AVAGO AFCT

AFCT-721XPDZ
10GbE/10GFC 1310 nm XFP 10 Gbit/s Optical Transceiver
Data Sheet
Description
Features
The 1310 nm XFP transceiver is a high performance, cost
effective module for serial optical data communications
applications specified for signal rates of 10.30 Gb/s to
11.3 Gb/s. It is compliant to XFP MSA Rev 4.5. The module is designed for single mode fiber and operates at a
nominal wavelength of 1310 nm. The transmitter section incorporates Avago Technologies’ uncooled directly
modulated 1310 nm distributed feedback laser (DFB).
The receiver section uses Avago Technologies’ MOVPE
grown planar TEDET PIN photodetector for low dark
current and excellent responsivity. Integrated Tx and Rx
signal conditioners provide high jitter-tolerance for full
XFI compliance. The internally AC coupled high speed
serial I/O simplifies interfacing to external circuitry. The
electrical interface is made using an industry standard
0.8 mm pitch 30-pin right angle connector. Optical connection is made via the duplex LC connector.
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Applications
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Fibre Channel Switches
Host Bus Adapter Cards
Mass Storage System and Server I/O
Ethernet Switches
Core Routers
Related Products
• AFCT-711XPDZ: Multi-rate 1310nm XFP 10Gbit/s Optical
Transceiver for SONET/SDH OC-192, 10GbE & 10GFC
• AFBR-720XPDZ: 10GbE 850nm XFP 10Gbit/s Optical
Transceiver
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RoHS-6 Compliant
Supports 10.3Gb/s to 11.3Gb/s bit rates
Compliant to XFP MSA
Supports 10Gb/s Ethernet and Fibre Channel
- IEEE 802.3ae 10GBASE-LR for 10GbE, 10.3125 Gb/s
- 10GFC 1310 nm Serial PMD, type 1200-SM-LL-L,
10.51875 Gb/s
Avago Technologies’ uncooled 1310 nm DFB Laser and
PIN Photodiode
Compliant XFI 10G Serial electrical interface
LC Duplex optical connector interface conforming to
ANSI TIA/EIA604-10 (FOCIS 10)
1.5W typical power dissipation
No Reference Clock required
Superior Thermal and EMI integrity performance to
support high port densities
Customizable clip-on heatsink to support a variety of
line card environments
-5 to +70 °C case operating temperature range
Support XFI loopback
2-wire serial management interface provides real time
monitors of:
- Transmitted Optical Power
- Received Optical Power
- Laser Bias Current
- Module Temperature
Link Lengths up to 10 km with 9 µm fiber
IEC 60825-1 Class 1/CDRH Class 1 laser eye safety.
The product also offers digital diagnostics using the 2wire serial interface defined in the XFP MSA. The product provides real time temperature (module and laser),
supply voltage, laser bias current, laser average output
power and received input power. The digital diagnostic
interface also adds the ability to disable the transmitter
(TX_DIS), power down the module, monitor for module
faults and monitor for Receiver Loss of Signal (RX_LOS).
Transmitter disable, interrupt, power down/reset, receiver loss of signal and module not ready are also hard
wired pins on the 30-pin right angle connector.
Installation
The AFCT-721XPDZ can be installed in any XFP port regardless of host equipment operating status. The AFCT721XPDZ is hot-pluggable, allowing the module to be
installed while the host system is operating and on-line.
The clip-on heatsink is designed to clip on to the XFP
cage without a module present.
Upon insertion, the transceiver housing makes initial
contact with the host board XFP cage, mitigating potential damage due to Electro-Static Discharge (ESD).
Once fully inserted into the XFP cage, the top surface
of the XFP module makes contact with the heatsink
through a cutout in the top of the cage ensuring an effective thermal path for module heat.
Functional Description
Transmitter Section
The transmitter section includes a 1310 nm DFB (Distributed Feedback Laser) light source, a transmitter
driver circuit and a signal conditioner circuit on the TX
data inputs. (see Figure 1) Optical connection to the
transmitter is provided via a LC connector. The optical
output is controlled by a custom IC that detects the laser output via the monitor photodiode. This IC provides
both DC and AC current drive to the laser to ensure correct modulation, eye diagram and extinction ratio over
temperature, supply voltage and operating life.
