AFCT-711XPDZ Multi-rate 1310 nm XFP 10 Gbit/s Optical Transceiver Data Sheet Description Features The 1310 nm XFP transceiver is a high performance, cost effective module for serial optical data communications applications specified for signal rates of 9.95 Gb/s to 11.3 Gb/s. It is compliant to XFP MSA Rev 4.5. The module is designed for single mode fiber and operates at a nominal wavelength of 1310 nm. The transmitter section incorporates a directly modulated 1310 nm distributed feedback laser (DFB). The receiver section uses an MOVPE grown planar TEDET PIN photodetector for low dark current and excellent responsivity. Integrated Tx and Rx eye openers provide high jitter-tolerance and low jitter-generation and transfer for full XFI and SONET compliance. The internally AC coupled high speed serial I/O simplifies interfacing to external circuitry. The electrical interface is made using an industry standard 0.8 mm pitch 30-pin right angle connector. Optical connection is made via the duplex LC connector. • • • • Applications • Fibre Channel Switches • Host Bus Adapter Cards • Mass Storage System and Server I/O • Optical Cross Connect Switches - Next generation SONET/SDH ADMs - Core Routers Related Products • AFCT-721XPDZ: 10GbE/10GFC 1310nm XFP 10Gbit/s Optical Transceiver • AFBR-720XPDZ: 10GbE 850nm XFP 10Gbit/s Optical Transceiver • • • • • • • • • • • • RoHS-6 Compliant Supports 9.95Gb/s to 11.3Gb/s bit rates Compliant to XFP MSA Multi-protocol multi-bitrate - SONET/SDH OC-192/STM-64 rate 9.9532 Gb/s, Telcordia GR-253-CORE SR-1, ITU-T G.691 I64.1 - IEEE 802.3ae 10GBASE-LR for 10GbE, 10.3125 Gb/s - 10GFC 1310 nm Serial PMD, type 1200-SM-LL-L, 10.51875 Gb/s Uncooled 1310 nm DFB Laser and PIN Photodiode Compliant XFI 10G Serial electrical interface LC Duplex optical connector interface conforming to ANSI TIA/EIA604-10 (FOCIS 10) 1.5W typical power dissipation No Reference Clock required Superior Thermal and EMI performance to support high port densities Customizable clip-on heatsink to support a variety of line card environments -5 to +70 °C case operating temperature range Support XFI loopback 2-wire serial management interface provides real time monitors of: - Transmitted Optical Power - Received Optical Power - Laser Bias Current - Module Temperature - Supply Voltage Link Lengths up to 10 km with 9 µm SMF IEC 60825-1 Class 1/CDRH Class 1 laser eye safe The product offers digital diagnostics using the 2-wire serial interface defined in the XFP MSA. The product provides real time temperature (module and laser), supply voltage, laser bias current, laser average output power and received input power. The digital diagnostic interface also adds the ability to disable the transmitter (TX_DIS), power down the module, monitor for module faults and monitor for Receiver Loss of Signal (RX_LOS). Transmitter disable, interrupt, power down/reset, receiver loss of signal and module not ready are also hard wired pins on the 30-pin right angle connector. Installation The AFCT-711XPDZ is hot-pluggable, allowing the module to be installed while the host system is operating and on-line. The attach heatsink is designed to clip on to the XFP cage without a module present. Upon insertion, the transceiver housing makes initial contact with the host board XFP cage, mitigating potential damage due to Electro-Static Discharge (ESD). Once fully inserted into the XFP cage, the top surface of the XFP module makes contact with the heatsink through a cutout in the top of the cage ensuring an effective thermal path for module heat. Functional Description Transmitter Section The transmitter section includes a 1310 nm DFB (Distributed Feedback Laser) light source, a transmitter driver circuit and a signal conditioner circuit on the TX data inputs. (See Figure 1) Optical connection to the transmitter is provided via a LC connector. The optical output is controlled by a custom IC that detects the laser output via the monitor photodiode. This IC provides both dc and AC current drive to the laser to ensure correct modulation, eye diagram and extinction ratio over temperature, supply voltage and operating life. TX_DIS Asserting pin 