HYMA6V16733F14HGTG 16Mx72 buffered Fast Page DRAM DIMM PRELIMINARY Description The HYMA6V16733F14HGTG familiy is an 16Mx72 bits Dynamic RAM Module which is assembled 18 pieces of 16Mx4bit DRAMs in 32pin TSOP-II package and two 16bit driver ICs in 48pin TTSOP package mounted on a 168pin printed circuit board with decoupling capacitors. The HYMA6V16733F14HGTG is optimized for application to the systems which are required high density and large capacity such as main memory of the computers and an image memory systems, and to the others which are requested compact size. The HYMA6V16733F14HGTG provides common data inputs and fast page mode Features • Fast Page mode capability • 8K Refresh cycle / 64ms • All inputs and outputs TTL compatible • • /RAS only refresh, /CAS before /RAS refresh,Hidden refresh capability • • Single Power supply 168pins Dual In-Line Package - HYMA6V16733F14HGTG : Gold plating Low power - active : 7200/6552mW(Max) - standby : 105mW(CMOS level : Max) * Fast access time & cycle time Part No tRAC tCAC tRC tPC HYMA6V16733F14HGTG-5 50ns 13ns 90ns 35ns HYMA6V16733F14HGTG-6 60ns 20ns 104ns 40ns Ordering Information Part No. Power Suppy HYMA6V16733F14HGTG-5 Clock Frequency 50ns 3.3V HYMA6V16733F14HGTG-6 Interface Form Factor TTL 168pin buffered DIMM 5.25x1.5 inch 60ns This document is a general product description and is subject to change without notice. Hyundai Electronics does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev.0.1/Apr.01 HYMA6V16733F14HGTG Pin Description Pin Pin Description Pin Pin Description A0, B0, A1~A12 Address Inputs /PDE Presence Detect Enable DQ0 ~ DQ71 Data Input / Output Vcc Power (+3.3V) /RAS0, /RAS2 Row Address Strobe Vss Ground /CAS0, /CAS4 Column Address Strobe NC No connection /WE0, /WE2 Read / Write Enable /OE0, /OE2 Output Enable PD 1~8 Presence Detect RSVD Reserved Use ID 0~1 ID bit RFU Reserved for future use Pin Assignment Pin Name Pin Name Pin Name Pin Name Pin Name Pin Name 1 Vss 29 RSVD 57 DQ22 85 Vss 113 RSVD 141 DQ58 2 DQ0 30 /RAS0 58 DQ23 86 DQ36 114 /RAS1* 142 DQ59 3 DQ1 31 /OE0 59 Vcc 87 DQ37 115 RFU 143 Vcc 4 DQ2 32 Vss 60 DQ24 88 DQ38 116 Vss 144 DQ60 RFU 5 DQ3 33 A0 61 RFU 89 DQ39 117 A1 145 6 Vcc 34 A2 62 RFU 90 Vcc 118 A3 146 RFU 7 DQ4 35 A4 63 RFU 91 DQ40 119 A5 147 RFU 8 DQ5 36 A6 64 RFU 92 DQ41 120 A7 148 RFU 9 DQ6 37 A8 65 DQ25 93 DQ42 121 A9 149 DQ61 10 DQ7 38 A10 66 DQ26 94 DQ43 122 A11 150 DQ62 11 DQ8 39 A12 67 DQ27 95 DQ44 123 A13* 151 DQ63 12 Vss 40 Vcc 68 Vss 96 Vss 124 Vcc 152 Vss 13 DQ9 41 RFU 69 DQ28 97 DQ45 125 RFU 153 DQ64 14 DQ10 42 RFU 70 DQ29 98 DQ46 126 B0 154 DQ65 15 DQ11 43 Vss 71 DQ30 99 DQ47 127 Vss 155 DQ66 16 DQ12 44 /OE2 72 DQ31 100 DQ48 128 RFU 156 DQ67 17 DQ13 45 /RAS2 73 Vcc 101 DQ49 129 /RAS3* 157 Vcc 18 Vcc 46 /CAS4 74 DQ32 102 Vcc 130 /CAS5* 158 DQ68 19 DQ14 47 RSVD 75 DQ33 103 DQ50 131 RSVD 159 DQ69 20 DQ15 48 /WE2 76 