Data Sheet
26184.26A
A3980
Automotive DMOS Microstepping Driver with Translator
Package LP
SENSE1
1
VBB1 28 VBB1
26 ENABLE
OUT1A
4
25 OUT1B
PFD
5
24 CP2
RC1
6
AGND
7
REF
8
RC2
9
÷8
Charge
Pump
27 SLEEP
3
Translator
& Control Logic
2
PWM
Timer
SR
DIR
22 VCP
21 PGND
Reg
20 VREG
19 STEP
VDD 10 VDD
18 OUT2B
OUT2A 11
17 FF2
MS2 12
16 FF1
MS1 13
SENSE2 14
23 CP1
VBB2 15 VBB2
The A3980 is a complete microstepping motor driver with built-in
translator for easy operation. It is designed to operate bipolar stepper
motors in full-, half-, eighth-, and sixteenth-step modes, at up to 35 V
and ±1 A. The A3980 includes a fixed off-time current regulator which
has the ability to operate in slow, fast, or mixed decay modes. This
results in reduced audible motor noise, increased step accuracy, and
reduced power dissipation.
The translator is the key to the easy implementation of the A3980.
Simply inputting one pulse on the step input drives the motor one
microstep. There are no phase sequence tables, high frequency control
lines, or complex interfaces to program. The A3980 interface is an ideal
fit for applications where a complex µP is unavailable or overburdened.
Internal synchronous rectification control circuitry is provided to
improve power dissipation during PWM operation.
Internal circuit protection includes: thermal shutdown with hysteresis,
overvoltage lockout (OVLO), undervoltage lockout (UVLO), and
crossover current protection. Special power-up sequencing is not
required. In addition, two diagnostic fault flags provide indication of
shorts or opens on the motor windings.
The A3980 is supplied in a low-profile (1.1 mm) 28L TSSOP with
exposed thermal pad (part number suffix LP).
Approximate Scale 1:1
ABSOLUTE MAXIMUM RATINGS
Load Supply Voltage, 500 ms,VBB .....................50 V
Logic Supply Voltage, VDD................................7.0 V
Logic Input Voltage
VIN ................................. –0.3 V to VDD + 0.3 V
(tW < 30 ns) ....................... –1.0 V to VDD + 1 V
Sense Voltage, VSENSE .......................................0.5 V
Reference Voltage, VREF ………............. 0 V to VDD
Package Power Dissipation (TA = +25ºC), PD
"High-K" PCB1 ..............................RθJA28ºC/W
Typical PCB2..................................RθJA38ºC/W
Operating Temperature Range
Junction Temperature, TJ ...........–40°C to +150°C
Storage Temperature, TS ..........–55°C to +150°C
1Measured on a JEDEC-standard "High-K" 4-layer PCB.
2Measured on a typical two-sided PCB with 3 in.2 copper
ground area.
FEATURES
Typical application up to ±1 A, 35 V output rating
Low RDS(ON) outputs, 0.67 Ω source, 0.54 Ω sink typical
Automatic current decay mode detection/selection
3.0 V to 5.5 V logic supply voltage range
Mixed, fast, and slow current decay modes
Synchronous rectification for low power dissipation
Internal OVLO, UVLO, and thermal shutdown circuitry
Crossover current protection
Short to supply/ground and short/open load diagnostics
APPLICATIONS
Automotive stepper motors
Engine management
Headlamp positioning
Use the following complete part number when ordering:
Part Number
Package
Description
A3980KLP
28-pin, TSSOP
Exposed thermal pad
Data Sheet
26184.26A
A3980
Automotive DMOS Microstepping Driver with Translator
Functional Block Diagram
CCP
VREG
CP2
CP1
5V
VDD
VCP
VREF
SENSE 1
Charge
Pump
CCS
DAC
Voltage
Regulator
VBATT
STEP
DMOS Full Bridge
DIR
MS1
VBB1
Translator
MS2
OUT1A
OUT1B
RC1
RT1
PWM Latch
Blanking
Mixed Decay
CT1
SENSE1
Gate
Drive
SR
SLEEP
RS1
DMOS Full Bridge
Control
Logic
ENABLE
CS1
VBB2
OUT2A
OUT2B
PFD
PWM Latch
Blanking
Mixed Decay
RC2
SENSE2
RS2
RT2
CS2
CT2
DAC
OVLO
UVLO
OVERTEMP
SHORT SENSE
OPEN SENSE
SENSE 2
VREF
AGND
REF
FF1
VDD
VCP
VBB
OUT1A/1B
OUT2A/2B
SENSE1
SENSE2
FF2
PGND
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2
Data Sheet
26184.26A
A3980
Automotive DMOS Microstepping Driver with Translator
ELECTRICAL CHARACTERISTICS at TJ = –40°C to +150ºC, VBB = 14 V, VDD = 3.0 to 5.5 V (unless otherwise noted)
Characteristics
Symbol
Test Conditions
Min.
