The following charging parameters can be adjusted dynamically via the I2C interface, for optimizing battery management real-time. These parameters can also be programmed statically via a user-friendly GUI interface: • • • • • • • Battery (float) voltage Fast charge current Pre-conditioning voltage threshold Pre-conditioning charge current Termination current Safety charge timers Temperature window The SMB135 also offers three programmable PWM switching frequencies ranging from 750kHz to 1250kHz in 250kHz increments. 2106 3.1 11/4/2008 2 SMB135 INTERNAL BLOCK DIAGRAM EEPROM z Registers z Internal VDD z Regulator SDA Interface z SCL VDDCAP Charge z Control USB500/100 EN SENSEH IN SENSEL BATT WELL Control PWM Control Prog. Float Voltage OUT Internal Temperature z Limit COMP VDDCAP Prog. Cold Limit Programmable Current THERM Prog. Hot Limit Figure 2 – Internal block diagram of the SMB135 programmable switch-mode battery charger. Summit Microelectronics, Inc 2106 3.1 11/4/2008 3 SMB135 PACKAGE AND PIN DESCRIPTIONS Ball Number (CSP-15) Pin Number (QFN-32) Pin Name Pin Type A1 1 BATT I B1 4 SENSEH I C1 5 SENSEL I D1 7 COMP I E1 A2 10 29 STAT THERM O I/O B2 27 VDDCAP PWR AGND PWR Analog Ground – Connect to isolated PCB ground. GND PWR Ground – Connect to isolated PCB ground. C2 D2 3, 8, 18, 20, 22, 30, 32 3, 8, 18, 20, 22, 30, 32 E2 12 IN I A3 25 EN I B3 24 USB500/100 I C3 D3 E3 21 19 14 SDA SCL OUT I/O I O N/A 33 GND PWR N/A 2, 6, 9, 11, 13, 15, 16, 17, 23, 26, 28, 31 NC N/A Summit Microelectronics, Inc Pin Description Battery Voltage Sense – Connect directly to positive terminal of battery. Charge Current Sense – Connect to high-side of charge current sense resistor. Charge Current Sense – Connect to low-side of charge current sense resistor (allows for higher accuracy). Primary Compensation – Connect to R/C compensation network. Status and Fault Indicator. Battery Thermistor Sense. VDD Bypass – Connect to VDD bypass capacitor with 1µF or greater capacitor. USB (+4.35V to +5.5V) or Adaptor Input (+4.35V to +6.5V) – Bypass with a 1µF or greater capacitor. Enable Input (active low) – A logic low signal on this pin powers-up the device and allows a battery charge cycle to occur. A logic high signal on this pin forces IN to a highimpedance, low-current state, and the internal VDD regulator is powered down. If unused, this pin should be tied to GND. Charge Current Regulation Setting – Connect to logic high for 500mA or low for 100mA charge current setting. This charging current can be overridden by I2C but only for values less than 500mA and 100mA respectively. The actual charging values are (500-IOFFSET) mA and (100-IOFFSET) mA respectively, with IOFFSET being the device’s total active current (Note 1). When unused, this pin should be tied to VDDCAP or GND (do not leave floating). I2C Bus Data. I2C Bus Clock. Charge Current Output – Connect to inductor. Exposed metal (thermal) Pad on bottom of SMB135. The thermal pad of the SMB135 package must be connected to the PCB GND. 2106 3.1 11/4/2008 4 SMB135 PACKAGE AND PIN DESCRIPTIONS (CONT.) A1 A2 A3 SMB135 B1 B2 B3 lead-free C1 D1 C2 C3 uCSPTM-15 D2 D3 1.3mm x 2.1mm E1 E2 E3 Summit Microelectronics, Inc GND NC GND THERM NC VDD_CAP NC EN 15-Ball Ultra CSPTM Bottom View 32 31 30 29 28 27 26 25 BATT 1 24 USB500/100 NC 2 23 NC GND 3 22 GND SENSEH 4 21 SDA SENSEL 5 20 GND NC 6 19 SCL COMP 7 18 GND GND 8 17 NC 11 12 13 14 STAT NC IN NC OUT 2106 3.1 11/4/2008 15 16 NC 10 NC 9 NC SMB135 5mm x 5mm QFN-32 5 SMB135 ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS Temperature Under Bias ...................... -55°C to 155°C Storage Temperature............................ -55°C to 125°C Terminal Voltage with Respect to GND: VIN ................................................... -0.3V to +10V All Others ........................................... -0.3V to +6V Output Short Circuit Current ............................... 100mA Lead Solder Temperature (10 s).......................... 300°C Junction Temperature.......................…….....…...150°C HBM ESD Rating per JEDEC…………………..…4000V MM ESD Rating per JEDEC………………….….…200V CDM ESD Rating per JEDEC……………………..1000V Latch-Up testing per JEDEC………..…....……±100mA Industrial Temperature Range ……… … -30°C to +85°C VIN ..........................................................+4.35V to +6.5V Package Thermal Resistance (θJA) uCSPTM-15…………………………..………….....55°C/W 5x5 QFN-32 (thermal pad connected to PCB).37.2°C/W RELIABILITY CHARACTERISTICS Data Retention…………………………..…..100 Years Endurance…………………….……….100,000 Cycles Note – The device is not guaranteed to function outside its operating rating. Stresses listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions outside those listed in the operational sections of the specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability. Devices are ESD sensitive. Handling precautions are recommended. DC OPERATING CHARACTERISTICS TA= -30°C to +85°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND. Symbol Parameter Conditions Min VFLT = 4.2V, ICHG=100mA VFLT = 4.2V +4.35 IDD-ACTIVE IOFFSET Input supply voltage Under-voltage lockout voltage Under-voltage lockout hysteresis Input over-voltage lockout voltage Battery over-voltage lockout voltage Automatic shutdown threshold voltage Active supply current Active supply current IDD-SHDN Shutdown supply current Input voltage present ILK Reverse leakage current VIN < VBATT (no adapter), T=0oC to +70oC TREG Thermal regulation temperature Typ Max Unit +6.5 +3.5 V V 10 mV +7.0 V VFLT+0.1 V VIN – VBATT 130 mV PWM not switching PWM switching 0.8 5 4 mA mA 7 20 µA 2 µA General VIN VUVLO VUVLO-HYS VOVLO VBOV VASHDN Summit Microelectronics, Inc VFLT = 4.2V 110 2106 3.1 11/4/2008 o C 6 SMB135 DC OPERATING CHARACTERISTICS (CONTINUED) TA= -30°C to +85°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND. Symbol Parameter Conditions Min Typ Max Unit Switch-mode Controller RRDSON FET On-resistance VIN = 5.0V 550 ILIMIT Current limit D.C. Duty cycle fOSC=1.25MHz, VBATT=3.0V Maximum Minimum 1000 100 0 mΩ mA % % Logic Inputs/Output VIL VIH VILEN VIHEN VOL Input low level Input high level Input low level Input high level SDA/STAT Output low level IBIAS ISINK Input bias current STAT sink current All inputs except EN All inputs except EN 600 1.4 400 1.2 ISINK=3mA 300 mV V mV V mV 5 µA mA 52.5 mV 2.0 V 1 Battery Charger Fast-charge mode, maximum voltage