AOSMD AOC2802

AOC2802
Common-Drain Dual N-Channel Enhancement Mode Field
Effect Transistor
General Description
Product Summary
The AOC2802 uses advanced trench technology to provide
excellent RSS(ON), low gate charge and operation with gate
voltages as low as 2.5V while retaining a 12V VGS(MAX) rating.
It is ESD protected. This device is suitable for use as a unidirectional or bi-directional load switch, facilitated by its
common-drain configuration.
Vss
ID (at VGS=4.5V)
20V
6A
RSS(ON) (at VGS=4.5V)
< 34mΩ
RSS(ON) (at VGS=4.0V)
< 35mΩ
RSS(ON) (at VGS=3.1V)
< 43mΩ
RSS(ON) (at VGS=2.5V)
< 54mΩ
WLCSP 1.57x1.57_4
Bottom View
Equivalent Circuit
Top View
D2
D1
G2
S2
G1
Pin1(S1)
S1
G1
G2
S2
S1
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Source-Source Voltage
VSS
Gate-Source Voltage
VGS
Source Current (DC) Note1
Source Current (Pulse)
Power Dissipation
TA=25°C
Note2
Note1
Junction and Storage Temperature Range
Note 1. Mounted on minimum pad PCB
Note 2. PW <300 µs pulses, duty cycle 0.5% max
Rev 4: Nov 2012
Units
V
±12
V
IS
6
ISM
60
PD
TA=25°C
Maximum
20
TJ, TSTG
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1.3
-55 to 150
A
W
°C
Page 1 of 5
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
Source-Source Breakdown Voltage
BVSSS
Conditions
Min
IS=250µA, VGS=0V, Test Circuit 6
Typ
20
1
Zero Gate Voltage Source Current
IGSS
Gate leakage current
VSS=0V, VGS= ±10V, Test Circuit 2
BVGSO
Gate-Source Breakdown Voltage
VSS=0V, IG=±250µA, Test Circuit 7
±12
VGS(th)
Gate Threshold Voltage
VSS=VGS IS=250µA, Test Circuit 3
0.5
TJ=55°C
5
Note
TJ=125°C
1
10
1
1.5
28
34
µA
V
VGS=4.5V, IS=3A, Test Circuit 4
Static Source to Source On-Resistance
Units
V
VSS=20V, VGS=0V, Test Circuit 1
ISSS
RSS(ON)
Max
41
48
VGS=4.0V, IS=3A, Test Circuit 4
30
35
VGS=3.1V, IS=3A, Test Circuit 4
36
43
VGS=2.5V, IS=3A, Test Circuit 4
45
54
V
mΩ
gFS
Forward Transconductance Note
VSS=5V, IS=3A, Test Circuit 3
19
VFSS
Diode Forward Voltage Note
IS=1A,VGS=0V, Test Circuit 5
0.6
1
V
1000
1200
pF
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VSS=10V, f=1MHz,
152
S
pF
114
pF
1.5
kΩ
SWITCHING PARAMETERS
Turn-On DelayTime
tD(on)
284
ns
tr
Turn-On Rise Time
ns
tD(off)
Turn-Off DelayTime
VGS=10V, VSS=10V, RL=1.5Ω, RGEN=6Ω ,
900
5
µs
tf
Turn-Off Fall Time
4.8
µs
VG1S1=4.5V, VSS=10V, IS=6A
10.4
nC
Total Gate Charge
Qg
Note: Pulsed
VGS=0V, VSS=0V, f=1MHz
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE
Rev 4: Nov 2012
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Page 2 of 5
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
60
20
4.5V
4V
3.5V
50
VSS=5V
16
3V
40
IS(A)
IS (A)
