ANPEC APL3521BI-TRG

APL3521
Power-Distribution Switches
Features
General Description
•
•
•
•
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90mΩ High Side MOSFET
The APL3521A/B is a power-distribution switch with some
2A Continuous Current
protection functions that can deliver current up to 2A. The
device incorporates a 90mΩ N-channel MOSFET power
Built-in Soft-Start Control
switch that is controlled by an enable logic.
The device integrates some protection features, including current-limit protection, short-circuit protection, over-
Wide Supply Voltage Range: 2.7V to 5.5V
Current-Limit and Short-Circuit Protections
Under-Voltage Lockout Protection
temperature protection, and UVLO. The current-limit and
short-circuit protection can protect down-stream devices
Reverse Current Blocking when Switch Disabled
from catastrophic failure by limiting the output current at
current-limit threshold during over-load or short-circuit
Over-Temperature Protection
Logic Level Enable Input
events. When VOUT drops below VIN-1.5V the devices limit
the current to a lower and safe level. The over-tempera-
APL3521A: Active High
APL3521B: Active Low
•
ture protection function shuts down the N-channel
MOSFET power switch when the junction temperature
Lead Free and Green Devices Available
(RoHS Compliant)
rises beyond 140oC and will automatically turns on the
power switch when the temperature drops by 20oC. The
Applications
UVLO function keeps the power switch in off state until
there is a valid input voltage present.
•
•
•
•
The device is available in lead free SOT-23-5 packages
with enable active-high(EN) and active-low(ENB) versions.
TFT LCD Modules
Notebook and Desktop Computers
USB Ports
High-Side Power Protection Switches
Simplified Application Circuit
Pin Configuration
APL3521A/B
VIN
VIN
VOUT
5 VIN
VOUT 1
GND 2
EN 3
VOUT
4 NC
SOT-23-5
APL3521A
EN
Control
EN/ ENB
5 VIN
VOUT 1
GND 2
ENB 3
GND
4 NC
SOT-23-5
APL3521B
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Aug., 2012
1
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APL3521
Ordering and Marking Information
Package Code
B : SOT-23-5
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
EN Function
A : Active High B : Active Low
Assembly Material
G : Halogen and Lead Free Device
APL3521
Assembly Material
Handling Code
Temperature Range
Package Code
EN Function
APL3521A B:
21AX
X - Date Code
APL3521B B:
21BX
X - Date Code
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings
Symbol
VIN
VOUT
VENB, VEN
IOUT
TJ
TSTG
TSDR
(Note 1)
Parameter
Rating
Unit
VIN to GND Voltage
-0.3 ~ 6
V
VOUT to GND Voltage
-0.3 ~ 6
V
EN, ENB to GND Voltage
-0.3 ~ 6
V
Continuous Output Current
Internally Limited
Maximum Junction Temperature
Storage Temperature
Maximum Lead Soldering Temperature, 10 Seconds
A
-40 ~ 150
o
-65 ~ 150
o
260
o
C
C
C
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Thermal Characteristics
Symbol
θJA
Parameter
Typical Value
Junction-to-Ambient Resistance in Free Air (Note 2)
Unit
o
SOT-23-5
C/W
250
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Aug., 2012
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APL3521
Recommended Operating Conditions (Note 3)
Symbol
Parameter
VIN
VIN Input Voltage
IOUT
OUT Output Current
TA
Ambient Temperature
TJ
Range
Unit
2.7 ~ 5.5
V
0 ~2
Junction Temperature
A
-40 ~ 85
o
-40 ~ 125
o
C
C
Note 3: Refer to the typical application circuit.
Electrical Characteristics
Unless otherwise specified, these specifications apply over VIN=5V, VEN=5V or VENB=0V and TA=-40~85oC. Typical values are at
TA=25oC.
Symbol
Parameter
APL3521
Test Conditions
Unit
Min.
Typ.
Max.