DQ34 104 DQ51 132 /PDE 160 DQ70 21 DQ16 49 Vcc 77 DQ35 105 DQ52 133 Vcc 161 DQ71 22 DQ17 50 RSVD 78 Vss 106 DQ53 134 RSVD 162 Vss 23 Vss 51 RSVD 79 PD1 107 Vss 135 RSVD 163 PD2 24 RSVD 52 DQ18 80 PD3 108 RSVD 136 DQ54 164 PD4 25 RSVD 53 DQ19 81 PD5 109 RSVD 137 DQ55 165 PD6 26 Vcc 54 Vss 82 PD7 110 Vcc 138 Vss 166 PD8 27 /WE0 55 DQ20 83 ID0 111 RFU 139 DQ56 167 ID1 28 /CAS0 56 DQ21 84 Vcc 112 /CAS1* 140 DQ57 168 Vcc Note : Pins marked * are not used in this module Presence Detect Pins(Optional) Rev.0.1/Apr.01 Pin 50ns 60ns Pin 50ns 60ns PD1 1 1 PD6 0 1 PD2 1 1 PD7 0 1 PD3 1 1 PD8 0 0 PD4 1 1 ID0 0 0 PD5 0 0 ID1 0 0 2 HYMA6V16733F14HGTG Functinal Block Diagram RAS0 RAS2 CAS0 CAS4 WE0 WE2 OE0 A1~A12 OE2 DQ 0 DQ 1 DQ 2 DQ 3 DQ 0 DQ 1 DQ 2 DQ 3 DQ 4 DQ 5 DQ 6 DQ 7 DQ 0 DQ 1 DQ 2 DQ 3 DQ 8 DQ 9 DQ 10 DQ 11 DQ 0 DQ 1 DQ 2 DQ 3 DQ 12 DQ 13 DQ 14 DQ 15 DQ 0 DQ 1 DQ 2 DQ 3 DQ 16 DQ 17 DQ 18 DQ 19 DQ 0 DQ 1 DQ 2 DQ 3 DQ 20 DQ 21 DQ 22 DQ 23 DQ 0 DQ 1 DQ 2 DQ 3 DQ 24 DQ 25 DQ 26 DQ 27 DQ 0 DQ 1 DQ 2 DQ 3 DQ 28 DQ 29 DQ 30 DQ 31 DQ 0 DQ 1 DQ 2 DQ 3 DQ 32 DQ 33 DQ 34 DQ 35 DQ 0 DQ 1 DQ 2 DQ 3 DQ 0 DQ 1 DQ 2 DQ 3 DQ 40 DQ 41 DQ 42 DQ 43 DQ 0 DQ 1 DQ 2 DQ 3 D2 DQ 44 DQ 45 DQ 46 DQ 47 DQ 0 DQ 1 DQ 2 DQ 3 D3 DQ 48 DQ 49 DQ 50 DQ 51 DQ 0 DQ 1 DQ 2 DQ 3 DQ 52 DQ 53 DQ 54 DQ 55 DQ 0 DQ 1 DQ 2 DQ 3 DQ 56 DQ 57 DQ 58 DQ 59 DQ 0 DQ 1 DQ 2 DQ 3 DQ 60 DQ 61 DQ 62 DQ 63 DQ 0 DQ 1 DQ 2 DQ 3 DQ 64 DQ 65 DQ 66 DQ 67 DQ 0 DQ 1 DQ 2 DQ 3 DQ 68 DQ 69 DQ 70 DQ 71 DQ 0 DQ 1 DQ 2 DQ 3 D0 D1 D4 D5 D6 D7 D8 A0 DRAMS: D0~D8 VSS B0 DRAMS: D9~D17 PDE VCC VSS Rev.0.1/Apr.01 DQ 36 DQ 37 DQ 38 DQ 39 D0~D17, Buffer 0.1uF or 0.22uF Capacitor per each DRAMs D0~D17, Buffer VCC VSS D9 D10 D11 D12 D13 D14 D15 D16 D17 (when= 0, 1= NC) + 4.7uF Tantal Capacitor 3 HYMA6V16733F14HGTG Absolute Maximum Ratings* (TA=0 to 70 oC) Parameter Symbol Rating Unit Ambient Temperature TA 0 ~ 70 oC Storage Temperature TSTG -55 ~ 125 oC Voltage on Any Pin relative to Vss VIN / OUT -0.5 ~ 4.6 V Voltage on Vcc relative to Vss Vcc -0.5 ~ 4.6 V Short Circuit Output Current IOUT 50 mA Power Dissipation PD 21 W * Note : 1. Stress greater than above absolute maximum ratings may cause permanent damage to the device Recommended DC Operating Conditions (TA=0 to 70 oC) Parameter Symbol Min Typ. Max Unit Note Power Supply Voltage Vcc 3.0 3.3 3.6 V 1 Input High Voltage VIH 2.0 - Vcc + 0.3 V 1 Input Low Voltage VIL -0.3 - 0.8 V 1 * Note : 1. All voltage referenced to Vss Rev.0.1/Apr.01 4 HYMA6V16733F14HGTG DC Electrical Characteristics (TA = 0 ~ 70oC, Vcc = 3.3V +/- 0.3V ) Symbol Parameter VOH Output Level Output “H” Level voltage(Iout= -2mA) VOL Output Level Output “L” Level voltage(Iout=2mA) ICC1 Operating current Average power supply operating current ( /RAS, /CAS Cycling : tRC = tRC min) Min Max Unit 2.4 Vcc V 0 0.4 V 50ns - 2160 60ns - 1820 - 56 mA ICC2 Standby current (TTL interface) Power