TX_DIS
Asserting pin 5, TX_DIS, will disable the transmitter optical output. The transmitter output can also be disabled
and monitored via the two-wire serial interface.
Eye Safety Circuit
Under normal operating conditions laser power will be
maintained below Class 1 eye-safety limits.
Heat sink
RF
driver
Optical
isolator
Mon. PIN
CW
driver
Th
Power
supply
control
PIN
TIA
ROSA
Main housing
Figure 1. Transceiver Functional Diagram
Analog signal
conditioners
Optical receptacles
D/A
TOSA
Eye opener
(CDR)
ESA
Digital 10 Gb/s
electrical signal
EEPROM
Micro
controller
A/D
Eye opener
(CDR)
Digital low speed
bus or signal
Electrical connector
Laser
Analog low
speed signal
+3.3V
Receiver Section
Functional Data I/O
The receiver section includes a PIN detector with amplification quantization signal conditioner circuits. (see
Figure 1) Optical connection to the receiver is provided
via a LC optical connector.
Avago Technologies’ AFCT-721XPDZ fiber-optic transceiver is designed to accept industry standard electrical
input differential signals. The transceiver provides ACcoupled, internally terminated data input and output
interfaces. Bias resistors and coupling capacitors have
been included within the module to reduce the number
of components required on the customer’s board.
RX_LOS
The receiver section contains a loss of signal (RX_LOS)
circuit to indicate when the optical input signal power
is insufficient for reliable signal detection. A high signal
indicates loss of modulated signal, indicating link failure
such as a broken fiber or nonfunctional remote transmitter. RX_LOS can also be monitored via the two-wire
serial interface (byte 110, bit 1).
Electrical Pinout
GND
RX_LOS
14
17
RD-
MOD_NR
13
18
RD+
MOD_ABS
12
19
GND
SDA
11
VCC5
20
VCC2
SCL
10
0.1 µF
Host +3.3 V
0.1 µF
Optional
Host +1.8 V
22 µF
0.1 µF
21
P_DOWN/RST
VCC3
9
4.7 µH
22
VCC2
VCC3
8
22 µF
23
GND
GND
7
4.7 µH
24
REFCLK+
VCC5
6
25
REFCLK-
TX_DIS
5
0.1 µF
Optional
Host -5.2 V
22 µF
26
GND
4.7 µH
27
GND
MOD_DESEL
3
28
TD-
VEE5
0.1 µF
22 µF
2
29
TD+
GND
1
30
GND
VCC3
0.1 µF
VCC2
XFP Connector
4.7 µH
0.1 µF
VEE5
0.1 µF
TOWARD
ASIC
XFP Module
GND
Figure 2. MSA recommended power supply filter
15
16
Host Board
Optional
Host +5 V
GND
Figure 3. Host PCB XFP Pinout Top View
INTERRUPT
4
TOWARD
BEZEL
Table 1. Electrical Pin Definitions
Pin
Name
Function/Description
Notes
1
GND
Logic
Module Ground
1
2
VEE5
-5.2 V power supply. (Not Used)
3
Mod-Desel
LVTTL-I
Module De-select; When held low allows the module to respond to 2-wire Serial interface commands
4
4
Interrupt
LVTTL-O
Interrupt; Indicates presence of an important condition which can be readover
the serial 2-wire interface
2
5
TX_DIS
LVTTL-I
Transmitter Disable; Transmitter Laser Source Turned Off
4
6
VCC5
5 V power supply. (Not Used)
7
GND
Module Ground
8
VCC3
+3.3 V Power Supply
9
VCC3
10
SCL
LVTTL-I
Two Wire Interface Clock
2
11
SDA
LVTTL-I/O
Two Wire Interface Data Line
2
12
Mod_Abs
LVTTL-O
LVTTL-O Mod_Abs Indicates Module is not present. Grounded in the Module
2
13
Mod_NR
LVTTL-O
Module Not Ready; Indicating Module Operational Fault
2
14
RX_LOS
LVTTL-O
Receiver Loss Of Signal Indicator
2
15
GND
Module Ground
1
16
GND
Module Ground
1
17
RD-
CML-O
Receiver Inverted Data Output
18
RD+
CML-O
Receiver Non-Inverted Data Output
19
GND
20
VCC2
21
P_Down/RST
22
VCC2
+1.8 V Power Supply. (Not Used)
23
GND
Module Ground
1
24
RefCLK+
PECL-I
Reference Clock Non-Inverted Input, AC coupled on the host board (Not Used)
3
25
RefCLK-
PECL-I
Reference Clock Inverted Input, AC coupled on the host board (Not Used)
3
26
GND
Module Ground
1
27
GND
Module Ground
1
28
TD-
CML-I
Transmitter Inverted Data Input
29
TD+
CML-I
Transmitter Non-Inverted Data Input
30
GND
+3.3 V Power Supply
Module Ground
1
+1.8 V Power Supply. (Not Used)
LVTTL-I
Power down: When high, the module is put into a lower power mode. Serial
interface is functional in the low power mode. Reset: The falling edge initiates
a complete reset of the module including the serial Interface, equivalent to a
power cycle.