No load, VEN=0V or VENB=5V
-
-
1
µA
No load, VEN=5V or VENB=0V
-
60
100
µA
SUPPLY CURRENT
VIN Supply Current
Leakage Current
VOUT=GND, VEN=0V or VENB=5V
-
-
1
µA
Reverse Leakage Current
VIN=GND, VOUT=5V, VEN=0V or VENB=5V
-
-
1
µA
IOUT=1.5A, TA=25oC
-
90
110
mΩ
IOUT=1.5A, TA=-40~85oC
-
90
140
mΩ
VIN rising, TA=-40~85oC
2.3
-
2.65
V
-
0.2
-
V
POWER SWITCH
RDS(ON)
Power Switch On Resistance
UNDER-VOLTAGE LOCKOUT
VIN UVLO Threshold Voltage
VIN UVLO Hysteresis
CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTIONS
ILIM
ISHORT
Current-Limit Threshold
VIN=2.7V to 5.5V, TA=-40~85oC
2.5
3.1
4.22
A
Short-Circuit Output Current
VIN=2.7V to 5.5V
-
0.8
-
A
No load, COUT=1µF
1
2
3
ms
SOFT-START CONTROL PIN
tSS
Soft-Start Time
EN OR ENB INPUT PIN
VIH
Input Logic HIGH
VIN=2.7V to 5V
2
-
-
V
VIL
Input Logic LOW
VIN=2.7V to 5V
-
-
0.8
V
-
-
1
µA
VEN=0V or VENB=5V
-
150
-
Ω
TJ rising
-
140
-
°C
-
20
-
°C
Input Current
VOUT Discharge Resistance
OVER-TEMPERATURE PROTECTION (OTP)
TOTP
Over-Temperature Threshold
Over-Temperature Hysteresis
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APL3521
Typical Operating Characteristics
Switch On Resistance vs. Input
Voltage
Switch On Resistance vs. Junction
Temperature
130
140
Switch On Resistance, RDS(on) (mΩ)
Switch On Resistance , RDS(on) (mΩ)
160
VIN=3.3V
120
100
80
60
VIN=5V
40
IOUT=1.5A, CIN =1µF/X7R,
COUT =10µF/X7R
20
0
120
110
100
90
80
70
50
-50
0
50
100
Junction Temperature ( oC)
IOUT=1.5A, CIN =1µF/X7R,
COUT =1µF/X7R, TA=25oC
60
150
2.5
Supply Current vs. Junction
Temperature
5.0
5.5
Supply Current vs. Input Voltage
VIN =5V, RLOAD = Open,
CIN =COUT =33µF/Electrolytic
70
80
Supply Current, ICC (µA)
Supply Current, ICC (µA)
3.5
4.0
4.5
Input Voltage (V)
80
100
60
IC Enabled
40
20
IC Disabled
60
50
IC Enabled
40
RLOAD = Open,
CIN =COUT =1µF/X7R, TA=25oC
30
20
IC Disabled
10
0
00
-50
0
50
100
Junction Temperature ( oC)
2.5
150
3.6
3.6
Current-Limit Threshold, ILIM (A)
3.8
3.4
3.2
3.0
2.8
2.6
2.4
2.0
-50
VIN =5V
0
50
100
4.0
4.5
5.0
5.5
3.4
3.2
3.0
2.8
2.6
2.4
2.2
2.0
2.5
150
Junction Temperature ( oC)
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Aug., 2012
3.5
Current-Limit Threshold vs.
Input Voltage
3.8
2.2
3.0
Input Voltage (V)
Current-Limit Threshold vs.
Junction Temperature
Current-Limit Threshold, ILIM (A)
3.0
TA =25oC
3.0
3.5
4.0
4.5
5.0
5.5
Input Voltage (V)
4
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APL3521
Short-Circuit Output Current vs.
Input Voltage
1.4
Current-Limit Response vs.
Output Peak Current
250
VIN =5V, TA=25oC
TA=25oC
1.2
Current-Limit Response (µs)
Short-Circuit Output Current, ISHORT (A)
Typical Operating Characteristics (Cont.)