across sense resistor VPRECHG Constant current sense voltage Trickle-charge to pre-charge voltage threshold Trickle-charge current Pre-charge to fast-charge voltage threshold IPRECHG Nominal pre-charge current ∆IPRECHG Pre-charge current tolerance 12.5mA steps, RSENSE = 0.1Ω IPRECHG = 100mA, RSENSE = 0.1Ω, T=0oC to +70oC IFCHG Nominal Fast charge current ICHG Nominal charge current ∆ICHG Fast charge current tolerance VFLT Float voltage range ∆VFLT Float voltage tolerance ITERM Charge termination current ∆ITERM Termination current tolerance VSENSE VTRICKLECHG ITRICKLECHG 10 100mV steps 16 steps, RSENSE = 0.1Ω USB500/100=VIN, Note 1 USB500/100=GND, Note 1 IFCHG = 525mA, RSENSE = 0.1Ω, T=0oC to +70oC 20mV steps T=+10oC to +50oC, VFLT = 4.2V 2.400 3.100 mA V 25 212.5 mA 125 mA 525 mA 75 100 47.5 495 75 525 100 555 125 mA mA 495 525 555 mA 4.020 4.620 V -1 +1 % 15mA steps, RSENSE = 0.1Ω 25 130 mA ITERM = 55mA, RSENSE = 0.1Ω, T=0oC to +70oC 25 85 mA Note 1: The ACTUAL charging current always equals the nominal values given in the register tables minus IOFFSET, where IOFFSET is the device’s total active current. The 525mA nominal value shown here is with the hex value F in register h00[7:4]. For USB1, the nominal value is the lower of the one selected in the register and 100mA. Note 2: Voltage, current and frequency accuracies are only guaranteed for factory-programmed settings. Changing any of these parameters from the values reflected in the customer specific CSIR code will result in inaccuracies exceeding those specified above. Note 3: The SMB135 device is not intended to function as a battery pack protector. Battery packs used in conjunction with this device need to provide adequate internal protection and to comply with the corresponding battery pack specifications. Summit Microelectronics, Inc 2106 3.1 11/4/2008 7 SMB135 DC OPERATING CHARACTERISTICS (CONTINUED) TA= -30°C to +85°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND. Symbol Parameter Conditions Min Typ Max Unit Battery Charger VRECH Recharge threshold voltage CMR Common mode range THI Charge cutoff temp (high) TLO Charge cutoff temp (low) 115 Current Sense Amplifier, Note 4 Adjustable, conditions per typical application Adjustable, conditions per typical application mV 2 VBATT 30 65 o -20 15 o V C C Note 4: Guaranteed by Design. AC OPERATING CHARACTERISTICS TA= -30°C to +85°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND. Symbol Description Conditions Min 250kHz steps (3 settings) fOSC=1.25MHz (default), T=0oC to +70oC Note 5 Disabled Enabled Short Long 750 Typ Max Unit 1250 kHz 1.375 MHz Oscillator fOSC Frequency range ∆fOSC Frequency accuracy tSTART Start-up time tGLITCH Glitch filter tHOLDOFF Hold-off time tFCTO Fast-charge Timeout tFCTO = 350min tFCTO = 699min 1.125 1.250 20 0 250 0 1 256 ms msec msec msec msec -15 tFCTO +15 % -15 tPCTO +15 % tFCTO = 1398min tPCTO = 44min tPCTO Pre-charge Timeout tPCTO = 87min tPCTO = 175min Note 5: This is the time it takes for the device to be ready for I2C communication or charging after power-up (including coming out of shutdown). When charging is enabled, actual charging begins after the hold-off timer has expired. Summit Microelectronics, Inc 2106 3.1 11/4/2008 8 SMB135 CHARGING ALGORITHM (500mA) Charge Algorithm (CC-CV) vs. Time 4.50 1 Battery Voltage Charge Current Input current Float Voltage Vfloat (prog) Battery Voltage (V) 3.50 3.00 0.1 Fast-charge Vbat<Vfloat Ichg (prog) Trickle charge Vbat<2.00V Itrickle = 10mA Taper-charge Vbat=Vfloat Charge termination (prog) 0.01 2.50 Pre-charge Vbat<Vprechg Iprechg (prog) Log Current (A) 4.00 Pre-charge to fast-charge transition (prog) 2.00 Trickle to pre-charge transition (fixed 2.00V) 1.50 0.001 Time Figure 3 – Typical SMB135 Charging Algorithm) Summit Microelectronics, Inc 2106 3.1 11/4/2008 9 SMB135 I2C-2 WIRE SERIAL INTERFACE AC OPERATING CHARACTERISTICS – 400 kHz TA= 0°C to +85°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND. 400kHz Symbol Description fSCL SCL clock frequency TLOW Clock low period 1.3 µs THIGH Clock high period 0.6 µs tBUF Bus free time between a STOP and a START condition 1.3 µs tSU:STA Start condition setup time 0.6 µs tHD:STA Start condition hold time 0.6 µs tSU:STO Stop condition setup time 0.6 tAA Clock edge to data valid SCL low to valid SDA (cycle n) 0.2 tDH Data output hold time SCL low (cycle n+1) to SDA change 0.2 tR SCL and SDA rise time Note 6 20 + 0.1Cb 300 ns tF SCL and SDA fall time Note 6 20 + 0.1Cb 300 ns tSU:DAT Data in setup time 100 tHD:DAT Data in hold time 0 TI Noise filter SCL and SDA Noise suppression tWR_CONFIG Write cycle time config Configuration registers 10 ms tWR_EE Write cycle time EE Memory array 5 ms Conditions Min Typ 0 Before new transmission – Note 6 Max Units 400 kHz µs 0.9 µs µs ns 0.9 140 µs ns Note 6: Guaranteed by Design. I2C TIMING DIAGRAMS tR tF tSU:STA tHD:STA tHIGH tWR (For Write Operation Only) tLOW SCL tHD:DAT tSU:DAT tSU:STO tBUF SDA (IN) tAA tDH SDA (OUT) Figure 4 – I2C Timing Diagrams Summit Microelectronics, Inc 2106 3.1 11/4/2008 10 SMB135 EFFICIENCY GRAPHS Figure 5: SMB135 QFN Efficiency vs Voltage VIN=5V, IFCHG=500mA, F=1.25MHz, TA=25°C Efficiency (%) 100 95 90 Taiyo Y 4.7uH TDK 6.8uH 85 80 75 3 3.2 3.4 3.6 3.8 4 4.2 VBATT (V) Figure 6: SMB135 QFN Efficiency vs Voltage VIN=5V, IFCHG=500mA, L=6.8uH (TDK:VLF4012), TA=25°C Efficiency (%) 100 95 90 1.25MHz 1MHz 85 750kHz 80 75 3 3.2 3.4 3.6 3.8 4 4.2 VBATT (V) Summit Microelectronics, Inc 2106 3.1 11/4/2008 11 SMB135 OUTPUT CURRENT GRAPH Figure 7: Output Current vs. Battery Voltage VIN=5V, IFCHG=1000mA, RSENSE=50mOhm, F=1.25MHz, VFLOAT=4.2V,TA=25°C IBATT (mA) 1100 1000 900 800 700 3.00 3.50 4.00 4.50 VBATT (V) Summit Microelectronics, Inc 2106 3.1 11/4/2008 12 SMB135 APPLICATIONS INFORMATION DEVICE OPERATION The SMB135 is a fully programmable battery charger for single-cell Li-Ion and Li-Polymer battery packs. The device’s high-efficiency, switch-mode operation reduces heat dissipation and allows for higher current capability for a given package size. The SMB135 provides four main charging phases: trickle-charge, pre-conditioning (pre-charge), constant (fast-charge) current and constant voltage. The overall system accuracy of the SMB135 is 1%, allowing for a higher capacity utilization versus other conventional solutions. Furthermore, the main battery charging parameters are programmable, allowing for high