Module Ground
Notes:
1. Module ground pins Gnd are isolated from the module case and chassis ground within the module.
2. Open Collector should be pulled up with 4.7KW to 10KW to a voltage between 3.15 V and 3.6 V on the host board.
3. RefCLK+/- are internally terminated (50W)
4. Pulled up to Vcc3 via 4.7-10KW resistor inside the module
1
4
1
Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Unit
Notes
Storage Temperature (non-operating)
TS
-40
Typical
+85
°C
1, 2, 3
Ambient Operating Temperature
TA
-40
+85
°C
1, 2, 3
Relative Humidity
RH
10
90
%
1
Supply Voltage
VCC3
0
3.6
V
1, 2
Low Speed Input Voltage
VIN
-0.5
VCC+0.5
V
1
Recommended Operating Conditions [4]
Parameter
Symbol
Minimum
Case Operating Temperature
TC
Supply Voltage
VCC3
Data Rate
Typical
Maximum
Unit
Notes
-5
+70
°C
3
3.135
3.465
V
5
9.95
11.3
Gb/s
Maximum
Unit
Notes
Transceiver Electrical Characteristics
(TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%)
Parameter
Symbol
Minimum
Typical
Power Supply Noise Rejection
(peak-peak) under 1MHz
PSNR
2% of VCC
mV
6
Power Supply Noise Rejection
(peak-peak) 1MHz to 10 MHz
PSNR
3% of VCC
mV
6
Module supply current
ICC
425
605
mA
Power Dissipation
PDISS
1410
2100
mW
Low Speed Outputs:
MOD_NR, RX_LOS, MOD_ABS,
INTERRUPT
VOH
VOL
Host_VCC-0.5
0.0
Host_VCC+0.3
0.4
V
V
7
8
Low Speed Inputs:
TX_DIS, MOD_DESEL,
P_DOWN/RST
VIH
VIL
2.0
-0.5
VCC3+0.3
0.8
V
V
10
9
Notes:
1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded for other than a short
period of time. See Reliability Data Sheet for specific reliability performance.
2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability
is not implied, and damage to the device may occur over an extended period of time.
3. The Ambient Operating Temperature limitations are based on the Case Operating Temperature limitations and are subject to the host system
thermal design.
4. Recommended Operating Conditions are those values for which functional performance and device reliability is implied
5. Vcc condition applies to supply voltage at the XFP module
6. Power Supply filtering on host board required as per XFP MSA specification.
7. 4.7 KW to 10 KW resistor pull-up to host_VCC, measured at the host side of connector. IOH(max) = - 2 mA.
8. 4.7 KW to 10 KW resistor pull-up to host_VCC, measured at the host side of connector. IOL(max) = 2 mA.
9. 4.7 KW to 10 KW resistor pull-up to host_VCC, measured at the host side of connector. IIL(max) = 10 µA.