Typ.1
Max.
Units
Output Drivers
Load Supply Voltage Range
VBB
Driving
Operating
Sleep mode
8
7
0
–
VOVB
50
35
V
Output Leakage Current2
IDSS
VOUT = VBB
VOUT = 0 V
–
< 1.0
< 1.0
20
–20
µA
Source driver, IOUT = –1 A, TA < 25ºC
Sink driver, IOUT = 1 A, TA < 25ºC
–
0.51
0.45
0.86
0.65
Ω
Source driver, IOUT = –1 A, TA < 125ºC
Sink driver, IOUT = 1 A, TA < 125ºC
–
0.87
0.72
1.06
0.83
Ω
Output-On Resistance
RDSON
Body Diode Forward Voltage
VF
Source diode, IF = –1 A
Sink diode, IF = 1 A
–
–
1.4
1.4
V
Motor Supply Current
IBB
fPWM < 50 kHz
Operating, outputs disabled
Sleep mode
–
–
8
6
20
mA
mA
µA
Logic Supply Current
IDD
fPWM < 50 kHz
Outputs off
Sleep mode
–
–
12
10
20
mA
mA
µA
Logic Supply Voltage Range
VDD
Operating
3.0
5.0
5.5
V
Input Low Voltage
VIL
–
V
VIH
–
–
0.3 VDD
Input High Voltage
–
–
–
–
–
V
200
300
500
mV
–20
< ±1
20
µA
–
–
–
–
–
–
–
–
0.4
V
–
–
–
–
–
V
Logic Interface
Input Hysteresis
Input Current2
VIHYS
IIN
0.7 VDD
Output Low Voltage
VOL
IO = 3 mA
Output High Voltage
VOH
IO = –200 µA
STEP Pin Low
tSTPL
STEP Pin High
tSTPH
–
–
2.8
1
1
Setup Time for Input Change to STEP
tSU
MS1, MS2, DIR
200
Hold Time for Input Change from STEP
tH
MS1, MS2, DIR
200
Wake-Up Time from SLEEP
tEN
–
–
1
µs
µs
ns
ns
ms
Continued on next page
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115 Northeast Cutoff, Box 15036
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3
Data Sheet
26184.26A
A3980
Automotive DMOS Microstepping Driver with Translator
ELECTRICAL CHARACTERISTICS (continued) at TJ = –40°C to +150ºC, VBB = 14 V, VDD = 3.0 to 5.5 V (unless otherwise noted)
Characteristics
Symbol
Test Conditions
Min.
Typ.1
Max.
Units
Current Control
Blank Time
tBLANK
RT = 56 K , CT = 680 pF
700
950
1200
ns
Fixed Off Time
TOFF
RT = 56 K , CT = 680 pF
30
38
46
µs
Mixed Decay Trip Points
PFDH
PFDL
–
–
0.60 VDD
0.21 VDD
–
V
tDT
–
–
–
100
475
800
ns
0.8
–
4
V
–3
0
3
µA
–
–
±15
±10
±5
%
160
170
180
ºC
–
15
–
ºC
1.5
V
35
–
–
–
–
Crossover Dead Time
Recommended Reference Input Voltage
Reference Input
Current2
Current Trip-Level Error3
VREF
IREF
errI
VREF = 4 V, %ITripMAX = 38%
VREF = 4 V, %ITripMAX = 70%
VREF = 4 V, %ITripMAX = 100%
Thermal Protection
Thermal Shutdown
TSD
Thermal Shutdown Hysteresis
TSDH
–
–
Max VDS on High-Side Bridge FETs
VDSHT
Sampled after tBLANK + tSCT
Max VDS on Low-Side Bridge FETs
VDSLT
Sampled after tBLANK + tSCT
Diagnostics
VDS Fault Measurement Delay
tSCT
–
Minimum Load Current
IOC
w.r.t. ITRIPMAX at Home position
–
–
–
–
1.5
700
V
ns
%
VBB Overvoltage Lockout
VOVB
VBB rising
32
34
36
V
VBB Overvoltage Lockout Hysteresis
VOVBH
–
2
–
4
V
VREG Undervoltage Lockout
VUVR
VREG falling
5.3
5.7
6.0
V
VDD Enable Threshold
VUVD
VDD rising
2.45
2.7
2.95
V
VDD Enable Threshold Hysteresis
VUVDH
–
50
100
–
mV
1Typical data are for initial design estimations only, and assume optimum manufacturing and application conditions. Performance may vary
for individual units, within the specified maximum and minimum limits.
2Negative current is defined as coming out of (sourcing from) the specified device pin.
3err = (I
ITripMAX.