design flexibility and sophisticated battery management. Power Supply The SMB135 can be powered from an input voltage between +4.35 and +6.5 Volts applied between the IN pin and ground. The voltage on the IN pin is monitored by Under-Voltage (UVLO) and Over-Voltage Lockout (OVLO) circuits, which prevent the charger from turning on when the voltage at this node is less than the UVLO threshold (+3.5V), or greater than the OVLO threshold (+7.0V). The IN pin also supplies an internal +2.5V VDD regulator, filtered by an external capacitor attached between the VDDCAP pin and ground; this filtered voltage is then used as an internal VDD supply. When the input supply is removed, the SMB135 enters a low-power shutdown mode, exhibiting a very low discharge leakage current (2µA), thereby extending battery life. Pre-qualification Mode When an external wall adaptor or a USB cable is connected, the SMB135 performs a series of prequalification tests before initiating the first charge cycle. The input voltage level needs to be higher than the UVLO threshold, lower than the OVLO threshold and 130mV greater than the battery voltage; the ENABLE input needs to be asserted or the appropriate I2C command needs to be asserted; and the cell temperature needs to be within the specified temperature limits for the charging cycle to start. The pre-qualification parameters are continuously monitored and charge cycle is suspended when one of them is outside the limits. Trickle-charge Mode Once all pre-qualification conditions are met, the device checks the battery voltage to decide if trickle-charging is required (Figure 3). If the battery voltage is below approximately 2.0V, a charging current of 10mA (typical) is applied on the battery cell. This allows the SMB135 to reset the protection circuit in the battery Summit Microelectronics, Inc pack and bring the battery voltage to a higher level without compromising safety. Pre-charge Mode Once the battery voltage crosses the 2.0V level, the SMB135 pre-charges the battery to safely charge the deeply discharged cells (Figure 3). The pre-charge (pre-conditioning) current is programmable from 25mA to 212.5mA in 12.5mA steps, assuming a sense resistor of 100mΩ (Register 00h). The SMB135 remains in this mode until the battery voltage reaches the pre-charge to fast-charge voltage threshold (programmable from +2.4V to +3.1V in 100mV steps). If the pre-charge to fast-charge voltage threshold is not exceeded before the pre-charge timer expires, the charge cycle is terminated and a corresponding timeout fault signal is asserted (“Pre-charge Timeout” in register 36h). Constant Current Mode When the battery voltage exceeds the pre-charge to fast-charge voltage threshold, the device enters the constant current (fast charge) mode. During this mode, the fast charge current level is set by either the USB500/100 input (see below) or the corresponding register. The fast charge current is programmable from 47.5mA to 525mA (16 steps), assuming a sense resistor of 100mΩ (Register 00h). Constant Voltage Mode When the battery voltage reaches the pre-defined float voltage, the fast-charge current starts diminishing. The float voltage is programmable from +4.00V to +4.62V in 20mV steps and is ±1% accurate over the 0°C to +70°C temperature range. The higher float voltage settings of the SMB135 enable the charging of modern battery packs with a required float voltage of 4.3V, 4.4V, and 4.5V. Furthermore, the ability to dynamically adjust the float voltage allows the implementation of sophisticated battery charging and control algorithms. Charge Completion The charge cycle is considered complete when the charge current reaches the programmed termination current threshold. The termination current is programmable from 25mA to 130mA in 15mA steps, assuming a sense resistor of 100mΩ (Register 01h). If the termination current threshold is not met before the fast-charge timer expires, the charge cycle is terminated and a corresponding timeout fault signal is asserted (“Fast-charge Timeout” in register 36h). 2106 3.1 11/4/2008 13 SMB135 APPLICATIONS INFORMATION (CONTINUED) EN (ENABLE) EN is a logic input pin (active low) for enabling/disabling the device and/or restarting a charge cycle. When EN is held at a high logic level, IN goes into a high impedance state, the internal VDD regulator is powered down, no communication can occur over the I2C bus, and no charge cycles may proceed. EN must be held low in order to get any functionality out of the device. If unused, this pin should be tied to GND. Charge Enable The initiation of a charge cycle is controlled via the state of the volatile command register (Register 31, bit 4) and Register 0F bit 7. Bit 0F[7] controls the polarity of the command bit 31[4]; if 0F[7] is low, then a 0 at 31[4] will cause a charge cycle to start. Since the volatile register always powers-up to all 0’s, then 0F[7] determines whether a charge cycle may begin on power up, or whether an I2C command must be issued to initiate charging. USB500/100 USB500/100 is a logic input that allows the user to select a maximum fast charge current of 100mA or 500mA. When a logic high signal is applied on this pin, the charge current level may be as high as 500mA. When a logic low signal is applied on this input, the charge current level is limited to 100mA. In all cases, a lower register value setting will impose an overriding current limit. When the USB500/100 input is not used, this pin should be tied to VDDCAP or GND (do not leave floating). The USB500/100 functionality can also be controlled over the I2C interface (ignoring the state of the pin), allowing for full software control of charge current levels. This function is accomplished via register 31 bit 3, when Register 7 bit 0 is programmed high. Automatic Battery Recharge The SMB135 allows the battery to be automatically recharged (topped off) when the battery voltage falls by a value of VRECH (115mV typical) below the programmed float voltage. Provided that the input power supply is still present, charging remains enabled and all the pre-qualification parameters are still met, a new charging cycle will be initiated. This ensures that the battery capacity remains high, without the need to manually re-start a charging cycle. The automatic battery recharging can be disabled if not required by the application (Register 03h). Safety Timers The