APDS-9700 Signal Conditioning IC for Optical Proximity Sensors Data Sheet Description Features APDS-9700 is a signal conditioning IC that enhances the performance and robustness of the optical sensors used for proximity or object detection. x Low power consumption APDS-9700 is a single chip solution that consists of a LED driver circuit, sunlight cancellation and built-in LED stuck high protection circuit integrated into a single chip. APDS9700 has artificial light immunity and is also operational under the sun. Design flexibility is optimized as APDS9700 can be paired up with an integrated proximity sensor or discrete pair solution. APDS-9700 can be disabled to maximize power savings and battery life in applications such as portable or battery-operated devices. The LED current of the optical proximity sensors can be configured to different levels using a limiting resistor at the LEDA pin. APDS-9700 also provides user flexibility to control the pulse width with suitable burst rate, duty cycle and frequency that can reduce power consumption. These low power consumption features makes it also ideal for low power mobile and handheld devices. APDS-9700 is capable of operating at voltage supply ranging from 2.4 V to 3.6 V. APDS-9700 has two separate output pins for analog and digital outputs. This provides flexibility to use either the analog or digital output (or both) depending on the requirements of the application. The device is packaged in 8-pin QFN package measuring 0.55mm(H) x 2mm(W) x 2mm(L). LED pulse width control Low shut down current External LED drive-current control x Complete shutdown mode x Supply voltage : 2.4 V to 3.6 V x Operational in sunlight conditions up to 100klux(with HSDL-9100) x Artificial light immunity x Analog & Digital output available Built in hysteresis comparator for digital output x LED stuck High protection x Wide bandwidth Trans-impedance amplifier x External capacitor and resistor for integration and gain controls x Flexibility to enhance detection distance up to 200mm with HSDL-9100 or further with external discretes pair x Small 2mm x 2mm QFN 8-pin package x Design flexibility to pair with Avago Proximity Sensors or discretes pair solution x Lead-free & ROHS Compliant Applications x PDA and mobile phones Ordering Information x Portable and Handheld devices Part Number Package Shipping Option x Personal Computers/Notebooks APDS-9700-020 Tape & Reel 2500 x Amusement/Games/Vending Machines x Industrial Automation Application Support Information x Contactless Switches The Application Engineering Group is available to assist you with the application design associated with APDS9700 module. You can contact them through your local sales representatives for additional details. x Sanitary Automation Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Min. Max. Units Supply Voltage VCC 0 4.5 V Input Logic Voltage Vi 0 4.5 V 260 °C Reflow Soldering Temperature Conditions Recommended Operating Conditions Parameter Symbol Min. Max. Units Conditions Operating Temperature TA -40 105 °C Storage Temperature Ts -40 125 °C Supply Voltage VCC 2.4 3.6 V Symbol Minimum Typical Logic High Voltage, LEDON VIH 1.6 Vcc V Logic High Voltage, ENB VIH 1.4 Vcc V For Vcc = 2.4V 1.5 Vcc V For 2.4V <Vcc d 3V 1.7 Vcc V For 3V < Vcc d 3.6V Electrical & Optical Specifications (Ta=25°C) Parameters Maximum Units Conditions Input Logic Low Voltage, LEDON VIL 0 0.3 V Logic Low Voltage, ENB VIL 0 0.3 V Logic High Input Current, LEDON IIH 0.1 1 uA VI ≥ VIH Logic High Input Current, ENB IIH 0.1 1 μA VI ≥ VIH