supply standby current (/RAS, /UCAS,/LCAS=VIH, Dout = High-Z) 50ns - 2160 ICC3 /RAS only refresh current Average power supply current /RAS only refresh mode (/RAS cycling, /CAS=VIH, tRC= tRC min) 60ns - 1820 Extended data out page mode current (/RAS=VIL, /CAS, Address cycling : tHPC=tHPC min) 50ns - 1980 60ns - 1820 - 29 50ns - 2160 60ns - 1820 ICC4 ICC5 Standby current (CMOS ) Power supply standby current ( /RAS, /UCAS, /LCAS >= Vcc-0.2V, Dout = High-Z) ICC6 /CAS-before-/RAS refresh current (tRC=tRC min) Note 1, 2 mA mA 2 mA 1, 3 mA mA ICC7 Battery back up operating current (standby with CBR) (tRC=31.25us, tRAS=300ns, Dout=High-Z) - 110 uA II(L) Input leakage current, Any input (0V<= Vin<=Vcc) -5 5 uA IO(L) Output leakage current, (Dout is disabled, 0V<= Vout<=Vcc) -5 5 uA 1 Note : 1. Icc depends on output load condition when the device is selected. Icc(max) is specified at the output open condition 2. Address can be changed once or less while /RAS = VIL 3. Address can be changed once or less while /CAS = VIH Rev.0.1/Apr.01 5 HYMA6V16733F14HGTG Capacitance ( Vcc = 3.3V +/- 0.3V, TA = 25C, f = 1MHz ) Parameter Symbol Min. Max Unit Note Input capacitance (A0 ~ A12, B0) CI1 - 20 pF 1 Input capacitance (/WE0, /WE2, /OE0,/OE2) CI2 - 20 pF 1,2 Input capacitance (/RAS0, /RAS2) CI3 - 65 pF 1,2 Input capacitance (/CAS0, /CAS4) CI4 - 20 pF 1,2 Output capacitance (DQ0 ~ DQ71) CI/O - 20 pF 1, 2 Note : 1. Capacitance measured with Boonton Meter or effective capacitance measuring method 2. /CAS = VIH to disable Dout AC Characteristics (Vcc=3.3V +/-10%, TA=0~70C, Note 1, 2, 19) Test Condition • Input rise and fall times : 2ns • Input level : VIL / VIH = 0.0 / 3.0V • Input timing reference levels : VIL / VIH = 0.8 / 2.0V • Output timing reference levels : VOL / VOH = 0.8 / 2.0V • Output load : 1 TTL gate + CL(100pF) (Including scope and jig) Read, Write, Read-modify-write and Refresh Cycles -50 Parameter -60 Symbol Unit Min Max Min Max Note Random read or write cycle time tRC 84 - 104 - ns /RAS precharge time tRP 30 - 40 - ns /CAS precharge time tCP 10 - 10 - ns /RAS pulse width tRAS 50 10,000 60 10,000 ns /CAS pulse width tCAS 8 10,000 10 10,000 ns Row address set-up time tASR 5 - 5 - ns Row address hold time tRAH 10 - 10 - ns Column address set-up time tASC 0 - 0 - ns Column address hold time tCAH 10 - 10 - ns /RAS to /CAS delay time tRCD 14 32 14 40 ns 3 /RAS to Column address delay time tRAD 12 20 12 25 ns 4 /RAS hold time tRSH 8 - 20 - ns /CAS hold time tCSH 30 - 40 - ns /CAS to /RAS precharge time tCRP 10 - 10 - ns Rev.0.1/Apr.01 6 HYMA6V16733F14HGTG - continued -50 Parameter -60 Symbol Min Max Min Max Unit Note /OE to Din delay time tODD 18 - 20 - ns 5 /OE delay time from Din tDZO 0 - 0 - ns 6 /CAS delay time from Din tDZC 0 - 0 - ns 6 Transition time ( Rise and Fall) tT 2 50 2 50 ns 7 Refresh period tREF - 64 - 64 ms 8K