10.4.7 KW to 10 KW resistor pull-up to host_VCC, measured at the host side of connector. IIH(max) = - 10 µA.
Transmitter Electrical Input Characteristics
(TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%)
Parameter
Symbol
Minimum
Differential Input Impedance
Zd
Termination Mismatch
DZM
Differential Input Amplitude
DVQDO
120
Differential Input Return Loss
SDD11
Differential Input Return Loss
Differential Input Return Loss
Typical
Maximum
Unit
Notes
W
100
5
%
820
mV
peak to peak (1)
20
dB
0.05 to 0.1 GHz
SDD11
8
dB
0.1 to 5.5 GHz
SDD11
8 - 20.66
log10(f/5.5)
f in GHz
dB
5.5 - 12 GHz
Common Mode Input Return Loss
SCC11
3
dB
0.1 to 12 GHz
Differential to Common Mode Conversion
SCD11
10
dB
0.1 to 12 GHz
Jitter and Eye Mask
XFP MSA Compliant
Receiver Electrical Output Characteristics
Parameter
Symbol
Differential Input Impedance
Zd
Termination Mismatch
DZM
Differential Output Amplitude
DVQDO
DC Common Mode Potential
Vcm
Minimum
Typical
Maximum
Unit
W
100
5
%
340
850
mV
0
3.6
V
15
mV
Output AC Common Mode Voltage
Notes
peak to peak (1)
RMS
Output Rise/Fall time
(20% to 80%)
tr, tf
24
ps
Common mode output return loss
SCC22
3
dB
0.1 to 12 GHz
Differential output return loss
SDD22
20
dB
0.05 to 0.1 GHz
Differential output return loss
SDD22
8
dB
0.1 to 5.5 GHz
Differential output return loss
SDD22
8 - 20.66
log10(f/5.5)
f in GHz
dB
5.5 - 12 GHz
Jitter and Eye Mask
Note:
1. The differential input and output amplitudes are per XFP MSA Rev 4.5 mask at points B’ and C’.
XFP MSA Compliant
Transmitter Optical Characteristics 10 GbE/10GFC
(TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%)
Parameter
Symbol
Minimum
Optical Output Power
Pout
-5.2
Average Optical Output Power
Pout
-8.2
Extinction Ratio
ER
3.5
Spectral Width - rms
s, rms
Center Wavelength
λC
Transmitter and dispersion penalty
TDP
1260
Typical
Maximum
0.5
1310
Unit
Notes
dBm OMA
1, 2
dBm
1, 2
dB
1, 2
0.2
nm RMS
3
1355
nm
3.2
dB
1, 2
Side mode suppression ratio
30
dB
1
Optical output power (min) in OMA
- TDP
-6.2
dBm OMA
1, 2
dB/Hz
1
Maximum
Unit
Notes
0.5
dBm mean
1
-10.3
dBm OMA
1
-12.6
dBm OMA
3
-12
dB
1
1355
nm
RIN12 (OMA)
RIN
Optical Eye Mask
Compliant with IEEE 802.3ae 10GBASE-LR
-128
Receiver Optical Characteristics 10 GbE/10GFC
(TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%)
Parameter
Symbol
Average Receive power
Minimum
Typical
-14.4
Stressed receiver sensitivity
Receiver sensitivity
PIN
Max Receiver Reflectance
Wavelength
λC
1260
Notes:
1. 10GFC 1200-SM-LL-L / IEEE 802.3ae 10BASE-LR compliant
2. These parameters are interrelated: see IEEE 802.3ae
3. For information only
1310
Transceiver Timing Characteristics
(TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%)
Parameter
Symbol
TX_DIS Assert Time
Maximum
Unit
Notes
t_off
20
µs
Time from rising edge of TX_DIS to
when the optical output falls below
10% of nominal.
TX_DIS Negate Time
t_on
2
ms
Time from falling edge of TX_DIS to
when the modulated optical output
rises above 90% of nominal.
Time to initialize
t_init
300
ms
From power on or hot plug after
meeting power supply specs
Interrupt assert
delay
Interrupt_on
200
ms
From occurrence of the condition
triggering interrupt
Interrupt negate
delay
Interrupt_off
500
us
From clear on read interrupt flags
P_Down/
RST assert delay
P_Down/RST_on
100
us
From Power down initiation
P-Down negate
delay
P_Down/RST_
off
300
ms
Max delay from negate to completion
of power up and reset
Mod_NR assert
delay
Mod_nr_on
1
ms
From Occurrence of fault to assertion
of MOD_NR
Mod_NR negate
delay
Mod_nr_off
1
ms
From Occurrence of signal to negation of MOD_NR
Mod_DeSel assert
time
T_Mod_DeSel
2
ms
Maximum delay between assertion
ofMod_DeSel and end of module
response to 2-wire interface communications
Mod_DeSel
de-assert time
T_Mod_Sel
2
ms
Maximum delay between de-assertion of Mod_DeSel and proper module response to 2-wire interface
communications
P_Down reset time
t_reset
µs
Min length of P-Down assert to initial
reset
RX_LOS Assert delay
T_loss_on
100
µs
From Occurrence of loss of signal to
assertion of RX_LOS
RX_LOS negate delay
T_loss_off
2.3
100
µs
From Occurrence of presence of
signal to negation of RX_LOS
Serial ID Clock Rate
f_serial_clock
0
400
kHz
Minimum
Typical
10
Digital Diagnostic Interface and Serial Identification
Transmitter Laser DC Bias Current
The 2-wire serial interface is explicitly defined in the
XFP MSA Rev 4.0. 2-wire timing specifications and the
structure of the memory map are per XFP MSA Rev 2.0.
