DS90LV027A LVDS Dual High Speed Differential Driver General Description Features The DS90LV027A is a dual LVDS driver device optimized for high data rate and low power applications. The device is designed to support data rates in excess of 600Mbps (300MHz) utilizing Low Voltage Differential Signaling (LVDS) technology. The DS90LV027A is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized. The device is in a 8-lead small outline package. The DS90LV027A has a flow-through design for easy PCB layout. The differential driver outputs provides low EMI with its typical low output swing of 360 mV. It is perfect for high speed transfer of clock and data. The DS90LV027A can be paired with its companion dual line receiver, the DS90LV028A, or with any of National"s LVDS receivers, to provide a high-speed point-to-point LVDS interface. n n n n n n n n n n n n n > 600 Mbps (300MHz) switching rates 0.3 ns typical differential skew 0.7 ns maximum differential skew 1.5 ns maximum propagation delay 3.3V power supply design ± 360 mV differential signaling Low power dissipation (46 mW @ 3.3V static) Flow-through design simplifies PCB layout Interoperable with existing 5V LVDS devices Power Off Protection (outputs in high impedance) Conforms to TIA/EIA-644 Standard 8-Lead SOIC package saves space Industrial temperature operating range (−40˚C to +85˚C) Connection Diagram Dual-In-Line 10011401 Order Number DS90LV027ATM See NS Package Number M08A Functional Diagram 10011402 10011403 © 2005 National Semiconductor Corporation DS100114 www.national.com DS90LV027A LVDS Dual High Speed Differential Driver August 2005 DS90LV027A Absolute Maximum Ratings (Note 1) ESD Ratings Supply Voltage (VCC) −0.3V to +4V Input Voltage (DI) −0.3V to +3.6V Output Voltage (DO ± ) −0.3V to +3.9V ≥ 1000V (CDM) ≥ 1000V Min Typ Max Supply Voltage (VCC) 3.0 3.3 3.6 V Temperature (TA) −40 25 +85 ˚C 9.5 mW/˚C above +25˚C Storage Temperature Range −65˚C to +150˚C Lead Temperature Range Soldering (4 sec.) ≥ 4kV Recommended Operating Conditions 1190 mW Derate M Package (EIAJ 0 Ω, 200 pF) (IEC direct 330 Ω, 150 pF) Maximum Package Power Dissipation @ +25˚C M Package ≥ 8kV (HBM 1.5 kΩ, 100 pF) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Units +260˚C Electrical Characteristics Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Notes 2, 3, 7) Symbol Parameter Conditions Pin Min Typ Max Units DO+, DO− 250 360 450 mV 1 35 mV 1.4 1.6 DIFFERENTIAL DRIVER CHARACTERISTICS VOD Output Differential Voltage ∆VOD VOD Magnitude Change RL = 100Ω (Figure 1) VOH Output High Voltage VOL Output Low Voltage VOS Offset Voltage ∆VOS Offset Magnitude Change IOXD Power-off Leakage IOSD Output Short Circuit Current VIH Input High Voltage VIL Input Low Voltage IIH Input High Current VIN = 3.3V or 2.4V IIL Input Low Current VIN = GND or 0.5V VCL Input Clamp Voltage ICL = −18 mA ICC Power Supply Current No Load 0.9 1.1 1.125 1.2 0 VOUT = VCC or GND, VCC = 0V DI V mV 3 25 ± 10 µA −5.7 −8 mA VCC V 2.0 0.8 V ± 10 ± 10 µA 8 14 mA 14 20 mA ±2 ±1 −1.5 1.375 ±1 GND VIN = VCC or GND V V µA −0.6 VCC RL = 100Ω V Switching Characteristics Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified. (Notes 3, 4, 5, 6) Symbol Parameter Conditions Min Typ Max Units ns DIFFERENTIAL DRIVER CHARACTERISTICS tPHLD Differential Propagation Delay High to Low RL = 100Ω, CL = 15 pF 0.3 0.8 1.5 tPLHD Differential Propagation Delay Low to High (Figure 2 and Figure 3) 0.3 1.1 1.5 ns tSKD1 Differential Pulse Skew |tPHLD − tPLHD| (Note 8) 0 0.3 0.7 ns 0.4 tSKD2 Channel to Channel Skew (Note 9) 0 0.8 ns tSKD3 Differential Part to Part Skew (Note 10) 0 1.0 ns tSKD4 Differential Part to Part Skew (Note 11) 0 1.2 ns tTLH Transition Low to High Time 0.2 0.5 1.0 ns tTHL Transition High to Low Time 0.2 0.5 1.0 fMAX Maximum Operating Frequency (Note 12) 350 ns MHz Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation. Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD. Note 3: All typicals are given for: VCC = +3.3V and TA = +25˚C. Note 4: These parameters are guaranteed by design. The limits are based on statistical analysis of the device over PVT (process, voltage, temperature) ranges. Note 5: CL includes probe and fixture capacitance. www.national.com 2 (Continued) Note 6: Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr ≤ 1 ns, tf ≤ 1 ns (10%-90%). Note 7: The DS90LV027A is a current mode device and only function with datasheet specification when a resistive load is applied to the drivers outputs. Note 8: tSKD1, |tPHLD − tPLHD|, is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the same channel. Note 9: tSKD2 is the Differential Channel to Channel Skew of any event on the same device. Note 10: tSKD3, Differential Part to Part Skew, is defined as the difference between the minimum and maximum specified differential propagation delays. This specification applies to devices at the same VCC and within 5˚C of each other within the operating temperature range. Note 11: tSKD4, part to part skew, is the differential channel to channel skew of any event between devices. This specification applies to devices over recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min| differential propagation delay. Note 12: fMAX generator input conditions: tr = tf < 1 ns (0% to 100%), 50% duty cycle, 0V to 3V. Output criteria: duty cycle = 45%/55%, VOD > 250mV, all channels switching. Parameter Measurement Information 10011404 FIGURE 1. Differential Driver DC Test Circuit 10011405 FIGURE 2. Differential Driver Propagation Delay and Transition Time Test Circuit 10011406 FIGURE 3. Differential Driver Propagation Delay and Transition Time Waveforms 3 www.national.com DS90LV027A Switching Characteristics DS90LV027A Application Information TABLE 1. Device Pin Descriptions Pin # Name Description 2, 3 DI TTL/CMOS driver input pins 6, 7 DO+ Non-inverting driver output pin 5, 8 DO− Inverting driver output pin 4 GND Ground pin 1 VCC Positive power supply pin, +3.3V ± 0.3V Typical Performance Curves Output High Voltage vs Power Supply Voltage Output Low Voltage vs Power Supply Voltage 10011407 10011408 Output Short Circuit Current vs Power Supply Voltage Differential Output Voltage vs Power Supply Voltage 10011410 10011409 www.national.com 4 DS90LV027A Typical Performance Curves (Continued) Differential Output Voltage vs Load Resistor Offset Voltage vs Power Supply Voltage 10011411 10011412 Power Supply Current vs Frequency Power Supply Current vs Power Supply Voltage 10011414 10011413 5 www.national.com DS90LV027A Typical Performance Curves (Continued) Power Supply Current vs Ambient Temperature Differential Propagation Delay vs Power Supply Voltage 10011415 10011416 Differential Propagation Delay vs Ambient Temperature Differential Skew vs Power Supply Voltage 10011418 10011417 www.national.com 6 DS90LV027A Typical Performance Curves (Continued) Differential Skew vs Ambient Temperature Transition Time vs Power Supply Voltage 10011419 10011420 Transition Time vs Ambient Temperature 10011421 7 www.national.com DS90LV027A LVDS Dual High Speed Differential Driver Physical Dimensions inches (millimeters) unless otherwise noted Order Number DS90LV027ATM NS Package Number M08A National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. For the most current product information visit us at www.national.com. LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. BANNED SUBSTANCE COMPLIANCE National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2. Leadfree products are RoHS compliant. National Semiconductor Americas Customer Support Center Email: [email protected] Tel: 1-800-272-9959 www.national.com National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: [email protected] Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: [email protected] National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: [email protected] Tel: 81-3-5639-7560