ETC 7MBP50RTJ-060

1.Package Outline Drawings
13.8
109
±1
95
±0.3
66.44
±0.3
1 0 ±0.2
3 . 2 2 ±0.3
±0.15
±0.2
6 ±0.15
1 0 ±0.2 1 2 ±0.25
6 ±0.15
4-φ5.5
2 ±0.1
2
±0.3
6
10
±0.3
P
20
10
74
88
±1
20
B
N
V
U
0.5
17
W
0.5
24
26
26
19-□0.5
2-φ2.5
50A
2 ±0.1
2 ±0.1
3.22 ±0.3
2 ±0.1
2
9
+0.6
3 1 -0.3
22
600V JAPAN
2
0.1 max
2
+1.0
-0.3
17
7 MB P50 RT J06 0
8
17
+1.0
-0.2
22
+1.0
-0.3
12.5
7
6-M5
4.5
φ2.5
(φ1∼1.5)
10
1
8 ±0.3
(1∼2)
□0.5
Details of control terminals
Fuji Electric Co.,Ltd.
DWG.NO.
.
NOTES: Dimensions are shown in Millimeter.
MS6M0672
3/23
H04-004-03
2.Pin Descriptions
Main circuit
Symbol
Description
P
Positive input supply voltage.
U
Output (U).
V
Output (V).
W
Output (W).
N
Negative input supply voltage.
B
Collector terminal of Brake IGBT.
Control circuit
№
Symbol
①
GNDU
High side ground (U).
②
ALMU
larm signal output (U).
③
VinU
Logic input for IGBT gate drive (U).
④
VccU
High side supply voltage (U).
⑤
GNDV
High side ground (V).
⑥
ALMV
larm signal output (V).
⑦
VinV
Logic input for IGBT gate drive (V).
⑧
VccV
High side supply voltage (V).
⑨
GNDW
High side ground (W).
⑩
ALMW
larm signal output (W).
⑪
VinW
Logic input for IGBT gate drive (W).
⑫
VccW
High side supply voltage (W).
⑬
GND
Low side ground.
⑭
Vcc
Low side supply voltage.
⑮
VinDB
⑯
VinX
Logic input for IGBT gate drive (X).
⑰
VinY
Logic input for IGBT gate drive (Y).
⑱
VinZ
Logic input for IGBT gate drive (Z).
⑲
ALM
Low side alarm signal output.
Logic input for Brake IGBT gate drive.
DWG.NO.
.
Fuji Electric Co.,Ltd.
Description
MS6M0672
4/23
H04-004-03
3.Block Diagram
P
VccU
④
VinU
③
ALMU
②
Pre-Driver
RALM 1.5k
GNDU
①
VccV
⑧
VinV
⑦
ALMV
⑥
GNDV
⑤
VccW
⑫
VinW
⑪
ALMW
⑩
GNDW
⑨
Vcc
⑭
VinX
⑯
Vz
U
Pre-Driver
RALM 1.5k
Vz
V
Pre-Driver
RALM 1.5k
Vz
W
Pre-Driver
Vz
GND
VinY
⑬
⑰
Pre-Driver
Vz
VinZ
⑱
Pre-Driver
Vz
B
ALM
⑮
⑲
RALM 1.5k
Pre-Driver
Vz
N
Over heating protection
circuit
Fuji Electric Co.,Ltd.
DWG.NO.
.
VinDB
Pre-drivers include following functions
1.Amplifier for driver
2.Short circuit protection
3.Under voltage lockout circuit
4.Over current protection
5.IGBT chip over heating protection
MS6M0672
5/23
H04-004-03
4.Absolute Maximum Ratings
Tc=25℃ unless otherwise specified.
Items
Symbol
Min.
Max.
Units
VDC
0
450
V
VDC(surge)
0
500
V
Vsc
200
400
V
Vces
0
600
V
DC
Ic
―
50
A
1ms
Icp
―
100
A
Duty=76.1% *2
-Ic
―
50
A
*3
Pc
―
144
W
DC
Ic
―
30
A
1ms
Icp
―
60
A
IF
―
30
A
Pc
―
144
W
Supply Voltage of Pre-Driver *4
Vcc
-0.5
20
V
Input Signal Voltage *5
Vin
-0.5
Vcc+0.5
V
Input Signal Current
Iin
―
3
mA
Alarm Signal Voltage *6
VALM
-0.5
Vcc
V
Alarm Signal Current *7
IALM
―
20
mA
Tj
―
150
℃
Operating Case Temperature
Topr
-20
100
℃
Storage Temperature
Tstg
-40
125
℃
Viso
―
AC2500
V
―
―
3.5
Nm
DC
Bus Voltage
(between terminal P and N)
Surge
Shortoperating
Inverter
Collector-Emitter Voltage *1
Collector Current
Brake
Collector Power Dissipation
Collector Current
One transistor
Forward Current of Diode
Collector Power Dissipation
One transistor
*3
Junction Temperature
Isolating Voltage
(Terminal to base, 50/60Hz sine wave 1min.) *8
Screw Torque
Terminal (M5)
Mounting (M5)
Fuji Electric Co.,Ltd.