Ref. Parameter Symbol Unit Note Read Cycles -50 -60 Min Max Min Max Access time from /RAS tRAC - 50 - 60 ns 8, 9 Access time from /CAS tCAC - 18 - 20 ns 9,10,17 Access time from column address tAA - 30 - 35 ns 9,11,17 Access time from /OE tOAC - 18 - 20 ns 9 Read command set-up time tRCS 0 - 0 - ns Read command hold time to /CAS tRCH 0 - 0 - ns 12 Read command hold time to /RAS tRRH 0 - 0 - ns 12 Column address to /RAS lead time tRAL 30 - 35 - ns Column address to /CAS lead time tCAL 13 - 18 - ns Output buffer turn off delay time from /CAS tOFF - 18 - 20 ns 13,21 Output buffer turn off delay time from /OE tOEZ - 18 - 20 ns 13 /CAS to Din delay time tCDD 18 - 20 - ns 5 /OE pulse width tOEP 13 - 15 - ns Rev.0.1/Apr.01 7 HYMA6V16733F14HGTG Write Cycles -50 Parameter -60 Symbol Min Max Min Max Unit Note Write command set-up time tWCS 0 - 0 - ns 14 Write command hold time tWCH 5 - 10 - ns 21 Write command pulse width tWP 10 - 10 - ns Write command to /RAS lead time tRWL 20 - 20 - ns Write command to /CAS lead time tCWL 8 - 10 - ns Data-in set-up time tDS 0 - 0 - ns 15 Data-in hold time tDH 10 - 15 - ns 15 Unit Note Read-Modify-Write Cycles -50 Parameter -60 Symbol Min Max Min Max Read-modify-write cycle time tRWC 128 - 140 - ns /RAS to /WE delay time tRWD 72 - 84 - ns 14 /CAS to /WE delay time tCWD 30 - 34 - ns 14 Column address to /WE delay time tAWD 42 - 49 - ns 14 /OE hold time from /WE tOEH 13 - 15 - ns Refresh cycles -50 Parameter -60 Symbol Unit Min Max Min Max /CAS set-up time ( /CAS-before-/RAS Refresh Cycle) tCSR 5 - 5 - ns /CAS hold time ( /CAS-before-/RAS Refresh Cycle) tCHR 10 - 10 - ns /RAS precharge to /CAS hold time tRPC 5 - 5 - ns /CAS precharge time in normal mode tCPN 10 - 10 - ns Rev.0.1/Apr.01 Note 8 HYMA6V16733F14HGTG Fast Page Mode Cycles -50 Parameter -60 Symbol Unit Min Max Min Max Note Fast page mode cycle time tPC 35 - 40 - ns Fast page mode /CAS precharge time tCP 10 - 10 - ns Fast page mode /RAS pulse width tRASP - 100K - 100K ns 16 Access time from /CAS precharge tACP - 30 - 35 ns 9,17 /RAS hold time from /CAS precharge tRHCP 30 - 35 - ns Fast page mode read-modify-write cycle /CAS precharge to /WE delay time tCPW 50 - 55 - ns Fast page mode read-modify-write cycle time tPRWC 76 - 85 - ns Test Mode Cycles -50 Parameter -60 Symbol Unit Min Max Min Max Test mode /WE set-up time tWS 0 - 0 - ns Test mode /WE hold time tWH 10 - 10 - ns Note Counter Test Cycles -50 Parameter /CAS precharge time in counter test cycle Rev.0.1/Apr.01 -60 Symbol tCPT Unit Min Max Min Max 40 - 40 - Note ns 9 HYMA6V16733F14HGTG Notes : 1. AC measurements assume t T = 2ns 2. AC initial pause of 200us is required after power up followed by a minimum of eight initialization cycles ( any combination of cycles containing /RAS-only refresh or /CAS-before-/RAS refresh) 3. Operation with the tRCD(max) limit insures that tRAC(max) can