BOOKHAM IGF

Data Sheet
XFP Optical Transceivers for 40km
10G Datacom & Storage Applications
IGF Series
IGF-17511J
Features:
The Bookham IGF Series optical transceiver modules are highperformance, cost-effective modules for serial optical data
communication applications at 10Gb/s. The IGF-17511J is
designed to provide 10Gb/s Ethernet for 40km compliant links.
The modules are designed for single mode fibre and operate at
a nominal wavelength of 1550nm.
The modules aid system hardware engineers in implementing
low-cost single mode PMD solutions, which are protocol
transparent. The “hot pluggable” feature built into every module
reduces manufacturing cost, inventory costs and allows optical
port upgrades at the customer premises. Built-in remote
monitoring via digital diagnostics allows user access to static
and dynamic data as well as module condition.
The IGF-17511J uses an Externally Modulated Laser (EML)
packaged in conjunction with an optical isolator for excellent
back reflection performance. The Bookham IGF series of
modules have been extensively tested utilizing industry standard
single mode fibers in order to ensure compatibility with
enterprise, access and metro systems.
• Compliant IEEE802.3 10G Ethernet
(10GBASE-ER/EW) 10GFC INCITS Project 1413-D
• Compliant with the XFP MSA
• Ultra small form factor
• 10Gb/s serial operation
• Hot Pluggable
• Supports 40km link distances
• Integrated PIN receiver technology
• Data rates from 9.9Gb/s to 10.52Gb/s
• XFI electrical interface
• On board Enhanced Digital Diagnostics providing I2C
remote monitoring capability
• Typically less than 3.0 W power dissipation
• Integral Signal Conditioning ICs enabling FR4 host
board PCB traces up to 8 inches
• Duplex LC connector
• Low EMI
• Transmit disable and loss-of-signal functions
• RoHS compliant
Applications:
• 10Gb/s Gigabit Ethernet 10GBASE-ER/EW,
10G Fibre Channel
• Client side interconnection
• Inter-office connections
1
Data Sheet
Absolute maximum ratings
Parameter
Symbol
Min
Max
Units
Tstg
-40
85
°C
Supply voltage 5
VCC5
0
6
V
Supply voltage 3
VCC3
0
4.0
V
Supply voltage 2
VCC2
0
2.2
V
Supply voltage E5
VEE5
0
-6
V
Data AC volt. differential
Tx+, Tx-
-0.5
2
Vpp
Data DC volt.
Tx+, Tx-
0
VCC2
Vpp
Optical Damage Threshold
PDamage
+5
dBm
Storage Temp
Notes
[1]
[1] VEE5 supply is not used – if voltage is applied to these pins it must be within the limits specified
Recommended operating conditions
Parameter
Symbol
Baud rate
Min
Typ
Max
Units
Notes
10.5
GBd
STM-64/OC192;
G.709; 10 GbE;
5.0
5.25
V
350
550
mA
3.3
3.47
V
90
200
mA
1.8
1.89
V
750
mA
Supplies TEC,
current draw
depends on temp [1]
V
[2]
3.5
W
[3]
70
°C
9.95
4.75
Supply voltage 5
VCC5
Supply current 5
ICC5
Supply voltage 3
VCC3
Supply current 3
ICC3
Supply voltage 2
VCC2
Supply current2
ICC2
50
Supply voltage
VEE5
-5.2
Power dissipation
Pw
2.3
Temperature case
Tcase
E5
3.13
1.71
-5
Please contact sales for special requirements
[1] Typical figures for supply current and power dissipation represent start-of-life 40C.
Max figures for supply currents and power dissipation are worst case, end-of-life, over
temperature.
Currents are quiescent values and exclude inrush.
[2] VEE5 supply is not used – if voltage is applied to these pins it must be within the limits specified.
[3] Maximum currents from each supply rail not all present simultaneously.
