HM5164805F Series HM5165805F Series 64 M EDO DRAM (8-Mword × 8-bit) 8 k Refresh/4 k Refresh ADE-203-1057B (Z) Rev. 2.0 Nov. 30, 1999 Description The Hitachi HM5164805F Series, HM5165805F Series are 64M-bit dynamic RAMs organized as 8,388,608-word × 8-bit. They have realized high performance and low power by employing CMOS process technology. HM5164805F Series, HM5165805F Series offer Extended Data Out (EDO) Page Mode as a high speed access mode. They have the package variation of standard 32-pin plastic SOJ and standard 32pin plastic TSOPII. Features • Single 3.3 V supply: 3.3 V ± 0.3 V • Access time: 50 ns/60 ns (max) • Power dissipation Active: 414 mW/378 mW (max) (HM5164805F Series) : 486 mW/414 mW (max) (HM5165805F Series) Standby : 1.8 mW (max) (CMOS interface) : 1.1 mW (max) (L-version) • EDO page mode capability • Refresh cycles RAS-only refresh 8192 cycles /64 ms (HM5164805F, HM5164805FL) 4096 cycles /64 ms (HM5165805F, HM5165805FL) CBR/Hidden refresh 4096 cycles /64 ms (HM5164805F, HM5164805FL, HM5165805F, HM5165805FL) HM5164805F Series, HM5165805F Series • 4 variations of refresh RAS-only refresh CAS-before-RAS refresh Hidden refresh Self refresh (L-version) • Battery backup operation (L-version) Ordering Information Type No. Access time Package HM5164805FJ-5 HM5164805FJ-6 50 ns 60 ns 400-mil 32-pin plastic SOJ (CP-32DC) HM5164805FLJ-5 HM5164805FLJ-6 50 ns 60 ns HM5165805FJ-5 HM5165805FJ-6 50 ns 60 ns HM5165805FLJ-5 HM5165805FLJ-6 50 ns 60 ns HM5164805FTT-5 HM5164805FTT-6 50 ns 60 ns HM5164805FLTT-5 HM5164805FLTT-6 50 ns 60 ns HM5165805FTT-5 HM5165805FTT-6 50 ns 60 ns HM5165805FLTT-5 HM5165805FLTT-6 50 ns 60 ns 2 400-mil 32-pin plastic TSOP II (TTP-32DC) HM5164805F Series, HM5165805F Series Pin Arrangement (HM5164805F Series) 32-pin SOJ 32-pin TSOP VCC 1 32 V SS VCC 1 32 V SS I/O0 2 31 I/O7 I/O0 2 31 I/O7 I/O1 3 30 I/O6 I/O1 3 30 I/O6 I/O2 4 29 I/O5 I/O2 4 29 I/O5 I/O3 5 28 I/O4 I/O3 5 28 I/O4 NC 6 27 V SS NC 6 27 V SS VCC 7 26 CAS VCC 7 26 CAS WE 8 25 OE WE 8 25 OE RAS 9 24 A12 RAS 9 24 A12 A0 10 23 A11 A0 10 23 A11 A1 11 22 A10 A1 11 22 A10 A2 12 21 A9 A2 12 21 A9 A3 13 20 A8 A3 13 20 A8 A4 14 19 A7 A4 14 19 A7 A5 15 18 A6 A5 15 18 A6 VCC 16 17 V SS VCC 16 17 V SS (Top view) (Top view) Pin Description Pin name Function A0 to A12 Address input — Row/Refresh address A0 to A12 — Column address A0 to A9 I/O0 to I/O7 Data input/output RAS Row address strobe CAS Column address strobe WE Write enable OE Output enable VCC Power supply VSS Ground NC No connection 3 HM5164805F Series, HM5165805F Series Pin Arrangement (HM5165805F Series) 32-pin SOJ 32-pin TSOP VCC 1 32 VSS VCC 1 32 VSS I/O0 2 31 I/O7 I/O0 2 31 I/O7 I/O1 3 30 I/O6 I/O1 3 30 I/O6 I/O2 4 29 I/O5 I/O2 4 29 I/O5 I/O3 5 28 I/O4 I/O3 5 28 I/O4 NC 6 27 VSS NC 6 27 VSS VCC 7 26 CAS VCC 7 26 CAS WE 8 25 OE WE 8 25 OE RAS 9 24 NC RAS 9 24 NC A0 10 23 A11 A0 10 23 A11 A1 11 22 A10 A1 11 22 A10 A2 12 21 A9 A2 12 21 A9 A3 13 20 A8 A3 13 20 A8 A4 14 19 A7 A4 14 19 A7 A5 15 18 A6 A5 15 18 A6 VCC 16 17 V SS VCC 16 17 V SS (Top view) Pin Description Pin name Function A0 to A11 Address input — Row/Refresh address A0 to A11 — Column address A0 to A10 I/O0 to I/O7 Data input/output