A3983 DMOS Microstepping Driver with Translator Features and Benefits Description ▪ ▪ ▪ ▪ ▪ ▪ The A3983 is a complete microstepping motor driver with built-in translator for easy operation. It is designed to operate bipolar stepper motors in full-, half-, quarter-, and eighth-step modes, with an output drive capacity of up to 35 V and ±2 A. The A3983 includes a fixed off-time current regulator which has the ability to operate in Slow or Mixed decay modes. Low RDS(ON) outputs Automatic current decay mode detection/selection Mixed and Slow current decay modes Synchronous rectification for low power dissipation Internal UVLO and thermal shutdown circuitry Crossover-current protection Package: 24-pin TSSOP with exposed thermal pad (suffix LP) Not to scale The translator is the key to the easy implementation of the A3983. Simply inputting one pulse on the STEP input drives the motor one microstep. There are no phase sequence tables, high frequency control lines, or complex interfaces to program. The A3983 interface is an ideal fit for applications where a complex microprocessor is unavailable or is overburdened. The chopping control in the A3983 automatically selects the current decay mode (Slow or Mixed). When a signal occurs at the STEP input pin, the A3983 determines if that step results in a higher or lower current in each of the motor phases. If the change is to a higher current, then the decay mode is set to Slow decay. If the change is to a lower current, then the current decay is set to Mixed (set initially to a fast decay for a period amounting to 31.25% of the fixed off-time, then to a slow decay for the remainder of the off-time). This current decay Continued on the next page… Functional Block Diagram 0.1 μF 0.22 μF VREG VDD Current Regulator ROSC CP1 CP2 Charge Pump OSC VCP 0.1 μF DMOS Full Bridge REF DAC VBB1 OUT1A OUT1B PWM Latch Blanking Mixed Decay STEP DIR RESET Translator MS1 Control Logic MS2 DMOS Full Bridge RS1 VBB2 OUT2A OUT2B PWM Latch Blanking Mixed Decay ENABLE SLEEP SENSE2 RS2 DAC VREF 26184.29D SENSE1 Gate Drive A3983 DMOS Microstepping Driver with Translator Description (continued) control scheme results in reduced audible motor noise, increased step accuracy, and reduced power dissipation. lockout (UVLO), and crossover-current protection. Special poweron sequencing is not required. Internal synchronous rectification control circuitry is provided to improve power dissipation during PWM operation. Internal circuit protection includes: thermal shutdown with hysteresis, undervoltage The A3983 is supplied in a low-profile (1.2 mm maximum height), 24-pin TSSOP with exposed thermal pad (suffix LP). It is lead (Pb) free, with 100% matte tin leadframe plating. Selection Guide Part Number A3983SLPTR-T Package Packing 24-pin TSSOP with exposed thermal pad 4000 pieces per 13-in. reel Absolute Maximum Ratings Characteristic Symbol Load Supply Voltage Notes VBB Output Current Output current rating may be limited by duty cycle, ambient temperature, and heat sinking. Under any set of conditions, do not exceed the specified current rating or a junction temperature of 150°C. IOUT Logic Input Voltage Sense Voltage Units 35 V ±2 A VIN –0.3 to 7 V VSENSE 0.5 V Reference Voltage VREF Operating Ambient Temperature TA Maximum Junction Rating Range S 4 V –20 to 85 ºC TJ(max) 150 ºC Tstg –55 to 150 ºC Storage Temperature THERMAL CHARACTERISTICS Characteristic Symbol Package Thermal Resistance RθJA Test Conditions* Value Units 4-layer PCB, based on JEDEC standard) 28 ºC/W *In still air. Additional thermal information available on Allegro Web site. Maximum Power Dissipation, PD(max) 5.5 Power Dissipation, PD (W) 5.0 4.5 4.0 (R 3.5 θJ 3.0 2.5 A = 28 ºC /W ) 2.0 1.5 1.0 0.5 0.0 20 40 60 80 100 120 Temperature (°C) 140 160 180 Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 2 A3983 DMOS Microstepping Driver with Translator ELECTRICAL CHARACTERISTICS1 at TA = 25°C, VBB = 35 V (unless otherwise noted) Characteristics Output Drivers Min. Typ.2 Max. Units 8 0 3.0 – – – – – – – – – – – – – 0.350 0.300 – – – – – – – – 35 35 5.5 0.450 0.370 1.2 1.2 4 2 10 8 5 10 V V V Ω Ω V V mA mA μA mA mA μA VIN(1) VDD0.7 – – V VIN(0) – – V μA Symbol Load Supply Voltage Range VBB Logic Supply Voltage Range VDD Output On