5, TX_DIS, will disable the transmitter optical output. The transmitter output can also be disabled and monitored via the two-wire serial interface. Eye Safety Circuit Under normal operating conditions laser power will be maintained below Class 1 eye-safety limits. Heat sink RF driver Optical isolator Mon. PIN CW driver Th Power supply control PIN TIA ROSA Main housing Figure 1. Transceiver Functional Diagram Analog signal conditioners Optical receptacles D/A TOSA Eye opener (CDR) ESA Digital 10 Gb/s electrical signal EEPROM Micro controller A/D Eye opener (CDR) Digital low speed bus or signal Electrical connector Laser Analog low speed signal +3.3V Receiver Section Host Board The receiver section includes a PIN detector with amplification, quantization and signal conditioner circuits. (See Figure 1) Optical connection to the receiver is provided via a LC optical connector. 0.1 µF Host +3.3 V RX_LOS 0.1 µF The receiver section contains a loss of signal (RX_LOS) circuit to indicate when the optical input signal power is insufficient for reliable signal detection. A high signal indicates loss of modulated signal, indicating link failure such as a broken fiber or nonfunctional remote transmitter. RX_LOS can also be monitored via the two-wire serial interface (byte 110, bit 1). Optional Host +1.8 V 0.1 µF Optional Host -5.2 V 0.1 µF Functional Data I/O 4.7 µH 22 µF 4.7 µH 22 µF 4.7 µH 22 µF 0.1 µF VCC 3 0.1 µF VCC 2 0.1 µF VEE 5 0.1 µF Figure 2. MSA Recommended Power Supply Filter Electrical Pinout Top surface of edge connector on module Bottom surface of edge connector on module GND 15 16 GND RX_LOS 14 17 RD- MOD_NR 13 18 RD+ MOD_ABS 12 19 GND SDA 11 20 VCC2 SCL 10 21 P_DOWN/RST VCC3 9 22 VCC2 VCC3 8 23 GND GND 7 24 REFCLK+ VCC5 6 25 REFCLK- TX_DIS 5 26 GND INTERRUPT 4 27 GND MOD_DESEL 3 28 TD- VEE5 2 29 TD+ GND 1 30 GND Figure 3. Host PCB XFP Pinout Top View 22 µF VCC 5 GND Avago Technologies’ AFCT-711XPDZ fiber-optic transceiver is designed to accept industry standard electrical input differential signals. The transceiver provides AC-coupled, internally terminated data input and output interfaces. Bias resistors and coupling capacitors have been included within the module to reduce the number of components required on the customer’s board. TOWARD ASIC 4.7 µH XFP Connector Optional Host +5 V TOWARD BEZEL XFP Module Table 1. Electrical Pin Definitions Pin Name Function/Description Notes 1 GND Logic Module Ground 1 2 VEE5 -5.2 V power supply. (Not Used) 3 Mod-Desel LVTTL-I Module De-select; When held low allows the module to respond to 2wireSerial interface commands 4 4 Interrupt LVTTL-O Interrupt; Indicates presence of an important condition which can be read over the serial 2-wire interface 2 5 TX_DIS LVTTL-I Transmitter Disable; Transmitter Laser Source Turned Off 4 6 VCC5 5 V power supply. (Not Used) 7 GND Module Ground 8 VCC3 +3.3 V Power Supply 9 VCC3 +3.3 V Power Supply 10 SCL LVTTL-I Two Wire Interface Clock 2 11 SDA LVTTL-I/O Two Wire Interface Data Line 2 12 Mod_Abs LVTTL-O LVTTL-O Mod_Abs Indicates Module is not present. Grounded in the Module 2 13 Mod_NR LVTTL-O Module Not Ready; Indicating Module Operational Fault 2 14 RX_LOS LVTTL-O Receiver Loss Of Signal Indicator 2 15 GND Module Ground 1 16 GND Module Ground 1 17 RD- CML-O Receiver Inverted Data Output 18 RD+ CML-O Receiver Non-Inverted Data Output 19 GND Module Ground 20 VCC2 +1.8 V Power Supply (Not Used) 21 P_Down/RST 22 VCC2 23 GND 24 RefCLK+ PECL-I Reference Clock Non-Inverted Input, AC coupled on the host board (Not 3 Used) 25 RefCLK- PECL-I Reference Clock Inverted Input, AC coupled on the host board (Not Used) 3 26 GND Module Ground 1 27 GND Module Ground 1 28 TD- CML-I Transmitter Inverted Data Input 29 TD+ CML-I Transmitter Non-Inverted Data Input 30 GND LVTTL-I 1 Power down: When high, the module is put into a low power mode. Se- 4 rial interface is functional in the low power mode. Reset: The falling edge initiates a complete reset of the module including the serial Interface, equivalent to a power cycle. +1.8 V Power Supply (Not Used) Module Ground Module Ground Notes: 1. Module ground pins Gnd are isolated from the module case and chassis ground within the module. 