2
[1]
[1]
Data Sheet
Operating Specifications – electrical
Tcase = -5oC to +70oC
Parameter
Symbol
Value
Typical
Min
Units
Notes
Max
CML input (differential)
VTxDiff
150
900
mVpp
100 ohm differential
CML output (differential)
VRxDiff
360
770
mVpp
100 ohm differential
Tr/Tf
24
ps
20% - 80%
VOH
VOL
2
0
Rise/Fall time
Loss of signal
Output voltage high
Output voltage low
VCC3+0.3
0.8
V
V
100
100
µs
µs
Loss of signal timing
Input voltage high
Input voltage low
TA
TD
Tx_Disable High
VDH
2
VCC3+0.3
V
Tx_Disable Low
VDL
0
0.8
V
Transmitter operating specifications – optical
Tcase = -5oC to +70oC
Parameter
Value
Typical
Max
1550
1565
nm
+2.0
dBm
Center wavelength
λc
1530
Optical transmit power
Po
-1.0
Side mode suppression
SMSR
30
dB
ER
8.2
dB
Extinction ratio
Optical path penalty
Output optical eye
3
Units
Min
Symbol
OPP
2
dB
Notes
EOL
800 ps/nm disp.
Compliant with IEEE 802.3æ and 10GFC INCITS Project 1413-Deye mask
Data Sheet
Receiver operating specifications – optical
Tcase = -5oC to +70oC
Parameter
Symbol
Min
λ
Input operating wavelength
Receiver sensitivity
Value
Typical
1290
Units
1565
nm
PIN-MIN
-19.0
-15.8
dBm
Stressed receiver sensitivity in OMA
SRS
-13.5
-11.4
dBm
[1]
Maximum input power (overload)
PIN-MAX
dBm
Ave. power
+2
Reflectance
-27
dB
-19
dBm
-17
dBm
6
dB
Loss of Signal
Loss of Signal Assert (Off to On)
PA
Loss of Signal Deassert (On to Off)
PD
Hysteresis
PA - PD
[1] BER 1E-12 used for Rx sensitivity measurements.
4
Notes
Max
-32
0.5
Ave. power
at ER=8.2dB[1]
Data Sheet
Electrical pin out
Bottom of Board as
viewed through top
of board
Top of Board
1 GND
GND
30
2 VEE5
TD+
29
3 Mod_Desel
TD-
28
4 Interrupt
GND
27
5 TX_DIS
GND
26
6 VCC5
RefCLK-
25
7 GND
RefCLK+
24
8 VCC3
GND
23
9 VCC3
VCC2
22
10 SCL
P_down/RST
21
11 SDA
VCC2
20
12 Mod_Abs
GND
19
13 Mod_NR
RD+
18
14 Rx_LOS
RD-
17
15 GND
GND
16
Figure 1: XFP Module Board Pinout & Names
5
1
GND
2
VEE5
3
Mod_Desel
4
Interrupt
5
TX_DIS
6
VCC5
7
GND
8
VCC3
9
VCC3
GND
30
TD+
29
TD-
28
GND
27
GND
26
RefCLK-
25
RefCLK+
24
GND
23
VCC2
22
P_down/RST
21
VCC2
20
GND
19
RD+
18
RD-
17
GND
16
10 SCL
11 SDA
12 Mod_Abs
13 Mod_NR
14 Rx_LOS
15 GND
Towards Bezel
Towards ASIC
Figure 2: Host Board Connector Pinout Top View
Data Sheet
Pin definitions
Pin #
Symbol
Function
Plug Seq
Notes
1
GND
Module Ground; Signal Ground
1
1
2
VEE5
Optional -5.2V Power Supply
2
Mod_Desel
Module De-select; When held low by host allows the module to
respond to 2-wire serial interface commands
3
Interrupt_BAR; Indicates the presence of an important condition
that can be read over the two wire interface
3
TX_DIS
Transmitter Disable; Turns Off Transmitter Laser Source
3
6
VCC5
+5V Power Supply
2
7
GND
Module Ground; Signal Ground
1
8
VCC3
+3.3V Power Supply
2
9
VCC3
+3.3V Power Supply
2
3
4
5
LVTTL-I
LVTTL-O
LVTTL-I
Interrupt
2
1
10
LVTTL-I
SCA
Two Wire Interface Clock
3
2
11
LVTTL-I/O
SDA
Two Wire Interface Data Line
3
2
12
LVTTL-O
Mod_Abs
Indicates Module Not Present; Grounded in Module
3
2
13
LVTTL-O
Mod_NR
Module Not Ready or Indicating Module Operational Fault
3
2
14
LVTTL-O
RX_LOS
Receiver Loss of Signal Indicator
3
2
15
GND
Module Ground; Signal Ground
1
1
16
GND
Module Ground; Signal Ground
1
1
17
CML-O
RD-
Receiver Inverted Data Output
3
18
CML-O
RD+
Receiver Non-Inverted Data Output
3
19
GND
Module Ground; Signal Ground
1
20
VCC2
+1.8V Power Supply
2
P_down/RST
Power down; When high, places the module in the low power
standby mode of less than 1.5W with 2-wire interface
still operational.
