54AC20 Dual 4-Input NAND Gate General Description The ’AC20 contains four 4-input NAND gates. n Outputs source/sink 24 mA n Standard Military Drawing (SMD) n ’AC20: 5962-87613 Features n ICC reduced by 50% Logic Symbol IEEE/IEC DS100264-1 Pin Names Description An, Bn, Cn, Dn Inputs On Outputs Connection Diagrams Pin Assignment for DIP and Flatpak Pin Assignment for LCC DS100264-3 DS100264-2 FACT™ is a trademark of Fairchild Semiconductor Corporation. © 1998 National Semiconductor Corporation DS100264 www.national.com 54AC20 Dual 4-Input NAND Gate July 1998 Absolute Maximum Ratings (Note 1) Junction Temperature (TJ) CDIP If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (VCC) DC Input Diode Current (IIK) VI = −0.5V VI = VCC + 0.5V DC Input Voltage (VI) DC Output Diode Current (IOK) VO = −0.5V VO = VCC + 0.5V DC Output Voltage (VO) DC Output Source or Sink Current (IO) DC VCC or Ground Current per Output Pin (ICC or IGND) Storage Temperature (TSTG) 175˚C Recommended Operating Conditions −0.5V to +7.0V Supply Voltage (VCC) ’AC Input Voltage (VI) Output Voltage (VO) Operating Temperature (TA) 54AC Minimum Input Edge Rate (∆V/∆t) ’AC Devices VIN from 30% to 70% of VCC VCC @ 3.3V, 4.5V, 5.5V −20 mA +20 mA −0.5V to VCC + 0.5V −20 mA +20 mA −0.5V to VCC + 0.5V ± 50 mA 2.0V to 6.0V 0V to VCC 0V to VCC −55˚C to +125˚C 125 mV/ns Note 1: Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met, without exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables. National does not recommend operation of FACT™ circuits outside databook specifications. ± 50 mA −65˚C to +150˚C DC Characteristics for ’AC Family Devices Symbol Parameter 54AC TA = VCC (V) Units Conditions −55˚C to +125˚C Guaranteed Limits VIH VIL VOH Minimum High Level 3.0 2.1 Input Voltage 4.5 3.15 5.5 3.85 Maximum Low Level 3.0 0.9 Input Voltage 4.5 1.35 5.5 1.65 Minimum High Level 3.0 2.9 Output Voltage 4.5 4.4 5.5 5.4 VOUT = 0.1V V or VCC − 0.1V V or VCC − 0.1V VOUT = 0.1V IOUT = −50 µA V (Note 2) VIN = VIL or VIH VOL 3.0 2.4 4.5 3.7 5.5 4.7 Maximum Low Level 3.0 0.1 Output Voltage 4.5 0.1 5.5 0.1 IOH = −12 mA V IOH = −24 mA IOH = −24 mA IOUT = 50 µA V (Note 2) VIN = VIL or VIH IIN Maximum Input 3.0 0.5 4.5 0.5 5.5 0.5 5.5 ± 1.0 IOL = 12 mA V IOL = 24 mA µA IOL = 24 mA VI = VCC, GND Leakage Current IOLD IOHD www.national.com Minimum Dynamic Output Current (Note 3) 5.5 50 mA 5.5 −50 mA 2 VOLD = 1.65V Max VOHD = 3.85V Min DC Characteristics for ’AC Family Devices Symbol Parameter (Continued) 54AC TA = VCC (V) Units Conditions −55˚C to +125˚C Guaranteed Limits ICC Maximum Quiescent 5.5 40.0 VIN = VCC µA Supply Current or GND Note 2: All outputs loaded; thresholds on input associated with output under test. Note 3: Maximum test duration 2.0 ms, one output loaded at a time. Note 4: IIN and ICC @ 3.0V are guaranteed to be less than or equal to the respective limit @ 5.5V VCC. ICC for 54AC @ 25˚C is identical to 74AC @ 25˚C. AC Electrical Characteristics 54AC TA = −55˚C VCC Symbol Parameter (V) to +125˚C CL = 50 pF (Note 5) tPLH Propagation Delay tPHL Propagation Delay Units Min Max 3.3 1.0 11.0 5.0 1.0 8.5 3.3 1.0 10.0 5.0 1.0 7.0 ns ns Note 5: Voltage Range 3.3 is 3.3V ± 0.3V Voltage Range 5.0 is 5.0V ± 0.5V Capacitance Symbol CIN CPD Parameter Typ Units Input Capacitance 4.5 pF Power Dissipation 40.0 pF Conditions VCC = OPEN VCC = 5.0V Capacitance 3 www.national.com 4 Physical Dimensions inches (millimeters) unless otherwise noted 20 Terminal Ceramic Leadless Chip Carrier (L) NS Package Number E20A 14 Lead Ceramic Dual-In-Line Package (D) NS Package Number J14A 5 www.national.com 54AC20 Dual 4-Input NAND Gate Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 14 Lead Ceramic Flatpak (F) NS Package Number W14B LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support 1. Life support devices or systems are devices or sysdevice or system whose failure to perform can be reatems which, (a) are intended for surgical implant into sonably expected to cause the failure of the life support the body, or (b) support or sustain life, and whose faildevice or system, or to affect its safety or effectiveness. ure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 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