1.0
0.8
0.6
0.4
0.2
0.0
2.5
3.0
3.5
4.0
4.5
Input Voltage (V)
5.0
200
150
100
50
0
5.5
0
2
Turn-On Rising Time vs. Junction
Temperature
VIN UVLO Threshold Voltage, VVLOC (V)
Turn-On Rising Time, tF (ms)
VIN = 5V, RLOAD =30Ω,
CIN = 1µF/X7R, COUT =33µF/Electrolytic
1.5
1.0
0.5
0
50
100
Junction Temperature ( oC)
3.2
2.8
UVLO Rising
2.4
UVLO Falling
2.0
1.6
1.2
IOUT =15mA,
CIN = 1µF/X7R, COUT =33µF/Electrolytic
0.8
-50
150
50
100
150
EN Pin Threshold Voltage vs.
Junction Temperature
3.0
EN Pin Threshold Voltage, VEN (V)
EN Pin Threshold Voltage, VEN (V)
0
Junction Temperature ( oC)
EN Pin Threshold Voltage vs.
Input Voltage
2.1
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
12
VIN UVLO Threshold Voltage vs.
Junction Temperature
2.0
0.0
-50
4
6
8
10
Output Peak Current (A)
EN Rising
EN Falling
RLOAD =50Ω,
CIN = COUT =33µF/
Elctrolytic, TA=25oC
2.5
3.0
3.5
4.0
4.5
Input Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Aug., 2012
5.0
2.5
EN Rising
2.0
1.5
EN Falling
1.0
VIN =5V, RLOAD =50Ω,
CIN = COUT =33µF/Elctrolytic
0.5
5.5
-50
5
0
50
100
Junction Temperature (oC)
150
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APL3521
Typical Operating Characteristics (Cont.)
Turn Off Leakage Current vs.
Junction Temperature
Output Voltage vs. Output Current
5.0
Output Voltage, VOUT (V)
Turn Off Leakage Current, ILEAK(µA)
10
4.5
VIN=5V
4.0
3.5
3.0
2.5
VIN=3.3V
2.0
1.5
1.0
0.5
o
TA=25 C
0.0
0
1
2
3
8
6
4
2
0
4
-50
Output Current (A)
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Aug., 2012
VIN = 5V, RLOAD = 0Ω,
CIN = COUT =1µF/X7R
6
0
50
100
Junction Temperature ( oC)
150
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APL3521
Operating Waveforms
The test condition is VIN=5V, TA= 25oC unless otherwise specified.
Power On
Power Off
VIN
V IN
1
1
VOUT
VOUT
2
2
I OUT
IOUT
3
3
VIN =5V, RLOAD =30Ω, CIN =1µF/MLCC,
COUT =100µF/Electrolytic
CH1: VIN, 2V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: IOUT, 0.5A/Div, DC
TIME:5ms/Div
VIN =5V, RLOAD =30Ω, CIN =1µF/MLCC,
COUT =100µF/Electrolytic
CH1: VIN, 2V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: IOUT, 0.5A/Div, DC
TIME:20ms/Div
Turn On Response
Turn Off Response
VIN
VE N
1
1
VOUT
V OUT
2
2
I OUT
I OUT
3
3
VIN =5V, RLOAD =30Ω, CIN =1µF/MLCC,
COUT =100µF/Electrolytic
CH1: VEN, 5V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: IOUT, 0.5A/Div, DC
TIME:1ms/Div
VIN =5V, RLOAD =30Ω, CIN =1µF/MLCC,
COUT =100µF/Electrolytic
CH1: VEN, 5V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: IOUT, 0.5A/Div, DC
TIME:0.5ms/Div
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Aug., 2012
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APL3521
Operating Waveforms (Cont.)
The test condition is VIN=5V, TA= 25oC unless otherwise specified.
Current Limit Response
Short Circuit Protection
VIN
V IN
VOUT
VOUT
1
1
2
2
IOUT
IOUT
3
3
VIN =5V, CIN =1µF/MLCC,
COUT=33µF/Electrolytic
CH1: VIN, 2V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: IOUT, 1A/Div, DC
TIME: 2ms/Div
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Aug., 2012
VIN =5V, VOUT short to ground,
CIN =1µF/MLCC, COUT=33µF/Electrolytic
CH1: VIN, 2V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: IOUT, 20A/Div, DC
TIME: 100µs/Div
8
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APL3521
Pin Description
PIN
FUNCTION
NO.