integrated safety timers provide protection in case of a defective battery pack. The pre-charge timer starts after the pre-qualification check is completed and Summit Microelectronics, Inc resets when the transition to the constant current mode happens. At that point, the fast charge timer is initiated. The fast charge timer expires and charge cycle is terminated if the termination current level is not reached within the pre-determined duration. Each safety timer has three programmable timeout periods, which eliminates the need for external timing capacitors and allows for maximum design flexibility. In addition, each timer can be disabled by the appropriate bit selection in Register 05h. Thermal Monitor A temperature sensing I/O (THERM) is provided to prevent excessive battery temperatures during charging. The battery temperature is measured by sensing the voltage between the THERM pin and ground. The voltage is created by injecting a current into the parallel combination of Negative Temperature Coefficient (NTC) thermistor and a resistor. This voltage is then compared to two predetermined voltages representing the maximum and minimum temperature settings of the battery. The purpose of the resistor in parallel to the NTC thermistor is to linearize the resistance of the thermistor. The table below, shows the 1% resistor that should be placed in parallel with the corresponding thermistor. If the temperature limits are exceeded, battery charging will be suspended until the temperature level has fallen within the safe operating range. The over-temperature limit is programmable from 30°C to 65°C, and the under-temperature limit is programmable from −20°C to 15°C, each in 5°C increments using Register 04h. In addition, the user can easily select the required bias current, based on the value of the negative temperature coefficient (NTC) thermistor located in the battery pack: 10k, 25k, 100k (Register 04h). Disabling the thermal monitor is also possible by selecting the appropriate bits in Register 04h. As the temperature changes, the resistance of the thermistor changes creating a voltage proportional to temperature. The temperature coefficient or Beta (Β) of the thermistor must be as close to 4400 as possible to achieve the maximum temperature accuracy. NTC THERMISTOR RESISTANCE 10K 24.9K 25K 61.9K 100K 249K Table: NTC values and associated parallel resistances. 2106 3.1 11/4/2008 14 SMB135 APPLICATIONS INFORMATION (CONTINUED) Frequency Selection The SMB135 can operate at three different switching frequencies (750kHz, 1MHz, 1.25MHz), which are selectable via an I2C command (Register 08h). STAT Output The STAT is an open-drain output that indicates battery charge status or an input under-voltage/over-voltage (UV/OV) condition. The type of indication can be selected via the corresponding bit in Register 07h. STAT has two modes of operation, as determined by Register 05h[7]: in Mode 0, STAT is asserted low whenever the battery is charging and de-asserted at all other times; in Mode 1, STAT is de-asserted when the charger is disabled, blinks during charging, and remains continuously asserted when the charge cycle has completed. A pull-up resistor should be applied on this pin for interfacing to a microcontroller or other logic IC. Programmable Battery Charging A unique feature of the SMB135 is the ability to modify all of the important charger parameters via internally programmable EEPROM, found in Registers 00-07. Once the device has been configured correctly, the EEPROM may be locked, preventing any further changes. Additionally, these registers may also be configured so that they may be updated in RAM (volatile), even if the underlying EEPROM is locked. This feature is useful if it is desired to actively manage the charging profile without making changes to the nonvolatile defaults. Use Register 0E to control locking and volatile access. Before writing to Registers 00-07 in a volatile manner, Register 31[7] must first be set high. Glitch Filter The SMB135 features a glitch filter to ensure that short violations in the UV or OV settings will not result in a fault-triggered action. The glitch filter is userprogrammable (Register 05h) and may be set to 0msec (glitch filer disabled) or to 250msec. Enabling the glitch filter will delay “automatic recharge” and “current termination” by 250msec. Hold-off Timer The SMB135 features a hold-off timer that defines the amount of time from enabling the charger output until current begins flowing (trickle charge is excluded from this condition). Two choices (short & long) are available: <1msec or 256msec. The short timer is asynchronous and could be any value between 0msec and 1msec. Internal Thermal Protection When the die temperature of the SMB135 reaches approximately 110°C, the PWM switcher will cut back on the duty cycle to reduce current and prevent further die heating. This internal thermal protection circuit helps to improve device (and consequently, system) reliability. FAULT and STATUS Indicators A large number of battery charging conditions and parameters are monitored and corresponding fault and status indications are available to the user via the I2C compatible registers. These include the following: • Charging status • Safety timer timeout • Over-temperature alarm • Under-temperature alarm • Over-voltage alarm • Under-voltage alarm • Missing battery detection Summit Microelectronics, Inc 2106 3.1 11/4/2008 15 SMB135 APPLICATIONS INFORMATION (CONTINUED) EXTERNAL COMPONENTS (Figure 9) Input and Output Capacitors The input capacitor needs to absorb all reflected input switching ripple current generated by the SMB135 device during charging, so that no ripple current will be seen on the input supply. The RMS value of input ripple current in buck type charger is given by, Irms = Ibat Vbat ⋅ (Vin − Vbat ) . Vin A 4.7uF ceramic capacitor, X5R or X7R rated, with the 0603 size and low ESR sufficiently accommodates the above RMS current. The output capacitor needs to ensure stability of the charger and low output ripple voltage. A 10uF ceramic capacitor, X5R or X7R rated, with the 0603 size and low ESR can make operations of the SMB135 device stable and absorb all AC portion of the inductor switching ripple current, since the RMS value of the output ripple current is much smaller than that of the input ripple current. Inductor The inductor in a buck type charger