DWG.NO.
.
Note
*1 :Vces shall be applied to the input voltage between terminal P and U or V or W or DB,
N and U or V or W or DB
*2 : 125℃/FWD Rth(j-c)/(Ic×VF MAX)=125/1.263/(50×2.6)×100=76.1%
*3 : Pc=125℃/IGBT Rth(j-c)=125/0.87=144W [Inverter]
Pc=125℃/IGBT Rth(j-c)=125/0.87=144W [Break]
*4 : VCC shall be applied to the input voltage between terminal No.4 and 1,
8 and 5, 12 and 9, 14 and 13
*5 : Vin shall be applied to the input voltage between terminal No.3 and 1,
7 and 5, 11 and 9, 15,16,17,18 and 13.
*6 :VALM shall be applied to the voltage between terminal No.2 and 1, No6 and 5,
No10 and 9, No.19 and 13.
*7 :IALM shall be applied to the input current to terminal No.2,6,10 and 19.
*8 : 50Hz/60Hz sine wave 1 minute.
MS6M0672
6/23
H04-004-03
5.Electrical Characteristics
Tj=25℃,Vcc=15V unless otherwise specified.
5.1 Main circuit
Item
Collector
Symbol
Current
Inverter
at off signal input
Collector-Emitter
saturation voltage
Forward voltage of
FWD
Collector
Current
Brake
at off signal input
Collector-Emitter
saturation voltage
Forward voltage of
Conditions
Min.
Typ.
Max.
Units
-
-
1.0
mA
Terminal
-
-
2.5
V
Chip
-
2.0
-
V
Terminal
-
-
2.6
V
Chip
-
1.6
-
V
-
-
1.0
mA
Terminal
-
-
2.2
V
Chip
-
1.75
-
V
Terminal
-
-
3.3
V
Chip
-
1.9
-
V
1.2
-
-
-
-
3.6
VCE=600V
ICES
Vin terminal open.
VCE(sa
t
)
I
c=50A
-Ic=50A
VF
VCE=600V
ICES
Vin terminal open.
VCE(sa
t
)
I
c=30A
VF
-Ic=30A
Turn-on time
ton
VDC=300V、Tj=125℃
Turn-off time
toff
Ic=50A Fig.1,Fig.6
Diode
Reverse recovery time
trr
-
-
0.3
30
-
-
mJ
Min.
Typ.
Max.
Units
-
-
18
mA
-
-
65
mA
ON
1.00
1.35
1.70
OFF
1.25
1.60
1.95
-
8.0
-
V
Tc=-20℃ Fig.2
1.1
-
-
ms
Tc=25℃ Fig.2
-
2.0
-
ms
Tc=125℃ Fig.2
-
-
4.0
ms
1425
1500
1575
Ω
IF=50A
Fig.1,Fig.6
internal wiring
Maximum Avalanche
inductance=50nH
PAV
Energy
us
VDC=300V
Main circuit wiring
(A non-repetition)
inductance=54nH
5.2 Control circuit
Supply
current
Symbol
of
P-side
Iccp
pre-driver (one unit)
Supply
current
of
Switching Frequency:
0∼15kHz
Tc=-20∼125℃
N-side
Iccn
pre-driver
Input signal threshold voltage
Conditions
Vin(th)
Input Zener Voltage
Alarm Signal Hold Time
Limiting Resistor for Alarm
Fuji Electric Co.,Ltd.
Vz
tALM
Fig.7
Rin=20kΩ
RALM
DWG.NO.
.
Item
MS6M0672
V
7/23
H04-004-03
5.3 Protection Section
(Vcc=15V)
Item
Symbol
Over Current Protection Level of
Conditions
Min.
Typ.
Max.
