TYSEMI FTD2011

IC
MOSFET
SMDType
Type
SMD
Product specification
FTD2011
TSSOP-8
■ Features
Unit: mm
● RDS(ON)=30mΩ Max. @VGS=4V
● RDS(ON)=45mΩ Max. @VGS=2.5V
D1
D2
S1
S2
S1
S2
G1
G2
1 : Drain1
2 : Source1
3 : Source1
4 : Gate1
5 : Gate2
6 : Source2
7 : Source2
8 : Drain2
■ Absolute Maximum Ratings Ta = 25℃
Symbol
Rating
Unit
Drain-Source Voltage
Parameter
VDS
20
V
Gate-Source Voltage
VGS
±10
V
Drain-Current
-Continuous
-Pulsed
Power Dissipation
ID
5
A
(NOTE 1)
IDM
20
A
(NOTE 2)
PD
1.3
W
RθJA
96
℃/W
Tj.Tstg
-55 to 150
℃
Thermal Resistance,Junction- to-Ambient
Operating Junction and Storage Temperature Range
Note: 1. PW≤10μs, duty cycle≤1%
2. Mounted on a ceramic board (1000mm2×0.8mm)
http://www.twtysemi.com
[email protected]
4008-318-123
1 of 2
IC
MOSFET
SMDType
Type
SMD
Product specification
FTD2011
■ Electrical Characteristics Ta = 25℃
Parameter
Symbol
Test conditions
Min
Typ
Max
Unit
Drain-Source Breakdown Voltage
VDSS
VGS=0V,ID=1mA
Zero Gate Voltage Drain Current
IDSS
VDS=20V,VGS=0V
1
μA
Gate-Body Leakage
IGSS
VGS=±8V,VDS=0V
±10
μA
Cutoff Voltage
20
VGS(off) VDS=10V, ID=1mA
Drain- Source on-state Resistance
On-State Drain Current
RDS(ON)
ID(ON)
Forward Transconductance
gFS
Input Capacitance
Ciss
V
1.3
V
VGS=4V,ID=4A
0.5
30
mΩ
VGS=2.5V,ID=2A
45
mΩ
VDS=5V,VGS=4.5V
18
A
VDS=5V,ID=5A
5
S
900
VDS = 10V, VGS = 0V,f =1.0MHZ
pF
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Turn-On Delay Time
tD(on)
15
ns
tr
150
ns
100
ns
Rise Time
Turn-Off Delay Time
tD(off)
Fall Time
VDD=10V,ID=4A,VGS=4V,
RL=2.5Ω,RGEN=50Ω
260
pF
200
pF
tf
150
ns
Total Gate Charge
Qg
32
nC
Gate-S ource Charge
Qgs
1.5
nC
Gate-Drain Charge
Qgd
6
nC
VDS = 10V, ID = 4A,VGS = 10V
■ Marking
Marking
2011
http://www.twtysemi.com
[email protected]
4008-318-123
2 of 2