should be selected so that all its form-factor, cost, switching ripple and efficiency conform to the system requirement, or constitute the best compromise. Small dimensions, higher inductance value usually suggests higher DCR value. High DCR generates high conduction loss. Lower inductance value has less DCR but creates larger switching ripple current, which produces higher AC loss in the magnetic core and the windings. Setting the peak-to-peak ripple current approximately 30% of the maximum charge current is a commonly used method. Thus, ∆I L = Vinmax − Vbat Vbat , ⋅ L Vin max ⋅ fs and, Diode The rectifying diode circulates the inductor current when the internal top FET is turned off. This causes the forward voltage drop across the diode. Thus the diode power loss is, PLOSS _ DIODE = VFD ⋅ Ibat ⋅ Vin − Vbat . Vin Minimize the diode power loss by choosing a low forward voltage diode. The reverse blocking voltage rating that is considerably higher than the input voltage withstands any spike voltage that might appear across the diode. Be cautious of the reverse leakage current that constantly bleeds a small power out the battery cells when the battery cells aren’t charged. BOARD LAYOUT RECOMMENDATIONS The SMB135 only requires an inductor, a rectifying diode, an input capacitor, an output capacitor, a sense resistor and some bypass components, the high side FET is internal (Figures 9, 10 and 11, Table 1). Place an input capacitor close to the IC. Place an inductor, a rectifying diode, and an output capacitor close to each other. Place a VDD cap, a COMP capacitor and a COMP resistor close to the pins. Pour sufficiently large copper shapes on both sides of the sense resistor, toward the output capacitor and toward the battery cells. Pour large copper shapes on the “IN”, “OUT” and “GND” nodes as well. If it is necessary to route from these nodes to the other side of the board, place enough number of vias. Accuracy of current measurements and therefore accuracy of charge current control are at maximum only if both the SENSEH trace and the SENSEL trace are directly connected to each side of the resistor pads without contacting any shapes on their ways. Make the two routes a differential pair if possible. Internal ground planes and power planes quickly sink heat generated by the SMB135, the rectifying diode, and the inductor, furthermore reduce noise concern for the IC by providing shielding. ∆I L = 30% ⋅ Ibat max , where, L is inductance, fs is the switching frequency. Summit Microelectronics, Inc 2106 3.1 11/4/2008 16 SMB135 APPLICATIONS INFORMATION (CONTINUED) POR Divide I(charge) settings by 5 Standby Mode (Pause Charge) NO Vin > Vbat+130mV ? (Always Monitored) HUB YES Vbat>2.0V? T(hi)>T>T(lo)? (Always Monitored) NO NO 3mA trickle charge (timers off) YES Precharge Mode Reset t(precharge) YES YES Vbat <Vprechg? Default 100mA USB Mode Wait for USB Controller Regulate Current to I(precharge) (<Imax-in) HOST USB TYPE Host/Hub NO NO Normal Charge Mode Reset t(charge) Vbat <Vprechg? NO YES t(precharge) expired? NO NO Vbat < Vfloat? Regulate Voltage to Vfloat YES YES YES Regulate Current to I(charge) (See Current Boosting) YES I(charge) < I(terrm)? Battery Fault NO NO t(charge) expired? YES Terminate Charge Standby Mode t(charge) expired? NO Vbat <Vprechg? NO Terminate Charge Standby Mode YES Vbat < Vfloat100mV? YES Figure 8 – Functional flow chart. Summit Microelectronics, Inc 2106 3.1 11/4/2008 17 SMB135 APPLICATIONS INFORMATION (CONTINUED) Figure 9 – Typical applications schematic. The USB device has internal pull up resistors for SDA and SCL. Summit Microelectronics, Inc 2106 3.1 11/4/2008 18 SMB135 APPLICATIONS INFORMATION (CONTINUED) Table 1: Recommended Bill of Material. Item Description Vendor / Part Number Qty Ref. Des. Resistors 1 15kohm, 1%, 0402 Vishay# CRCW04021502F 1 R3 2 10kohm, 1%, 0402 Vishay# CRCW04021002F 3 R4, R12, R13 3 100mohm, 1%, 0402, 1/6W Susumu# RP1005S-R10-F-C 1 R5 4 24.9kohm, 1%, 0402 Vishay# CRCW04022492F 1 R11 5 10kohm, Thermistor, 0402 TDK# NTCG103JF103FT 1 RT1 1 C5 1 C1 1 C2 Capacitors 6 8 1uF, 0402, X5R, 10V, Ceramic TDK# C1608X5R0J106M Murata# GRM40X5R475K16D520 Panasonic# ECJ-0EB1A105M 9 2200pF, 0402, X5R, 25V, Ceramic Vishay# VJ0402Y222KXXA 1 C3 10 0.1uF, 0402, X7R, 16V, Ceramic Kemet# C0402C104K4RACTU 3 C7, C8, C9 1 D1 7 10uF, 0603, X5R, 6.3V, Ceramic 4.7uF, 0805, X5R, 16V, Ceramic Semiconductors 11 RB551V-30, SOD-323, 30V, 0.5A, 0.47Vf ROHM# RB551V-30TE-17 LED, Red, SMD, 0805 Lumex# SML-LXT0805SRW 1 D2 13 Cypress CY7C63001A USB to I2C Micro Delcom Engineering #802200 1 U1 14 Crystal Oscillator, SMT, 6MHz SMB135E Digikey# 300-6112-1-ND Summit Microelectronics 1 1 Y1 U2 6.8uH, 0.96A (saturation), 0.97A (dc) TDK# VLF4012AT-6R8MR96 1 L1 4.7uH, 1.02A (saturation), 1.04A (dc) Taiyo Yuden # NR3015T4R7M 1 L1 (Alternate) 1 J1 12 15 Magnetics 16 Hardware Digi-Key, H2960CT-ND 17 Connector Receptacle Mini USB type B 2.0 Hirose Electric USA UX60-MB5S8 H2960CT Summit Microelectronics, Inc 2106 3.1 11/4/2008 19 SMB135 LAYOUT – TOP SIDE Figure 10 – Example Layout. The top side layout provides space (U2) for an SMB135 device packaged in a leadless QFN package (Not to Scale). LAYOUT – BOTTOM SIDE Figure 11 – Example Layout. The bottom side layout provides space (U3) for a SMB135E device packaged in a CSP package. Summit Microelectronics, Inc 2106 3.1 11/4/2008 20 SMB135 DEVELOPMENT HARDWARE & SOFTWARE The SMX3202 system consists of a USB programming Dongle, cable and WindowsTM GUI software. It can be ordered on the website or from a local representative. The latest revisions of all software and an application brief describing the SMX3202 is available from the website (www.summitmicro.com). The Windows GUI software will generate the data and send it in I2C serial bus format so that it can be directly downloaded to the SMB135 via the programming Dongle and cable. An example of the connection interface is shown in Figure 12. When design prototyping is complete, the software can generate a HEX data file that should be transmitted to Summit for approval. Summit will then assign a unique customer ID to the HEX code and program production devices before the final electrical test operations. This will ensure proper device operation in the end application. The SMX3202 programming Dongle/cable interfaces directly between a PC’s USB port and the target application. The device is then configured