RAS Row address strobe CAS Column address strobe WE Write enable OE Output enable VCC Power supply VSS Ground NC No connection 4 (Top view) HM5164805F Series, HM5165805F Series Block Diagram (HM5164805F Series) RAS CAS WE OE Timing and control Column decoder A0 Column A1 to • • • 8M array address 8M array buffers A9 • • • Row address buffers A10 to A12 Row decoder 8M array 8M array 8M array I/O buffers I/O0 to I/O7 8M array 8M array 8M array 5 HM5164805F Series, HM5165805F Series Block Diagram (HM5165805F Series) RAS CAS WE OE Timing and control Column decoder A0 Column A1 to • • • 8M array address 8M array buffers A10 • • • Row address buffers Row decoder 8M array 8M array 8M array 8M array 8M array 8M array A11 6 I/O buffers I/O0 to I/O7 HM5164805F Series, HM5165805F Series Operation Table RAS CAS WE OE I/O 0 to I/O 7 Operation H × × × High-Z Standby L L H L L L Dout Read cycle L* 2 × Din Early write cycle 2 H Din Delayed write cycle L L L* L L H to L L to H Dout/Din Read-modify-write cycle L H × × High-Z RAS-only refresh cycle H to L L H × High-Z CAS-before-RAS refresh cycle or Self refresh cycle (L-version) L L H H High-Z Read cycle (Output disabled) Notes: 1. H: VIH (inactive), L: VIL (active), ×: VIH or VIL 2. t WCS ≥ 0 ns: Early write cycle t WCS < 0 ns: Delayed write cycle Absolute Maximum Ratings Parameter Symbol Value Unit Terminal voltage on any pin relative to V SS VT –0.5 to VCC + 0.5 (≤ 4.6 V (max)) V Power supply voltage relative to V SS VCC –0.5 to +4.6 V Short circuit output current Iout 50 mA Power dissipation PT 1.0 W Storage temperature Tstg –55 to +125 °C DC Operating Conditions Parameter Symbol Min Typ Max Unit Notes Supply voltage VCC 3.0 3.3 3.6 V 1, 2 VSS 0 0 0 V 2 Input high voltage VIH 2.0 — VCC + 0.3 V 1 Input low voltage VIL –0.3 — 0.8 V 1 Ambient temperature range Ta 0 — 70 ˚C Notes: 1. All voltage referred to VSS . 2. The supply voltage with all VCC pins must be on the same level. The supply voltage with all VSS pins must be on the same level. 7 HM5164805F Series, HM5165805F Series DC Characteristics (HM5164805F Series) HM5164805F -5 Parameter -6 Symbol Min Max Min Max Unit Test conditions I CC1 — 115 — 105 mA t RC = min I CC2 — 2 — 2 mA TTL interface RAS, CAS = VIH Dout = High-Z — 0.5 — 0.5 mA CMOS interface RAS, CAS ≥ VCC – 0.2 V Dout = High-Z I CC2 — 300 — 300 µA CMOS interface RAS, CAS ≥ VCC – 0.2 V Dout = High-Z I CC3 — 115 — 105 mA t RC = min Standby current* I CC5 — 5 — 5 mA RAS = VIH, CAS = VIL Dout = enable CAS-before-RAS refresh current I CC6 — 115 — 105 mA t RC = min EDO page mode current*1, * 3 I CC7 — 110 — 100 mA RAS = VIL , CAS cycle, t HPC = tHPC min Battery backup current*4 (Standby with CBR refresh) (L-version) I CC10 — 1.2 — 1.2 mA CMOS interface Dout = High-Z CBR refresh: tRC = 15.6 µs t RAS ≤ 0.3 µs Self refresh mode current (L-version) I CC11 — 500 — 500 µA CMOS interface RAS, CAS ≤ 0.2 V Dout = High-Z Input leakage current I LI –5 5 –5 5 µA 0 V ≤ Vin ≤ VCC + 0.3 V Output leakage current I LO –5 5 –5 5 µA 0 V ≤ Vout ≤ VCC Dout = disable Output high voltage VOH 2.4 VCC 2.4 VCC V High Iout = –2 mA Output low voltage VOL 0 0.4 0 0.4 V Low Iout = 2 mA 1, Operating current* * 2 Standby current Standby current (L-version) RAS-only refresh current*2 1 Notes: 1. I CC depends on output load condition when the device is selected. ICC max is specified at the output open condition. 