Cree® EZ400™ Gen II LED Data Sheet CxxxEZ400-Sxxx00-2 Cree’s EZBright™ LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary optical design and device technology to deliver superior value for high-intensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern. Additionally, these LEDs are die attachable with conductive epoxy, solder paste or solder preforms, as well as the flux eutectic method. These vertically structured, low forward voltage LED chips are approximately 170 microns in height. Cree’s EZ™ chips are tested for conformity to optical and electrical specifications. These LEDs are useful in a broad range of applications, such as general illumination, automotive lighting and LCD backlighting. FEATURES APPLICATIONS • • EZBright Power Chip LED Rf Performance General Illumination – 90 mW min. @ 150 mA – 450 & 460 nm – Automobile – 75 mW min. @ 150 mA - 470 nm – Aircraft – 25 mW min. @ 150 mA - 527 nm – Decorative Lighting • Lambertian Radiation – Task Lighting • Conductive Epoxy, Solder Paste or Preforms, – Outdoor Illumination or Flux Eutectic Attach • White LEDs • Low Forward Voltage – 3.5 V Typical at 150 mA • Crosswalk Signals • Single Wire Bond Structure • Television Backlighting • Maximum DC Forward Current - 200 mA ● Dielectric Passivation Across Epi Surface CxxxEZ400-Sxxx00 Chip Diagram .CPR3ED Rev Data Sheet: Top View Die Cross Section Bottom View EZBright LED Chip 380 x 380 μm2 Backside Metallization Gold Bond Pad 112 μm Dielectric Passivation Cathode (-) t = 170 μm Anode (+); 3 μm AuSn Subject to change without notice. www.cree.com 1 Maximum Ratings at TA = 25°C Note 1 CxxxEZ400-Sxxx00-2 DC Forward Current 200 mA Peak Forward Current 350 mA LED Junction Temperature Note 3 145°C Reverse Voltage 5V Operating Temperature Range -40°C to +100°C Storage Temperature Range -40°C to +120°C Typical Electrical/Optical Characteristics at TA = 25°C, If = 150 mA Part Number Forward Voltage (VF, V) Note 2 Reverse Current [I(Vr=5 V), μA] Full Width Half Max (λD, nm) Min. Typ. Max. Max. Typ. C450EZ400-Sxxx00-2 3.1 3.5 4.1 2 20 C460EZ400-Sxxx00-2 3.1 3.5 4.1 2 21 C470EZ400-Sxxx00-2 3.1 3.5 4.1 2 24 C527EZ400-Sxxx00-2 3.2 3.7 4.2 2 35 Mechanical Specifications Description CxxxEZ400-Sxxx00-2 Dimension Tolerance P-N Junction Area (µm) 350 x 350 ±40 Chip Area (µm) 380 x 380 ±40 Chip Thickness (µm) 170 ±25 Top Au Bond Pad Diameter (µm) 112 ±15 Au Bond Pad Thickness (µm) Back Contact Metal Area (µm) Back Contact Metal Thickness (µm) 3.0 ±1.0 380 x 380 ±40 3.0 ±1.0 Notes: 1. Maximum ratings are package-dependent. The above ratings were determined using a Au-plated TO39 header without an encapsulant for characterization. Ratings for other packages may differ. The junction temperature should be characterized in a specific package to determine limitations. Assembly processing temperature must not exceed 325°C (< 5 seconds). See Cree EZBright Applications Note for assembly-process information. 2. All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled and operated at 150 mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given are within the range of average expected by the manufacturer in large quantities and are provided for information only. All measurements were made using a Au-plated TO39 header without an encapsulant. Optical characteristics measured in an integrating sphere using Illuminance E. 3. This peak forward current specification is based on a 400-ms pulse width at a 1/5-duty cycle with a junction temperature of 65°C. Copyright © 2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks, and EZBright, EZ, and EZ400 are trademarks of Cree, Inc. 2 CPR3ED Rev. - Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com Standard Bins for CxxxEZ400-Sxxx00-2 LED chips