Logic Low Input Current, LEDON IIL 0.1 1 μA VI ≤ VIL Logic Low Input Current, ENB IIL 0.1 1 μA VI ≤ VIL Shutdown Current ISD 0.3 1 μA Vcc=3V, ENB=3V Idle Current Icc 500 650 μA Vcc=3V, ENB=0V 0.3 V IDOUT(Low) = 2mA, Vcc = 3V Output 0 Digital Output VOL Rise Time(DOUT) TR 1 us Vcc = 3V, R2 = 10kΩ, Frequency = 10kHz Fall Time(DOUT) TF 1 us Vcc = 3V, R2 = 10kΩ, Frequency = 10kHz Rise Time (LEDA) TR 40 ns Vcc = 3V , ILED = 120mA, Freq = 10kHz Fall Time (LEDA) TF 40 ns Vcc = 3V , ILED = 120mA, Freq = 10kHz Max ILED Pulse Width Max-PW 120 μs Vcc=3V, ENB=0V ILED Pulse Current ILED 120 mA Vcc=3V, R1 = 10Ω Transmitter 2 300 Electrical & Optical Specification (continued) Parameters Symbol Minimum Typical Maximum Units Conditions Photodiode input current (PD) IPD 0 Current Gain IPFiLT/IPD 20 times Vcc = 3V Hysterisis VHYS 40 mV Vcc= 3.0V Threshold voltage V TH 655 mV Vcc= 3.0V IDC 100 μA Vcc= 3.0V Receiver 3 μA Hysterisis Comparator Sunlight Cancellation DC Current, PD APDS-9700 pin-out and I/O Configurations PIN #1 CORNER Pin 1 Pin 8 Pin 2 Pin 7 Pin 3 Pin 6 Pin 4 Pin 5 I/O Pins Configuration Table Pin Symbol Type Description 1 LEDON Digital I/P LED Driver Input LEDA will turn off when LEDON is stuck in high state for > Max-PW 2 ENB Digital I/P Power Down Enable ENB = 0 Normal mode operation ENB = 1 Shut down mode 3 DOUT Digital O/P Digital Output An open drain output that requires a pull-up resistor of recommended value 10k Ω DOUT = Low when VPFILT > V TH DOUT = High when VPFILT < V TH 4 GND Ground Ground 5 PD Analog I/P Photo-Detector Input Connect to Cathode of photo-detector (proximity sensor) 6 PFILT Analog O/P Analog Output Connect to integration circuit (R3 & CX3) 7 LEDA Analog O/P LED Driver Output Connect to Anode of LED (proximity sensor) LEDA will turn off when LEDON is stuck in high state for > Max-PW 8 VCC Supply Voltage Supply Figure 1. APDS-9700 pin-out and I/O Configurations 3 Application Circuit for APDS-9700 VIO R2 PWM/ GPIO LEDON 1 8 Vcc CX2 CX1 R1 ENB GPIO 2 MCU 7 LEDA APDS-9700 GPIO DOUT 3 R3 6 PFILT CX3 GND ADC 4 5 PD Avago Proximity Sensor Reflective Object Figure 2. Typical Application Circuit for APDS-9700 Recommended Avago Proximity Sensor Description HSDL-9100 Integrated Reflective Proximity Sensor Component Recommended Values ( with HSDL-9100) R1 10 Ω R2 10k Ω R3 100k Ω to 500k Ω CX1 100 nF ± 20% X 7R, Ceramic, CX2 6.8 μF ± 20%, Tantalum CX3 3.3 nF ± 20% X 7R, Ceramic 4 APDS-9700 Block Diagram (1) LEDON (7) LEDA Stuck High Protection Sunlight Cancellation R1 (5) PD TIA Avago Proximity Sensor V IO PIN (6) PFILT R2 CX3 V-I CONVERTER (2) ENB (3) DOUT Hysteresis Comparator (4) DOUT Figure 3. APDS-9700 Block Diagram 5 LED R3 APDS-9700 Typical Timing Waveforms Vcc ENB >50ns Burst Pulses LEDON >20μs V TH PFLIT DOUT Note: Pulses at LEDON can only be activated at least 20us after ENB turn from high to low. Figure 4. APDS-9700 Typical Timing Waveforms 6 APDS-9700 Performance Charts (Typical Conditions) 1.6 1.1 1.4 1 NORMALIZED ILED NORMALIZED ILED 1.2 1 0.8 0.9 0.8 0.7 0.6 0.6 0.4 0.5 0.2 2.4 2.6 2.8 3 VCC (V) 3.2 3.4 -40 3.6 -20 0 20 40 60 80 100 TEMP(ºC) Figure 5. Normalized ILED Vs Vcc (T=25 qC, R1=10Ω ) Figure 6. Normalized ILED VS Temp (VCC=3V,R1=10Ω) 1.1 0.7 Vcc=2.4V Vcc=2.7V 0.6 Vcc=3V 0.5 TYPICAL ILED (A) NORMALIZED ICC IDLE 1.05 1 Vcc=3.3V Vcc=3.6V 0.4 0.3 0.2 0.95 0.1 0.9 2.4 0 2.6 2.8 3 VCC(V) 3.2 3.4 3.6 Figure 7. Normalized ICC Idle Vs Vcc (T=25qC) 2 1.02 1.15 1.01 NORMALIZED ICC IDLE NORMALIZED ICC SD 5 6 RLED (-) 7 8 9 10 1.00 1.1 1.05 1 0.95 0.9 0.99 0.98 0.97 0.96 0.95 0.85 