NAME
SOT-23-5
1
VOUT
Output Voltage Pin. The output voltage follows the input voltage. When ENB is high or EN is
low the output voltage is discharged by an internal resistor.
2
GND
Ground
3
EN
(APL3521
Enable Input. Pull this pin to high to enable the device and pull this pin to low to disable
device. The EN pin cannot be left floating.
ENB
(APL3521
Enable Input. Pull this pin to high to disable the device and pull this pin to low to enable
device. The ENB pin cannot be left floating.
4
NC
Internally not connected.
5
VIN
Power Supply Input. Connect this pin to external DC supply.
-
NC
Internally not connected.
Block Diagram
VIN
VOUT
UVL
O
Charg
e
Pump
EN/
ENB
Current
-Limit
Gate Driver and
Control Logic
Soft-Start
OTP
GND
Copyright  ANPEC Electronics Corp.
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APL3521
Typical Application Circuit
APL3521A/B
VOUT
VIN
VIN
VOUT
CIN
CBY
COUT
1µF
0.1µF
10µF
Controller
EN/ENB
GND
Copyright  ANPEC Electronics Corp.
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APL3521
Function Description
VIN Under-Voltage Lockout (UVLO)
Enable/Disable
The APL3521A/B power switch is built-in an under-voltage lockout circuit to keep the output shut off until internal
Pull the ENB above 2V, or EN below 0.8V to disable the
device and pull ENB pin below 0.8V or EN above 2V to
circuitry is operating properly. The UVLO circuit has hysteresis and a de-glitch feature so that it will typically ig-
enable the device. When the IC is disabled, the supply
current is reduced to less than 1µA. The enable input is
nore undershoot transients on the input. When input voltage exceeds the UVLO threshold, the output voltage starts
compatible with both TTL and CMOS logic levels. The
EN/ENB pins cannot be left floating.
a soft-start to reduce the inrush current.
Over-Temperature Protection
Power Switch
The power switch is an N-channel MOSFET with a low
When the junction temperature exceeds 140oC, the internal thermal sense circuit turns off the power FET and
RDS(ON). The internal power MOSFET does not have the
body diode. When IC is off, the MOSFET prevents a cur-
allows the device to cool down. When the device’s junction temperature cools by 20 oC, the internal thermal
rent flowing from the VOUT back to VIN and VIN to VOUT.
sense circuit will enable the device, resulting in a pulsed
output during continuous thermal protection. Thermal
Current-Limit Protection
protection is designed to protect the IC in the event of
over-temperature conditions. For normal operation, the
The APL3521A/B power switch provides the current-limit
protection function. During current-limit, the devices limit
junction temperature cannot exceed TJ=+125oC.
output current at current-limit threshold. For reliable
operation, the device should not be operated in currentlimit for extended period.
Short-Circuit Protection
When the output voltage drops below VIN-1.5V, which is
caused by the over load or short-circuit, the devices limit
the output current down to a safe level. The short circuit
current-limit is used to reduce the power dissipation during short-circuit condition. If the junction temperature is
over the thermal shutdown temperature, the device will
enter the thermal shutdown.
Soft-Start
The APL3521 has a built-in soft start to control the rise
rate of the during start-up. The softstart time is 2ms when
VIN=5V.
Copyright  ANPEC Electronics Corp.
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APL3521
Application Information
Input Capacitor
Layout Consideration
A 1µF ceramic bypass capacitor from VIN to GND, located
The PCB layout should be carefully performed to maximize thermal dissipation and to minimize voltage drop,
near the APL3521, is strongly recommended to suppress
the ringing during short-circuit fault event. Without the by-
droop and EMI. The following guidelines must be
considered:
pass capacitor, the output short may cause sufficient ringing on the input (from supply lead inductance) to damage
1. Please place the input capacitors near the VIN pin as
close as possible.
internal control circuitry.