are sorted to the radiant flux and dominant wavelength bins shown. A sorted die sheet contains die from only one bin. Sorted die kit (CxxxEZ400-Sxxx00-2) orders may be filled with any or all bins (CxxxEZ400-0xxx-2) contained in the kit. All radiant flux and all dominant wavelength values shown and specified are at If = 150 mA. Radiant flux values are measured using Au-plated TO39 headers without an encapsulant. Radiant Flux C450EZ400-S09000-2 C450EZ400-0213-2 C450EZ400-0214-2 C450EZ400-0215-2 C450EZ400-0216-2 C450EZ400-0209-2 C450EZ400-0210-2 C450EZ400-0211-2 C450EZ400-0212-2 C450EZ400-0205-2 C450EZ400-0206-2 C450EZ400-0207-2 C450EZ400-0208-2 120 mW 105 mW 90 mW 445 nm 447.5 nm 450 nm 452.5 nm 455 nm Dominant Wavelength Radiant Flux C460EZ400-S09000-2 C460EZ400-0213-2 C460EZ400-0214-2 C460EZ400-0215-2 C460EZ400-0216-2 C460EZ400-0209-2 C460EZ400-0210-2 C460EZ400-0211-2 C460EZ400-0212-2 C460EZ400-0205-2 C460EZ400-0206-2 C460EZ400-0207-2 C460EZ400-0208-2 120 mW 105 mW 90 mW 455 nm 457.5 nm 460 nm 462.5 nm 465 nm Dominant Wavelength Radiant Flux C470EZ400-S07500-2 C470EZ400-0209-2 C470EZ400-0210-2 C470EZ400-0211-2 C470EZ400-0212-2 C470EZ400-0205-2 C470EZ400-0206-2 C470EZ400-0207-2 C470EZ400-0208-2 C470EZ400-0201-2 C470EZ400-0202-2 C470EZ400-0203-2 C470EZ400-0204-2 105 mW 90 mW 75 mW 465 nm 467.5 nm 470 nm 472.5 nm 475 nm Dominant Wavelength Radiant Flux C527EZ400-S2500-2 C527EZ400-0207-2 C527EZ400-0208-2 C527EZ400-0209-2 C527EZ400-0204-2 C527EZ400-0205-2 C527EZ400-0206-2 C527EZ400-0201-2 C527EZ400-0202-2 C527EZ400-0203-2 50 mW 40 mW 25 mW 520 nm 525 nm 530 nm 535 nm Dominant Wavelength Copyright © 2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks, and EZBright, EZ, and EZ400 are trademarks of Cree, Inc. 3 CPR3ED Rev. - Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com Dominant Wavel 2 1 0 -1 -2 25 Characteristic Curves 50 75 100 125 150 Junction Temperature (°C) These are representative measurements for the EZBright400. Actual curves will vary slightly for the various radiant flux and dominant wavelength bins. Forward Current vs. Forward Voltage Relative Light Intensity vs Junction Temperature 100% 175 95% Relative Light Intensity 200 If (mA) 150 125 100 75 50 25 90% 85% 80% 75% 70% 65% 0 0 1 2 3 4 25 5 50 Vf (V) 75 100 125 150 Junction Temperature (°C) Relative Intensity vs. Forward Current Relative Intensity vs. Forward Current 150% Voltage Shift vs Junction Temperature 0.100 125% 100% 0.000 Mean(Vf Shift) Voltage Shift (V) Relative Intensity Relative Intensity 150% 125% 100% 75% 75% 50% 50% 25% 25% 0% 0% -0.100 -0.200 -0.300 -0.400 -0.500 0 25 50 75 100 125 150 175 200 225 0 25 50 75 100 125 If (mA) 150 175 200 225 If (mA) Mean(Vf Shift) -0.600 25 Wavelength Shift vs. Forward Current Dominant Wavelength Shift (nm) DW Shift DW Shift (nm)(nm) 100 125 150 Dominant Wavelength Shift vs Junction Temperature 16 12 12 8 8 4 4 0 0 -4 -4 -8 -8 75 Junction Temperature (°C) EZ400 Wavelength Shift vs. Forward Current 16 50 0 25 50 75 100 125 150 175 200 225 0 25 50 75 100 125 If (mA) 150 175 200 225 6 5 4 3 2 1 0 -1 -2 25 50 75 100 125 150 Junction Temperature (°C) If (mA) Copyright © 2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks, and EZBright, EZ, and EZ400 are trademarks of Cree, Inc. Relative Light Intensity vs 4 CPR3ED Rev. - 100% Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 Junction Temperature www.cree.com Radiation Pattern This is a representative radiation pattern for the EZBright Power Chip LED product. Actual patterns will vary slightly for each chip. Copyright © 2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks, and EZBright, EZ, and EZ400 are trademarks of Cree, Inc. 5 CPR3ED Rev. - Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com