2. Address can be changed once or less while RAS = VIL. 3. Measured with one sequential address change per EDO cycle, tHPC . 4. VIH ≥ VCC – 0.2 V, 0 V ≤ VIL ≤ 0.2 V. 8 HM5164805F Series, HM5165805F Series DC Characteristics (HM5165805F Series) HM5165805F -5 Parameter -6 Symbol Min Max Min Max Unit Test conditions I CC1 — 135 — 115 mA t RC = min I CC2 — 2 — 2 mA TTL interface RAS, CAS = VIH Dout = High-Z — 0.5 — 0.5 mA CMOS interface RAS, CAS ≥ VCC – 0.2 V Dout = High-Z I CC2 — 300 — 300 µA CMOS interface RAS, CAS ≥ VCC – 0.2 V Dout = High-Z I CC3 — 135 — 115 mA t RC = min Standby current* I CC5 — 5 — 5 mA RAS = VIH, CAS = VIL Dout = enable CAS-before-RAS refresh current I CC6 — 135 — 115 mA t RC = min EDO page mode current*1, * 3 I CC7 — 110 — 100 mA RAS = VIL , CAS cycle, t HPC = tHPC min Battery backup current*4 (Standby with CBR refresh) (L-version) I CC10 — 1.2 — 1.2 mA CMOS interface Dout = High-Z CBR refresh: tRC = 15.6 µs t RAS ≤ 0.3 µs Self refresh mode current (L-version) I CC11 — 500 — 500 µA CMOS interface RAS, CAS ≤ 0.2 V Dout = High-Z Input leakage current I LI –5 5 –5 5 µA 0 V ≤ Vin ≤ VCC + 0.3 V Output leakage current I LO –5 5 –5 5 µA 0 V ≤ Vout ≤ VCC Dout = disable Output high voltage VOH 2.4 VCC 2.4 VCC V High Iout = –2 mA Output low voltage VOL 0 0.4 0 0.4 V Low Iout = 2 mA 1, Operating current* * 2 Standby current Standby current (L-version) RAS-only refresh current*2 1 Notes: 1. I CC depends on output load condition when the device is selected. ICC max is specified at the output open condition. 2. Address can be changed once or less while RAS = VIL. 3. Measured with one sequential address change per EDO cycle, tHPC . 4. VIH ≥ VCC – 0.2 V, 0 V ≤ VIL ≤ 0.2 V. 9 HM5164805F Series, HM5165805F Series Capacitance (Ta = 25˚C, VCC = 3.3 V ± 0.3 V) Parameter Symbol Typ Max Unit Notes Input capacitance (Address) CI1 — 5 pF 1 Input capacitance (Clocks) CI2 — 7 pF 1 Output capacitance (Data-in, Data-out) CI/O — 7 pF 1, 2 Notes : 1. Capacitance measured with Boonton Meter or effective capacitance measuring method. 2. RAS and CAS = VIH to disable Dout. 10 HM5164805F Series, HM5165805F Series AC Characteristics (Ta = 0 to +70˚C, VCC = 3.3 V ± 0.3 V, VSS = 0 V) *1, *2, *19 Test Conditions • • • • • Input rise and fall time: 2 ns Input pulse levels: V IL = 0 V, V IH = 3.0 V Input timing reference levels: 0.8 V, 2.0 V Output timing reference levels: 0.8 V, 2.0 V Output load: 1 TTL gate + C L (100 pF) (Including scope and jig) Read, Write, Read-Modify-Write and Refresh Cycles (Common parameters) HM5164805F/HM5165805F -5 -6 Parameter Symbol Min Max Min Max Unit Notes Random read or write cycle time t RC 84 — 104 — ns RAS precharge time t RP 30 — 40 — ns CAS precharge time t CP 8 — 10 — ns RAS pulse width t RAS 50 10000 60 10000 ns CAS pulse width t CAS 8 10000 10 10000 ns Row address setup time t ASR 0 — 0 — ns Row address hold time t RAH 8 — 10 — ns Column address setup time t ASC 0 — 0 — ns Column address hold time t CAH 8 — 10 — ns