20160325160948256

APX9172/72A/72B
Single-Phase Full-Wave Motor Driver with Built-in Hall Sensor
Features
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General Description
On-chip Hall Sensor
The APX9172 is an integrated Hall Effect Sensor IC de-
High Sensitivity Hall Effect Sensor IC: ±15G(Typ.)
signed for electric commutation of single-phase DC
brushless motor applications. The device is built-in lock
Built-in Lock Protection and Auto Restart Function
protection. When fan is locked, the device will enter the
lock protection mode. It is also with thermal shutdown
Speed Controllable by PWM Input Signal
FG Output (for APX9172)
function. The APX9172 is available in a low cost TSOT236F, TSOT23-6 and SOP-8F packages.
1/2FG Output (for APX9172A)
RD Output (for APX9172B)
Built-in Thermal Protection Circuit
6 Pin TSOT23-6F, TSOT23-6 and SOP-8F Packages
Lead Free and Green Devices Available (RoHS
Compliant)
Pin Configuration
Applications
APX9172
FG 1
•
•
Brushless DC Fans
6 VDD
GND 2
5 PWM
OUT1 3
4 OUT2
Brushless DC Motors
TSOT-23-6F
(TOP VIEW)
APX9172
FG 1
6 VDD
GND 2
5 PWM
OUT1 3
4 OUT2
TSOT-23-6
(TOP VIEW)
APX9172
VDD 1
PWM 2
OUT2 3
NC 4
8 FG
SOP-8F
7 GND
6 OUT1
5 NC
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Mar., 2015
1
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APX9172/72A/72B
Ordering and Marking Information
APX9172
Assembly Material
Handling Code
Temperature Range
Package Code
APX9172 CE/CT :
X72X
APX9172A CE/CT :
A72X
APX9172B CE/CT :
B72X
Package Code
CE : TSOT-23-6F CT : TSOT-23-6 KE : SOP-8F
Operating Ambient Temperature Range
I : -40 to 105 ℃
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
The last X is referred as Date Code
The last X is referred as Date Code
The last X is referred as Date Code
APX9172 KE :
APX9172
XXXXX
XXXXX - Date Code
APX9172A KE :
APX9172A
XXXXX
XXXXX - Date Code
APX9172B KE :
APX9172B
XXXXX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
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APX9172/72A/72B
Absolute Maximum Ratings
Symbol
(Note 1)
Parameter
Rating
Unit
VDD
VDD Pin Supply Voltage (VDD to GND)
-0.3 to 20
V
VOUT
Output Pin (OUT1, OUT2) Output Voltage
-0.3 to 20
V
IOUT
VPWM
IFG
Output Pin (OUT1, OUT2) Maximum Output Current – Continuous
300
Hold
PWM Pin Input Voltage
FG Pin Output Sink Current
FG Pin Output Voltage
TJ
mA
600
-0.3 to 20
V
20
mA
-0.3 to 20
Maximum Junction Temperature
TSTG
Storage Temperature
TSOR
Maximum Lead Soldering Temperature, 10 Seconds
V
150
o
-65 to 150
o
260
o
C
C
C
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Thermal Characteristics
Parameter
Symbol
Thermal Resistance-Junction to Ambient
Typical Value
Unit
(Note 2)
TSOT-23-6F
TSOT-23-6
SOP-8F
θ JA
240
240
156.25
o
C/W
Power Dissipation, TA = 25°C
TSOT-23-6F
520
mW
TSOT-23-6
520
SOP-8F
800
Note 2 : The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD =(TJ – T A) / θJA; TJ = 150°C.
PD
Exceeding the maximum allowable power dissipation will result in excessive die temperature.
Recommended Operation Conditions
Symbol
VDD
VPWM
TA
TJ
Parameter
Range
Unit
VDD Supply Voltage
3 to 17
V
PWM Pin Input Voltage
0 to VCC
V
Operating Ambient Temperature
Junction Temperature
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Rev. A.2 - Mar., 2015
3
-40 to 105
o
-40 to 125
o
C
C
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APX9172/72A/72B
Electrical Characteristics
Symbol
(TA=25°C, VDD=12V, unless otherwise noted)
Parameter
APX9172/72A/72B
Test Conditions
Unit
Min.
Typ.
Max.