Reset; The falling edge of P_Down/RST initiates a complete
module reset including the 2-wire interface.
3
21
LVTTL-I
1
22
VCC2
+1.8V Power Supply
2
23
GND
Module Ground; Signal Ground
1
1
24
PECL-I
RefCLK+
Reference Clock Non-Inverted Input, AC coupled on Host Board
3
3
25
PECL-I
RefCLK-
Reference Clock Inverted Input, AC coupled on Host Board
3
3
26
GND
Module Ground; Signal Ground
1
1
27
GND
Module Ground; Signal Ground
1
1
28
CML-I
TD-
Transmitter Inverted Data Input
3
29
CML-I
TD+
Transmitter Non-Inverted Data Input
3
GND
Module Ground; Signal Ground
1
30
6
Logic
[1] Module ground pins are isolated from the module case and chassis ground within the module.
[2] Open Collector should be pulled up with 4.7K-10Kohms to a voltage between 3.15V and 3.6V on the host board.
[3] Reference clock is required for IGF-17511J.
1
Data Sheet
Figure 3. Host Board Supply Filtering
Figure 4. Host Board mechanical layout (mm)
7
Data Sheet
Mechanical interface
The XFP module is a pluggable module with its foundation based on the successful SFP package configuration It consists of a
rectangular package that is approximately 18mm wide and 78mm long. The module interface is a 30 lead connector. The module
is inserted into a metal cage assembly.
Figure 5. Example of clip-on heat sink
Thermal interface
One of the unique features of the XFP module is that the module cage is designed with the ability to accommodate a clip-on
thermal heat sink, as shown in Figure 5, to enhance the cooling of the module. Thus the equipment manufacturer that designs
with the XFP can select a heat sink that is optimized for the particular environmental conditions of vertical space above module,
air flow, air-flow direction and desired pressure drop.
Figure 6. Mechanical Dimensions (mm) of the XFP module.
8
Data Sheet
Figure 7. Interface Design with Bezel (mm)
Management Interface
Digital diagnostics is available on all Bookham XFP
transceivers. A 2-wire Serial ID interface provides user access
to vendor/module identification, customer specific data, link
type, static and dynamic monitor hooks, and a check code
mechanism for verifying accuracy in the data registers. These
“static” and “dynamic” diagnostics allow users to remotely and
accurately identify modules and their vendors, make
determinations about its compatibility with the system, verify
which “Enhanced” diagnostics are supported, and monitor
module parameters to determine the module and link
condition.
The module’s “Enhanced Digital Diagnostics” features provide
real-time monitoring of receiver input power, transmitter power,
internal module temperature, laser bias current, and supply
voltage parameters.
The 2-wire serial ID interface was originally defined by the GBIC
(GigaBit Interface Converter) and SFF-8472 specifications.
The XFP MSA (Multi-Source Agreement) document further
defined the diagnostics features and introduced a new
memory map of the diagnostic information. This interface is a
2-wire interface that allows read-only access to separate
memory locations.
The memory location starting at A0h (data address 0 ~ 127)
contains the Digital Diagnostic Functions.