I
Trip – IProg ) ⁄ IProg , where IProg = %ITripMAX
×
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Data Sheet
26184.26A
A3980
Automotive DMOS Microstepping Driver with Translator
Logic Interface Timing Diagram
tSTPH
tSTPL
STEP
tSU
tH
MS1, MS2,
or DIR
tEN
SLEEP
Table 1. Microstep Resolution Truth Table
MS1
MS2
Microstep Resolution
L
L
Full Step
H
L
Half Step
L
H
Eighth Step
H
H
Sixteenth Step
Table 2. Fault Report by Fault Flags
FF1
FF2
Fault
L
L
UVLO, OVLO, Overtemperature,
Open Load, or Shorted Load
H
L
Short to Ground
L
H
Short to Supply
H
H
None
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Data Sheet
26184.26A
A3980
Automotive DMOS Microstepping Driver with Translator
Table 3. Step Sequencing Settings
Home microstep position at Step Angle 45º; DIR = H
Full
Step
#
Half
Step
#
1
2
99.52
9.80
5.6
98.08
19.51
11.3
4
95.69
29.03
16.9
5
92.39
38.27
22.5
6
88.19
47.14
28.1
7
83.15
55.56
33.8
8
77.30
63.44
39.4
9
70.71
70.71
45.0
5
(%)
0.00
63.44
77.30
50.6
11
55.56
83.15
56.3
12
47.14
88.19
61.9
13
38.27
92.39
67.5
14
29.03
95.69
73.1
15
19.51
98.08
78.8
16
9.80
99.52
84.4
9
17
0.00
100.00
90.0
18
–9.80
99.52
95.6
10
19
–19.51
98.08
101.3
20
–29.03
95.69
106.9
21
–38.27
92.39
112.5
22
–47.14
88.19
118.1
23
–55.56
83.15
123.8
24
–63.44
77.30
129.4
13
25
–70.71
70.71
135.0
26
–77.30
63.44
140.6
14
27
–83.15
55.56
146.3
28
–88.19
47.14
151.9
29
–92.39
38.27
157.5
30
–95.69
29.03
163.1
31
–98.08
19.51
168.8
32
–99.52
9.80
174.4
8
11
12
4
(%)
100.00
Step
Angle
(º)
0.0
10
7
2
[% ItripMax]
3
6
3
[% ItripMax]
2
4
2
Phase 2
Current
1/16
Step
#
1
3
1
Phase 1
Current
1/8
Step
#
1
15
16
Full
Step
#
Half
Step
#
5
34
–99.52
–9.80
185.6
18
35
–98.08
–19.51
191.3
36
–95.69
–29.03
196.9
37
–92.39
–38.27
202.5
38
–88.19
–47.14
208.1
39
–83.15
–55.56
213.8
40
–77.30
–63.44
219.4
21
41
–70.71
–70.71
225.0
42
–63.44
–77.30
230.6
22
43
–55.56
–83.15
236.3
44
–47.14
–88.19
241.9
45
–38.27
–92.39
247.5
46
–29.03
–95.69
253.1
47
–19.51
–98.08
258.8
48
–9.80
–99.52
264.4
25
49
0.00
–100.00
270.0
50
9.80
–99.52
275.6
26
51
19.51
–98.08
281.3
52
29.03
–95.69
286.9
53
38.27
–92.39
292.5
54
47.14
–88.19
298.1
55
55.56
–83.15
303.8
56
63.44
–77.30
309.4
29
57
70.71
–70.71
315.0
58
77.30
–63.44
320.6
30
59
83.15
–55.56
326.3
60
88.19
–47.14
331.9
61
92.39
–38.27
337.5
62
95.69
–29.03
343.1
63
98.08
–19.51
348.8
64
99.52
–9.80
354.4
20
6
23
24
7
27
28
4
8
Phase 2
Current
1/16
Step
#
33
19
3
Phase 1
Current
1/8
Step
#
17
31
32
[% ItripMax]
(%)
–100.00
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Worcester, Massachusetts 01615-0036 (508) 853-5000
[% ItripMax]
(%)
0.00
Step
Angle
(º)
180.0
6
Data Sheet
26184.26A
100.00
100.00
70.71
70.71
–70.71
–100.00
100.00
Phase 1
IOUT1B
Direction = H
(%)
Home Microstep Position
Phase 1
IOUT1B
Direction = H
(%)
–70.71
–100.00
100.00
Home Microstep Position
A3980
Automotive DMOS Microstepping Driver with Translator
70.71
70.71
Phase 2
IOUT2B
Direction = H
(%)
Phase 2
IOUT2B
Direction = H
(%)
–70.71
–70.71
–100.00
–100.00
Figure 6. Half Step
Figure 5. Full Step
STEP
100.00
92.39
83.15
70.71
55.56
38.27
19.51
0.00
Slow
Mixed
Mixed
Slow
–19.51
–38.27
–55.56
–70.71
–83.15
–92.39
–100.00
100.00
92.39
83.15
70.71
55.56
Phase 2
IOUT2B
Direction = H
(%)
Slow
Mixed
Mixed
Slow
Home Microstep Position
Phase 1
IOUT1B
Direction = H
(%)
38.27
19.51
0.00
–19.51
–38.27
–55.56
–70.71
–83.15
–92.39
–100.00
Figure 7. Eighth Step
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Data Sheet
26184.26A
A3980
Automotive DMOS Microstepping Driver with Translator
STEP
100.00
95.69
88.19
83.15
77.30
70.71
63.44
55.56
47.14
38.27
29.03
19.51
Phase 1
IOUT1B
Direction = H
(%)
9.8
Slow
0.00
Mixed
Slow
Mixed
–9.8
–19.51
–29.03
–38.27
Home Microstep Position
–47.14
–55.56
–63.44
–70.71
–77.30
–83.15
–88.19
–95.69
–100.00
100.00
95.69
88.19
83.15
77.30
70.71
63.44
55.56
47.14
38.27
29.03
19.51
Phase 2
IOUT2B
Direction = H
(%)
9.8
Slow
0.00
Mixed
Slow
Mixed
Slow
–9.8
–19.51
–29.03
–38.27
–47.14
–55.56
–63.44
–70.71
–77.30
–83.15
–88.19
–95.69
–100.00
Figure 8. Sixteenth Steps