Resistance RDSON Body Diode Forward Voltage VF Motor Supply Current IBB Logic Supply Current IDD Test Conditions Operating During Sleep Mode Operating Source Driver, IOUT = –1.5 A Sink Driver, IOUT = 1.5 A Source Diode, IF = –1.5 A Sink Diode, IF = 1.5 A fPWM < 50 kHz Operating, outputs disabled Sleep Mode fPWM < 50 kHz Outputs off Sleep Mode Control Logic Logic Input Voltage Logic Input Current Microstep Select 2 Input Hysteresis Blank Time IIN(1) IIN(0) VIN = VDD0.7 VIN = VDD0.3 MS2 –20 <1.0 VDD0.3 20 –20 <1.0 20 μA 100 300 1 30 30 – 0 – – – 475 – 500 1.3 40 37 4 3 ±15 ±5 ±5 800 kΩ mV μs μs μs V μA % % % ns 165 15 2.7 0.10 – – 3 – °C °C V V Current Trip-Level Error3 errI Crossover Dead Time Protection Thermal Shutdown Temperature Thermal Shutdown Hysteresis UVLO Enable Threshold UVLO Hysteresis tDT – 150 0.7 20 23 0 –3 – – – 100 TJ TJHYS UVLO UVHYS – – 2.35 0.05 VHYS(IN) tBLANK Fixed Off-Time tOFF Reference Input Voltage Range Reference Input Current VREF IREF OSC > 3 V ROSC = 25 kΩ VREF = 2 V, %ITripMAX = 38.27% VREF = 2 V, %ITripMAX = 70.71% VREF = 2 V, %ITripMAX = 100.00% VDD rising 1Negative current is defined as coming out of (sourcing from) the specified device pin. 2Typical data are for initial design estimations only, and assume optimum manufacturing and application conditions. Performance may vary for individual units, within the specified maximum and minimum limits. I = (ITrip – IProg ) ⁄ IProg , where IProg = %ITripMAX ITripMAX. 3err Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 3 A3983 DMOS Microstepping Driver with Translator tA tB STEP tC tD MS1, MS2, RESET, or DIR Time Duration Symbol Typ. Unit STEP minimum, HIGH pulse width tA 1 μs STEP minimum, LOW pulse width tB 1 μs Setup time, input change to STEP tC 200 ns Hold time, input change to STEP tD 200 ns Figure 1. Logic Interface Timing Diagram Table 1. Microstep Resolution Truth Table MS1 MS2 Microstep Resolution Excitation Mode L L Full Step 2 Phase H L Half Step 1-2 Phase L H Quarter Step W1-2 Phase H H Eighth Step 2W1-2 Phase Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 4 A3983 DMOS Microstepping Driver with Translator Functional Description Device Operation. The A3983 is a complete microstepping motor driver with a built-in translator for easy operation with minimal control lines. It is designed to operate bipolar stepper motors in full-, half-, quarter-, and sixteenth-step modes. The currents in each of the two output full-bridges and all of the N-channel DMOS FETs are regulated with fixed off-time PMW (pulse width modulated) control circuitry. At each step, the current for each full-bridge is set by the value of its external current-sense resistor (RS1 or RS2), a reference voltage (VREF), and the output voltage of its DAC (which in turn is controlled by the output of the translator). At power-on or reset, the translator sets the DACs and the phase current polarity to the initial Home state (shown in figures 2 through 5), and the current regulator to Mixed Decay Mode for both phases. When a step command signal occurs on the STEP input, the translator automatically sequences the DACs to the next level and current polarity. (See table 2 for the current-level sequence.) The microstep resolution is set by the combined effect of inputs MS1 and MS2, as shown in table 1. When stepping, if the new output levels of the DACs are lower than their previous output levels, then the decay mode for the active full-bridge is set to Mixed. If the new output levels of the DACs are higher than or equal to their previous levels, then the decay mode for the active full-bridge is set to Slow. This automatic current decay selection improves microstepping performance by reducing the distortion of the current waveform that results from the back EMF of the motor. RESET Input (RESET). The RESET input sets the translator to a predefined Home state (shown in figures 2 through 5), and turns off all of the DMOS outputs. All STEP inputs are ignored until the RESET input is set to high. Step Input (STEP). A low-to-high transition on the STEP input sequences the translator and advances the motor one increment. The translator controls the input to the DACs and the direction of current flow in each winding. The size of the increment is determined by the