be met, t RCD(max) is specified as a reference point only : if tRCD is greater than the specified tRCD(max) limit, then access time is controlled exclusively by tCAC. 4. Operation with the tRAD(max) limit insures that tRAC(max) can be met, tRAD(max) is specified as a reference point only : if tRAD is greater than the specified tRAD(max) limit, then access time is controlled exclusively by tAA. 5. Either tODD or tCDD must be satisfied. 6. Either tDZO or tDZC must be satisfied. 7. VIH(min) and VIL(max) are reference levels for measuring timing of input signals, also transition times are measured between V IH(min) and VIL(max) 8. Assumes that tRCD<=tRCD(max) and tRAD<=tRAD(max). If tRCD or tRAD is greater than the maximum recommended value shown in this table, tRAC exceeds the value shown 9. Measured with a load circuit equivalent to 1 TTL loads and 100pF. 10. Assumes that tRCD>=tRCD(max) and tRCD + tCAC(max) >= tRAD + tAA(max) 11. Assumes that tRAD>=tRAD(max) and tRCD + tCAC(max) <= tRAD + tAA(max) 12. Either tRCH of tRRH must be satified for a read cycles 13. tOFF(max), tOEZ(max), tOFR(max) and tWEZ(max) define the time at which the outputs achieve the open circuit condition and is not referenced to output voltage levels 14 tWCS, tRWD, tCWD, tAWD and tCPW are not restrictive operating parameters. They are included in the data sheet as electrical characteristics only : If tWCS >=tWCS(min), the cycle is an early write cycle and the data out pin will remain open circuit(high impedance) throughout the entire cycle : If tRWD>=tRWD(min), tCWD>=tCWD(min), tAWD>=tAWD(min), the cycle is a read-modify-write and the data output will contain data read from the selected cell : if neither of the above sets of conditions is satified, the condition of the data out (at access time) is indeterminate. 15. tDS and tDH are refered to /CAS leading edge in early write cycles and to /WE leading edge in delayed write or read-modify-write cycles 16. tRASP defineds /RAS pulse width in extended data out mode cycles 17. Access time is determined by the longest among tAA, tCAC and tACP 18 In delaying write or read-modify-write cycles, /OE must disable output buffer prior to applying data to the device. Rev.0.1/Apr.01 HYMA6V16733F14HGTG 19. When output buffers are enabled once, sustain the low impedence state until valid data is obtained. when output buffer is turned on and off within a very short time, generally it causes large Vcc/Vss line noise, which causes to degrade V IH min / VIL max level 20. tHPC(min) can be achieved during a series of EDO mode early write cycles or EDO mode read cycels If both write and read operation are mixed in a EDO mode, /RAS cycle[EDO mode mix cycle (1)(2)] minimum value of /CAS cycle t HPC[tCAS + tCP + 2tT] become greater than the specified tHPC(min) value. The value of CAS cycle time of mixed EDO page mode is shown in EDO page mode mix cycle (1) and (2) 21. Data output turns off and becomes high impedance from later rising edge of /RAS and /CAS. Hold time and turn off time are specified by the timing specifications of later rising edge of /RAS and /CAS between tOHR and tOH and between tOFR and tOFF 22. tDOH defines the time at which the output level go cross, VOL=0.8V, VOH=2.0V of output timing reference level. 