74ALVCH16244 Low-Voltage 16-Bit Buffer with Bus Hold 1.8/2.5/3.3 V (3–State, Non–Inverting) The 74ALVCH16244 is an advanced performance, non–inverting 16–bit buffer. It is designed for very high–speed, very low–power operation in 1.8 V, 2.5 V or 3.3 V systems. The 74ALVCH16244 is nibble controlled with each nibble functioning identically, but independently. The control pins may be tied together to obtain full 16–bit operation. The 3–state outputs are controlled by an Output Enable (OEn) input for each nibble. When OEn is LOW, the outputs are on. When OEn is HIGH, the outputs are in the high impedance state. The data inputs include active bushold circuitry, eliminating the need for external pull–up resistors to hold unused or floating inputs at a valid logic state. • Designed for Low Voltage Operation: VCC = 1.65 – 3.6 V • 3.6 V Tolerant Inputs and Outputs • High Speed Operation: 2.5 ns max for 3.0 to 3.6 V • • • 3.0 ns max for 2.3 to 2.7 V 6.0 ns max for 1.65 to 1.95 V Static Drive: ±24 mA Drive at 3.0 V ±18 mA Drive at 2.3 V ±6 mA Drive at 1.65 V Supports Live Insertion and Withdrawal Includes Active Bushold to Hold Unused or Floating Inputs at a Valid Logic State IOFF Specification Guarantees High Impedance When VCC = 0 V† • • Near Zero Static Supply Current in All Three Logic States (20 µA) • • • Substantially Reduces System Power Requirements Latchup Performance Exceeds ±250 mA @ 125°C ESD Performance: Human Body Model >2000 V; Machine Model >200 V Second Source to Industry Standard 74ALVCH16244 http://onsemi.com MARKING DIAGRAM 48 48 74ALVCH16244DT 1 AWLYYWW TSSOP–48 DT SUFFIX CASE 1201 A WL YY WW 1 = Assembly Location = Wafer Lot = Year = Work Week ORDERING INFORMATION Device Package Shipping 74ALVCH16244DT TSSOP 39 Units/Rail 74ALVCH16244DTR TSSOP 2500/Tape & Reel †To ensure the outputs activate in the 3–state condition, the output enable pins should be connected to VCC through a pull–up resistor. The value of the resistor is determined by the current sinking capability of the output connected to the OE pin. Semiconductor Components Industries, LLC, 2001 November, 2001 – Rev. 0 1 Publication Order Number: 74ALVCH16244/D 74ALVCH16244 OE1 1 48 OE2 O0 2 47 D0 O1 3 46 D1 GND 4 1 OE1 48 OE2 25 OE3 24 OE4 45 GND O2 5 44 D2 O3 6 43 D3 VCC 7 42 VCC O4 8 41 D4 O5 9 40 D5 GND 10 D0:3 O0:3 D8:11 O8:11 D4:7 O4:7 D12:15 O12:15 One of Four 39 GND O6 11 38 D6 O7 12 37 D7 O8 13 36 D8 O9 14 35 D9 GND 15 34 GND O10 16 33 D10 O11 17 32 D11 VCC 18 31 VCC O12 19 30 D12 O13 20 29 D13 GND 21 28 GND O14 22 27 D14 O15 23 26 D15 OE4 24 25 OE3 Figure 2. Logic Diagram 1 OE1 48 OE2 25 OE3 24 OE4 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 Figure 1. 