The normal 256 Byte I2C address space is divided into
lower and upper blocks of 128 Bytes. The lower block
of 128 Bytes is always directly available and is used for
diagnostic information providing the opportunity for
Predictive Failure Identification, Compliance Prediction, Fault Isolation and Component Monitoring. The
upper address space tables are used for less frequently
accessed functions such as serial ID, user writeable EEPROM, reserved EEPROM and diagnostics and control
spaces for future standards definition, as well as Avago
Technologies-specific functions.
Laser bias current is measured using sensing circuitry
located on the transmitter laser driver IC. Normal variations in laser bias current are expected to accommodate
the impact of changing transceiver temperature and
supply voltage operating points. The AFCT-721XPDZ
uses a closed loop laser bias feedback circuit to maintain constant optical power over time at a given temperature. This circuit compensates for normal laser
parametric variations in quantum efficiency, forward
voltage and lasing threshold due to changing transceiver operating points.
Predictive Failure Identification
The diagnostic information allows the host system to
identify potential link problems. Once identified, a “fail
over” technique can be used to isolate and replace suspect devices before system uptime is impacted.
Compliance Prediction
The real-time diagnostic parameters can be monitored
to alert the system when operating limits are exceeded
and compliance cannot be ensured. As an example, the
real time average receive optical power can be used to
assess the compliance of the cable plant and remote
transmitter.
Fault Isolation
The diagnostic information can allow the host to pinpoint the location of a link problem and accelerate system servicing and minimize downtime.
Component Monitoring
As part of host system qualification and verification,
real time transceiver diagnostic information can be
combined with system level monitoring to ensure performance and operating environment are meeting application requirements.
Transceiver Module Temperature
The transceiver module temperature represents the
module case temperature. It is a calibrated value from
an internal PCB temperature measured using a sensing
circuitry.
Transmitted Average Optical Output Power
Variations in average optical power are not expected
under normal operation because the AFCT-721XPDZ
uses a closed loop laser bias feedback circuit to maintain constant optical power. This circuit compensates
for normal laser parametric variations due to changing
transceiver operating points. Only under extreme laser
bias conditions will significant drifting in transmitted
average optical power be observable. Therefore it is recommended Tx average optical power be used for fault
isolation, rather than predictive failure purposes.
Received Average Optical Input Power
Received average optical power measurements are a
valuable asset for installers to verify cable plant compliance. Drifts in average power can be observed from the
cable plant and remote transmitter for potential predictive failure use. Received average optical power can be
used for fault isolation.
Auxiliary Monitors
There are two auxiliary monitors implemented in the
AFCT-721XPDZ. One is the +3.3V supply voltage reported as Auxiliary Measurement 2. The other is the Module
PCB Temperature reported as Auxiliary Measurement
1. As there is no auxiliary type defined for Module PCB
Temperature, the auxiliary type for Laser Temperature
(0100b) is used in this case.
Mechanical Specifications
Package Dimensions
Figure 4a. Module Drawing
Figure 4b. Module Drawing
10
Figure 5. XFP host board mechanical layout
11
Host Board
Clip
Heat Sink
Cage Assembly
Connector
EMI Gasket
(not shown)
Bezel
Module
Figure 6. XFP Assembly Drawing
12
Application Support
Electrostatic Discharge (ESD)
An Evaluation Kit and Reference Designs are available
to assist in evaluation of the AFCT-721XPDZ. Please contact your local Field Sales representative for availability
and ordering details.
There are two conditions in which immunity to ESD
damage is important. Table 2 documents the ESD immunity to both of these conditions.
Regulatory Compliance
The transceiver Regulatory Compliance performance
is provided in Table 2 as a figure of merit to assist the
designer. The overall equipment design will determine
the certification level.