on-screen via an intuitive graphical user interface employing dropdown menus. Top view of straight 0.1" x 0.1" closed-side connector. SMX3202 interface connector. Pin 10, USB500/100 Pin 8, EN Pin 6, MR# Pin 4, SDA Pin 2, SCL IN USB500/100 EN SMB135 SDA SCL 10 8 6 4 2 9 7 5 3 1 Pin 9, 5.0V Pin 7, 10V Pin 5, Reserved Pin 3, GND Pin 1, GND 0.1µF GND Figure 12 – SMX3202 Programmer I2C serial bus connections to program the SMB135. Only SDA and SCL connections are necessary for programming purposes, the other 2 pins are control options provided by the SMX3202 and Windows GUI, see pin descriptions Summit Microelectronics, Inc 2106 3.1 11/4/2008 21 SMB135 I2C PROGRAMMING INFORMATION SERIAL INTERFACE Access to the configuration registers, command and status registers is carried out over an industry standard 2-wire serial interface (I2C). SDA is a bidirectional data line and SCL is a clock input (Figure 4). Data is clocked in on the rising edge of SCL and clocked out on the falling edge of SCL. All data transfers begin with the MSB. During data transfers, SDA must remain stable while SCL is high. Data is transferred in 8-bit packets with an intervening clock period in which an Acknowledge is provided by the device receiving data. The SCL high period (tHIGH) is used for generating Start and Stop conditions that precede and end most transactions on the serial bus. A high-to-low transition of SDA while SCL is high is considered a Start condition while a low-to-high transition of SDA while SCL is high is considered a Stop condition. The interface protocol allows operation of multiple devices and types of devices on a single bus through unique device addressing. The address byte is comprised of a 7-bit device type identifier (slave address). The remaining bit indicates either a read or a write operation. Refer to Table 1 for a description of the address bytes used by the SMB135. The device type identifier for the configuration registers and the command and status registers are accessible with the same slave address. The slave address can be can be programmed to any seven bit number 0000000BIN through 1111111BIN. Table 2. WRITE Writing to a configuration register is illustrated in Figures 13 and 14. A Start condition followed by the slave address byte is provided by the host; the SMB135 responds with an Acknowledge; the host then responds by sending the memory address pointer or configuration register address pointer; the SMB135 responds with an acknowledge; the host then clocks in one byte of data. For configuration register writes, up to 15 additional bytes of data can be clocked in by the host to write to consecutive addresses within the same page. Slave Address ANY After the last byte is clocked in and the host receives an Acknowledge, a Stop condition must be issued to initiate the nonvolatile write operation. READ The address pointer for the non-volatile configuration registers and memory registers as well as the volatile command and status registers must be set before data can be read from the SMB135. This is accomplished by issuing a dummy write command, which is a write command that is not followed by a Stop condition. A dummy write command sets the address from which data is read. After the dummy write command is issued, a Start command followed by the address byte is sent from the host. The host then waits for an Acknowledge and then begins clocking data out of the slave device. The first byte read is data from the address pointer set during the dummy write command. Additional bytes can be clocked out of consecutive addresses with the host providing an Acknowledge after each byte. After the data is read from the desired registers, the read operation is terminated by the host holding SDA high during the Acknowledge clock cycle and then issuing a Stop condition. Refer to Figure 15 for an illustration of the read sequence. CONFIGURATION REGISTERS Writing and reading the configuration registers is shown in Figures 13, 14 and 15. A description of the configuration registers is shown in Table 3 through Table 12. GRAPHICAL USER INTERFACE (GUI) Device configuration utilizing the Windows based SMB135 graphical user interface (GUI) is highly recommended. The software is available from the Summit website (www.summitmicro.com). Using the GUI in conjunction with this datasheet, simplifies the process of device prototyping and the interaction of the various functional blocks. A programming Dongle (SMX3202) is available from Summit to communicate with the SMB135. The Dongle connects directly to the USB port of a PC and programs the device through a cable using the I2C bus protocol. See Figure 12 and the SMX3202 Data Sheet. Register Type Configuration Registers are located in 00 HEX thru 05 HEX , 08 HEX and 0F HEX Table 2 – Address bytes used by the SMB135. Summit Microelectronics, Inc 2106 3.1 11/4/2008 22 SMB135 I2C PROGRAMMING INFORMATION (CONTINUED) M aster S T A R T Configuration Register Address Bus Address S A 3 S A 2 S A 1 S A 0 A 2 A 1 A 0 C 6 C 7 W C 5 C 4 C 3 Data C 2 C 1 C 0 D 7 A C K Slave S T O P D 6 D 5 D 4 D 3 D 2 D 1 D 0 A C K A C K Figure 13 – Configuration Register Byte Write S T A R T M aster Configuration Register Address Bus Address S A 3 S A 2 S A 1 S A 0 A 2 A 1 A 0 C 6 C 7 W C 5 C 4 C 3 Data (1) C 2 C 1 C 0 D 7 A C K Slave D 6 D 7 D 6 D 5 D 4 D 4 D 3 D 2 D 1 D 0 A C K A C K S T O P Data (16) Data (2) M aster D 5 D 3 D 2 D 1 D 0 D 7 D 6 D 5 D 2 D 1 D 0 D 7 A C K Slave D 6 D 5 D 4 D 3 D 2 D 1 D 0 A C K A C K Figure 14 – Configuration Register Page Write M aster S T A R T Configuration Register Address Bus Address S A 3 S A 2 S A 1 S A 0 A 2 A 1 A 0 S T A R T C 7 W C 6 C 5 C 4 C 3 C 2 C 1 C 0 A C K Slave D 7 D 6 D 5 D 4 D 3 D 2 D 1 D 0 S A 1 S A 0 A 2 A 1 A 0 R A C K A C K D 7 S A 2 A C K A C K Data (1) M aster Bus Address S A 3 D 6 D 5 D 2 D 1 D 0 N A C K Data (n) D 7 D 6 D 5 D 4 D 3 D 2 D 1 S T O P D 0 Slave Figure 15 – Configuration Register Read Summit Microelectronics, Inc 2106 3.1 11/4/2008 23 SMB135 CONFIGURATION REGISTERS The following tables (Tables 3 to 15) describe the user-programmable registers of the SMB135 programmable battery charger. Locations 00-0F are non-volatile, EEPROM registers; however, registers 00-07, which contain the battery charging parameters, may also be configured to be programmable in RAM. Locations 31-3F contain volatile status and command registers. To lock all