23. Before and after self refresh mode, execute CBR refresh to all refresh addresses in or within 64ms period on the condition a) and b) below a) Enter self refresh mode within 15.6us after either burst refresh or distributed refresh at equal interval to all refresh addresses are completed. b) Start burst refresh or distributed refresh at equal interval to all refresh addresses within 15.6us after exiting from self refresh mode 24. In case of entering from /RAS-only-refresh, It is necessary to execute CBR refresh before and after self refresh mode according as note 23 25. For L-version, It is available to apply each 128ms and 31.2us instead of 64ms and 15.6us at note 23 26. At tRASS > 100us, self refresh mode is activated, and not active at tRASS < 10us, It is undefined within the range of 10us < tRASS < 100us. For tRASS > 10us, It is necessary to satify tRPS 27. XXX : H or L [ H : VIH(min) <= VIN <=VIH(max), L : VIH(min) <=VIN <=VIH(max)] ///// : Invalid Dout When the address, clock and input pins are not described on timing waveforms, their pins must be applied VIH or VIL Rev.0.1/Apr.01 HYMA6V16733F14HGTG Timing Waveforms tRAS tRP RAS tCSH tCRP tRCD tRSH tCAS tT CAS tRAD tASR ADDRESS tRAL tASC tRAH ROW tCAH COLUMN tRRH tRCS tRCH WE tCAC tOFF tAA High-Z DOUT DOUT tRAC tOEZ tDZC tCDD High-Z DIN tDZO tOAC tOED OE * Figure 1. Read Cycle Rev.0.1/Apr.01 : Don`t care HYMA6V16733F14HGTG tRC tRAS tRP RAS tRSH tT tRCD tCAS tCRP tCSH CAS tASR ADDRESS tRAH tASC ROW tCAH COLUMN tWCS tWCH WE tDS DIN tDH DIN High-Z DOUT * ** : Don`t care OE : Don`t care *** tWCS > = tWCS (min) Figure 2. Early Write Cycle Rev.0.1/Apr.01 HYMA6V16733F14HGTG tRC tRAS tRP RAS tRSH tT tRCD tCAS tCRP tCSH CAS tASR ADDRESS tRAH tCAH tASC ROW COLUMN tCWL tRCS tRWL tWP WE tDZC tDH tDS High-Z DIN DIN tOED tDZO tOEH OE tOEZ High-Z DOUT ** INVALID OUTPUT * : Don`t care ** Invalid DOUT comes out, when OE is low level. Figure 3 . Delayed Write Cycle Rev.0.1/Apr.01 HYMA6V16733F14HGTG tRWC tRAS tRP RAS tT tRCD tCAS tCRP CAS tRAD tRAH tASR ADDRESS tASC tCAH COLUMN ROW tCWL tRWL tWP tCWD tAWD tRCS tRWD WE tAA tRAC tDZC High-Z DIN tDH tDS tCAC DIN tOED tOEH High-Z DOUT DOUT tDZO tOAC tOEZ OE * Figure 4. Read Modify Write Cycle Rev.0.1/Apr.01 : Don`t care HYMA6V16733F14HGTG tRC tRAS tRP RAS tCRP tT tRPC tCRP CAS tASR ADDRESS tRAH ROW High-Z DOUT * OE,WE : Don`t care ** Rrfresh address : A0~A12 (AX0 ~ AX12) Figure 5. /RAS only Refresh Cycle tRC tRP tRAS tRC tRP tRAS