12
30
2.5V
8
20
125°C
VGS=2V
10
-
4
75°C
25°
0
0
0
1
2
3
4
5
0.5
VSS (Volts)
Fig 1: On-Region Characteristics
1
1.25
1.5
1.75
2
2.25
VGS(Volts)
Figure 2: Transfer Characteristics
65
55
VGS=2.5V
50
45
VGS=3.1V
40
VGS=4V
35
30
Normalized On-Resistance
1.6
60
RSS(ON) (mΩ
Ω)
0.75
VGS=4.5V
VGS=4V
VGS=3.1V
1.4
VGS=2.5V
1.2
1
VGS=4.5V
25
0.8
0
5
10
15
20
0
IS (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
100
1.0E+01
IS=3A
90
1.0E+00
RSS(ON) (mΩ
Ω)
80
1.0E-01
70
125°C
50
IS (A)
Note 2. 60
PW <300 µs pulses, duty cycle 0.5% max
125°C
1.0E-02
1.0E-03
40
75°C
25°C
1.0E-04
30
25°C
20
1.0E-05
-25°C
10
0
2
4
6
8
10
12
1.0E-06
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Rev 4: Nov 2012
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0.0
0.5
1.0
1.5
2.0
VSS (Volts)
Figure 6: Body-Diode Characteristics
Page 3 of 5
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
1400
6
VSS=10V
IS=6A
1200
Capacitance (pF)
VGS (Volts)
5
4
3
2
1
Ciss
1000
800
Crss
600
Coss
400
Crss
Coss
200
0
0
0
2
4
6
8
10
12
14
0
Qg (nC)
Figure 7: Gate-Charge Characteristics
100.0
5
10
15
VSS (Volts)
Figure 8: Capacitance Characteristics
50
TJ(Max)=150°C
TA=25°C
10µs
40
RSS(ON)
limited
100µs
1.0
1ms
DC
0.1
10ms
100ms
TJ(Max)=150°C
TA=25°C
Power (W)
10.0
IS (Amps)
20
30
20
10
1s
0
0.0
0.01
0.1
1
VSS (Volts)
10
100
0.001
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
Zθ JA Normalized Transient
Thermal Resistance
10
D=Ton/(Ton+T)
TJ,PK=TA+PD.ZθJA.RθJA
RθJA=100°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
Note 2. PW <300 µs pulses, duty cycle 0.5% max
PD
0.1
Single Pulse
Ton
T
0.01
0.00001
Rev 4: Nov 2012
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
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100
1000
Page 4 of 5
TEST CIRCUIT 1 Isss
TEST CIRCUIT 2 Igss1,2
POSITIVE VSS FOR ISSS+
POSITIVE VGS FOR IGSS1+
S2
NEGATIVE VSS FOR ISSS-
S2
NEGATIVE VGS FOR IGSS1When FET1 is measured
between GATE and SOURCE
A
G2
G2
of FET2 are shorted
D2
D2
D1
D1
VSS
G1
G1
A
VG
S1
TEST CIRCUIT 3 Vgs(off)
S1
TEST CIRCUIT 4 Rss(on)
S2
S2
When FET1 is measured
Vss/Is
between GATE and SOURCE
of FET2 are shorted
G2
A
G2
Is
D2
D2
D1
D1
VSS
G1
V
G1
VSS
VGS
VGS
S1
TEST CIRCUIT 5 VF(SS)1,2
S1
TEST CIRCUIT 6 BVDSS
POSITIVE VSS FOR ISSS+
NEGATIVE VSS FOR ISSS-
S2
S2
4.5V
When FET1 measured
G2
G2
IF
FET2 VGS=4.5V
Is
D2
D2
D1
D1
V
G1
V
G1
VSS
VGS=0
S1
S1
TEST CIRCUIT 7 BVGSO1,2
POSITIVE VSS FOR ISSS+
NEGATIVE VSS FOR ISSS-
S2
When FET1 is measured
between GATE and SOURCE
G2
of FET2 are shorted
D2
D1
G1
V
IG
Rev 4: Nov 2012
S1
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Page 5 of 5