0.94 2.6 2.8 3 VCC(V) Figure 9. Normalized ICC SD VS VCC (T=25qC) 7 4 Figure 8. ILED VS RLED (T=25qC) 1.2 0.8 2.4 3 3.2 3.4 3.6 0.93 -40 -20 0 20 40 TEMP(ºC) Figure 10. Normalized ICC IDLE VS TEMP (VCC=3V) 60 80 100 APDS-9700 Package Dimensions 2 8 7 6 5 2 Marking Information Pin #1 ID On Top 1 2 3 4 0.02 0.50 0.10 TOP VIEW SIDE VIEW 1.20 0.28 0.40 2 3 4 8 7 6 5 0.60 0.7 1 0.35 X 45° 0.125 (x4) 0.25 (x8) 0.25 (x6) BOTTOM VIEW Dimensions in mm. Tolerance ±0.1mm Figure 11. Package Outline Dimensions and land patterm 8 The unit is marked ‘YWW LL’ on the chip. Y = Year (Last digit of the year) WW = work week (1-54) LL = Lot number (01-99) Recommended Minimum Land pattern and Keep-out Area Keep-out Area Recommendations: 1. Area of Solder Land pattern = 2.3mm x 2.1mm 0.1 0.32 0.5 2. Module placement tolerance & keep out on each side with no lead = 0.55mm & keep out on each side solder lead = 0.8mm 0.25 0.22 R0 .17 5 2 0.22 3. Keep-out area = 3.9mm x 3.2mm 0.25 0.5 2 SOLDER LAND PATTERN Dimension in mm. Tolerances +0.1mm Figure 12. Recommended Minimum Land pattern and Keep-out Area APDS-9700 Tape Dimensions 4.00 ± 0.10 2.00 ± .05 Ø 1.50 + .10 4.00 ± 0.10 1.75 ± 0.10 3.50 ± .05 .30 8.00 + .10 Ø 1.00 + 0.25 YWW LLa UNIT ORIENTATION IN POCKET .254 ± 0.02 5° MAX 5° MAX 2.30 ± 0.10 A. Figure 13. APDS-9700 Tape Dimensions 9 0.75 ± 0.10 K. 2.30 ± 0.10 B. ALL DIMENSIONS IN mm. Reel Drawings XXX-REPRESENTS SUPPLIERS’S LOGO OR NAME (OPTION) TEXT HEIGHT: 6.25mm HIGH X 1.6mm WIDE (EMBOSSED LETTERS) CL 1.5 MIN. 120º +0.50 Ø13.00 -0.20 SEE DETAIL “ B” SLOT 180º APART (2 PLACES) ø20.2 MIN. FRONT SIDE 15º R 10.65 DETAIL “B” SCALE: 1:3 45º 14.40 MAX. R 5.20 45º EMBOSSED RIBS RAISED 0.25mm WIDTH 1.25mm 179.00 ±0.50 55.00 ±0.50 CL ø51.20 ± 0.30 +1.50 8.40 -0.0 ø164.30 ± 0.30 BACK VIEW ø179.00 ± 0.50 Figure 14. Reel Dimension Drawing APDS-9700 Packaging All APDS-9700 options are shipped in ESD proof package. This part is compliant to JEDEC MSL1. 10 Recommended Storage Conditions Storage Temperature The units in tape and reel are recommended to be kept in a controlled climate environment, with temp at 25 +5/-10°C and relative humidity at 55 +/-15%. Time from unsealing to soldering This part is compliant to JEDEC MSL-1 (unlimited floor life at < 30’C / 85%RH) Recommended Reflow Profile MAX 260C T - TEMPERATURE (°C) 255 R3 230 217 200 180 R2 R4 60 sec to 90 sec Above 217 C 150 R5 R1 120 80 25 0 P1 HEAT UP 50 100 150 200 P2 SOLDER PASTE DRY P3 SOLDER REFLOW 250 P4 COOL DOWN 300 t-TIME (SECONDS) Figure 15. Recommended Reflow Profile The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different 'T/'time temperature change rates or duration. The 'T/'time rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and APDS-9700 pins are heated to a temperature of 150°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC board and APDS-9700 pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200°C (392°F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of For product information and a complete list of distributors, please go to our web site: solder to 255°C (491°F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 40 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 40 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200°C (392°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and APDS-9700 pins to change dimensions evenly, putting minimal stresses on the APDS-9700. It is recommended to perform reflow soldering no more than twice. www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. AV02-0893EN - March 4, 2010