2. Open Collector should be pulled up with 4.7kΩ to 10kΩ to a voltage between 3.15 V and 3.6 V on the host board. 3. RefCLK+/- are internally terminated (50Ω) 4. Pulled up to Vcc3 via 4.7-10kΩ resistor inside the module 1 1 1 Absolute Maximum Ratings Parameter Symbol Minimum Maximum Unit Notes Storage Temperature (non-operating) TS -40 Typical +85 °C 1, 2, 3 Ambient Operating Temperature TA -40 +85 °C 1, 2, 3 Relative Humidity RH 10 90 % 1 Supply Voltage VCC3 3.6 V 1, 2 Low Speed Input Voltage VIN -0.5 VCC+0.5 V 1 Parameter Symbol Minimum Maximum Unit Notes Case Operating Temperature TC -5 +70 °C 3 Supply Voltage VCC3 3.135 3.465 V 5 9.95 11.3 Gb/s Recommended Operating Conditions [4] Data Rate Typical Transceiver Electrical Characteristics (TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%) Parameter Symbol Power Supply Noise Rejection (peak-peak) under 1MHz Maximum Unit Notes PSNR 2% of VCC mV 6 Power Supply Noise Rejection (peak-peak) 1MHz to 10 MHz PSNR 3% of VCC mV 6 Module supply current ICC 425 605 (EOL) mA Power Dissipation PDISS 1410 2100 (EOL) mW Low Speed Outputs: MOD_NR, RX_LOS, MOD_ABS, INTERRUPT VOH VOL Host_VCC-0.5 0.0 Host_VCC+0.3 0.4 V V 7 8 VIH VIL 2.0 -0.5 VCC3+0.3 0.8 V V 10 9 Low Speed Inputs: TX_DIS, MOD_DESEL, P_DOWN/RST Minimum Typical Notes: 1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded for other than a short period of time. See Reliability Data Sheet for specific reliability performance. 2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability is not implied, and damage to the device may occur over an extended period of time. 3. The Ambient Operating Temperature limitations are based on the Case Operating Temperature limitations and are subject to the host system thermal design. 4. Recommended Operating Conditions are those values for which functional performance and device reliability is implied 5. Vcc condition applies to supply voltage at the XFP module 6. Power Supply filtering on host board required as per XFP MSA specification 7. 4.7 kW to 10 kW resistor pull-up to host_VCC, measured at the host side of connector. IOH(max) = - 2 mA. 8. 4.7 kW to 10 kW resistor pull-up to host_VCC, measured at the host side of connector. IOL(max) = 2 mA. 9. 4.7 kW to 10 kW resistor pull-up to host_VCC, measured at the host side of connector. IIL(max) = 10 µA. 10.4.7 kW to 10 kW resistor pull-up to host_VCC, measured at the host side of connector. IIH(max) = - 10 µA. Transmitter Electrical Input Characteristics (TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%) Parameter Symbol Differential Input Impedance Zd Minimum Termination Mismatch DZM Differential Input Amplitude DVQDO 120 Differential Input Return Loss SDD11 Differential Input Return Loss SDD11 Differential Input Return Loss Typical Maximum Unit Notes W 100 5 % 820 mV peak to peak (1) 20 dB 0.05 to 0.1 GHz 8 dB 0.1 to 5.5 GHz SDD11 8 - 20.66 log10(f/5.5), f in GHz dB 5.5 - 12 GHz Common Mode Input Return Loss SCC11 3 dB 0.1 to 12 GHz Differential to Common Mode Conversion SCD11 10 dB 0.1 to 12 GHz Jitter and Eye Mask XFP MSA Compliant Receiver Electrical Output Characteristics Parameter Symbol Differential Output Impedance Zd Termination Mismatch DZM Differential Output Amplitude DVQDO DC Common Mode Potential Vcm Minimum Typical Maximum Unit 5 % 340 850 mV 0 3.6 V 15 mV Output AC Common Mode Voltage Notes W 100 peak to peak (1) RMS Output Rise/Fall time (20% to 80%) tr, tf 24 ps Common mode output return loss SCC22 3 dB 0.1 to 12 GHz Differential output return loss SDD22 20 dB 0.05 to 0.1 GHz Differential output return loss SDD22 8 dB 0.1 to 5.5 GHz Differential output return loss SDD22 8 - 20.66 log10(f/5.5) f in GHz dB 5.5 to 12 GHz Jitter and Eye Mask Notes: 1. The differential input and output amplitudes are per XFP MSA Rev 4.5 mask at points B’ and C’. XFP MSA Compliant Transmitter Optical Characteristics 10 GbE/10GFC (TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%) Parameter Symbol Minimum Optical Output Power Pout -5.2 Average Optical Output Power Pout -8.2 Extinction Ratio ER 3.5 Spectral Width - rms s, rms Center Wavelength lC Transmitter and