IDD1
Operating Current
Rotation Mode
-
5
7
mA
IDD2
Standby Supply Current
PWM = 0
-
4
6
mA
-
0.6
0.9
V
VFG/RD
FG/RD Pin Low Voltage
IOUT=300mA,
Upper and Lower total
IFG =5mA
IFGL/RDL
FG/RD Pin Off Leakage Current
VFG =12V
VPWMH
Pulse Mode PWM Input High Level
Voltage
VPWML
Pulse Mode PWM Input Low Level Voltage
VO
Output Driver Saturation Voltage
-
0.1
0.3
V
-
<0.1
1
µA
2.5
-
VDD+0.5
V
0
-
0.8
V
TON
Lock Detection On Time
0.28
0.4
0.52
sec
TOFF
Lock Detection Off Time
2.8
4
5.2
sec
TQS
Quick Start Enable Time
FPWM
PWM Input Frequency
OTS
Over Temperature Shutdown Threshold
Over Temperature Shutdown Hysteresis
-
66.5
90
ms
20
-
50
kHz
-
165
-
o
-
o
-
30
C
C
Magnetic Characteristics (TA=25°C, VDD=12V, unless otherwise noted)
Symbol
Parameter
Test Condition
APX9172/72A/72B
Min.
Typ.
Max.
Unit
Bop
Magnetic Operation Point
5
15
30
Gauss
Brp
Magnetic Release Point
-30
-15
-5
Gauss
Bhys
Magnetic Hysteresis
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Rev. A.2 - Mar., 2015
30
4
Gauss
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APX9172/72A/72B
Pin Description
TSOT-23-6F / TSOT-23-6
PIN
NO.
Function
NAME
FG
(APX9172)
1/2FG
1
(APX9172A)
Rotation Speed or Detection Output. This is an open-drain output.
RD
(APX9172B)
2
GND
Ground of the IC.
3
OUT1
H-bridge output connection.
4
OUT2
H-bridge output connection.
5
PWM
PWM Signal Input Terminal.
6
VDD
Supply Voltage Input.
SOP-8F
PIN
NO.
NAME
Function
1
VDD
Supply Voltage Input.
2
PWM
PWM Signal Input Terminal.
3
OUT2
H-bridge output connection.
4
NC
No connection.
5
NC
No connection.
6
OUT1
H-bridge output connection.
7
GND
Ground of the IC.
FG
(APX9172)
8
1/2FG
(APX9172A)
Rotation Speed or Detection Output. This is an open-drain output.
RD
(APX9172B)
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APX9172/72A/72B
Typical Application Circuit
PWM Signal
Pull High
Voltage
D1
VIN
R1:2Ω
C1:1µF
VIN
APX9172
10KΩ
Pull High
Voltage
10KΩ
5
4
PWM OUT2
FG
GND
OUT1
1
2
3
1
VDD
R1:2Ω
2
PWM
C1:1µF
3
OUT2
4
NC
APX9172
6
VDD
FG
8
GND
7
OUT1
6
NC
5
RFG
PWM Signal
RFG
Block Diagram
PWM
VDD
PWM Control
Circuit
Voltage
Regulator
VDD
OUT2
Hall
Plane
OUT1
Logic Control
Citcuit
FG/RD
Oscillator
GND
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APX9172/72A/72B
Function Description
Output Switch Principle
B=0
The APX9172/72A/72B built in a Hall-effect sensor plane
to sense the vertical magnetic flux density (B). There are
two output drivers in APX9172/72A/72B to drive singlephase DC brushless motor. For example of TSOT/23-6
package, when the N pole magnetic field close to the IC
TOFF
OUT2
marking surface and the magnetic flux density higher than
operate point (Bop), the OUT1 pin output will turn to LOW
TOFF
TON
and the OUT2 pin output will turn to HIGH. When the N
pole magnetic field far away the IC marking surface and
OUT1
S pole magnetic field close to the IC marking surface
until the magnetic flux density higher than release point
FG
(Brp), the OUT1 pin output will turn HIGH and the OUT2
pin output will turn LOW.
Bop
Brp
N
RD
S
Marking
Surface
S
Marking
Surface
N
(SOP-8F)
S
Release
Reset
Lock Lock
Detection
(SOP-8F)
N
Marking
Surface
N
Marking
Surface
S
(TSOT-23-6)
Speed Control by Direct PWM Input Signal
Applying PWM pulses to the PWM pin directly, the duty
cycle of PWM pulses will control the output driver ON duty
(TSOT-23-6)
VOUT1
VOUT1
directly. In PWM control, the high level of pulse signal
should be higher than 2.5V and the low level should be
B
Brp
Bop
lower than 0.8V. When the PWM pin is floating, the output
driver of APX9172/72A/72B will be full duty to drive the
B
Brp
Bop
Bhys
Bhys
VOUT2
VOUT2
motor.
Quick Start and Standby Mode
This IC would enter standby mode when the PWM input
B
Brp
Bop
B
Brp
keeps low level for then 66.5m(typ.). In standby mode, it
will shutdown amplifier and FG. In standby mode, the
Bop
lock protection function doesn’t work, therefore, starting
fan is unobstructed when releasing standby mode.
Lockup Protection and Automatic Restart
The APX9172/72A/72B detects the rotation of the motor
by internal hall sensor signal, and adjusts lock detection
ON time (TON) and lock detection OFF time (TOFF) by inter-
PWM
nal counter.
66.5ms
(typ.)