RAS to CAS delay time t RCD 12 37 14 45 ns 3 RAS to column address delay time t RAD 10 25 12 30 ns 4 RAS hold time t RSH 13 — 15 — ns CAS hold time t CSH 35 — 40 — ns CAS to RAS precharge time t CRP 5 — 5 — ns OE to Din delay time t OED 13 — 15 — ns 5 OE delay time from Din t DZO 0 — 0 — ns 6 CAS delay time from Din t DZC 0 — 0 — ns 6 Transition time (rise and fall) tT 2 50 2 50 ns 7 11 HM5164805F Series, HM5165805F Series Read Cycle HM5164805F/HM5165805F -5 -6 Parameter Symbol Min Max Min Max Unit Notes Access time from RAS t RAC — 50 — 60 ns 8, 9 Access time from CAS t CAC — 13 — 15 ns 9, 10, 17 Access time from address t AA — 25 — 30 ns 9, 11, 17 Access time from OE t OEA — 13 — 15 ns 9 Read command setup time t RCS 0 — 0 — ns Read command hold time to CAS t RCH 0 — 0 — ns Read command hold time from RAS t RCHR 50 — 60 — ns Read command hold time to RAS t RRH 0 — 0 — ns Column address to RAS lead time t RAL 25 — 30 — ns Column address to CAS lead time t CAL 15 — 18 — ns CAS to output in low-Z t CLZ 0 — 0 — ns Output data hold time t OH 3 — 3 — ns Output data hold time from OE t OHO 3 — 3 — ns Output buffer turn-off time t OFF — 13 — 15 ns 13, 21 Output buffer turn-off to OE t OEZ — 13 — 15 ns 13 CAS to Din delay time t CDD 13 — 15 — ns 5 Output data hold time from RAS t OHR 3 — 3 — ns 21 Output buffer turn-off to RAS t OFR — 13 — 15 ns 13, 21 Output buffer turn-off to WE t WEZ — 13 — 15 ns 13 WE to Din delay time t WED 13 — 15 — ns RAS to Din delay time t RDD 13 — 15 — ns 12 12 12 21 HM5164805F Series, HM5165805F Series Write Cycle HM5164805F/HM5165805F -5 -6 Parameter Symbol Min Max Min Max Unit Notes Write command setup time t WCS 0 — 0 — ns 14 Write command hold time t WCH 8 — 10 — ns Write command pulse width t WP 8 — 10 — ns Write command to RAS lead time t RWL 13 — 15 — ns Write command to CAS lead time t CWL 8 — 10 — ns Data-in setup time t DS 0 — 0 — ns 15 Data-in hold time t DH 8 — 10 — ns 15 Notes Read-Modify-Write Cycle HM5164805F/HM5165805F -5 -6 Parameter Symbol Min Max Min Max Unit Read-modify-write cycle time t RWC 116 — 140 — ns RAS to WE delay time t RWD 67 — 79 — ns 14 CAS to WE delay time t CWD 30 — 34 — ns 14 Column address to WE delay time t AWD 42 — 49 — ns 14 OE hold time from WE t OEH 13 — 15 — ns Refresh Cycle HM5164805F/HM5165805F -5 -6 Parameter Symbol Min Max Min Max Unit CAS setup time (CBR refresh cycle) t CSR 5 — 5 — ns CAS hold time (CBR refresh cycle) t CHR 8 — 10 — ns WE setup time (CBR refresh cycle) t WRP 0 — 0 — ns WE hold time (CBR refresh cycle) t WRH 8 — 10 — ns RAS precharge to CAS hold time t RPC 5 — 5 — ns Notes 13 HM5164805F Series, HM5165805F Series EDO Page Mode Cycle HM5164805F/HM5165805F -5 -6 Parameter Symbol Min Max Min Max Unit Notes EDO page mode cycle time t HPC 20 — 25 — ns 20 EDO page mode RAS pulse width t RASP — 100000 — 100000 ns 16 Access time from CAS precharge t CPA — 28 — 35 ns 9, 17 RAS hold time from CAS precharge t CPRH 28 — 35 — ns Output data hold time from CAS low t DOH 3 — 3 — ns CAS hold time referred OE t COL 8 — 10 — ns CAS to OE setup time t COP 5 — 5 — ns Read command hold time from CAS precharge t RCHC 28 — 35 — ns Write pulse width during CAS precharge