AOSMD AOT12N40

AOT12N40
400V,11A N-Channel MOSFET
General Description
Product Summary
The AOT12N40 is fabricated using an advanced high
voltage MOSFET process that is designed to deliver high
levels of performance and robustness in popular AC-DC
applications.By providing low RDS(on), Ciss and Crss along
with guaranteed avalanche capability this part can be
adopted quickly into new and existing offline power supply
designs.
VDS
ID (at VGS=10V)
500V@150℃
11A
RDS(ON) (at VGS=10V)
<0.59Ω
100% UIS Tested
100% Rg Tested
For Halogen Free add "L" suffix to part number:
AOT12N40L
Top View
D
TO-220
D
S
G
G
S
AOT12N40
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
Continuous Drain
Current
VGS
TC=25°C
TC=100°C
Maximum
400
Units
V
±30
V
11
ID
7
A
Pulsed Drain Current C
IDM
28
Avalanche Current C
IAR
3.5
A
Repetitive avalanche energy C
EAR
184
mJ
Single pulsed avalanche energy G
Peak diode recovery dv/dt
TC=25°C
Power Dissipation B Derate above 25oC
Junction and Storage Temperature Range
EAS
dv/dt
368
5
184
mJ
V/ns
W
1.5
-55 to 150
W/ oC
°C
300
°C
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A,D
Maximum Case-to-sink A
Maximum Junction-to-Case
Rev0: Sep 2012
PD
TJ, TSTG
TL
Symbol
RθJA
RθCS
Typical
54
Maximum
65
Units
°C/W
0.56
0.5
0.68
°C/W
°C/W
RθJC
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Page 1 of 5
AOT12N40
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
ID=250µA, VGS=0V, TJ=25°C
400
Typ
Max
Units
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
BVDSS
/∆TJ
Zero Gate Voltage Drain Current
IDSS
Zero Gate Voltage Drain Current
ID=250µA, VGS=0V, TJ=150°C
500
ID=250µA, VGS=0V
0.4
V/ oC
VDS=400V, VGS=0V
1
VDS=320V, TJ=125°C
10
IGSS
Gate-Body leakage current
VDS=0V, VGS=±30V
VGS(th)
Gate Threshold Voltage
VDS=5V, ID=250µA
RDS(ON)
Static Drain-Source On-Resistance
VGS=10V, ID=6A
gFS
Forward Transconductance
VDS=40V, ID=6A
VSD
Diode Forward Voltage
IS=1A,VGS=0V
IS
ISM
±100
µA
3.9
4.5
nΑ
V
0.49
0.59
Ω
1
V
Maximum Body-Diode Continuous Current
11
A
Maximum Body-Diode Pulsed Current
28
A
DYNAMIC PARAMETERS
Input Capacitance
Ciss
Coss
V
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=25V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
SWITCHING PARAMETERS
Qg
Total Gate Charge
3.3
10
S
0.72
740
925
1110
pF
70
100
130
pF
3.5
6.4
9.0
pF
1.4
2.9
4.5
Ω
17
21
nC
13
VGS=10V, VDS=320V, ID=12A
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
IF=12A,dI/dt=100A/µs,VDS=100V
180
235
290
Qrr
Body Diode Reverse Recovery Charge IF=12A,dI/dt=100A/µs,VDS=100V
1.9
2.4
2.9
Body Diode Reverse Recovery Time
VGS=10V, VDS=200V, ID=12A,
RG=25Ω
5.4
nC
5.7
nC
25
ns
57
ns
41
ns
32
ns
ns
µC
A. The value of R θJA is measured with the device in a still air environment with T A =25°C.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial
TJ =25°C.
D. The R θJA is the sum of the thermal impedance from junction to case R θJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
G. L=60mH, IAS=3.5A, VDD=150V, RG=25Ω, Starting TJ=25°C
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev0: Sep 2012
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Page 2 of 5
AOT12N40
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
100
25
8V
20
-55°C
VDS=40V
10V
10
15
ID(A)
ID (A)
7V
6.5V
125°C
10
1
6V
25°C
5
VGS=5.5V
0
0.1
0
5
10
15
20
25
VDS (Volts)
Fig 1: On-Region Characteristics
30
2
RDS(ON) (Ω
Ω)
1.6
1.2
VGS=10V
0.8
0.4
0.0
10
2.4
VGS=10V
ID=6A
1.8
1.2
0.6
0.0
0
5
10
15
20
25
-100
ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage
-50
0
50
100
150
200
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
1E+01
1.3
1E+00
1.2
1E-01
1.1
IS (A)
BVDSS (Normalized)
6
8
VGS(Volts)
Figure 2: Transfer Characteristics
3.0
Normalized On-Resistance
2.0
4
40
125°C
1E-02
25°C
1
1E-03
0.9
1E-04
0.8
1E-05
-100
50
100
150
TJ (°C)
Figure 5:Break Down vs. Junction Temparature
Rev0: Sep 2012
-50
0
200
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0.0
0.2
0.4
0.6
0.8
1.0
1.2
VSD (Volts)
Figure 6: Body-Diode Characteristics (Note E)
Page 3 of 5
AOT12N40
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
15
10000
VDS=320V
ID=12A
12
Ciss
Capacitance (pF)
VGS (Volts)
1000
9
6
Coss
100
Crss
10
3
1
0
0
6
12
18
24
Qg (nC)
Figure 7: Gate-Charge Characteristics
0.1
30
100
10
VDS (Volts)
Figure 8: Capacitance Characteristics
100
50
150
15
10µs
100µs
1
1ms
DC
10ms
0.1
TJ(Max)=150°C
TC=25°C
12
Current rating ID(A)
RDS(ON)
limited
10
ID (Amps)
1
9
6
3
0.01
1
10
100
VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area for AOT12N40 (Note F)
1000
0
0
25
75
100
125
TCASE (°C)
Figure 10: Current De-rating (Note B)
Zθ JC Normalized Transient
Thermal Resistance
10
1
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
RθJC=0.68°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
PD
0.1
Single Pulse
Ton
T
0.01
1E-05
Rev0: Sep 2012
0.0001
0.001
0.01
0.1
1
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance for AOT12N40(Note F)
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10
100
Page 4 of 5
AOT12N40
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+
VDC
-
VDC
DUT
Qgs
Vds
Qgd
-
Vgs
Ig
Charge
Res istive Switching Test Circuit & Waveforms
RL
Vds
Vds
DUT
Vgs
+
VDC
90%
Vdd
-
Rg
10%
Vgs
Vgs
t d(on)
tr
t d(off)
t on
tf
t off
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
EAR= 1/2 LI
Vds
2
AR
BVDSS
Vds
Id
+
Vgs
Vgs
VDC
-
Rg
Vdd
I AR
Id
DUT
Vgs
Vgs
Diode Recovery Test Circuit & Waveforms
Qrr = - Idt
Vds +
DUT
Vgs
Vds -
Isd
Vgs
Ig
Rev0: Sep 2012
L
Isd
+
VDC
-
IF
trr
dI/dt
IRM
Vdd
Vdd
Vds
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Page 5 of 5