The normal 256 Byte I2C address space is divided into lower
and upper blocks of 128 Bytes. The lower block of 128 Bytes
is always directly available and is used for the diagnostics and
control functions that must be accessed repeatedly. One
9
exception to this is that the standard module identifier Byte
defined in the GBIC and SFP is located in Byte 0 of the
memory map (in the diagnostics space) to allow software
developed for multiple module types to have a common
branching decision point. This Byte is repeated in the Serial ID
section so that it also appears in the expected relationship to
other serial ID bits.
Multiple blocks of memories are available in the upper 128
Bytes of the address space. These are individually addressed
through a table select Byte which the user enters into a
location in the lower address space. Thus, there is a total
available address space of 128 * 256 = 32Kbytes in this upper
memory space. The upper address space tables are used for
less frequently accessed functions such as serial ID, user
writable EEPROM, reserved EEPROM and diagnostics and
control spaces for future standards definition, as well as ample
space for vendor specific functions. These are allocated as
follows:
• Table 01h: Serial ID EEPROM
• Table 02h: User writable EEPROM
The details of each memory space are found in the XFP MSA
specification Chapter 5.
Reference Documents:
1. XFP MSA revision 4.0, INF-8077i, “10 Gigabit Small Form
Factor Pluggable Module” found at www.xfpmsa.org; April 13,
2004.
Data Sheet
Regulatory compliance
Bookham IGF-3000 Series 1550 nm XFP transceivers are designed to be Class 1 Laser compliant. They are certified per the
following standards:
Feature
Laser Safety
Agency
Standard
Certificate/Comments
FDA/CDRH
CDHR 21(J) CFR 1040.10
0520196-02
US-TUVR-3130
TÜV
IEC/EN 60950-1:2001
IEC/EN 60825-1/A2:2001
CAN/CSA-60825-1-03
CU72060154
CAN/CSA-C22.2 No. 60950-1-03
UL 60950-1:2003 UL 94 V-0
U8V 06 06 54880 002
Component Safety
UL/CSA
ESD
IEC
MIL-STD-883 Method 3015
Part 15 Class B
FCC Class B margin = 46.0 dBuV/m
[EU Directive]
EN55022, EN55024 Class B
EN55022 Class B margin
= 15.9 dBuV/m
EU Directives
73/23/EEC (Low voltage)
89/336/EEC (EMC)
Pass
FCC/89/336/EE
EMI
CE
Pass
IEC61000-4-2
This product meets the requirements of the relevant EMC standards (EN 55022, EN 55024, FCC Part 15). However the
EMC performance of the product within the host system may depend on characteristics of the host system over which
Bookham has no control. It may therefore be necessary to ensure that the host system provides adequate grounding &
shielding of the product.
10
Data Sheet
RoHS Compliance
Bookham is fully committed to environment
protection and sustainable development and has
set in place a comprehensive program for
removing polluting and hazardous substances from
all of its products. The relevant evidence of RoHS
compliance is held as part of our controlled
documentation for each of our compliant products.
RoHS compliance parts are available to order,
please refer to the ordering information section for
further details.
Ordering Information:
TRx 10G 40KM XFP GE COM
IGF-17511J
Contact Information
North America
Bookham Worldwide
Headquarters
Europe
Paignton Office
Asia
Shenzhen Office
2584 Junction Ave.
San Jose
CA 95134
USA
Brixham Road
Paignton
Devon
TQ4 7BE
United Kingdom
2 Phoenix Road
Futian Free Trade Zone
Shenzhen 518038
China
• Tel: +1 408 919 1500
• Tel: +44 (0) 1803 66 2000
• Fax: +1 408 919 6083
• Fax: +44 (0) 1803 66 2801
• Fax: +86 755 33305805
+86 755 33305807
• Tel: +86 755 33305888
Important Notice
Performance figures, data and any illustrative material
provided in this data sheet are typical and must be
specifically confirmed in writing by Bookham before
they become applicable to any particular order or
contract. In accordance with the Bookham policy of
continuous improvement specifications may change
without notice. The publication of information in this
data sheet does not imply freedom from patent or other
protective rights of Bookham or others. Further details
are available from any Bookham sales representative.
www.bookham.com
[email protected]
11
BH13399 Rev 1.0 February 2007
©Bookham 2005. Bookham is a registered trademark of Bookham Inc.