tRP RAS tRPC tCPN tT tCSR tRPC tCHR tCPN tCRP tCSR tCHR CAS ADDRESS tOFF DOUT INVALID DOUT High-Z : Don`t care * ** WE : VIH Figure 6. /CAS before /RAS Refresh Cycle Rev.0.1/Apr.01 HYMA6V16733F14HGTG tRC tRC tRAS tRP (Read) tRAS tRC tRP tRAS (Refresh) tRP (Refresh) RAS tT tCHR tRSH tRCD tCRP tCAS CAS tRAD tASR ADDRESS tRAH tRAL tCAH tASC ROW COLUMN tRCH tRCS tRRH WE tCAC tAA tOFF tRAC DOUT High-Z DOUT tDZC tOEZ High-Z DIN tCDD tDZO tOAC tOED OE * Figure 7. Hidden Refresh Cycle Rev.0.1/Apr.01 : Don`t care HYMA6V16733F14HGTG tRASP tRP tRHCP RAS tT tCSH tRCD tHPC tCAS tCP tCAS tRSH tCP tCAS tCRP CAS tRAD tRAL tCSH tASR ADDRESS tRAH ROW tASC tCAH tASC COLUMN tCAH COLUMN tASC tCAH COLUMNN tRCH tRCHA tRCS tRRH tRCHC WE tOAC OE tRAC tAA tCAC DOUT tCPA tAA tCAC High-Z tCPA tAA tCAC tOEZ tDOH DOUT 1 tOH tDOH DOUT 2 DOUT N * Figure 8. Fast Page Mode Read Cycle Rev.0.1/Apr.01 tWEZ tOHR tOFR tOFF : Don`t care HYMA6V16733F14HGTG tRASP tRP tCPRH RAS tT tHPC tCSH tCP tCP tCAS tRSH tCAS tCAS tRCHR tRCHC tRCH tRCS tCRP tHPC tCP tCAS CAS tHPC tRRH tRCS tRCH WE tRAL tASC tCAH tASR ADDRESS ROW tASC tASC tCAH tCAH tASC tCAH tRAH COLUMN 1 COLUMN 2 tCAL COLUMN 3 tCAL COLUMN N tCAL tCOL tOFR tOFF tOHR tOH tCAL tCOP OE tCPA tAA tOAC tCAC tAA tRAC tWEZ tOEZ tCPA tAA tCAC tCAC tOAC tCPA tAA tOEZ tDOH tOEZ tCAC tOAC High-Z DOUT DOUT 1 DOUT 2 DOUT 2 DOUT 3 DOUT N Figure 9. Fast Page Mode Read Cycle( /OE Control)* * Note : FP Hi-Z control by /OE or /WE. /OE rising edge disables data outputs. When /OE goes high during /CAS high, the data will not come out until next /CAS access. When /WE goes low during /CAS high, the data will not come out until next /CAS access. Rev.0.1/Apr.01 HYMA6V16733F14HGTG tRP tRASP RAS tT tHPC tCSH tRCD tCAS tCP tRSH tCAS tCRP tCP tCAS CAS tASR tRAH ADDRESS tASC ROW tASC tCAH COLUMN 2 COLUMN 1 tWCS tWCH tWCS tCAH tASC tCAH COLUMN N tWCH tWCS tWCH WE tDS DIN tDH tDS D IN 1 tDH tDS DIN 2 tDH DIN N High-Z DOUT * OE : Don`t care ** tWCS ¡ ÃtWCS (min) *** Figure 10. Fast Page Mode Early Write Cycle Rev.0.1/Apr.01 : Don`t care HYMA6V16733F14HGTG tRP tRASP RAS tCP tT tCP tCSH tCRP tHPC tRCD tCAS tRSH tCAS tCAS CAS tRAD tASR tASC tRAH ADDRESS tASC tASC tCAH ROW tCAH tCAH COLUMN 1 COLUMN 2 COLUMN N tCWL tRCS tCWL tRCS tCWL tRWL tRCS WE tWP tDZC tDS tWP tDS tDZC tDH DIN tDH tDZO tOED tDH DIN 2 DIN 1 tDZO tWP tDS tDZC DIN N tDZO tOED tOEH tOED tOEH tOEH OE tCLZ tCLZ tOEZ High-Z DOUT INVALID DOUT tCLZ tOEZ tOEZ INVALID DOUT INVALID DOUT * : Don`t care > tCWL ** tOEH= Figure 11. Fast Page Mode Delayed Write Cycle Rev.0.1/Apr.01 HYMA6V16733F14HGTG tRP tRASP RAS tHPRWC tT tCRP tCP tRCD tCAS tRSH tCP tCAS tCAS CAS tRAD tASR ADDRESS tASC tASC tCAH tRAH ROW tCAH tCAH COLUMN 1 tRCS tASC COLUMN 2 tRWD tAWD tCWD COLUMN N tRCS tCPW tAWD tCWD tDZC tDS tCWL tRCS tCPW tAWD tCWD tDZC tDS tCWL tCWL tRWL WE tWP tDZC tDS tWP tDH DIN tWP tDH DIN 1 tDH