of the configuration registers, set 0E[2]=1; please note that this operation cannot be undone. To allow volatile access to locations 00-07, set 0E[0]=1; then after every power-on, 31[7] must also be set high. It is prohibited to write to any location, not specifically mentioned in the tables below7. Default register settings are in BOLD. Table 3 – Charge current – 8-bit (address: 00h) – Non-Volatile & Volatile (mirror) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Fast Charge Current RSENSE=100mΩ RSENSE=50mΩ 47.5mA 95mA 62.5mA 125mA 65.0mA 130mA 67.5mA 135mA 195mA 390mA 225mA 450mA 255mA 510mA 285mA 570mA 315mA 630mA 345mA 690mA 375mA 750mA 405mA 810mA 435mA 870mA 465mA 930mA 495mA 990mA 525mA 1050mA Pre-charge current RSENSE=100mΩ X X X X 0 0 0 0 25mA X X X X 0 0 0 1 37.5mA X X X X 0 0 1 0 50mA X X X X 0 0 1 1 62.5mA X X X X 0 1 0 0 75mA X X X X 0 1 0 1 87.5mA X X X X 0 1 1 0 100mA X X X X 0 1 1 1 112.5mA X X X X 1 0 0 0 125mA X X X X 1 0 0 1 137.5mA X X X X 1 0 1 0 150mA X X X X 1 0 1 1 162.5mA X X X X 1 1 0 0 175mA X X X X 1 1 0 1 187.5mA X X X X 1 1 1 0 200mA X X X X 1 1 1 1 212.5mA Note 7: Never Write to Reserved bits. Note 8: Charge current can be limited by internal current limit under certain conditions. Summit Microelectronics, Inc 2106 3.1 11/4/2008 RSENSE=50mΩ 50mA 75mA 100mA 125mA 150mA 175mA 200mA 225mA 250mA 275mA 300mA 325mA 350mA 375mA 400mA 425mA 24 SMB135 CONFIGURATION REGISTERS (CONT.) Table 4 – Termination current – 8-bit (address: 01h) – Non-Volatile & Volatile (mirror) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 X X X X X 0 0 X X X X X 0 X X X X X X X X X X X X X X X X X X X X Termination Current RSENSE=100mΩ RSENSE=50mΩ 0 25mA 50mA 0 1 40mA 80mA 0 1 0 55mA 110mA X 0 1 1 70mA 140mA X 1 0 0 85mA 170mA X X 1 0 1 100mA 200mA X X X 1 1 0 115mA 230mA X X X 1 1 1 130mA 260mA Note 7: Never Write to Reserved bits. Summit Microelectronics, Inc 2106 3.1 11/4/2008 25 SMB135 CONFIGURATION REGISTERS (CONT.) Table 5 – Float Voltage – 8-bit (address: 02h) – Non-Volatile & Volatile (mirror) Bit7 Bit6 Bit5 X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X Note 7: Never Write to Reserved bits. Summit Microelectronics, Inc Bit4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Bit3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 Bit2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 Bit1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 2106 3.1 11/4/2008 Bit0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Float Voltage 3.850V 4.020V 4.040V 4.060V 4.080V 4.100V 4.120V 4.140V 4.160V 4.180V 4.200V 4.220V 4.240V 4.260V 4.280V 4.300V 4.320V 4.340V 4.360V 4.380V 4.400V 4.420V 4.440V 4.460V 4.480V 4.500V 4.520V 4.540V 4.560V 4.580V 4.600V 4.620V 26 SMB135 CONFIGURATION REGISTERS (CONT.) Table 6 – Other Charging Parameters – 8-bit (address: 03h) – Non-Volatile & Volatile (mirror) Bit7 0 1 Bit7 X X Bit6 X X Bit6 0 1 Bit5 X X Bit5 X X Bit4 X X Bit4 X X Bit3 X X Bit3 X X Bit2 X X Bit2 X X Bit1 X X Bit1 X X Bit0 X X Bit0 X X Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 X X X X X X X X Bit7 X X X X X X X X X X Bit6 X X 0 0 0 0 1 1 1 1 Bit5 X X 0 0 1 1 0 0 1 1 Bit4 X X 0 1 0 1 0 1 0 1 Bit3 X X X X X X X X X X Bit2 X X X X X X X X X X Bit1 0 1 X X X X X X X X Bit0 X X Automatic Recharge Enabled Disabled Current Termination Enabled Disabled Pre-charge to Fast-charge Voltage Threshold 2.4V 2.5V 2.6V 2.7V 2.8V 2.9V 3.0V 3.1V Hold-off Timer <1msec (short) 256msec (long) Table 7 – Cell temperature monitor – 8-bit (address: 04h) – Non-Volatile & Volatile (mirror) Bit7 0 Bit6 0 Bit5 X Bit4 X Bit3 X Bit2 X Bit1 X Bit0 X 0 1 X X X X X X 40µA (25k NTC) 1 0 X X X X X X 10µA (100k NTC) 1 Bit7 X 1 Bit6 X X Bit5 0 X Bit4 0 X Bit3 0 X Bit2 X X Bit1 X X Bit0 X 0µA (Disabled) Low Temperature Alarm Trip Point X X 0 0 1 X X X -15°C X X 0 1 0 X X X -10°C X X 0 1 1 X X X -5°C X X 1 0 0 X X X 0°C X X 1 0 1 X X X +5°C X X 1 1 0 X X X +10°C X Bit7 X X Bit6 X 1 Bit5 X 1 Bit4 X 1 Bit3 X X Bit2 0 X Bit1 0 X Bit0 0 +15°C High Temperature Alarm Trip Point X X X X X 0 0 1 +35°C X X X X X 0 1 0 +40°C X X X X X 0 1 1 +45°C X X X X X 1 0 0 +50°C X X X X X 1 0 1 +55°C X X X X X 1 1 0 +60°C X X 1 1 1 +65°C X X X Note 7: Never Write to Reserved bits. Summit Microelectronics, Inc 2106 3.1 11/4/2008 Thermistor Current 100µA (10k NTC) -20°C +30°C 27 SMB135 CONFIGURATION REGISTERS (CONT.) Table 8 – Battery charging control – 8-bit (address: 05h) – Non-Volatile & Volatile (mirror) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 0 X X X X X X X 1 X X X X X X X Bit7 X X Bit7 X X X X Bit7 X X X X Bit6 X X Bit6 X X X X Bit6 X X X X Bit5 0 1 Bit5 X X X X Bit5 X X X X Bit4 X X Bit4 X X X X Bit4 X X X X Bit3 X X Bit3 0 0 1 1 Bit3 X X X X Bit2 X X Bit2 0 1 0 1 Bit2 X X X X Bit1 X X Bit1 X X X X Bit1 0 0 1 1 Bit0 X X Bit0 X X X X Bit0 0 1 0 1 Status Output STAT is active low while charging, active high all other times STAT blinks while charging, is active low when finished, active high when disabled Glitch Filter Glitch filter enabled Glitch filter disabled Fast-charge Timeout 350 min 699 min 1398 min Disabled Pre-charge Timeout 44 min 87 min 175 min Disabled Table 9 – STAT and USB500/100 Settings – 8-bit (address: 07h) – Non-Volatile Bit7 X X Bit7 X X Bit7 X X Bit6 X X Bit6 X X Bit6 X X Bit5 X X Bit5 X X Bit5 X X Bit4 X X Bit4 X X Bit4 X X Bit3 X X Bit3 X X Bit3 X X Bit2 0 1 Bit2 X X Bit2 X X Bit1 X X Bit1 0 1 Bit1 X X Bit0 X X Bit0 X X Bit0 0 1 STAT Output Indicator Battery charge status Input over-voltage or input under-voltage Battery over-voltage Behavior Charger is not shutdown Charger is shutdown USB500/100 Control USB500/100 input pin USB500/100 register (address 31h) Bit0 X X X X Switching Frequency 750kHz 1000kHz 1250kHz 1250kHz Table 10 – Frequency Selection – 8-bit (address: 08h) – Non-Volatile Bit7 Bit6 Bit5 0 0 X 0 1 X 1 0 X 1 1 X Note 7: Never Write to Reserved bits. Summit Microelectronics, Inc Bit4 X X X X Bit3 X X X X Bit2 X X X X Bit1 X X X X 2106 3.1 11/4/2008 28 SMB135 CONFIGURATION REGISTERS (CONT.) Table 11 – Configuration and User Memory Lock – 8-bit (address: 0Eh) – Non-Volatile Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 X X X X X 0 X X X X X X X 1 X X Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 X X X X X X 0 X X X X X X X 1 X Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 X X X X X X X 0 X X X X X X X 1 Configuration Lock Unlocked – user can write to