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Data Sheet
26184.26A
A3980
Automotive DMOS Microstepping Driver with Translator
Functional Description
Device Operation. The A3980 is a complete microstepping motor driver with a built-in translator for easy operation
with minimal control lines. It is designed to operate bipolar
stepper motors in full-, half-, eighth-, and sixteenth-step
modes. The currents in each of the two output full-bridges
and all of the N-channel DMOS FETs are regulated with
fixed off-time PMW (pulse width modulated) control circuitry. At each step, the current for each full-bridge is set by
the value of its external current-sense resistor (RS1 or RS2), a
reference voltage (VREF), and the output voltage of its DAC
(which in turn is controlled by the output of the translator).
At power-up, the translator resets to the Home state, in which
the motor is driven to the Home microstep position, where
both phase currents are set to +70%. Then the translator sets
the voltage regulator to mixed decay mode for both phases.
When a step command signal occurs on the STEP input, the
translator automatically sequences the DACs to the next
level and current polarity. (See table 3 for the current-level
sequence.) The microstep resolution is set by the combined
effect of inputs MS1 and MS2, as shown in table 1.
When stepping, if the new output levels of the DACs are
lower than their previous output levels, then the decay mode
(fast, slow, or mixed decay) for the active full-bridge is set
by the PFD input. If the new output levels of the DACs are
higher than or equal to their previous levels, then the decay
mode for the active full-bridge is set to slow decay. This
automatic current decay selection improves microstepping
performance by reducing the distortion of the current waveform that results from the back EMF of the motor.
Home Microstep Position. At power-up, or after
a UVLO (undervoltage lockout) condition caused by low
voltage on VDD, the translator in the A3980 resets the motor
to the Home microstep position. This corresponds to the 45°
position, which is the step where both phase currents are
+70%. Referring to table 3, for full-step mode this is step
1, for half-step this is step 2, for eighth-step this is step 5,
and for sixteenth-step this is step 9. In table 3 and figures 5
through 8, the Home microstep position is indicated.
Step Input (STEP). A low-to-high transition on the STEP
increment. The translator controls the input to the DACs and
the direction of current flow in each winding. The size of
the increment is determined by the combined state of inputs
MS1 and MS2.
Microstep Select (MS1 and MS2). Selects the microstepping format, as shown in table 1. Any changes made to
these inputs do not take effect until the next STEP rising edge.
Direction Input (DIR). This determines the direction of
rotation of the motor. When low, the direction will be clockwise and when high, counterclockwise. Changes to this input
do not take effect until the next STEP rising edge.
Internal PWM Current Control. Each full-bridge is
controlled by a fixed off-time PWM current control circuit
that limits the load current to a desired value, ITRIP. Initially,
a diagonal pair of source and sink DMOS FETs are enabled
and current flows through the motor winding and the current
sense resistor, RS. When the voltage across RS equals the
DAC output voltage, the current sense comparator resets the
PWM latch. The latch then turns off either the source DMOS
(when in slow decay mode) or the sink and source DMOSs
(when in fast or mixed decay modes).
The transconductance function is approximated by the maximum value of current limiting, ITripMAX (A), which is set by
ITripMAX = VREF ⁄ (8
× RS )
where RS is the resistance of the sense resistor (Ω) and VREF
is the input voltage on the REF pin (V).
The DAC output reduces the VREF output to the current
sense comparator in precise steps, such that
Itrip = (%ITripMAX ⁄ 100)
× ITripMAX
(See table 3 for %ITripMAX at each step.)