D IN 2 DIN N tDZO tDZO tOED tDZO tOED tOEH tOAC tCAC tAA tRAC tOED tOEH tOEZ OE tOEH tOEZ tOAC tCAC tAA tCPA tCLZ tOEZ tOAC tCAC tCPA tCLZ DOUT 1 tAA tCLZ DOUT 2 DOUT N DOUT * ** tOEH Figure 12. Fast Page Mode Read Modify Write Cycle Rev.0.1/Apr.01 High-Z High-Z : Don`t care > = tCWL HYMA6V16733F14HGTG tRP tRASP RAS tT tCP tCAS tRCD CAS tCP tCP tCAS tCRP tCAS tCAS tCSH tRCHC tRSH tWP tWCS tWCH tCPW WE tRRH tRCH tRAL tAWD tRAH tASC ADDRESS ROW tASC tASC tCAH tASR COLUMN 1 COLUMN 2 tCAH COLUMN 4 COLUMN 3 tRDD tDS tDH tDS tASC tCAH tCAH tCDD tDH Din DIN 1 High - Z DIN 3 tWDD tOED OE tCAC tOAC tAA tCPA Dout High - Z tDOH tCAC tOEZ tAA tCPA DOUT 2 tCAC tAA tOAC tCPA DOUT 3 Rev.0.1/Apr.01 tOFF tOH DOUT 4 * Figure 13. Fast Page Mode Mix Cycle (1) tOFR : Don`t care tWEZ tOEZ HYMA6V16733F14HGTG tRP tRASP RAS tT tCSH tCP tCAS tRCD CAS tCP tCAS tRCHR tRCS tRAH tASC tRSH tWP tRCH t tASC tCAH tCAH tCAH COLUMN 4 COLUMN 3 COLUMN 2 COLUMN 1 ROW tCAL tDS High - Z tOED tCOL tCAC tAA tOEZ tCPA tOAC DOUT 1 High - Z tCOP tOEZ tCAC tAA tOAC tCPA Figure 14. Fast Page Mode Mix Cycle(2) tOFF tOH tOFR D OUT 4 DOUT 3 * Rev.0.1/Apr.01 tRDD tCDD DIN 3 OE tCAC tAA tOAC tRAC tCAL tCAL tDH tDS tDH DIN 2 tOED tRRH RAL tASC tASC tCAH tCAL Dout tCAS tCPW tASR Din tCAS tRCH tWCH tWCS WE ADDRESS tCRP tCP : Don`t care tWEZ tOEZ HYMA6V16733F14HGTG Set Cycle*** Test Mode Cycle Reset Cycle* Normal Mode ~ ~ RAS ~ ~ ~ ~ CAS ~ ~ WE * CBR or RAS-only refresh ** : Don`t care *** Address, DIN , OE: Don`t care Figure 15. Test Mode Cycle tRC tRP tRAS tRP RAS tRPC tCSR tCHR tT CAS tCPN tRPC tCRP tCPN tWS tWH WE ADDRESS tOFF High-Z DOUT INVALID D OUT * Figure 16. Test Mode Set Cycle Rev.0.1/Apr.01 : Don`t care HYMA6V16733F14HGTG tRC tRAS tRP RAS tT tCSR tCHR tCPT tRSH tCRP tCAS CAS tCAH tASC ADDRESS COLUMN tWS tWH tRRH tRCH tRCS WE tDZC tCDD High-Z DIN tOED tDZO OE tOAC tCAC tOEP tOEZ tOFF tAA tRAC High-Z DOUT DOUT * : Don`t care Figure 17. /CAS Before /RAS Refresh Counter Check Cycle ( Read ) Rev.0.1/Apr.01 HYMA6V16733F14HGTG tRC tRAS tRP RAS tCSR tCHR tCPT tRSH tCRP tCAS tT CAS tASC ADDRESS tCAH COLUMN tWS tWH tWCS tWCH WE tDS DIN tDH DIN OE High-Z DOUT * : Don`t care Figure 18. /CAS Before /RAS Refresh Counter Check Cycle ( Write ) Rev.0.1/Apr.01 HYMA6V16733F14HGTG Package Dimension Unit : mil (mm) (1mm = 1/1000inches) 700(17.78) 1500(38.10) 157.48(4.0) 5250(133.35) 1 84 "C"1450(36.83) 450(11.43) "B" 2150(54.61) "A" 250(6.35) 1700(43.18) 4550(115.57) 5013.78(127.35) 157.48(4.0) max. 157.48(4.0) min. (Front Side) 168 85 (Rear Side) 39.37(1.0) 39.37(1.0) R78.74 (2.0) 125(3.175) 50(1.27) 125(3.175) 39.37(1.0) DETAIL "C" 78.74(2.0) DETAIL "B" Note : 1. Tolerances on all dimensions +/- 5 ( 0.127) unless otherwise spedified 2. Thickness includes Plating and / or Metallization Rev.0.1/Apr.01 DETAIL "A" 100(2.54) min. R78.74 (2.0) 5.9(0.15) 122.83(3.12) 78.74(2.0) 50(1.27)