48–Lead Pinout (Top View) PIN NAMES Pins Function OEn D0–D15 O0–O15 Output Enable Inputs Inputs Outputs EN1 EN2 EN3 EN4 47 1 46 1∇ 2 3 5 44 43 41 1 2∇ 6 8 40 9 38 11 37 36 1 3∇ 12 13 35 14 33 16 32 30 1 4∇ 17 19 29 20 27 22 26 23 O0 O1 O2 O3 O4 O5 O6 O7 O8 O9 O10 O11 O12 O13 O14 O15 Figure 3. IEC Logic Diagram OE1 D0:3 O0:3 OE2 D4:7 O4:7 OE3 D8:11 O8:11 OE4 D12:15 O12:15 L L L L L L L L L L L L L H H L H H L H H L H H H X Z H X Z H X Z H X Z H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State; X = High or Low Voltage Level and Transitions Are Acceptable, for ICC reasons, DO NOT FLOAT Inputs http://onsemi.com 2 74ALVCH16244 MAXIMUM RATINGS (Note 1) Symbol Parameter Value Unit VCC DC Supply Voltage 0.5 to 4.6 V VI DC Input Voltage 0.5 to 4.6 V VO DC Output Voltage 0.5 to 4.6 V IIK DC Input Diode Current VI < GND 50 mA IOK DC Output Diode Current VO < GND 50 mA IO DC Output Sink Current 50 mA ICC DC Supply Current per Supply Pin 100 mA IGND DC Ground Current per Ground Pin 100 mA TSTG Storage Temperature Range 65 to 150 C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias JA Thermal Resistance (Note 2) MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage 260 C 150 C 90 C/W Level 1 Oxygen Index: 30% – 35% UL–94–VO (0.125 in) 2000 200 N/A Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) V ILATCH–UP Latch–Up Performance Above VCC and Below GND at 85C (Note 6) 250 mA Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum–rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 1. IO absolute maximum rating must be observed. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm–by–1 inch, 2–ounce copper trace with no air flow. 3. Tested to EIA/JESD22–A114–A. 4. Tested to EIA/JESD22–A115–A. 5. Tested to JESD22–C101–A. 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free–Air Temperature t/V Input Transition Rise or Fall Rate Operating Data Retention Only (Note 7) (HIGH or LOW State) VCC = 2.5 V 0.2 V VCC = 3.0 V 0.3 V VCC = 5.0 V 0.5 V Min Max Unit 2.3 1.5 3.6 3.6 V 0 3.6 V 0 3.6 V 40 85 C 0 0 0 20 10 5 ns/V 7. Unused inputs may not be left open. All inputs must be tied to a high–logic voltage level or a low–logic input voltage level. http://onsemi.com 3 74ALVCH16244 DC ELECTRICAL CHARACTERISTICS TA = 40C to 85C Symbol VIH VIL VOH VOL Parameter HIGH Level Input Voltage ( (Note 8)) LOW Level Input Voltage ( (Note 8)) HIGH Level Output Voltage LOW Level Output Voltage Condition Min 1.65 V VCC 2.3 V 0.65 VCC 2.3 V VCC 2.7 V 1.7 2.7 V VCC 3.6 V 2.0 Max V 1.65 V VCC 2.3 V 0.35 VCC 2.3 V VCC 2.7 V 0.7 2.7 V VCC 3.6 V 0.8 1.65 V VCC 3.6 V; IOH = 100 A VCC 0.2 VCC = 1.65 V; IOH = 4 mA 1.20 VCC = 2.3 V; IOH = 6 mA 2.0 VCC = 2.3 V; IOH = 12 mA 1.7 VCC = 2.7 V; IOH = 12 mA 2.2 VCC = 3.0 V; IOH = 12 mA 2.4 VCC = 3.0 V; IOH = 24 mA 2.0 0.2 VCC = 1.65 V; IOL = 4 mA 0.45 VCC = 2.3 V; IOL = 6 mA 0.4 VCC = 2.3 V; IOL = 12 mA 0.7 VCC = 2.7 V; IOL = 12 mA 0.4 VCC = 3.0 V; IOL = 24 mA 0.55 LOW Level Output Voltage VCC = 3.6 V; VI = 0 to 3.6 V II Input Leakage Current 1.65 V VCC 3.6 V; 0 V VI 3.6 V II(HOLD) Minimum Bus–hold Input Current VCC = 3.0 V, VIN = 0.8 V 75 VCC = 3.0 V, VIN = 2.0 V 75 VCC = 2.3 V, VIN = 0.7 V 45 VCC = 2.3 V, VIN = 1.7 V 45 VCC = 1.65 V, VIN = 0.58 V 25 VCC = 1.65 V, VIN = 1.07 V 25 IOZ 3–State Output Current 1.65 V VCC 3.6 V; 0 V VO 3.6 V; VI = VIH or VIL IOFF Power–Off Leakage