DS26LV31T 3V Enhanced CMOS Quad Differential Line Driver General Description Features The DS26LV31T is a high-speed quad differential CMOS driver that meets the requirements of both TIA/EIA-422-B and ITU-T V.11. The CMOS DS26LV31T features low static ICC of 100 µA MAX which makes it ideal for battery powered and power conscious applications. n Industrial product meets TIA/EIA-422-B (RS-422) and ITU-T V.11 recommendation n Military product conforms to TIA/EIA-422-B (RS-422) n Interoperable with existing 5V RS-422 networks n Industrial and Military temperature range n Guaranteed VOD of 2V min over operating conditions n Balanced output crossover for low EMI (typical within 40 mV of 50% voltage level) n Low power design (330 µW 3.3V static) n ESD ≥ 7 kV on cable I/O pins (HBM) n Guaranteed AC parameter: — Maximum driver skew: 2 ns — Maximum transition time: 10 ns n Pin compatible with DS26C31 n Available in SOIC and Cerpack packaging n Standard Microcircuit Drawing (SMD) 5962-98584 Differential outputs have the same VOD guarantee (≥2V) as the 5V version. The EN and EN* inputs allow active Low or active High control of the TRI-STATE ® outputs. The enables are common to all four drivers. Protection diodes protect all the driver inputs against electrostatic discharge. Outputs have enhanced ESD protection providing greater than 7 kV tolerance. The driver and enable inputs (DI, EN, EN*) are compatible with low voltage LVTTL and LVCMOS devices. Connection Diagram Truth Table Enables Dual-In-Line Package Input Outputs EN EN* DI DO+ L H X Z DO− Z All other combinations of enable inputs L L H H H L L = Low logic state X = Irrelevant H = High logic state Z = TRI-STATE DS012642-1 Top View Order Number DS26LV31TM or DS26LV31W See NS Package Number M16A or W16A TRI-STATE ® is a registered trademark of National Semiconductor Corporation. © 1999 National Semiconductor Corporation DS012642 www.national.com DS26LV31T 3V Enhanced CMOS Quad Differential Line Driver March 1999 Absolute Maximum Ratings (Note 1) Lead Temperature Range Soldering (4 sec.) ESD Ratings (HBM, 1.5 kΩ, 100 pF) Driver Outputs Other Pins If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (VCC) −0.5V to +7V Enable Input Voltage (EN, EN*) −0.5V to VCC + 0.5V Driver Input Voltage (DI) −0.5V to VCC + 0.5V ± 20 mA Clamp Diode Current ± 150 mA DC Output Current, per pin Driver Output Voltage (Power Off: DO+, DO−) −0.5V to +7V Maximum Package Power Dissipaton +25˚C M Package 1226 mW W Package 1119 mW Derate M Package 9.8 mW/˚C above +25˚C Derate W Package 7.5 mW/˚C above +25˚C Storage Temperature Range −65˚C to +150˚C +260˚C ≥7 kV ≥2.5 kV Recommended Operating Conditions Min Typ Max 3.0 3.3 3.6 Supply Voltage (VCC) Operating Free Air Temperature Range (TA) DS26LV31T −40 +25 +85 DS26LV31W −55 +25 +125 Input Rise and Fall Time 500 Units V ˚C ˚C ns Electrical Characteristics(Note 2) (Note 3) Over supply voltage and operating temperature ranges, unless otherwise specified Symbol VOD1 Output Differential Voltage Parameter Conditions RL = ∞ (No Load) DO+, Pin VOD2 Output Differential Voltage RL = 100Ω (Figure 1) DO− ∆VOD2 Change in Magnitude of IO ≥ 20 mA Min Typ Max Units 3.3 4 V 2 2.6 −400 7 400 mV V 3.2 3.6 V Output Differential Voltage VOD3 Output Differential Voltage RL = 3900Ω (V.11) Figure 1 (Note 7) VOC Common Mode Voltage RL = 100Ω (Figure 1) ∆VOC Change in Magnitude of −400 1.5 2 V 6 400 mV ± 0.5 ± 20 µA −70 −150 mA -160 mA Common Mode Voltage IOZ ISC IOFF TRI-STATE Leakage VOUT = VCC or GND Current Drivers Disabled Output Short Circuit Currrent VOUT = 0V VIN = VCC or GND (Note 4) Output Leakage Current TA = -40˚C to +85˚C −40 TA = -55˚C to +125˚C (Note 10) -30 VCC = 0V, VOUT = 3V or 6V VCC = 0V, VOUT = −0.25V TA = -40˚C to +85˚C TA = -55˚C to +125˚C 0.03 100 µA −0.08 −100 µA -200 µA V VIH High Level Input Voltage DI, 2.0 VCC VIL Low Level Input Voltage EN, GND 0.8 V IIH High Level Input Current 10 µA IIL Low Level Input Current VIN = GND VCL Input Clamp Voltage IIN = −18 mA ICC Power Supply Current No Load, VIN (all) = VCC or GND www.national.com VIN = VCC EN* −10 TA = -40˚C to +85˚C TA = -55˚C to +125˚C 2 VCC µA −1.5 V 100 µA 125 µA Switching Characteristics - Industrial (Note 5) (Note 6) Over supply voltage and -40˚C to +85˚C operating temperature range, unless otherwise specified Sym tPHLD tPLHD Parameter Conditions