t WPE 8 — 10 — ns OE precharge time 8 — 10 — ns t OEP 9, 22 EDO Page Mode Read-Modify-Write Cycle HM5164805F/HM5165805F -5 -6 Parameter Symbol Min Max Min Max Unit EDO page mode read-modify-write cycle time t HPRWC 57 — 68 — ns WE delay time from CAS precharge t CPW 45 — 54 — ns Notes 14 Refresh (HM5164805F Series) Parameter Symbol Max Unit Notes Refresh period t REF 64 ms 8192 cycles Parameter Symbol Max Unit Notes Refresh period t REF 64 ms 4096 cycles Refresh (HM5165805F Series) 14 HM5164805F Series, HM5165805F Series Self Refresh Mode (L-version) HM5164805FL/HM5165805FL -5 -6 Parameter Symbol Min Max Min Max Unit Notes RAS pulse width (self refresh) t RASS 100 — 100 — µs 25 RAS precharge time (self refresh) t RPS 90 — 110 — ns 25 CAS hold time (self refresh) t CHS –50 — –50 — ns Notes: 1. AC measurements assume t T = 2 ns. 2. An initial pause of 200 µs is required after power up followed by a minimum of eight initialization cycles (any combination of cycles containing RAS-only refresh or CAS-before-RAS refresh). 3. Operation with the tRCD (max) limit insures that tRAC (max) can be met, tRCD (max) is specified as a reference point only; if t RCD is greater than the specified tRCD (max) limit, than the access time is controlled exclusively by tCAC . 4. Operation with the tRAD (max) limit insures that tRAC (max) can be met, tRAD (max) is specified as a reference point only; if t RAD is greater than the specified tRAD (max) limit, then access time is controlled exclusively by tAA . 5. Either t OED or tCDD must be satisfied. 6. Either t DZO or tDZC must be satisfied. 7. VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Also, transition times are measured between V IH (min) and VIL (max). 8. Assumes that t RCD ≤ tRCD (max) and tRAD ≤ tRAD (max). If tRCD or tRAD is greater than the maximum recommended value shown in this table, t RAC exceeds the value shown. 9. Measured with a load circuit equivalent to 1 TTL loads and 100 pF. 10. Assumes that t RCD ≥ tRCD (max) and tRCD + tCAC (max) ≥ tRAD + tAA (max). 11. Assumes that t RAD ≥ tRAD (max) and tRCD + tCAC (max) ≤ tRAD + tAA (max). 12. Either t RCH or tRRH must be satisfied for a read cycles. 13. t OFF (max), tOEZ (max), tWEZ (max) and tOFR (max) define the time at which the outputs achieve the open circuit condition and are not referred to output voltage levels. 14. t WCS , t RWD, t CWD, t AWD and t CPW are not restrictive operating parameters. They are included in the data sheet as electrical characteristics only; if t WCS ≥ tWCS (min), the cycle is an early write cycle and the data out pin will remain open circuit (high impedance) throughout the entire cycle; if tRWD ≥ tRWD (min), tCWD ≥ tCWD (min), and tAWD ≥ tAWD (min), or tCWD ≥ tCWD (min), tAWD ≥ tAWD (min) and tCPW ≥ t CPW (min), the cycle is a read-modify-write and the data output will contain data read from the selected cell; if neither of the above sets of conditions is satisfied, the condition of the data out (at access time) is indeterminate. 15. t DS and t DH are referred to CAS leading edge in early write cycles and to WE leading edge in delayed write or read-modify-write cycles. 16. t RASP defines RAS pulse width in EDO page mode cycles. 