It is critical that the maximum rating (0.5 V) on the SENSE
pin is not exceeded. For full-step mode, VREF can be applied
up to the maximum rating of VDD, because the peak sense
value is 70% of maximum:
input sequences the translator and advances the motor one
VREF
× (0.707 ⁄ 8)
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9
as shown in table 3. In all other modes, VREF should not be
allowed to exceed 4 V, because the peak sense value can
reach VREF ⁄ 8, or 100%.
Fixed Off-Time. The internal PWM current control
circuitry uses a one-shot circuit to control the duration of
time that the DMOS FETs remain off. The one shot off-time,
tOFF, is determined for each of the two phases by the combination of an external resistor (RT) and a capacitor (CT). One
combination is connected from the timing terminal RC1 to
ground, and the other similarly connected to RC2 . tOFF (ns)
is approximated by
tOFF = RT
VREG (VREG). This internally-generated voltage is used
to operate the sink-side DMOS FETs. The VREG terminal
must be decoupled with a 220 nF (10V) capacitor to ground.
VREG is internally monitored. In the case of a fault condition, the DMOS outputs of the A3980 are disabled.
Enable Input (ENABLE). This input simply turns off all
× CT
over a range of values from CT= 470 pF to 1500 pF and from
RT = 12 kΩ to 100 kΩ.
RC Blanking. In addition to the fixed off-time of the
PWM control circuit, the CT component sets the comparator
blanking time. This function blanks the output of the current
sense comparators when the outputs are switched by the
internal current control circuitry. The comparator outputs are
blanked to prevent false overcurrent detection due to reverse
recovery currents of the clamp diodes, and switching transients related to the capacitance of the load. The blank time,
tBLANK (ns), can be approximated by
tBLANK = 1400
capacitor (CCP), capable of withstanding the battery voltage VBATT, should be connected between CP1 and CP2.
In addition, a 100 nF ceramic capacitor (CCS)is required
between VCP and VBB, to act as a reservoir for operating
the high-side DMOS devices. The voltage on CCS is limited to
the charge pump voltage, which is always less than 10 V.
× CT
of the DMOS outputs. When set to a logic high, the outputs
are disabled. When set to a logic low, the internal control
enables the outputs as required. The translator inputs (STEP,
DIR, MS1, and MS2), as well as the internal sequencing
logic, all remain active, independent of the ENABLE input
state.
Sleep Mode (SLEEP). To minimize power consumption
when the motor is not in use, this input disables much of the
internal circuitry including the output DMOS FETs, voltage
regulator, and charge pump. A logic low on the SLEEP terminal puts the A3980 into Sleep mode. A logic high allows
normal operation, as well as start-up (at which time the
A3980 drives the motor to the Home microstep position).
Percent Fast Decay Input (PFD). When a STEP input
where CT is the value of the capacitor CT (nF).
The blank time should be as short as possible, without causing a false fault detection, to ensure that power dissipation
during a fault condition is minimized. The blank time also
defines the minimum duration of time that the full-bridge
DMOS outputs cause the load current to rise. To ensure
correct detection of motor faults, the minimum on-time is
extended by an additional fault sampling time, tSCT. The
minimum on-time, tMINON is then
tMINON = tBLANK + tSCT
signal commands an output current level that is lower than
that of the previous step, it switches the output current decay
to slow, fast, or mixed decay mode, depending on the voltage
level at the PFD input, as shown in the following table.
Lower PFD Input
Voltage Level
× VDD )
(0.21 × VDD ) ≤ VPFD ≤ (0.6 × VDD )
VPFD < (0.21 × VDD)
VPFD > (0.6
Decay Mode
Slow
Mixed
Fast
Charge Pump (CP1 and CP2). The charge pump is
Mixed Decay Operation. Depending on the step
used to generate a gate supply greater than that of VBB for
driving the source-side DMOS gates. A 100 nF ceramic
sequence, if the voltage on the PFD pin is between
0.6 VDD and 0.21 VDD, the full-bridge can operate in
×
×
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10
Data Sheet
26184.26A
A3980
Automotive DMOS Microstepping Driver with Translator
mixed decay mode, as shown in figures 5 through 8. As the
trip point is reached, the A3980 goes into fast decay mode
until the voltage on the RC pin decays to the same level as the
voltage applied to the PFD pin. The duration of time that the
bridge operates in fast decay mode, tFD (ns), is estimated by
tFD = RT
× CT × ln[0.6 (VDD ⁄ VPFD)]
over a range of values from CT= 470 pF to 1500 pF and from
RT = 12 kΩ to 100 kΩ.
After this fast decay period, the A3980 switches to slow
decay mode for the remainder of the fixed off-time period.
