QX2010 QXpander Processor Device Specifications - Preliminary Information General Description Applications The QXpander QX2010 is a bipolar analog stereo enhancement processor. This device is part of the QX chip family offered by QSound Labs, and uses the patented QXpander™ technology to produce a spatially widened stereo image from ordinary left and right channel inputs. • • • • This audio enhancement is achieved while using normal stereo signals and standard stereo audio equipment. No special initial encoding of the input signals is required, no additional speakers are required, and no special hardware is needed to produce QXpanded audio. A TTL-compatible control input is provided to select QXpanded audio or a normal stereo signal (bypass). The QX2010 is fabricated in bipolar technology, and is offered in a 22 pin SDIP standard package. A 20 pin plastic SSOP package is available on request. Features • • • • • • • Produce a wide sound image from normal stereo input. No encoding of input signals, no special equipment required to QXpand audio. TTL-compatible bypass control. Low noise: 55 uVRMS. High signal-to-noise ratio: 85 dB. single supply voltage. Few external components, low cost. Ref: 2010V253.DOC Rev: 2.53 • • Television sound systems (Stereo). Semi-professional audio equipment. Personal/portable audio. Multimedia applications for PCs and laptops. Multimedia speaker systems. Video Games. Pin Assignment RIN BYP FB1 FB2 FB3 FB4 FB5 FB6 ROUT GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC LIN VREF FA1 FA2 FA3 FA4 FA5 FA6 LOUT Figure 1: SSOP pinout RIN BYP FB1 FB2 FB3 NC FB4 FB5 FB6 ROUT GND 1 22 2 21 3 20 4 19 5 18 6 17 7 16 8 15 9 14 10 13 11 12 VCC LIN VREF FA1 FA2 NC FA3 FA4 FA5 FA6 LOUT Figure 2: SDIP Pin Assignment QX2010 Data Sheet -- Preliminary -- Confidential QSound Labs, Inc. Date: 97.01.29 Page 1 of 7 QX2010 QXpander Processor Device Specifications Principles of Operation. In ordinary stereo systems, the stereo image is formed between the left and right speakers, and is confined by the speaker positions (i.e., the "sound stage" is located between the two speakers). The QXpander™ is designed to form the stereo image beyond the speakers, thus enlarging the "sound stage". If the center channel is defined as the monaural or common component of the left and right channels, then Figure 3 shows the spatial response of the QXpander™ when operating, and for normal stereo bypass. 0 1 BYP (GND) (2.4 ~ VCC) MODE Bypass - Normal Stereo QXpanded Audio Table 1: Mode Selection Normally, the QXpander™ is used in the preamplifier stage between the stereo source and the amplifier stages used to drive the speakers. Figure 4 shows the functional elements of the QX2010. Power Amp Pre Amp L Stereo In Spatial Enhancement R L Stereo Stereo Out Switch R BYP Figure 4: QXpander™ Simplified Block Diagram Figure 3: QXpander™ Spatial Response The QXpander™ enhancements can be disabled using the BYP bypass control pin, allowing the unchanged stereo signal to pass through to the outputs. The BYP control pin requires VCC and 0 VDC as logic levels 1 and 0 respectively (see Table 1). Ref: 2010V253.DOC Rev: 2.53 QSound applications engineers can assist customers in integrating the QX2010 into their application designs. QX2010 Data Sheet -- Preliminary -- Confidential QSound Labs, Inc. Date: 97.01.29 Page 2 of 7 QX2010 QXpander Processor Device Specifications 1 2 3 4 C1 1000 pF D VCC D C2 1000 pF R3 R12 R5 R6 120K 68K R7 68K 160K 120K C11 0.1 uF 20 C C9 22 uF RCHIN 17 VCC 16 FA1 15 FA2 FA3 13 FA4 U1 QX2010-S20C 12 FA5 FA6 1 RIN ROUT 9 + LCHIN 14 C7 22 uF RCHOUT AUDIO QXPANDER PROCESSOR 19 LIN 2 LCHOUT LOUT 11 + C10 22 uF C + + + C6 22 uF C8 22 uF BYP FB1 FB2 FB3 FB4 FB5 FB6 VREF 3 VCC 4 5 6 7 8 10 B 18 B S1 R4 33K + C12 0.1 uF C5 47uF R11 150K R8 A NOTES: R3, R5 - R13: Tolerance: +/- 1% Type: Metal Film C1 - C4: Tolerance: +/- 5% Temperature Coefficient: 0 +/- 60ppm/°C BYP: Stereo Bypass BYP = 0 QXpanded Audio BYP = 1 1 2 R9 150K 68K R13 R10 68K 10K C4 1000 pF C3 1000 pF A Title Size: A File: QXPANDER PROCESSOR QX2010-S20C Number: Revision: Date: 4.0 Time: 3 Drawn By: KLS Sheet 1 of 1 4 Figure 5: QX2010 QXpander™ Typical Application Ref: 2010V253.DOC Rev: 2.53 QX2010 Data Sheet -- Preliminary -- Confidential QSound Labs, Inc. Date: 