TGS MBRF10150CT

TIGER ELECTRONIC CO.,LTD
TO-220F Plastic-Encapsulate Diodes
MBRF10150CT
SCHOTTKY BARRIER RECTIFIER
TO-220F
FEATURES
 Schottky Barrier Chip
 Guard Ring Die Construction for Transient Protection
 Low Power Loss,High Efficiency
 High Surge Capability
 High Current Capability and Low Forward Voltage Drop
 For Use in Low Voltage, High Frequency Inverters,Free Wheeling,
and Polarity Protection Applications
1. ANODE
2. CATHODE
3. ANODE
MAXIMUM RATINGS ( Ta=25℃ unless otherwise noted )
Symbol
Parameter
Value
Unit
150
V
105
V
10
A
120
A
Power dissipation
2
W
Thermal resistance from junction to ambient
50
℃/W
Tj
Junction temperature
125
℃
Tstg
Storage temperature
-55~+150
℃
VRRM
Peak repetitive reverse voltage
VRWM
Working peak reverse voltage
VR
DC blocking voltage
VR(RMS)
RMS reverse voltage
Average rectified output current
IO
IFSM
PD
RΘJA
Non-Repetitive peak forward surge current
8.3ms half sine wave
ELECTRICAL CHARACTERISTICS (Ta=25℃ unless otherwise specified)
Parameter
Symbol
Test conditions
Min
Typ
Max
Unit
Reverse voltage
V(BR)
IR=0.1mA
Reverse current
IR
VR=150V
0.2
mA
Forward voltage
VF
IF=5A
0.85
V
Typical total capacitance
Ctot
VR=5V,f=1MHz
150
V
500
pF
A,Jun,2011
Typical Characteristics
MBRF10150CT
Reverse Characteristics
Forward Characteristics
1000
100
Ta=100℃
REVERSE CURRENT IR
FORWARD CURRENT
Ta=100℃
(uA)
1000
IF
(mA)
10000
100
Ta=25℃
10
10
1
Ta=25℃
0.1
0.01
1
1E-3
0
200
400
600
FORWARD VOLTAGE
800
1000
0
60
90
REVERSE VOLTAGE
120
VR
150
(V)
Power Derating Curve
Capacitance Characteristics Per Diode
300
30
VF (mV)
2.5
Ta=25℃
f=1MHz
2.0
PD
200
POWER DISSIPATION
JUNCTION CAPACITANCE
CJ (pF)
(W)
250
150
100
1.5
1.0
0.5
50
0
0.0
0
5
10
REVERSE VOLTAGE
15
VR
(V)
20
0
25
50
75
AMBIENT TEMPERATURE
100
Ta
125
150
(℃ )
A,Jun,2011