Synchronous Rectification. When a PWM-off cycle
is triggered by an internal fixed-off-time cycle, load current
recirculates according to the decay mode selected by the
control logic. The synchronous rectification feature turns on
the appropriate FETs during current decay, and effectively
shorts out the body diodes with the low DMOS RDSON. This
reduces power dissipation significantly, and eliminates the
need for external Schottky diodes. Synchronous rectification
has two modes: Active mode and Disabled mode (described
below).
Active Mode. When the input on the SR terminal is set
at logic low, Active mode is enabled. This mode allows
synchronous rectification to occur, but when a zero current
level is detected, it also prevents reversal of the load current
by turning off synchronous rectification. This prevents the
motor winding from conducting in the reverse direction.
Disabled Mode. When the input on the SR terminal is set
at logic high, Disabled mode takes effect. This mode disables
synchronous rectification. This mode is typically used when
external diodes are required to transfer power dissipation
from the A3980 package to the external diodes.
Shutdown. In the event of an overtemperature fault or
an undervoltage fault on VREG, the DMOS outputs of the
A3980 are disabled until the fault condition is removed. In
the case of an overvoltage fault, the sink DMOS FETs are
switched on, and the source FETs off. At power-up, and in
the event of low VDD, the UVLO circuit disables the DMOS
outputs until VDD reaches the minimum level. Once VDD is
above the minimum level, the translator resets to the Home
state and the DMOS outputs are re-enabled.
Thermal Protection. All drivers are turned off when the
junction temperature reaches the thermal shutdown value,
typically 170°C. This is intended only to protect the A3980
from failures due to excessive junction temperatures. Thermal protection will not protect the A3980 from continuous
short circuits, and additional fault diagnostics are integrated for
this purpose. Thermal shutdown has a hysteresis of approximately 15°C.
Diagnostic Features. The A3980 includes monitor
circuits that can detect shorts to VBB, shorts to ground, and
shorted or open circuit load. Short circuits are detected by
monitoring the voltage across the driving DMOS FETs and
the open load is detected by monitoring the phase current
when the motor is in the Home microstep position. All fault
detection takes place following a delay after the blank time.
Short to VBB. A short from any of the motor connections
to the battery or VBB connection is detected by monitoring
the voltage across the bottom FETs in each full-bridge. When
the FET is on, the voltage should be no greater than the
VDSLT value defined in the Electrical Characteristics table.
Short to Ground. A short from any of the motor connections to ground is detected by monitoring the voltage across
the top FETs in each full-bridge. When the FET is turned
on, the voltage should be no greater than the VDSHT value
defined in the Electrical Characteristics table.
Shorted Load. A short across the load is detected by
monitoring the voltage across both the top and bottom FETs
in each full-bridge.
Short Fault Operation. Because motor capacitance may
cause the measured voltages to show a fault as the full-bridge
switches, voltages are not sampled until after the blank
time plus an internally-generated delay, tSCT. Once a short
circuit has been detected, all outputs for the faulty phase are
disabled until the next step command. At the next step command, the outputs are re-enabled and the voltage across the
FET is resampled.
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Data Sheet
26184.26A
A3980
Automotive DMOS Microstepping Driver with Translator
While the fault persists, the A3980 continues this cycle at
each step command: enabling the outputs for a short period,
and then disabling the outputs. This allows the A3980 to
handle a continuous short circuit without damage. If, while
stepping rapidly, a short circuit appears and no action is
taken, the repeated short-circuit current pulses eventually
cause the temperature of the A3980 to rise and an overtemperature fault occurs.
Open Load Fault Operation. An open load is detected
by monitoring the phase current while the motor is in the
Home microstep position, after a time duration of the blank
time plus an internally-generated delay, tSCT. At the Home
microstep position, each phase current should be 70% of
ITripMAX. If the measured current is less than half of this
expected current level (less than 35% of ITripMAX), then an
open load condition is reported on the first step command.
Because the A3980 translator is reset to the Home state at
power-up, an existing open load is detected at the initial step
command. If an open load condition appears while stepping, then it is detected after the translator cycles through
the Home state. Although the A3980 continues to drive the
DMOS outputs during an open load condition, it does not
clear the fault flags until the next Home state occurs.
Supply Monitors. External and internal supplies are
monitored to ensure that they are within the correct operating range. If the main supply exceeds the overvoltage limit,
VOVB, the fault flags are set and the A3980 enters a safety
mode in which all low-side DMOS FETs are enabled and all
high-side DMOS FETs are disabled. This allows the A3980
to survive a load dump transient condition that has up to
50 V on VBATT and a duration of up to 500 ms. If the internal regulator VREG or the logic supply VDD go below their respective undervoltage limits (VUVR or VUVD), then: the fault flags are
set, the DMOS outputs are disabled, and the internal logic is reset
to the power-on state (the translator is set to the Home state).