Units
75
-
-
A
45
-
-
A
Tj=125℃
Inverter circuit
Ioc
Over Current Protection Level of
Tj=125℃
Brake circuit
Over Current Protection Delay time
tdoc
Tj=125℃
-
5
-
us
SC Protection Delay time
tsc
Tj=125℃ Fig.4
-
-
8
us
150
-
-
℃
-
20
-
℃
110
-
125
℃
IGBT Chips Over Heating
TjOH
Protection Temperature Level
Over Heating Protection Hysteresis
Surface of
IGBT Chips
TjH
Over Heating Protection
TcOH
Temperature Level
VDC=0V,IC=0A
CaseTemperature
Over Heating Protection Hysteresis
TcH
-
20
-
Under Voltage Protection Level
VUV
11.0
-
12.5
VH
0.2
0.5
-
Under Voltage Protection Hysteresis
V
6.Thermal Characteristics (Tc=25℃)
Item
Symbol
Min.
Typ.
Max.
IGBT
Rth(j-c)
-
-
0.87
FWD
Rth(j-c)
-
-
1.263
IGBT
Rth(j-c)
-
-
0.87
Rth(c-f)
-
0.05
-
Min.
Typ.
Max.
Units
±2.0
-
-
kV
±5.0
-
-
kV
Symbol
Min.
Typ.
Max.
Units
DC Bus Voltage
VDC
-
-
400
V
Power Supply Voltage of Pre-Driver
Vcc
13.5
15.0
16.5
V
-
2.5
-
3.0
Nm
Symbol
Min.
Typ.
Max.
Units
Wt
-
450
-
g
Inverter
Junction to Case
Thermal Resistance *9
Brake
Case to Fin Thermal Resistance with Compound
7.Noise Immunity
Item
Common mode
rectangular noise
Units
℃/W
(Vdc=300V、Vcc=15V、Test Circuit Fig 5.)
Conditions
Pulse width 1us,polarity ±,10 minuets
Judge:no over-current, no miss operating
Rise time 1.2us, Fall time 50us
Common mode
Interval 20s, 10 times
lightning surge
Judge:no over-current, no miss operating
8.Recommended Operating Conditions
Item
Screw Torque (M5)
9.Weight
Item
Weight
Fuji Electric Co.,Ltd.
DWG.NO.
.
*9:( For 1device ,Case is under the device )
MS6M0672
8/23
H04-004-03
n(
t
h)
Vi
n Vi
On
Vi
n(
t
h)
t
r
r
90%
50%
I
c
90%
10%
t
on
t
off
Figure 1. Switching Time Waveform Definitions
off
/Vin
Vge (Inside IPM)
Fault (Inside IPM)
off
on
Gate On
on
Gate Off
normal
alarm
/ALM
tALM>Max.
tALM 2ms(typ.)
③
tALM>Max.
①
②
Fault:Over-current,Over-heat or Under-voltage
Figure 2. Input/Output Timing Diagram
Necessary conditions for alarm reset (refer to ① to ③ in figure2.)
① This represents the case when a failure-causing Fault lasts for a period more than
tALM. The alarm resets when the input Vin is OFF and the Fault has disappeared.
② This represents the case when the ON condition of the input Vin lasts for a period
more than tALM. The alarm resets when the Vin turns OFF under no Fault conditions.
③ This represents the case when the Fault disappears and the Vin turns OFF within
tALM. The alarm resets after lasting for a period of the specified time tALM.
/Vin
Ic
off
on
on
Ioc
/ALM
①
②
<tdoc
alarm
tdoc
Figure 3. Over-current Protection Timing Diagram
Period ①: When a collector current over the OC level flows and the OFF command is input
within a period less than the trip delay time tdoc, the current is hard-interrupted
and no alarm is output.
Period ②: When a collector current over the OC level flows for a period more than the trip
delay time tdoc, the current is soft-interrupted. If this is detected at the lower
Fuji Electric Co.,Ltd.
DWG.NO.
.
arm IGBTs, an alarm is output.
MS6M0672
9/23
H04-004-03
t SC
Ic
Ic
IALM
Ic
IALM
IALM
Figure.4 Definition of tsc
20k
DC
15V
VinU
CT
P
VccU
IPM
U
AC200V
SW1
GNDU
Vcc
V
VinX
W
+
20k
DC
15V
4700p
SW2
Noise
N
GND
Earth
Cooling
Fin
Figure 5. Noise Test Circuit
Vcc
20k
DC
15V
P
L
IPM
+
Vin
DC
300V
HCPL4504
GND
N
Ic
Figure 6. Switching Characteristics Test Circuit
Icc
A
Vcc
P
IPM
DC
15V
P.G
+8V
fsw
Vin
U
V
W
GND
N
Fuji Electric Co.,Ltd.