17. Access time is determined by the longest among t AA , t CAC and t CPA. 18. In delayed write or read-modify-write cycles, OE must disable output buffer prior to applying data to the device. 19. When output buffers are enabled once, sustain the low impedance state until valid data is obtained. When output buffer is turned on and off within a very short time, generally it causes large V CC/V SS line noise, which causes to degrade V IH min/VIL max level. 15 HM5164805F Series, HM5165805F Series 20. t HPC (min) can be achieved during a series of EDO page mode write cycles or EDO page mode read cycles. If both write and read operation are mixed in a EDO page mode RAS cycle (EDO page mode mix cycle (1), (2)), minimum value of CAS cycle (tCAS + tCP + 2 tT) becomes greater than the specified t HPC (min) value. The value of CAS cycle time of mixed EDO page mode is shown in EDO page mode mix cycle (1) and (2). 21. Data output turns off and becomes high impedance from later rising edge of RAS and CAS. Hold time and turn off time are specified by the timing specifications of later rising edge of RAS and CAS between t OHR and t OH and between tOFR and t OFF. 22. t DOH defines the time at which the output level go cross. V OL = 0.8 V, VOH = 2.0 V of output timing reference level. 23. Before and after self refresh mode, execute CBR refresh to all refresh addresses in or within 64 ms period on the condition a and b below. a. Enter self refresh mode within 15.6 µs after either burst refresh or distributed refresh at equal interval to all refresh addresses are completed. b. Start burst refresh or distributed refresh at equal interval to all refresh addresses within 15.6µs after exiting from self refresh mode. 24. In case of entering from RAS-only-refresh, it is necessary to execute CBR refresh before and after self refresh mode according as note 23. 25 At t RASS > 100 µs, self refresh mode is activated, and not activated at tRASS < 10 µs. It is undefined within the range of 10 µs ≤ t RASS ≤ 100 µs. For tRASS ≥ 10 µs, it is necessary to satisfy tRPS. 26. XXX: H or L (H: VIH (min) ≤ VIN ≤ VIH (max), L: VIL (min) ≤ VIN ≤ VIL (max)) ///////: Invalid Dout When the address, clock and input pins are not described on timing waveforms, their pins must be applied VIH or VIL. 16 HM5164805F Series, HM5165805F Series Timing Waveforms*26 Read Cycle tRC tRAS tRP RAS tCSH tT CAS Address tRSH tCAS tRAD tASR tCRP tRCD tRAH tRAL tCAL tASC tCAH Column Row tRRH tRCHR tRCS tRCH WE tDZC tCDD tWED tRDD High-Z Din tDZO tOEA tOED OE tOEZ tOHO tOFF tOH tOFR tOHR tCAC tAA tRAC tCLZ tWEZ Dout Dout 17 HM5164805F Series, HM5165805F Series Early Write Cycle tRC tRAS tRP RAS tCSH tCRP tRCD tRSH tCAS tT CAS tASR Address tRAH Row tASC tCAH Column tWCS tWCH WE tDS Din Dout tDH Din High-Z* * t WCS 18 t WCS (min) HM5164805F Series, HM5165805F Series Delayed Write Cycle*18 tRC tRAS tRP RAS tCSH tCRP tRCD tRSH tCAS tT CAS tASR Address tRAH tASC Row tCAH Column tCWL tRWL tWP tRCS WE tDS tDZC High-Z Din , Din tDH tOED tDZO tOEH tOEP OE tOEZ tCLZ High-Z Dout Invalid Dout 19 HM5164805F Series, HM5165805F Series Read-Modify-Write Cycle*18 tRWC tRAS tRP RAS tT