Diagnostic Fault Flags (FF1, FF2). Diagnostic fault
conditions are reported using the two fault flag outputs.
These are active-low outputs which are coded as shown in
table 2 to discriminate between the fault conditions. When
both fault flags are high, no fault exists.
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Data Sheet
26184.26A
A3980
Automotive DMOS Microstepping Driver with Translator
Application Information
The A3980 is a power circuit, therefore careful consideration must be given to power dissipation and the effects
of high currents on interconnect and supply wiring.
Power Dissipation. A first order approximation of
the power dissipation in the A3980 can be determined
by examining the power dissipation in each of the
two full-bridges during each of the operation modes.
When synchronous rectification is used, current flow
most of the time through the DMOS FETs that are
switched on. When synchronous rectification is not
used, the current flows through the body diode of
the DMOS FETs during the decay phase. The use of
fast or slow decay also affects the dissipation. All the
above combinations can be calculated from five basic
DMOS output states, shown in the following illustrations.
Synchronous Slow Decay
Both low-side DMOS output
transistors are on. Current circulates through both transistors and
the load.
Dissipation is I2R losses in the
DMOS transistors:
PSS = I2 (2
+
+
M
PD = I2 (RDSONH + RDSONL)
+
× RDSONL)
Synchronous Fast Decay
Diagonally opposite DMOS output
transistors are on. Current flows
from ground through load to positive supply.
Dissipation is I2R losses in the
DMOS transistors:
Diagonally opposite DMOS
output transistors are on. Current flows from positive supply
through load to ground. Used in
all combinations.
Dissipation is I2R losses in the
DMOS transistors:
M
M
Drive Current Ramp
Non-Synchronous Slow Decay
One low-side DMOS output transistor and one body diode conducting. Current circulates through the
diode, the transistor, and the load.
Dissipation is I2R losses in the
DMOS transistors plus IV loss in
the diode:
PNS = (I2
+
M
+
M
PSF = I2 (RDSONH + RDSONL)
× RDSONL) + (I × VF)
Non-Synchronous Fast Decay
Diagonally opposite body diodes
conducting. Current flows from
ground through load to positive
supply.
Dissipation is IV losses in the
diodes:
PNF = I (VFH + VFl)
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Data Sheet
26184.26A
A3980
Automotive DMOS Microstepping Driver with Translator
The total dissipation for each of the four decay modes is the
average power for the current ramp and the current decay
portions of the PWM cycle.
For slow decay, the current is rising for approximately 20%
of the cycle and decaying for approximately 80%. For fast
decay, the ratio is approximately 50% for each. Note that
these are approximate figures, and they vary slightly depending on the motor characteristics and the use of synchronous
rectification.
The power dissipation, PTOT, in each decay mode can be
calculated as shown in the following formulas.
Non-synchronous slow decay mode:
PTOT = (0.2
PTOT = [0.2
× I2(RDSONH+RDSONL)]+{0.8 × [I2RDSONL+(I × VF)]}
Synchronous fast decay mode:
PTOT = (0.5
PTOT = [0.2
×
×
PD ) + (0.8
×
I2 (RDSONH + RDSONL)] + [0.8
Non-synchronous fast decay mode:
PTOT = (0.5
PSS )
×
I2 (2
× RDSONL)]
5
× I2 (RDSONH + RDSONL)] + (0.5 × I2 × RDSONL)
An approximation of the total dissipation can be calculated
by summing the total power dissipated in both full-bridges
and adding the control circuit power due to VBB IBB and
VDD IDD. The total power at the required ambient temperature can then be compared to the allowable power dissipation,
shown in the Allowable Package Power Dissipation chart.
×
For critical applications, where the first order power estimate
is close to the allowable dissipation, the power calculation
should take several other parameters into account including:
motor parameters, dead time, and switching losses in the
controller.
4
Power Dissipation (W)
PTOT = [0.5
× PD ) + (0.5 × PNF )
×
Allowable Package Power Dissipation
3
1R
θJA
Layout. The printed circuit board should use a heavy
ground plane. For optimum electrical and thermal performance, the A3980 should be soldered directly onto the board.
The load supply terminal, VBB, should be decoupled with
an electrolytic capacitor (> 47 µF is recommended), placed
as close to the A3980 as possible. To avoid problems due to
capacitive coupling of the high dv/dt switching transients,
route the full-bridge output traces away from the sensitive
logic input traces. Always drive the logic inputs with a low
source impedance to increase noise immunity.
= 28ºC/W
2
2R
θJA
= 38ºC/W
1
0
× PD ) + (0.5 × PSF )
PTOT = I2 (RDSONH + RDSONL)
Synchronous slow decay mode:
PTOT = (0.2
× PD ) + (0.8 × PNS )
25
1R
50
75
100
125
Ambient Temperature (°C)
θJA at 28ºC/ W measured on a JEDEC-standard
“High-K” 4-layer PCB.