97.01.29 Page 3 of 7 QX2010 QXpander Processor Device Specifications (TA = +25 °C) Absolute Maximum Ratings* Parameter Symbol Rating Unit Supply Voltage VCC,max 12 V Input Voltage VIN,max V GND ≤ VIN ≤ VCC Output Current IC,max 10 mA Power dissipation Pd 500 mW Operating Temperature Topr -20 ~ +75 °C Storage Temperature Tstg -40 ~ +125 °C Warning: Operation of the device at or beyond these limits may result in permanent damage to the device. Normal operation is not guaranteed at these extremes. Digital Characteristics (TA = +25 °C, VCC = 6.0 ~ 10.0 VDC) Parameter TC Sym Min Typ Max Unit High-Level Input Voltage VIH 2.5 5.0 V Low-Level Input Voltage VIL 0 0.4 0.8 V High-Level Input Current IIH uA TBD Low-Level Input Current IIL uA TBD Note: Digital input (BYP, pin 2) should be driven with levels between 0V ~ +5V relative to GND. Ref: 2010V253.DOC Rev: 2.53 QX2010 Data Sheet -- Preliminary -- Confidential QSound Labs, Inc. Date: 97.01.29 Page 4 of 7 QX2010 QXpander Processor Device Specifications (TA = +25 °C, VCC = 9.0 VDC) Analog Characteristics: Parameter Supply Voltage Range Power Supply Rejection Ratio Supply Current Input Voltage, Analog Output Voltage, Analog Output Current, Analog Load Resistance Load Capacitance Input Impedance Usable Bandwidth Voltage Gain, QXpanded Voltage Gain, bypass Total Harmonic Distortion Signal-Noise Ratio, QXpander Signal-Noise Ratio, Bypass Output Noise Voltage Channel Balance Insertion Loss TC 1 2 3 4 5 6 7 8 9 10 Sym VCC PSRR ICC Vin VOUT IOUT RL CL RI BW AV,1 AV,2 THD SNR SNR VNOISE CB Min Typ Max 6.0 9.0 10.0 44 50 15 20 1.0 1.4 2.0 2.8 ±1 5 100 21 30 39 20 20000 5.0 6.0 7.0 -0.5 0.0 +0.5 0.3 0.7 80 85 90 95 55 100 -1.0 +1.0 0.5 Unit VDC dB mA VRMS VRMS mA kΩ pF kΩ Hz dB dB % dB dB µVRMS dB dB Test Conditions: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. VCC = 9V + 200 mVRMS ,f = 1 kHz, BYP = VCC (QXpanded mode). VCC = 9.0 V, BYP = VCC (QXpanded mode). BYP = VCC (QXpanded mode), THD = 1%, f = 1 kHz. BYP = VCC (QXpanded mode), a) LIN = 1 VRMS ,1 kHz, RIN=0 V, b) RIN= 1 VRMS ,1 kHz, LIN=0 V. BYP = GND (Bypass mode), LIN = RIN = 1 VRMS ,1 kHz. Total Harmonic Distortion: a) THD at LOUT: LIN = 1 VRMS , RIN = 0 V, 1 kHz, BYP = VCC (QXpanded mode). b) THD at ROUT: RIN = 1 VRMS , LIN = 0 V, 1 kHz, BYP = VCC (QXpanded mode). BW = 20 ~ 20000 Hz, LOUT = ROUT = 1 VRMS, BYP = VCC , A curve.(QXpanded mode). BW = 20 ~ 20000 Hz, LIN = RIN = 1 VRMS, BYP = GND, A curve. (Bypass mode). BW = 20 ~ 20000 Hz, BYP = VCC , A curve. (QXpanded mode). LIN = RIN = 1 VRMS , 1 kHz, BYP = GND (Bypass mode). Ref: 2010V253.DOC Rev: 2.53 QX2010 Data Sheet -- Preliminary -- Confidential QSound Labs, Inc. Date: 97.01.29 Page 5 of 7 QX2010 QXpander Processor Bill of Material Item 1 2 3 4 5 6 7 8 9 10 11 Quantity 1 1 2 2 2 1 4 2 5 1 1 Device Specifications For low cost implementation Description 10 kΩ, 1/4W, 5%, Carbon Film Resistor 33 kΩ, 1/4W, 5%, Carbon Film Resistor 120 kΩ, 1/4W, 5%, Carbon Film Resistor 130 kΩ, 1/4W, 5%, Carbon Film Resistor 150 kΩ, 1/4W, 5%, Carbon Film Resistor 160 kΩ, 1/4W, 5%, Carbon Film Resistor 0.001 uF, 5%, 50V, Ceramic Disk Capacitor 0.1uF. 50V. 10% Capacitor 22.0uF, 16V Electrolytic Capacitor 47.0uF, 16V Electrolytic Capacitor QX2130SDIP Integrated Circuit Reference R10 R4 R3, R7 R9 or R13, R5 or R12 R8, R11 R6 C1, C2, C3, C4 C11, C12 C6, C7, C8, C9, C10 C5 U1 NOTE: These values are suitable for applicatons where cost is an overriding factor. Operation within quoted specifications cannot be guaranteed using the parts listed above. When strict conformance to the quoted specifications is required use the values indicated on the schematic. Ref: 2010V253.DOC Rev: 2.53 QX2010 Data Sheet -- Preliminary -- Confidential QSound Labs, Inc. Date: 97.01.29 Page 6 of 7 QX2010 QXpander Processor Device Specifications Package Data Ordering Code Package Code Package Type QX2010-P22C P22 PLASTIC SDIP QX2010-S20C S20 PLASTIC SSOP P22 6.5 PLASTIC SDIP 22 LEAD 300 MIL 0.070 PITCH UNITS: mm 19.2 8.0 3.5 3.3 0~15° 0.42 1.0 1.78 0.25 0.70 8.9±0.3 S20 11 20 7.8± 5.4± 0.3 0.2 PLASTIC SSOP 20 LEAD 300 MIL 0.030 PITCH UNITS: mm 0~0.1 1 10 0~10° 0.15±0.1 1.8 0.05± 0.05 Ref: 2010V253.DOC Rev: 2.53 0.8 0.36 0.5±0.2 QX2010 Data Sheet -- Preliminary -- Confidential QSound Labs, Inc. Date: 97.01.29 Page 7 of 7