tRCD CAS tCRP tRAD tASR Address tCAS tASC tRAH Row tCAH Column tCWL tCWD tRCS tRWL tWP tAWD tRWD WE tDZC tDS High-Z Din , Din tDH tOED tDZO tOEH tOEA tOEP OE tCAC tAA tOEZ tRAC tOHO Dout Dout tCLZ 20 High-Z HM5164805F Series, HM5165805F Series RAS-Only Refresh Cycle tRC tRAS tRP RAS tT tRPC tCRP tCRP CAS tASR tRAH Row Address tOFR tOFF High-Z !" Dout 21 HM5164805F Series, HM5165805F Series CAS-Before-RAS Refresh Cycle tRC tRP tRC tRP tRAS tRAS tRP RAS tT tRPC tCP tRPC tCSR tCHR tWRP tWRH tCP tCRP tCSR tCHR CAS tWRP WE Address tOFR tOFF Dout 22 High-Z tWRH HM5164805F Series, HM5165805F Series Hidden Refresh Cycle tRC tRAS tRP tRC tRAS tRC tRP tRAS tRP RAS tT tRSH tCHR tCRP tRCD CAS tRAD tASR Address tRAH tRAL tASC Row tCAH Column tRRH tRCS tRCH WE tWED tDZC tCDD tRDD High-Z Din tDZO tOED tOEA OE tCAC tAA tRAC tOFF tCLZ Dout tOEZ tWEZ tOHO tOH Dout tOFR tOHR 23 HM5164805F Series, HM5165805F Series EDO Page Mode Read Cycle (1) t RP t HPC t RASP RAS tT t CSH t CP t HPC t CAS CAS t HPC t CPRH t CP t t CRP RSH t CAS t RCHR t RCS t CP tCAS tCAS t RCHC t RCH t RCS t RRH t RCH WE tASR Address tRAH tASC Row tCAH Column 1 t WPE t ASC t CAH t ASC t CAH Column 2 Column 3 t CAL t CAL t RAL t CAH tASC t WED Column 4 t CAL t CAL tRDD tCDD tDZC High-Z Din tCOL tDZO tCOP t OEP tOED tOEP OE tAA tCAC tCPA tAA tCAC tOEZ tOHO tAA tOEZ tCAC tAA tOFR tOHR tOEZ tCPA tCPA tOEA tWEZ tOEA tRAC Dout 24 tDOH Dout 1 Dout 2 Dout 2 tOHO Dout 3 tCAC tOHO tOFF tOH tOEA Dout 4 HM5164805F Series, HM5165805F Series EDO Page Mode Read Cycle (2) t RP t RASP RAS tT t CSH t CP t HPC t CAS CAS tHPC t CP t HPC t CP t CAS t CAS t CRP tRSH tCAS t RCHC t RRH t RCH t RCS WE tASR Address tRAH tASC Row tCAH Column 1 t ASC t CAH t ASC t CAH Column 2 t CAL t RAL t CAH tASC Column 3 t CAL t WED Column 4 t CAL tRDD t CAL tDZC tCDD High-Z Din tCOL tDZO tCOP t OEP tOED tOEP OE tOEA tCPA tAA tCAC tCPA tAA tCAC tOEZ tAA tCAC tAA tOFR tOHR tOEZ tCPA tDOH tRAC Dout tOHO tOEA tOEZ tDOH tOHO Dout 1 Dout 2 Dout 2 Dout 3 tCAC tOHO tOFF tOH tOEA Dout 4 25 HM5164805F Series, HM5165805F Series EDO Page Mode Early Write Cycle tRP tRASP RAS tT tCSH tHPC tCAS tRCD tCP tRSH tCAS tCP tCAS tCRP CAS tASR Address Row tRAH tASC tCAH Column 1 tWCS tWCH tASC tCAH Column 2 tWCS tWCH tASC tCAH Column N tWCS tWCH WE tDS Din Dout tDH Din 1 tDS tDH Din 2 tDS tDH Din N High-Z* * t WCS 26 t WCS (min) HM5164805F Series, HM5165805F Series EDO Page Mode Delayed Write Cycle*18 tRASP tRP RAS tT tCP tRCD tCRP tCP tCSH tHPC tCAS tCAS tRSH tCAS CAS tRAD tASR tASC tCAH tASC tCAH Column 1 Column 2 tRAH Address Row tASC tCAH tCWL Column N tCWL tCWL tRWL tRCS tRCS tRCS WE tWP tDZC tDS tWP tDZC tDS tWP tDZC tDS tDH tDH Din 1 Din tDZO tOED tDH Din 2 tDZO tOED tOEP tOEH tDZO tOED tOEP tOEH tOEP tOEH Din N OE tCLZ tCLZ tOEZ tCLZ tOEZ tOEZ Dout Invalid Dout Invalid Dout High-Z Invalid Dout 27 HM5164805F Series, HM5165805F Series EDO Page Mode Read-Modify-Write Cycle*18 t RASP t RP RAS tT t HPRWC t CP t RCD t RSH t CP t CAS t CAS t CRP t CAS CAS t ASR Address t RAD t ASC t RAH t ASC t CAH t CAH Column 1 Row t ASC t CAH Column 2 t RWD t CWL t AWD t CPW t CWL t CPW t AWD t RCS t CWD Column N t CWL t AWD t RCS t CWD t RWL t CWD WE t