2R
θJA at 38ºC/ W measured on a typical 2-sided PCB
with 3 in.2 (1935 mm2) copper ground area.
150
Grounding. A star ground system located close to the
A3980 is recommended. On the 28-lead TSSOP package, the
analog ground (lead 7) and the power ground (lead 21) must
be connected together externally. The copper ground plane
located under the exposed thermal pad is typically used as
the star ground point.
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Data Sheet
26184.26A
A3980
Automotive DMOS Microstepping Driver with Translator
Current Sensing. To minimize inaccuracies caused by
ground-trace IR drops in sensing the output current level,
the current-sense resistors (RS1 and RS2) should have an
independent ground return to the star ground point. This path
should be as short as possible. For low-value sense resistors,
the IR drops in the printed circuit board sense resistor traces
can be significant and should be taken into account. The use
of sockets should be avoided as they can introduce variation
in RS due to their contact resistance.
The recommended value of the sense resistor, RS (Ω), is
given by
RS = 0.5 / ITripMAX
up to a maximum of 1 Ω for ITripMAX of 0.5 A. Below 0.5 A,
RS should be 1 Ω, and VREF reduced accordingly, as shown
in the following table.
IMAX (A)
Recommended
RS(Ω)
VREF (V)
0.1
1.00
0.8
0.2
1.00
1.6
0.3
1.00
2.4
0.4
1.00
3.2
0.5
1.00
4.0
0.6
0.83
4.0
0.7
0.71
4.0
0.8
0.63
4.0
0.9
0.56
4.0
1.0
0.50
4.0
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Data Sheet
26184.26A
A3980
Automotive DMOS Microstepping Driver with Translator
Terminal List Table
Name
SENSE1
Description
Number
Sense resistor for full-bridge 1
1
SR
Enable synchronous rectification
2
DIR
Logic input
3
Output A for for full-bridge 1
4
PFD
Mixed decay setting
5
RC1
Analog input for fixed off-time for full-bridge 1
6
Analog ground
7
REF
Current trip reference voltage input
8
RC2
Analog input for fixed off-time for full-bridge 2
9
VDD
Logic supply voltage
10
Output A for for full-bridge 2
11
MS2
Logic input
12
MS1
Logic input
13
Sense resistor for full-bridge 2
14
Load supply 2
15
FF1
Fault flag 1
16
FF2
Fault flag 2
17
Output B for for full-bridge 2
18
STEP
Logic input
19
VREG
Regulator decoupling
20
PGND
Power ground
21
VCP
Reservoir capacitor
22
CP1
Charge pump capacitor 1
23
CP2
Charge pump capacitor 2
24
Output B for for full-bridge 1
25
ENABLE
Logic input
26
SLEEP
Logic input
27
Load supply 1
28
OUT1A
AGND
OUT2A
SENSE2
VBB2
OUT2B
OUT1B
VBB1
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Data Sheet
26184.26A
A3980
Automotive DMOS Microstepping Driver with Translator
A3980 28-Pin TSSOP with Exposed Thermal Pad
9.8
9.6
.386
.378
8º
0º
28
0.20 .008
0.09 .004
4.5
4.3
6.6
6.2
.177
.169
A
3 .118
BSC
.260
.244
1 .039
REF
1
2
5 .200
BSC
0.75 .030
0.45 .018
0.25 .010
BSC
Seating Plane
Gauge Plane
0.30 .012
0.19 .007
1.20 .047
MAX
0.65 .026
BSC
0.15 .006
0.00 .000
Dimensions in millimeters
U.S. Customary dimensions (in.) in brackets, for reference only
A Exposed thermal pad (bottom surface)
NOTES:
1. Exact body and lead configuration at vendor’s option within limits shown.
2. Lead spacing tolerance is non-cumulative.
3. Supplied in standard sticks/tubes of 49 devices or add “TR” to part number
for tape and reel.
4. Dimensions meet JEDEC MO-153AET. However, the exposed thermal pad
has the dimensions shown.
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Data Sheet
26184.26A
A3980
Automotive DMOS Microstepping Driver with Translator
The products described here are manufactured under one or
more U.S. patents or U.S. patents pending.
Allegro MicroSystems, Inc. reserves the right to make, from time
to time, such departures from the detail specifications as may be
required to permit improvements in the performance, reliability,
or manufacturability of its products. Before placing an order, the
user is cautioned to verify that the information being relied upon is
current.
Allegro products are not authorized for use as critical components in life-support devices or systems without express written
approval.
The information included herein is believed to be accurate and
reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringement of patents or other
rights of third parties which may result from its use.
Copyright©2003, 2004 AllegroMicrosystems, Inc.
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18
Data Sheet
26184.26A
A3980
Automotive DMOS Microstepping Driver with Translator