dispersion penalty TDP 1260 Typical Maximum Unit Notes dBm OMA 1, 2 dBm 1, 2 dB 1, 2 0.2 nm RMS 3 1355 nm 3.2 dB 1, 2 0.5 1310 Side mode suppression ratio 30 dB 1 Optical output power (min) in OMA - TDP -6.2 dBm OMA 1, 2 -128 dB/Hz 1 Maximum Unit Notes 0.5 dBm mean 1 -10.3 dBm OMA 1 -12.6 dBm OMA 3 -12 dB 1 1355 nm RIN12 (OMA) RIN Optical eye mask Compliant with IEEE 802.3ae 10GBASE-LR Receiver Optical Characteristics 10 GbE/10GFC (TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%) Parameter Symbol Average Receive power Minimum Typical -14.4 Stressed receiver sensitivity Receiver sensitivity PIN Max Receiver Reflectance Wavelength Jitter Tolerance Compliant with XFP MSA Rev 4.5 lC 1260 1310 Transmitter Optical Characteristics OC-192 SONET SR-1 (TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%) Parameter Symbol Minimum Optical Output Power PO -6 Typical Maximum Unit Notes -1 dbm 4 Extinction Ratio ER 6 Spectral Width @ 20 dB s Center Wavelength lC 1290 Side mode suppression ratio SMSR 30 Output Optical Eye Mask Compliant with Telcordia GR-253-CORE, ITU-T G.691 Jitter Generation (peak-to-peak) 20kHz – 80MHz 4MHz – 80MHz Tjpp Jitter Transfer Compliant with XFP MSA dB 1310 1 nm 1330 nm 5 dB 0.3 0.1 UIpp UIpp 6 Notes: 1. 10GFC 1200-SM-LL-L / IEEE 802.3ae 10GBASE-LR compliant 2. These parameters are interrelated: see IEEE 802.3ae 3. For information only 4. The output power is coupled into a 1 m single mode fiber. Minimum output optical level is at end of life. 5. Measured 20 dB down from the maximum of the central wavelength peak 6. Supports compliance to both GR-253-CORE and ITU-T G.783 specifications. Receiver Optical Characteristics OC-192 SONET SR-1 (TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%) Parameter Symbol Receiver sensitivity PIN (MIN) Receiver overload PIN (MAX) Minimum Max Receiver Reflectance Input Operating Wavelength 1290 Typical Maximum Unit Notes -18.1 (BOL, ER =6 dB) -11 dBm 1 -1 dBm 1 -14 dB 1330 nm Jitter Tolerance Compliant with GR-253 and ITU-T G.783 masks. Jitter Transfer Compliant with XFP MSA. Notes: 1. BER no worse than 1x10-12 Transceiver Timing Characteristics (TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%) Parameter Symbol Max Unit Notes TX_DIS Assert Time t_off 20 µs Time from rising edge of TX_DIS to when the optical output falls below 10% of nominal. TX_DIS Negate Time t_on 2 ms Time from falling edge of TX_DIS to when the modulated optical output rises above 90% of nominal. Time to initialize t_init 300 ms From power on or hot plug after meeting power supply specs Interrupt assert delay Interrupt_on 200 ms From occurrence of the condition triggering interrupt Interrupt negate delay Interrupt_off 500 us From clear on read interrupt flags P_Down/RST assert delay P_Down/RST_on 100 us From Power down initiation P_Down negate delay P_Down/RST_off 300 ms Max delay from negate to completion of power up and reset Mod_NR assert delay Mod_nr_on 1 ms From Occurrence of fault to assertion of MOD_NR Mod_NR negate delay Mod_nr_off 1 ms From Occurrence of signal to negation of MOD_NR Mod_DeSel assert time T_Mod_DeSel 2 ms Maximum delay between assertion ofMod_DeSel and end of module response to 2-wire interface communications Mod_DeSel de-assert time T_Mod_Sel 2 ms Maximum delay between de-assertion of Mod_DeSel and proper module response to 2-wire interface communications P_Down reset time t_reset RX_LOS Assert delay T_loss_on RX_LOS negate delay T_loss_off Serial ID Clock Rate f_serial_clock Min 10 µs Min length of P-Down assert to initial reset 100 µs From Occurrence of loss of signal to assertion of RX_LOS 2.3 100 µs From Occurrence of presence of signal to negation of RX_LOS 0 400 kHz Digital Diagnostic Interface and Serial Identification Transmitter Laser DC Bias Current The 2-wire serial interface is explicitly defined in the XFP MSA document and is designed to be compatible with I2C host controllers. 