non-volatile Configuration bits Locked – user cannot write to non-volatile Configuration bits User-Memory Lock Unlocked – user can write to general purpose EE bits (h20-h2F) Locked – user cannot write to general purpose EE bits (h20-h2F) Volatile Writes Permission Do not allow volatile writes to registers h00h07 Allow volatile writes to registers h00-h07 (even if h0E[2]=1) Table 12 – EN Polarity & I2C Bus/Slave Address – 8-bit (address: 0Fh) – Non-Volatile Bit7 0 1 Bit7 X X X X X X X X Bit7 X X X X X X X X X X X X X X X X Bit6 X X Bit6 0 0 0 0 1 1 1 1 Bit6 X X X X X X X X X X X X X X X X Bit5 X X Bit5 0 0 1 1 0 0 1 1 Bit5 X X X X X X X X X X X X X X X X Bit4 X X Bit4 0 1 0 1 0 1 0 1 Bit4 X X X X X X X X X X X X X X X X Bit3 X X Bit3 X X X X X X X X Bit3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 Bit2 X X Bit2 X X X X X X X X Bit2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 Bit1 X X Bit1 X X X X X X X X Bit1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 Bit0 X X Bit0 X X X X X X X X Bit0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 EN (Enable) Polarity (Register 31[4]) Active Low Active High 2 I C Bus Address 000 001 010 011 100 101 110 111 2 I C Slave Address 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 Note 7: Never Write to Reserved bits. Summit Microelectronics, Inc 2106 3.1 11/4/2008 29 SMB135 CONFIGURATION STATUS REGISTERS Table 13 – Volatile Configuration & Charger Enable – 8-bit (address: 31h) – Volatile Bit7 0 Bit6 X Bit5 X Bit4 X Bit3 X Bit2 X Bit1 X Bit0 X 1 X X X X X X X Bit7 X X Bit6 X X Bit5 X X Bit4 0 1 Bit3 X X Bit2 X X Bit1 X X Bit0 X X Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 X X X X X X X X 0 1 X X X X X X Volatile Configuration Volatile writes to h00-h07 are disabled Volatile writes to h00-h07 are enabled (if CFG h0E[0]=1) Charger Enable Enabled if 0F[7]=0; Disabled if 0F[7]=1 Disabled if 0F[7]=0; Enabled if 0F[7]=1 USB500/100 Select (This bit only has an effect when CFG 07[0]=1) USB 100mA current level USB 500mA current level Table 14 – Battery status register A – 8-bit (address: 36h) – Volatile (read only) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 1 X X X X X X X X 1 X X X X X X Bit7 X X X Bit7 X Bit7 X X X X Bit7 X Bit6 X X X Bit6 X Bit6 X X X X Bit6 X Bit5 0 0 1 Bit5 X Bit5 X X X X Bit5 X Bit4 0 1 0 Bit4 X Bit4 X X X X Bit4 X Bit3 X X X Bit3 1 Bit3 X X X X Bit3 X Bit2 X X X Bit2 X Bit2 0 0 1 1 Bit2 X Bit1 X X X Bit1 X Bit1 0 1 0 1 Bit1 X Bit0 X X X Bit0 X Bit0 X X X X Bit0 1 Charging Status Charger has completed at least 1 successful charge since being enabled Charger has completed at least 1 re-charge cycle since being enabled Timeout Status No timeouts have occurred Pre-charge timeout Fast-charge timeout Temperature Fault Charger paused – temperature fault Charging Status Idle Pre-charging Fast-charging Taper-charging Charging Status Charger is enabled Table 15 – Battery status register B – 8-bit (address: 37h) – Volatile (read only) Bit7 1 X X X X X X Bit6 X 1 X X X X X Bit5 X X 1 X X X X Bit4 X X X 1 X X X Bit3 X X X X 1 X X Bit2 X X X X X 1 X Bit1 X X X X X X 1 Bit0 X X X X X X X X X X X X X X 1 Fault Output Battery missing Charging error Battery over-voltage condition Charger over-voltage condition Charger under-voltage condition Over-temperature alarm Under-temperature alarm Termination Detect Current Threshold has been hit Note 7: Never Write to Reserved bits. Summit Microelectronics, Inc 2106 3.1 11/4/2008 30 SMB135 DEFAULT CONFIGURATION REGISTER SETTINGS – SMB135E-470V Register Content Register Content Register Content Register Content R00 F6 R04 E4 R08 80 R0C 01 R01 00 R05 0F R09 00 R0D E1 R02 0A R06 00 R0A 00 R0E 01 R03 F0 R07 01 R0B C8 R0F 80 Table 16 - The default device ordering number is SMB135E-470V. It is programmed with the register contents as shown above and guaranteed over the industrial temperature range. The ordering number is derived from the customer supplied hex file. New device suffix numbers (nnn) are assigned to non-default requirements. Default register settings are shown in the register Tables 3 through 15 as BOLD. Summit Microelectronics, Inc 2106 3.1 11/4/2008 31 SMB135 PACKAGE DRAWING 15-Ball Ultra CSPTM Summit Microelectronics, Inc 2106 3.1 11/4/2008 32 SMB135 PACKAGE DRAWING (CONT.) Summit Microelectronics, Inc 2106 3.1 11/4/2008 33 SMB135 PART MARKING Summit Part Number Ball A1 Identifier Note: Subject to change at any time during production Lead-free (CSP) Status Tracking Code (Summit Use) 135VSS 01AYWW Date Code (YWW) Multiple Lot Designator Drawing not to scale X is the sequential number per wafer (1 for first wafer, 2 for second wafer, etc.) ORDERING INFORMATION Summit Part Number SMB135 E nnn V Lead Free Package E = 15-Ball Ultra CSPTM N = 32-Pad QFN L = RoHS compliant QFN package V = RoHS compliant CSP package Part Number Suffix Specific requirements are contained in the suffix (Table 16) NOTICE NOTE 1 – This is a data sheet that describes a Summit that is in production. SUMMIT Microelectronics, Inc. reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. SUMMIT Microelectronics, Inc. assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained herein reflect representative operating parameters, and may vary depending upon a user’s specific application. While the information in this publication has been carefully checked, SUMMIT Microelectronics, Inc. shall not be liable for any damages arising as a result of any error or omission. SUMMIT Microelectronics, Inc. does not recommend the use of any of its products in life support or aviation applications where the failure or malfunction of the product can reasonably be expected to cause any failure of either system or to significantly affect their safety or effectiveness. Products are not authorized for use in such applications unless SUMMIT Microelectronics, Inc. receives written assurances, to its satisfaction, that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; and (c) potential liability of SUMMIT Microelectronics, Inc. is adequately protected under the circumstances. Revision 3.1 – This document supersedes all previous versions. Please check the Summit Microelectronics Inc. web site at www.summitmicro.com for data sheet updates. © Copyright 2006 SUMMIT MICROELECTRONICS, Inc. PROGRAMMABLE POWER FOR A GREEN PLANET™ I2C is a trademark of Philips Corporation Summit Microelectronics, Inc 2106 3.1 11/4/2008 34