RCS t WP t t DZC DS t WP t t DZC DS t WP t t DZC DS t DH t DH Din 1 Din t DZO t OED t OEP t OEH t DH Din 2 t OED t DZO t OEP t OEH Din N t OED t DZO t OEP t OEH OE t OHO t OHO t OHO t OEA t CAC t OEA t CAC t AA t OEA t CAC t AA t CPA t RAC t OEZ t CLZ t AA t CPA t OEZ t CLZ t OEZ t CLZ High-Z Dout Dout 1 28 Dout 2 Dout N HM5164805F Series, HM5165805F Series EDO Page Mode Mix Cycle (1)*20 t RP t RASP RAS tT t CAS CAS t CRP t CP t CP t CP t CAS tCAS t CSH tCAS tCWL tRSH t RCD t WCS t WCH tCPW tAWD WE t ASC tRAH tASR Address Row tCAH Column 1 t RRH t RCH t RCS t RCS t ASC t CAH tASC t CAH Column 2 Column 3 tWP tASC t RAL t CAH Column 4 t CAL t DS Din Din 1 tRDD tCDD t CAL t DH t DH t DS High-Z Din 3 tOED tOEP tWED OE tCPA tAA tCAC Dout tOFR tWEZ tCPA tCPA tAA tOEA t DOH Dout 2 t OEZ tCAC t OHO Dout 3 tAA tOEZ tCAC tOHO tOEA tOFF tOH Dout 4 29 HM5164805F Series, HM5165805F Series EDO Page Mode Mix Cycle (2) *20 t RP t RASP RAS tT t CSH t CAS CAS t RCD t CAS tCAS t RCHR t RCS t RCH tWCS t WCH Address tCAS tCWL Row tCAH Column 1 t ASC t CAH t ASC t CAH Column 2 Column 3 t RRH t RCH tWP tCPW t ASC tRAH tRSH t RCS t RCS WE tASR t CRP t CP t CP t CP t RAL t CAH tASC Column 4 t CAL t CAL t DS t DS High-Z Din t DH tRDD tCDD t DH Din 2 Din 3 t OEP t OEP tOED tOED tCOP tWED tCOL OE t OEA tAA tOEA tCAC tOEZ tCPA tAA tCAC tRAC tOEZ t OHO t OHO Dout 30 Dout 1 tOFR tWEZ tCPA Dout 3 tAA tCAC tOEZ tOEA tOFF tOH tOHO Dout 4 HM5164805F Series, HM5165805F Series Self Refresh Cycle (L-version)* 23, 24, 25 tRASS tRP tRPS RAS tT , , tRPC tCP tCRP tCHS tCSR CAS tWRP tWRH WE $%&+, tOFR tOFF Dout High-Z 31 HM5164805F Series, HM5165805F Series Package Dimensions HM5164805FJ/ FLJ Series HM5165805FJ/ FLJ Series (CP-32DC) Unit: mm 3.50 ± 0.26 1.165 Max *0.43 ± 0.10 0.41 ± 0.08 1.27 2.55 ± 0.12 16 0.74 0.90 ± 0.26 1 11.18 ± 0.13 17 10.16 ± 0.13 32 20.95 21.38 Max 9.40 ± 0.25 0.10 *Dimension including the plating thickness Base material dimension 32 Hitachi Code JEDEC EIAJ Weight (reference value) CP-32DC — Conforms 1.2 g HM5164805F Series, HM5165805F Series HM5164805FTT/FLTT Series HM5165805FTT/FLTT Series (TTP-32DC) Unit: mm 20.95 21.35 Max 17 10.16 32 1.27 0.21 M 0.80 11.76 ± 0.20 0.10 *Dimension including the plating thickness Base material dimension *0.145 ± 0.05 0.125 ± 0.04 1.20 Max 1.15 Max 0° – 5° 0.50 ± 0.10 Hitachi Code JEDEC EIAJ Weight (reference value) 0.68 *0.42 ± 0.08 0.40 ± 0.06 16 0.13 ± 0.05 1 TTP-32DC Conforms — 0.51 g 33 HM5164805F Series, HM5165805F Series Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Straße 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright © Hitachi, Ltd., 1998. All rights reserved. Printed in Japan. 34 HM5164805F Series, HM5165805F Series Revision Record Rev. Date Contents of Modification Drawn by Approved by M. Kawamura M. Mishima Features: Change of Power dissipation M. Kawamura Standby (L-version) max: TBD to 1.1 mW DC Characteristics I CC2 (L-version) max: TBD/TBD to 300/300 µA I CC10 (L-version) max: TBD/TBD to 1/1 mA I CC11 (L-version) max: TBD/TBD to 500/500 µA Y. Kasama 0.0 May. 25, 1999 Initial issue 1.0 Oct. 5, 1999 2.0 Nov. 30, 1999 DC Characteristics I CC10 (L-version) max: 1/1 mA to 1.2/1.2 mA 35