2-wire timing specifications and the structure of the memory map are per XFP MSA Rev 4.0. The normal 256 Byte I2C address space is divided into lower and upper blocks of 128 Bytes. The lower block of 128 Bytes is always directly available and is used for diagnostic information providing the opportunity for Predictive Failure Identification, Compliance Prediction, Fault Isolation and Component Monitoring. The upper address space tables are used for less frequently accessed functions such as serial ID, user writeable EEPROM, reserved EEPROM and diagnostics and control spaces for future standards definition, as well as Avago Technologies specific functions. Laser bias current is measured using sensing circuitry located on the transmitter laser driver IC. Normal variations in laser bias current are expected to accommodate the impact of changing transceiver temperature and supply voltage operating points. The AFCT-711XPDZ uses a closed loop laser bias feedback circuit to maintain constant optical power and extinction ratio. This circuit compensates for normal laser parametric variations in quantum efficiency, forward voltage and lasing threshold due to changing transceiver operating points. Predictive Failure Identification The diagnostic information allows the host system to identify potential link problems. Once identified, a “fail over” technique can be used to isolate and replace suspect devices before system uptime is impacted. Compliance Prediction The real-time diagnostic parameters can be monitored to alert the system when operating limits are exceeded and compliance cannot be ensured. As an example, the real time average receive optical power can be used to assess the compliance of the cable plant and remote transmitter. Fault Isolation The diagnostic information can allow the host to pinpoint the location of a link problem and accelerate system servicing and minimize downtime. Component Monitoring As part of host system qualification and verification, real time transceiver diagnostic information can be combined with system level monitoring to ensure performance and operating environment are meeting application requirements. Transceiver Module Temperature The transceiver module temperature represents the module case temperature. It is a calibrated value from an internal PCB temperature measured using a sensing circuitry. 10 Transmitted Average Optical Output Power Variations in average optical power are not expected under normal operation because the AFCT-711XPDZ uses a closed loop laser bias feedback circuit to maintain constant optical power over time at a given temperature. This circuit compensates for normal laser parametric variations due to changing transceiver operating points. Only under extreme laser bias conditions will significant drifting in transmitted average optical power be observable. Therefore it is recommended Tx average optical power be used for fault isolation, rather than predictive failure purposes. Received Average Optical Input Power Received average optical power measurements are a valuable asset for installers to verify cable plant compliance. Drifts in average power can be observed from the cable plant and remote transmitter for potential predictive failure use. Received average optical power can be used for fault isolation. Auxiliary Monitors There are two auxiliary monitors implemented in AFCT711XPDZ. One is the +3.3V supply voltage reported as Auxiliary Measurement 2. The other is the Module PCB temperature reported as Auxiliary Measurement 1. As there is no auxiliary type defined for Module PCB Temperature, auxiliary type for Laser Temperature (0100b) is used in this case. Host Board Clip Heat Sink Cage Assembly Connector EMI Gasket (not shown) Bezel Module Figure 4. XFP Assembly Drawing 11 Mechanical Specifications Package Dimensions Figure 5a. Module Drawing Figure 5b. Module Drawing 12 Figure 6. XFP host board mechanical layout 13 Application Support An Evaluation Kit and Reference Designs are available to assist in evaluation of the AFCT-711XPDZ. Please contact your local Field Sales representative for availability and ordering details. Regulatory Compliance The transceiver Regulatory Compliance performance is provided in Table 2 as a figure of merit to assist the designer. The overall equipment design will determine the certification level. Electrostatic Discharge (ESD) There are two conditions in which immunity