The first condition is static discharge to the transceiver
during handling such as when the transceiver is inserted into the transceiver port. To protect the transceiver,
it is important to use normal ESD handling precautions
including the use of grounded wrist straps, work benches, and floor mats in ESD controlled areas. The ESD sensitivity of the AFCT-721XPDZ is compatible with typical
industry production environments. The second condition is static discharge to the exterior
of the host equipment chassis after installation. To the
extent that the duplex LC optical interface is exposed
to the outside of the host equipment chassis, it may be
subject to system-level ESD requirements. The ESD performance of the AFCT-721XPDZ exceeds
typical industry standards. Table 2. Regulatory Compliance
Feature
Test Method
Performance
Electrostatic Discharge (ESD) to
the exterior of the XFP module
JEDEC JESD22-A114-B
500 Volts to the high speed pins, 2000 Volts
to the low speed pins
Electrostatic Discharge (ESD) to
the Duplex LC Receptacle
Variation of IEC 61000-4-2
Typically, no damage occurs with 25 kV when
the duplex LC connector receptacle is contacted by a Human Body Model probe.
Electrostatic Discharge (ESD) to
the Optical Connector
GR1089
10 contacts of 8 KV on the electrical
faceplate with device inserted into a panel.
Electrostatic Discharge (ESD) to
the Optical Connector
Variation of IEC 801-2
Air discharge of 15 kV(min) contact to
connector w/o damage
Electromagnetic Interference
(EMI)
FCC Class B
CENELEC EN55022 Class B
(CISPR 22A)
VCCI Class 1
System margins are dependent on
customer board and chassis design.
Immunity
Variation of IEC 61000-4-3
Less than 0.5 dB of Rx sensitivity
degradation and less than 10% margin reduction of Tx mask at 10 V/m, 10 MHZ to
1 GHz w/o chassis enclosure
Laser Eye Safety and
Equipment Type Testing
US FDA CDRH AEL Class 1
US21 CFR, Subchapter J per
Paragraphs 1002.10 and 1002.12.
CDRH accession # 951220
TUV certificate # R72071466
(IEC) EN60825-1: 1994 + A11+A2
(IEC) EN60825-2: 1994 + A1
(IEC) EN60950: 1992 + A1 + A2 + A3 + A4
+ A11
Component Recognition
13
Underwriters Laboratories and Canadian
Standards Association Joint Component
Recognition for Information Technology
Equipment Including Electrical Business
Equipment
UL file # E173874
Immunity
Caution
The transceivers have a shielded design to provide excellent immunity to radio-frequency electromagnetic
fields which may be present in some operating environments. The AFCT-721XPDZ contains no user serviceable parts. Tampering with or modifying the performance of
the AFCT-721XPDZ will result in voided product warranty. It may also result in improper operation of the
AFCT-721XPDZ circuitry, and possible overstress of
the laser source. Device degradation or product failure may result. Connection of the AFCT-721XPDZ to
a non-approved optical source, operating above the
recommended absolute maximum conditions may be
considered an act of modifying or manufacturing a
laser product. The person(s) performing such an act
is required by law to recertify and reidentify the laser
product under the provisions of U.S. 21 CFR (Subchapter J) and the TUV.
Electromagnetic Interference (EMI)
Most equipment designs using the AFCT-721XPDZ are
subject to the requirements of the FCC in the United
States, CENELEC EN55022 (CISPR 22) in Europe and VCCI
in Japan. The metal housing and shielded design of the
AFCT-721XPDZ minimizes EMI and provides excellent
EMI performance.
Eye Safety
The AFCT-721XPDZ transceivers provide Class 1 eye
safety by design. Avago Technologies has tested the
transceiver design for regulatory compliance, under
normal operating conditions and under single fault
conditions. See Table 2.
Flammability
The AFCT-721XPDZ is compliant to UL 94V-0.
Ordering Information
Please contact your local field sales engineer or one of
Avago Technologies franchised distributors for ordering information. For technical information, please visit
Avago Technologies’ WEB page at www.avagotech.com
or contact Avago Technologies Semiconductor Products Customer Response Center at 1-800-235-0312. For
information related to XFP MSA documentation visit
www.xfpmsa.org
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved.
AV02-1080EN - November 26, 2008