Output Capacitor
2. Output decoupling capacitors for load must be placed
near the load as close as possible for decoupling high-
A low-ESR 10µF MLCC, aluminum electrolytic or tantalum between VOUT and GND is strongly recommended
frequency ripples.
3. Locate APL3521 and output capacitors near the load to
to reduce the voltage droop during hot-attachment of
downstream peripheral. Higher-value output capacitor is
reduce parasitic resistance and inductance for excellent load transient performance.
better when the output load is heavy. Additionally, bypassing the output with a 0.1µF ceramic capacitor improves
4. The negative pins of the input and output capacitors
and the GND pin must be connected to the ground plane
the immunity of the device to short-circuit transients.
During soft-start process, the output bulk capacitor draws
of the load.
5. Keep VIN and VOUT traces as wide and short as possible.
inrush current from VIN. If the inrush current reaches
foldback current-limit threshold, namely 0.8A, the output
current will be clamped in 0.8A level. It will take longer to
complete the soft-start process since the soft-start rate
is not controlled by internal soft-start anymore. When the
COUT meets the following formula, the soft-start will be
controlled by foldback current-limiting:
COUT > (0.8xtSS)/VIN
Where,
tSS is 2ms.
If the soft-start rate is controlled by the foldback currentlimiting, the soft-start time can be got by the following
equation:
tSS_Foldback = (COUT x VIN)/0.8
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Aug., 2012
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APL3521
Package Information
SOT-23-5
D
e
E
E1
SEE
VIEW A
b
c
0.25
A
L
0
GAUGE PLANE
SEATING PLANE
A1
A2
e1
VIEW A
S
Y
M
B
O
L
SOT-23-5
INCHES
MILLIMETERS
MIN.
MIN.
MAX.
A
1.45
A1
0.00
0.15
A2
0.90
MAX.
0.057
0.000
0.006
1.30
0.035
0.051
0.020
b
0.30
0.50
0.012
c
0.08
0.22
0.003
0.009
D
2.70
3.10
0.106
0.122
0.118
0.071
E
2.60
3.00
0.102
E1
1.40
1.80
0.055
e
0.95 BSC
e1
1.90 BSC
0.037 BSC
0.075 BSC
L
0.30
0.60
0
0°
8°
0.012
0°
0.024
8°
Note : 1. Follow JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Aug., 2012
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APL3521
Package Information
SOP-8
-T-
SEATING PLANE < 4 mils
D
E
E1
SEE VIEW A
h X 45
°
c
A
0.25
b
GAUGE PLANE
SEATING PLANE
A1
A2
e
L
VIEW A
S
Y
M
B
O
L
SOP-8
INCHES
MILLIMETERS
MIN.
MAX.
A
MIN.
MAX.
1.75
0.069
0.010
0.004
0.25
A1
0.10
A2
1.25
b
0.31
0.51
0.012
0.020
c
0.17
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
0.157
e
0.049
1.27 BSC
0.050 BSC
h
0.25
0.50
0.010
0.020
L
0.40
1.27
0.016
0.050
0
0°
8°
0°
8°
Note: 1. Follow JEDEC MS-012 AA.
2. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.
3. Dimension “E” does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Aug., 2012
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APL3521
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
4.0±0.10
4.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±0.20
A
H
T1
C
d
D
W
E1
F
330.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.40±0.20
5.20±0.20
2.10±0.20
SOT-23-5
Application
SOP-8
4.0±0.10
8.0±0.10
(mm)
Devices Per Unit
Package Type
Unit
Quantity
SOT-23-5
Tape & Reel
3000
SOP-8
Tape & Reel
2500
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Aug., 2012
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APL3521
Taping Direction Information
SOT-23-5
USER DIRECTION OF FEED
SOP-8
USER DIRECTION OF FEED
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Aug., 2012
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APL3521
Classification Profile
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Aug., 2012
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APL3521
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Aug., 2012
18
www.anpec.com.tw