to ESD damage is important. Table 2 documents the ESD immunity to both of these conditions. The first condition is static discharge to the transceiver during handling such as when the transceiver is inserted into the transceiver port. To protect the transceiver, it is important to use normal ESD handling precautions including the use of grounded wrist straps, work benches, and floor mats in ESD controlled areas. The ESD sensitivity of the AFCT-711XPDZ is compatible with typical industry production environments. The second condition is static discharge to the exterior of the host equipment chassis after installation. To the extent that the duplex LC optical interface is exposed to the outside of the host equipment chassis, it may be subject to system-level ESD requirements. The ESD performance of the AFCT-711XPDZ exceeds typical industry standards. Immunity The transceivers have a shielded design to provide excellent immunity to radio-frequency electromagnetic fields which may be present in some operating environments. Electromagnetic Interference (EMI) Most equipment designs using the AFCT-711XPDZ are subject to the requirements of the FCC in the United States, CENELEC EN55022 (CISPR 22) in Europe and VCCI in Japan. The metal housing and shielded design of the AFCT-711XPDZ minimizes EMI and provides excellent EMI performance. Table 2. Regulatory Compliance Feature Test Method Performance Electrostatic Discharge (ESD) to the exterior of the XFP module JEDEC JESD22-A114-B 1000 Volts Electrostatic Discharge (ESD) to the Optical Connector GR1089 10 discharges of both polarities of 8 KV on the electrical faceplate with device inserted into a panel. Electrostatic Discharge (ESD) to the Optical Connector Variation of IEC 801-2 Air discharge of 15 kV(min) contact to connector w/o damage Electromagnetic Interference (EMI) FCC Class B CENELEC EN55022 Class B (CISPR 22A) VCCI Class 1 System margins are dependent on customer board and chassis design. Immunity Variation of IEC 61000-4-3 Less than 0.5 dB of Rx sensitivity degradation and less than 10% margin reduction of Tx mask at 10 V/m, 10 MHZ to 1 GHz w/o chassis enclosure Laser Eye Safety and Equipment Type Testing US FDA CDRH AEL Class 1 US21 CFR, Subchapter J per Paragraphs 1002.10 and 1002.12. CDRH certification # 9521220-100 TUV Certificate # R72071466 (IEC) EN60825-1: 1994 + A11+A2 (IEC) EN60825-2: 1994 + A1 (IEC) EN60950: 1992 + A1 + A2 + A3 + A4 + A11 Component Recognition 14 Underwriters Laboratories and Canadian Standards Association Joint Component Recognition for Information Technology Equipment Including Electrical Business Equipment UL file # E173874 Eye Safety Caution The AFCT-711XPDZ transceivers provide Class 1 eye safety by design. Avago Technologies has tested the transceiver design for regulatory compliance, under normal operating conditions and under single fault conditions. See Table 2. The AFCT-711XPDZ contains no user serviceable parts. Tampering with or modifying the performance of the AFCT-711XPDZ will result in voided product warranty. It may also result in improper operation of the AFCT711XPDZ circuitry, and possible overstress of the laser source. Device degradation or product failure may result. Connection of the AFCT-711XPDZ to a non-approved optical source, operating above the recommended absolute maximum conditions may be considered an act of modifying or manufacturing a laser product. The person(s) performing such an act is required by law to recertify and reidentify the laser product under the provisions of U.S. 21 CFR (Subchapter J) and the TUV. Flammability The AFCT-711XPDZ is compliant to UL 94V-0. Customer Manufacturing Processes The module is pluggable and is not designed for aqueous wash, IR reflow or wave soldering processes. Ordering Information Please contact your local field sales engineer or one of Avago Technologies franchised distributors for ordering information. For technical information, please visit Avago Technologies ’ WEB page at www.avagotech.com. For information related to XFP MSA documentation visit www. xfpmsa.org For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. AV02-1079EN - November 26, 2008