Lock protect
enable (internal)
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enable
disable
enable
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APX9172/72A/72B
Truth Table
Input
B
Output
Mode
OUT1
OUT2
FG
RD
L
H
OFF
L
Brp
H
L
L
L
Bop
L
L
OFF
L
Brp
L
L
L
L
Bop
L
L
OFF
OFF
L
L
OFF
OFF
OFF
OFF
OFF
OFF
Bop
PWM
H
L
-
Brp
-
L
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Operation Mode
Lock Mode
Standby Mode
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APX9172/72A/72B
Package Information
TSOT-23-6
D
Hall element location
e
6
5
4
1
2
3
0.86
E
E1
SEE VIEW A
1.02
c
b
0.25
A
GAUGE PLANE
SEATING PLANE
A1
A2
e1
L
VIEW A
S
Y
M
B
O
L
A
TSOT-23-6
MILLIMETERS
MIN.
0.70
INCHES
MAX.
MIN.
MAX.
1.00
0.028
0.039
A1
0.01
0.10
0.000
0.004
A2
0.70
0.90
0.028
0.035
b
0.30
0.50
0.012
0.020
c
0.08
0.20
0.003
0.008
D
2.70
3.10
0.106
0.122
E
2.60
3.00
0.102
0.118
E1
1.40
1.80
0.055
0.071
e
0.95 BSC
0.037 BSC
e1
1.90 BSC
0.075 BSC
L
0
0.30
0.60
0.012
0.024
0o
8o
0o
8o
Note : 1. Followed from JEDEC TO-178 AB.
2. Dimension D and E1 do not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 10 mil per side.
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APX9172/72A/72B
Package Information
TSOT-23-6F
E
E1
D
c
e
e1
6
5
4
0.86mm
A2
Sensor Location
1
b
2
3
1.02mm
Top view : Marking side
TSOT-23-6F
S
Y
M
B
O
L
MIN.
MAX.
MIN.
MAX.
A2
0.70
0.775
0.028
0.031
b
0.30
0.50
0.012
0.020
c
0.08
0.22
0.003
0.009
D
2.80
3.00
0.110
0.118
E
3.70
3.90
0.146
0.154
E1
1.50
1.70
0.059
0.067
INCHES
MILLIMETERS
e
0.95 BSC
0.037 BSC
e1
1.90 BSC
0.075 BSC
Note : 1. Dimension D and E1 do not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
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APX9172/72A/72B
Package Information
SOP-8F
h x 45o
E
E1
D
c
b
0.40
e
0.20
0.60
S
Y
M
B
O
L
SOP-8F
MILLIMETERS
MIN.
INCHES
MAX.
A
MIN.
1.75
MAX.
0.069
0.012
0.020
b
0.31
0.51
c
0.17
0.25
0.007
0.010
0.197
D
4.80
5.00
0.189
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
0.157
e
1.27 BSC
0.050 BSC
h
0.25
0.50
0.010
0.020
L
2.00
2.20
0.079
0.087
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APX9172/72A/72B
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
TSOT-23-6
A
H
T1
C
d
D
W
E1
F
178.0±
2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±
0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
4.0±0.10
2.0±
0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.20±
0.20
4.0±
0.10
Application
TSOT-23-6F
Application
SOP-8F
A
H
178.0±
2.00
50 MIN.
P0
P1
T1
16.4+2.00
-0.00
P2
4.0±
0.10
4.0±0.10
2.0±
0.05
A
H
T1
C
13.0+0.50
-0.20
D0
1.5+0.10
-0.00
C
330.0±
2.00
50 MIN.
12.4+2.00
-0.00
P0
P1
4.0±
0.10
8.0±0.10
d
D
W
E1
F
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.5±0.10
D1
A0
B0
K0
3.10±0.20
4.00±0.20
1.15±
0.20
d
T
0.6+0.00
-0.40
D
W
E1
F
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.5±0.05
P2
D0
D1
T
A0
B0
K0
2.0±
0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.90±0.10
5.30±0.10
2.00±
0.10
1.0 MIN.
(mm)
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APX9172/72A/72B
Devices Per Unit
Package Type
Unit
Quantity
TSOT-23-6
Tape & Reel
3000
TSOT-23-6F
Tape & Reel
3000
SOP-8F
Tape & Reel
2500
Taping Direction Information
TSOT-23-6
USER DIRECTION OF FEED
AAAX
AAAX
AAAX
AAAX
AAAX
AAAX
AAAX
TSOT-23-6F
USER DIRECTION OF FEED
AAAX
AAAX
AAAX
AAAX
AAAX
AAAX
AAAX
SOP-8F
USER DIRECTION OF FEED
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APX9172/72A/72B
Classification Profile
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3 °C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
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APX9172/72A/72B
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
3
Package
Thickness
<2.5 mm
Volume mm
<350
235 °C
Volume mm
≥350
220 °C
≥2.5 mm
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
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