combined state of inputs MS1 and MS2. Microstep Select (MS1 and MS2). Selects the microstepping format, as shown in table 1. MS2 has a 100 kΩ pulldown resistance. Any changes made to these inputs do not take effect until the next STEP rising edge. Direction Input (DIR). This determines the direction of rotation of the motor. When low, the direction will be clockwise and when high, counterclockwise. Changes to this input do not take effect until the next STEP rising edge. Internal PWM Current Control. Each full-bridge is controlled by a fixed off-time PWM current control circuit that limits the load current to a desired value, ITRIP . Initially, a diagonal pair of source and sink DMOS outputs are enabled and current flows through the motor winding and the current sense resistor, RSx. When the voltage across RSx equals the DAC output voltage, the current sense comparator resets the PWM latch. The latch then turns off either the source DMOS FETs (when in Slow Decay Mode) or the sink and source DMOS FETs (when in Mixed Decay Mode). The maximum value of current limiting is set by the selection of RSx and the voltage at the VREF pin. The transconductance function is approximated by the maximum value of current limiting, ITripMAX (A), which is set by ITripMAX = VREF / ( 8 RS) where RS is the resistance of the sense resistor (Ω) and VREF is the input voltage on the REF pin (V). The DAC output reduces the VREF output to the current sense comparator in precise steps, such that Itrip = (%ITripMAX / 100) × ITripMAX (See table 2 for %ITripMAX at each step.) It is critical that the maximum rating (0.5 V) on the SENSE1 and SENSE2 pins is not exceeded. Fixed Off-Time. The internal PWM current control circuitry uses a one-shot circuit to control the duration of time that the DMOS FETs remain off. The one shot off-time, tOFF, is determined by the selection of an external resistor connected from the ROSC timing pin to ground. If the ROSC Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 5 A3983 DMOS Microstepping Driver with Translator pin is tied to an external voltage > 3 V, then tOFF defaults to 30 μs. The ROSC pin can be safely connected to the VDD pin for this purpose. The value of tOFF (μs) is approximately tOFF ≈ ROSC ⁄ 825 Blanking. This function blanks the output of the current sense comparators when the outputs are switched by the internal current control circuitry. The comparator outputs are blanked to prevent false overcurrent detection due to reverse recovery currents of the clamp diodes, and switching transients related to the capacitance of the load. The blank time, tBLANK (μs), is approximately tBLANK ≈ 1 μs Charge Pump (CP1 and CP2). The charge pump is used to generate a gate supply greater than that of VBB for driving the source-side DMOS gates. A 0.1 μF ceramic capacitor, should be connected between CP1 and CP2. In addition, a 0.1 μF ceramic capacitor is required between VCP and VBB, to act as a reservoir for operating the high-side DMOS gates. VREG (VREG). This internally-generated voltage is used to operate the sink-side DMOS outputs. The VREG pin must be decoupled with a 0.22 μF ceramic capacitor to ground. VREG is internally monitored. In the case of a fault condition, the DMOS outputs of the A3983 are disabled. Enable Input (ENABLE). This input turns on or off all of the DMOS outputs. When set to a logic high, the outputs are disabled. When set to a logic low, the internal control enables the outputs as required. The translator inputs STEP, DIR, MS1, and MS2, as well as the internal sequencing logic, all remain active, independent of the ENABLE input state. Shutdown. In the event of a fault, overtemperature (excess TJ) or an undervoltage (on VCP), the DMOS outputs of the A3983 are disabled until the fault condition is removed. At power-on, the UVLO (undervoltage lockout) circuit disables the DMOS outputs and resets the translator to the Home state. Sleep Mode (SLEEP). To minimize power consumption when the motor is not in use, this input disables much of the internal circuitry including the output DMOS FETs, current regulator, and charge pump. A logic low on the SLEEP pin puts the A3983 into Sleep mode. A logic high allows normal operation, as well as start-up (at which time the A3983 drives the motor