Differential Propagation Delay RL = 100Ω, CL = 50 pF High to Low (Figures 2, 3) Differential Propagation Delay Min Typ Max Units 6 10.5 16 ns 6 11 16 ns 0.5 2.0 ns 1.0 2.0 ns Low to High tSKD Differential Skew (same channel) |tPHLD − tPLHD| tSK1 Skew, Pin to Pin (same device) tSK2 Skew, Part to Part (Note 8) 3.0 5.0 ns tTLH Differential Transition Time 4.2 10 ns 4.7 10 ns ns Low to High (20% to 80%) tTHL Differential Transition Time High to Low (80% to 20%) (Figures 4, 5) tPHZ Disable Time High to Z 12 20 tPLZ Disable Time Low to Z 9 20 ns tPZH Enable Time Z to High 22 32 ns tPZL Enable Time Z to Low 22 32 fmax Maximum Operating 32 ns MHz Frequency (Note 9) Switching Characteristics - Military (Note 5) (Note 6) Over supply voltage and -55˚C to +125˚C operating temperature range, unless otherwise specified Sym tPHLD tPLHD Parameter Conditions Differential Propagation Delay RL = 100Ω, CL = 50 pF High to Low (Figures 2, 3) Differential Propagation Delay Min Max Units 5 25 ns 5 25 ns 5.0 ns 5.0 ns Low to High tSKD Differential Skew (same channel) |tPHLD − tPLHD| tSK1 Skew, Pin to Pin (same device) (Figures 4, 5) tPHZ Disable Time High to Z 35 ns tPLZ Disable Time Low to Z 35 ns tPZH Enable Time Z to High 40 ns tPZL Enable Time Z to Low 40 ns Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation. Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except differential voltages VOD1, VOD2, VOD3. Note 3: All typicals are given for VCC = +3.3V, TA = +25˚C. Note 4: Only one output shorted at a time. The output (true or complement) is configured High. Note 5: f = 1 MHz, tr and tf ≤ 6 ns, 10% to 90%. Note 6: See TIA/EIA-422-B specifications for exact test conditions. Note 7: This specification limit is for compliance with TIA/EIA-422-B and ITU-T V.11. Note 8: Devices are at the same VCC and within 5˚C within the operating temperature range Note 9: All channels switching, output duty cycle criteria is 40%/60% measured at 50%. This parameter is guaranteed by design and characterization. Note 10: This parameter does not meet the TIA/EIA-422-B specification. 3 www.national.com Parameter Measurement Information DS012642-2 FIGURE 1. Differential Driver DC Test Circuit DS012642-3 FIGURE 2. Differential Driver Propagation Delay and Transition Time Test Circuit DS012642-4 FIGURE 3. Differential Driver Propagation Delay and Transition Time Waveforms Note 11: Generator waveform for all tests unless otherwise specified: f = 1 MHz, Duty Cycle = 50% Zo = 50Ω, tr ≤ 10 ns, tf ≤ 10. Note 12: CL includes probe and fixture capacitance. www.national.com 4 Parameter Measurement Information (Continued) DS012642-5 If EN is the input, then EN* = High If EN* is the input, then EN = Low FIGURE 4. Driver Single-Ended TRI-STATE Test Circuit DS012642-6 FIGURE 5. Driver Single-Ended TRI-STATE Waveforms 5 www.national.com Typical Application Information Power Decoupling Recommendations: Bypass caps must be used on power pins. High frequency ceramic (surface mount is recommended) 0.1 µF in parallel with 0.01 µF at the power supply pin. A 10 µF or greater solid tantalum or electrolytic should be connected at the power entry point on the printed circuit board. General application guidelines and hints for differential drivers and receivers may be found in the following application notes: AN-214, AN-457, AN-805, AN-847, AN-903, AN-912, AN916. DS012642-7 RT is optional although highly recommended to reduce reflection. DS012642-8 FIGURE 6. Typical Driver Connection DS012642-9 FIGURE 7. Typical Driver Output Waveforms www.national.com 6 Physical Dimensions inches (millimeters) unless otherwise noted 16-Lead Molded Small Outline Package (M) Order Number DS26LV31TM NS Package Number M16A 7 www.national.com DS26LV31T 3V Enhanced CMOS Quad Differential Line Driver Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 16-Lead Ceramic Flatpack (W) Order Number DS26LV31W NS Package Number W16A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: [email protected] www.national.com National Semiconductor Europe Fax: +49 (0) 1 80-530 85 86 Email: [email protected] Deutsch Tel: +49 (0) 1 80-530 85 85 English Tel: +49 (0) 1 80-532 78 32 Français Tel: +49 (0) 1 80-532 93 58 Italiano Tel: +49 (0) 1 80-534 16 80 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: [email protected] National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.