Current ICC Quiescent Supply Current (N (Note 9)) V V 1.65 V VCC 3.6 V; IOL = 100 A VOL Unit V 500 A 5.0 A A 10 A VCC = 0 V; VI or VO = 3.6 V 10 A 1.65 V VCC 3.6 V; VI = GND or VCC 40 A 1.65 V VCC 3.6 V; 3.6 V VI, VO 3.6 V ICC Increase in ICC per Input 2.7 V VCC ≤ 3.6 V; VIH = VCC 0.6 V 8. These values of VI are used to test DC electrical characteristics only. 9. Outputs disabled or 3–state only. http://onsemi.com 4 40 750 A 74ALVCH16244 AC CHARACTERISTICS (Note 10; tR = tF = 2.0 ns; CL = 30 pF; RL = 500 Ω) Limits TA = –40°C to +85°C VCC = 3.0 V to 3.6 V Symbol Parameter VCC = 2.3 V to 2.7 V VCC = 1.65 V – 1.95 V Waveform Min Max Min Max Min Max Unit tPLH tPHL Propagation Delay Input to Output 1 0.5 0.5 2.5 2.5 0.5 0.5 3.0 3.0 0.5 0.5 6.0 6.0 ns tPZH tPZL Output Enable Time to High and Low Level 2 0.5 0.5 3.5 3.5 0.5 0.5 4.1 4.1 0.5 0.5 8.2 8.2 ns tPHZ tPLZ Output Disable Time From High and Low Level 2 0.5 0.5 3.5 3.5 0.5 0.5 3.8 3.8 0.5 0.5 6.8 6.8 ns tOSHL tOSLH Output–to–Output Skew (Note 11) 0.75 0.75 ns 0.5 0.5 0.5 0.5 10. For CL = 50 pF, add approximately 300 ps to the AC maximum specification. 11. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (tOSHL) or LOW–to–HIGH (tOSLH); parameter guaranteed by design. CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance Note 12 6 pF COUT Output Capacitance Note 12 7 pF Note 12, 10 MHz 20 pF CPD Power Dissipation Capacitance 12. VCC = 1.8, 2.5 or 3.3 V; VI = 0 4 V or VCC. VIH Vm Dn Vm tPLH 0V tPHL Vm On VOH Vm VOL WAVEFORM 1 - PROPAGATION DELAYS tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns VIH Vm OEn 0V tPZH tPHZ Vm On VOH Vy ≈0V tPZL On tPLZ Vm ≈ VCC Vx VOL WAVEFORM 2 - OUTPUT ENABLE AND DISABLE TIMES tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 4. AC Waveforms http://onsemi.com 5 74ALVCH16244 VCC Symbol 3.3 V ±0.3 V 2.5 V ±0.2 V 1.8 V ±0.15 V VIH 2.7 V VCC VCC Vm 1.5 V VCC/2 VCC/2 Vx VOL + 0.3 V VOL + 0.15 V VOL + 0.15 V Vy VOH – 0.3 V VOH – 0.15 V VOH – 0.15 V VCC PULSE GENERATOR 6V or VCC × 2 OPEN GND RL DUT RT CL RL SWITCH TEST tPLH, tPHL Open tPZL, tPLZ 6 V at VCC = 3.3 ±0.3 V; VCC × 2 at VCC = 2.5 ±0.2 V; 1.8 ±0.15 V tPZH, tPHZ GND CL = 50 pF for VCC = 3.0 ± 0.3 V RL = 500 Ω or equivalent RT = ZOUT of pulse generator (typically 50 Ω) Figure 5. Test Circuit AC CHARACTERISTICS (tR = tF = 2.0 ns; CL = 50 pF; RL = 500 Ω) Limits TA = –40°C to +85°C VCC = 3.0 V to 3.6 V Symbol Parameter VCC = 2.7 V Waveform Min Max Max Unit tPLH tPHL Propagation Delay Input to Output 3 1.0 1.0 3.0 3.0 Min 3.6 3.6 ns tPZH tPZL Output Enable Time to High and Low Level 4 1.0 1.0 4.4 4.4 5.4 5.4 ns tPHZ tPLZ Output Disable Time From High and Low Level 4 1.0 1.0 4.1 4.1 4.6 4.6 ns tOSHL tOSLH Output–to–Output Skew (Note 13) 0.5 0.5 0.5 0.5 ns 13. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (tOSHL) or LOW–to–HIGH (tOSLH); parameter guaranteed by design. http://onsemi.com 6 74ALVCH16244 P0 K t P2 D TOP COVER TAPE E A0 + K0 SEE NOTE 2 B1 10 PITCHES CUMULATIVE TOLERANCE ON TAPE ±0.2 mm (±0.008") SEE NOTE 2 F + B0 W + D1 FOR COMPONENTS 2.0 mm × 1.2 mm AND LARGER P EMBOSSMENT FOR MACHINE REFERENCE ONLY INCLUDING DRAFT AND RADII CONCENTRIC AROUND B0 CENTER LINES OF CAVITY USER DIRECTION OF FEED *TOP COVER TAPE THICKNESS (t1) 0.10 mm (0.004") MAX R MIN BENDING RADIUS 10° TAPE AND COMPONENTS SHALL PASS AROUND RADIUS R" WITHOUT DAMAGE EMBOSSED CARRIER 100 mm (3.937") MAXIMUM COMPONENT ROTATION EMBOSSMENT 1 mm MAX TYPICAL COMPONENT CAVITY CENTER LINE TAPE 1 mm (0.039") MAX TYPICAL COMPONENT CENTER LINE 250 mm (9.843") CAMBER (TOP VIEW) ALLOWABLE CAMBER TO BE 1 mm/100 mm NONACCUMULATIVE OVER 250 mm Figure 6. Carrier Tape Specifications EMBOSSED CARRIER DIMENSIONS (See Notes 14 and 15) Tape Size B1 Max 24mm 20.1mm (0.791") D D1 E F K P P0 P2 R T W 1.5 + 0.1mm -0.0 (0.059 +0.004" -0.0) 1.5mm Min (0.060") 1.75 ±0.1 mm (0.069 ±0.004") 11.5 ±0.10 mm (0.453 ±0.004") 11.9 mm Max (0.468") 16.0 ±0.1 mm (0.63 ±0.004") 4.0 ±0.1 mm (0.157 ±0.004") 2.0 ±0.1 mm (0.079 ±0.004") 30 mm (1.18") 0.6 mm (0.024") 24.3 mm (0.957") 14. Metric Dimensions Govern–English are in parentheses for reference only. 15. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to 0.50 mm max. The component cannot rotate more than 10° within the determined cavity. http://onsemi.com 7 74ALVCH16244 t MAX 13.0 mm ±0.2 mm (0.512" ±0.008") 1.5 mm MIN (0.06") A 20.2 mm MIN (0.795") 50 mm MIN (1.969") FULL RADIUS G Figure 7. Reel Dimensions REEL DIMENSIONS Tape Size A Max G t Max 24 mm 360 mm (14.173") 24.4 mm + 2.0 mm, -0.0 (0.961" + 0.078", -0.00) 30.4 mm (1.197") DIRECTION OF FEED BARCODE LABEL POCKET Figure 8. Reel Winding Direction http://onsemi.com 8 HOLE 74ALVCH16244 CAVITY TAPE TOP TAPE TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN TAPE LEADER NO COMPONENTS 400 mm MIN COMPONENTS DIRECTION OF FEED Figure 9. Tape Ends for Finished Goods User Direction of Feed Figure 10. Reel Configuration ÉÉ ÉÉ ÉÉ É ÉÉ É ÉÉ ÉÉ ÉÉ É ÉÉ É ÉÉ ÉÉÉÉÉÉÉÉ ÉÉ ÉÉ ÉÉ É ÉÉ É ÉÉ ÉÉÉÉÉÉÉÉ ÉÉ ÉÉ ÉÉ ÉÉ É ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ É ÉÉ ÉÉÉÉ ÉÉÉÉÉÉÉ ÉÉ ÉÉ ÉÉ ÉÉ É ÉÉ ÉÉÉÉ ÉÉÉÉÉÉÉ K L G 48 Leads Figure 11. Package Footprint http://onsemi.com 9 F 74ALVCH16244 PACKAGE DIMENSIONS TSSOP DT SUFFIX CASE 1201–01 ISSUE A 48X ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ ÇÇÇ ÉÉÉ K K1 K REF 0.12 (0.005) M T U S V S T U S J J1 48 25 0.254 (0.010) M SECTION N–N B –U– L N 1 24 A –V– PIN 1 IDENT. N F DETAIL E D 0.076 (0.003) –T– SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. C M 0.25 (0.010) –W– DETAIL E G H http://onsemi.com 10 DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 12.40 12.60 6.00 6.20 --1.10 0.05 0.15 0.50 0.75 0.50 BSC 0.37 --0.09 0.20 0.09 0.16 0.17 0.27 0.17 0.23 7.95 8.25 0 8 INCHES MIN MAX 0.488 0.496 0.236 0.244 --0.043 0.002 0.006 0.020 0.030 0.0197 BSC 0.015 --0.004 0.008 0.004 0.006 0.007 0.011 0.007 0.009 0.313 0.325 0 8 74ALVCH16244 Notes http://onsemi.com 11 74ALVCH16244 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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