to the Home microstep position). When emerging from Sleep mode, in order to allow the charge pump to stabilize, provide a delay of 1 ms before issuing a Step command. Mixed Decay Operation. The bridge can operate in Mixed Decay mode, depending on the step sequence, as shown in figures 3 thru 5. As the trip point is reached, the A3983 initially goes into a fast decay mode for 31.25% of the off-time. tOFF. After that, it switches to Slow Decay mode for the remainder of tOFF. Synchronous Rectification. When a PWM-off cycle is triggered by an internal fixed–off-time cycle, load current recirculates according to the decay mode selected by the control logic. This synchronous rectification feature turns on the appropriate FETs during current decay, and effectively shorts out the body diodes with the low DMOS RDS(ON). This reduces power dissipation significantly, and can eliminate the need for external Schottky diodes in many applications. Turning off synchronous rectification prevents the reversal of the load current when a zero-current level is detected. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 6 A3983 DMOS Microstepping Driver with Translator Application Layout be created using the exposed thermal pad under the device, to serve both as a low impedance ground point and thermal path. Layout. The printed circuit board should use a heavy groundplane. For optimum electrical and thermal performance, the A3983 must be soldered directly onto the board. On the underside of the A3983 package is an exposed pad, which provides a path for enhanced thermal dissipation. The thermal pad should be soldered directly to an exposed surface on the PCB. Thermal vias are used to transfer heat to other layers of the PCB. The two input capacitors should be placed in parallel, and as close to the device supply pins as possible. The ceramic capacitor (CIN1) should be closer to the pins than the bulk capacitor (CIN2). This is necessary because the ceramic capacitor will be responsible for delivering the high frequency current components. The sense resistors, RSx , should have a very low impedance path to ground, because they must carry a large current while supporting very accurate voltage measurements by the current sense comparators. Long ground traces will cause additional voltage drops, adversely affecting the ability of the comparators to accurately measure the current in the windings. The SENSEx pins have very short traces to the RSx resistors and very thick, low impedance traces directly to the star ground underneath the device. If possible, there should be no other components on the sense circuits. In order to minimize the effects of ground bounce and offset issues, it is important to have a low impedance single-point ground, known as a star ground, located very close to the device. By making the connection between the pad and the ground plane directly under the A3983, that area becomes an ideal location for a star ground point. A low impedance ground will prevent ground bounce during high current operation and ensure that the supply voltage remains stable at the input terminal. The star ground can Solder A3983 Trace (2 oz.) Signal (1 oz.) Ground (1 oz.) PCB Thermal (2 oz.) Thermal Vias OUT2B C3 U1 GND C6 GND C4 GND C3 OUT2A C5 R4 ROSC R5 C4 C5 OUT1A C1 RESET OUT1B BULK GND GND CAPACITANCE VDD ROSC SLEEP VDD STEP C1 C2 VCP VREG GND REF VDD GND ENABLE OUT2B CP2 MS1 MS2 GND ROSC GND A3983 CP1 VBB2 PAD C6 SENSE2 OUT2A R4 OUT1A SENSE1 VBB1 R5 OUT1B DIR C2 GND VBB VBB Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 7 A3983 DMOS Microstepping Driver with Translator STEP STEP 100.00 100.00 70.71 70.71 Slow Phase 1 IOUT1A Direction = H (%) –100.00 100.00 Phase 2 IOUT2A Direction = H (%) –100.00 100.00 70.71 Phase 2 IOUT2B Direction = H (%) 0.00 Slow Slow Slow Mixed Mixed Slow Slow Mixed 0.00 –70.71 –70.71 –100.00 –100.00 Figure 2. Decay Mode for Full-Step Increments Mixed 0.00 –70.71 70.71 Slow Mixed Home Microstep Position –70.71 Home Microstep Position 0.00 Slow Mixed Home Microstep Position Slow Home Microstep Position Phase 1 IOUT1A Direction = H (%) Figure 3. Decay Modes for Half-Step Increments STEP 100.00 92.39 70.71 38.27 Slow Mixed Slow Mixed Slow 0.00 Home Microstep Position Phase 1 IOUT1A Direction = H (%) –38.27 –70.71 –92.39 –100.00 100.00 92.39 70.71 Phase 2 IOUT2B Direction = H (%) 38.27 Slow Mixed Slow Mixed Slow Mixed 0.00 –38.27 –70.71 –92.39 –100.00 Figure 4. Decay Modes for Quarter-Step Increments Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 8 A3983 DMOS Microstepping Driver with Translator STEP 100.00 92.39 83.15 70.71 55.56 38.27 19.51 0.00 Slow Mixed Mixed Slow –19.51 –38.27 –55.56 –70.71 –83.15 –92.39 –100.00 100.00 92.39 83.15 70.71 55.56 Phase 2 IOUT2B Direction = H (%) Slow Mixed Mixed Slow Home Microstep Position Phase 1 IOUT1A Direction = H (%) 38.27 19.51 0.00 –19.51 –38.27 –55.56 –70.71 –83.15 –92.39 –100.00 Figure 5. Decay Modes for Eighth-Step Increments Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 9 A3983 DMOS Microstepping Driver with Translator Table 2. Step Sequencing Settings Home microstep position at Step Angle 45º; DIR = H Full Step # 1 Half Step # 1 2 4 3 6 4 8 (%) 100.00 (%) 0.00 2 98.08 19.51 11.3 92.39 38.27 22.5 4 83.15 55.56 33.8 3 5 Step Angle (º) 0.0 5 70.71 70.71 45.0 6 55.56 83.15 56.3 7 38.27 92.39 67.5 8 19.51 98.08 78.8 9 0.00 100.00 90.0 101.3 10 –19.51 98.08 11 –38.27 92.39 112.5 12 –55.56 83.15 123.8 13 –70.71 70.71 135.0 14 –83.15 55.56 146.3 15 –92.39 38.27 157.5 16 –98.08 19.51 168.8 9 17 –100.00 0.00 180.0 18 –98.08 –19.51 191.3 10 19 –92.39 –38.27 202.5 20 –83.15 –55.56 213.8 21 –70.71 –70.71 225.0 22 –55.56 –83.15 236.3 23 –38.27 –92.39 247.5 24 –19.51 –98.08 258.8 13 25 0.00 –100.00 270.0 26 19.51 –98.08 281.3 14 27 38.27 –92.39 292.5 28 55.56 –83.15 303.8 29 70.71 –70.71 315.0 30 83.15 –55.56 326.3 31 92.39 –38.27 337.5 32 98.08 –19.51 348.8 7 11 12 7 [% ItripMax] 3 8 5 [% ItripMax] 2 6 2 Phase 2 Current 1/8 Step # 1 4 3 Phase 1 Current 1/4 Step # 1 15 16 10 Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com A3983 DMOS Microstepping Driver with Translator Package LP CP1 1 24 GND CP2 2 23 ENABLE VCP 3 22 OUT2B VREG 4 21 VBB2 MS1 5 MS2 6 RESET 7 18 OUT1A ROSC 8 17 SENSE1 SLEEP 9 16 VBB1 20 SENSE2 PAD VDD 10 19 OUT2A 15 OUT1B STEP 11 14 DIR REF 12 13 GND Terminal List Table Number Name Description Package LP CP1 1 Charge pump capacitor terminal CP2 2 Charge pump capacitor terminal VCP 3 Reservoir capacitor terminal VREG 4 Regulator decoupling terminal MS1 5 Logic input MS2 6 Logic input RESET 7 Logic input ROSC 8 Timing set SLEEP 9 Logic input VDD 10 Logic supply STEP 11 Logic input REF 12 Gm reference voltage input GND 13, 24 Ground* DIR 14 Logic input OUT1B 15 DMOS Full Bridge 1 Output B VBB1 16 Load supply SENSE1 17 Sense resistor terminal for Bridge 1 OUT1A 18 DMOS Full Bridge 1 Output A OUT2A 19 DMOS Full Bridge 2 Output A SENSE2 20 Sense resistor terminal for Bridge 2 VBB2 21 Load supply OUT2B 22 DMOS Full Bridge 2 Output B ENABLE 23 Logic input NC – No connection PAD – Exposed pad for enhanced thermal dissipation* *The GND pins must be tied together externally by connecting to the PAD ground plane under the device. 11 Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com A3983 DMOS Microstepping Driver with Translator LP Package, 24-Pin TSSOP with Exposed Thermal Pad 7.80 ±0.10 24 0.65 0.45 4° ±4 +0.05 0.15 –0.06 B 3.00 4.40 ±0.10 6.40 ±0.20 A 1 6.10 (1.00) 2 4.32 0.25 24X SEATING PLANE 0.10 C +0.05 0.25 –0.06 3.00 0.60 ±0.15 0.65 1.20 MAX 0.15 MAX C 1.65 SEATING PLANE GAUGE PLANE 4.32 C PCB Layout Reference View For reference only (reference JEDEC MO-153 ADT) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Exposed thermal pad (bottom surface) C Reference land pattern layout (reference IPC7351 TSOP65P640X120-25M); all pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances; when mounting on a multilayer PCB, thermal vias at the exposed thermal pad land can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5) Copyright ©2005-2009, Allegro MicroSystems, Inc. The products described here are manufactured under one or more U.S. patents or U.S. patents pending. Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the failure of that life support device or system, or to affect the safety or effectiveness of that device or system. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. For the latest version of this document, visit our website: www.allegromicro.com 12 Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com