DWG.NO.
.
Figure 7. Icc Test Circuit
MS6M0672
10/23
H04-004-03
10. Truth table
10.1 IGBT Control
The following table shows the IGBT ON/OFF status with respect to the input signal Vin.
The IGBT turn-on when Vin is at “Low” level under no alarm condition.
Input
(Vin)
Output
(IGBT)
Low
ON
High
OFF
10.2 Fault Detection
(1) When a fault is detected at the high side, only the detected arm stops its output. At
that time the IPM outputs detected arm’s alarm.
(2) When a fault is detected at the low side, all the lower arms stop their outputs and the
IPM outputs an alarm of the low side.
Fault
High side Uphase
High side Vphase
High side Wphase
Low side
Case
IGBT
Alarm Output
U-phase V-phase W-phase Low side
ALM-U
ALM-V
ALM-W
ALM
OC
OFF
*
*
*
L
H
H
H
UV
OFF
*
*
*
L
H
H
H
TjOH
OFF
*
*
*
L
H
H
H
OC
*
OFF
*
*
H
L
H
H
UV
*
OFF
*
*
H
L
H
H
TjOH
*
OFF
*
*
H
L
H
H
OC
*
*
OFF
*
H
H
L
H
UV
*
*
OFF
*
H
H
L
H
TjOH
*
*
OFF
*
H
H
L
H
OC
*
*
*
OFF
H
H
H
L
UV
*
*
*
OFF
H
H
H
L
TjOH
*
*
*
OFF
H
H
H
L
TcOH
*
*
*
OFF
H
H
H
L
Temperature
Fuji Electric Co.,Ltd.
DWG.NO.
.
*:Depend on input logic.
MS6M0672
11/23
H04-004-03
11. Cautions for design and application
1. Trace routing layout should be designed with particular attention to least stray capacity
between the primary and secondary sides of optical isolators by minimizing the wiring
length between the optical isolators and the IPM input terminals as possible.
フォトカプラとIPMの入力端子間の配線は極力短くし、フォトカプラの一次側と二次側の浮遊容量を小さくした
パターンレイアウトにして下さい。
2.
Mount a capacitor between Vcc and GND of each high-speed optical isolator as close
to as possible. 高速フォトカプラの Vcc-GND 間に、コンデンサを出来るだけ近接して取り付けて下さい。
3. For the high-speed optical isolator, use high-CMR type one with tpHL, tpLH ≦ 0.8µs.
高速フォトカプラは、tpHL,tpLH≦0.8us、高 CMR タイプをご使用ください。
4.
For the alarm output circuit, use low-speed type optical isolators with CTR ≧ 100%.
アラーム出力回路は、低速フォトカプラ CTR≧100%のタイプをご使用ください。
5. For the control power Vcc, use four power supplies isolated each. And they should be
designed to reduce the voltage variations.
制御電源 Vcc は、絶縁された4電源を使用してください。また、電圧変動を抑えた設計として下さい。
6. Suppress surge voltages as possible by reducing the inductance between the DC bus P
and N, and connecting some capacitors between the P and N terminals
P-N 間の直流母線は出来るだけ低インダクタンス化し、P-N 端子間にコンデンサを接続するなどしてサージ
電圧を低減して下さい。
7. To prevent noise intrusion from the AC lines, connect a capacitor of some 4700pF
between the three-phase lines each and the ground.
AC ラインからのノイズ侵入を防ぐために、3相各線−アース間に4700pF程のコンデンサを接続して下さい
8. At the external circuit, never connect the control terminal ① GNDU to the main
terminal U-phase, ⑤GNDV to V-phase, ⑨GNDW to W-phase, and ⑬GND to N-phase.
Otherwise, malfunctions may be caused.
制御端子①GNDUと主端子U相、制御端子⑤GNDVと主端子 V 相、制御端子⑨GNDWと主端子 W 相、
制御端子⑬GNDと主端子 N を外部回路で接続しないで下さい。誤動作の原因になります。
9. Take note that an optical isolator’s response to the primary input signal becomes slow if
a capacitor is connected between the input terminal and GND.
入力端子-GND 間にコンデンサを接続すると、フォトカプラ一次側入力信号に対する応答時間が長くなりま
Fuji Electric Co.,Ltd.
DWG.NO.
.
すのでご注意ください。
MS6M0672
12/23
H04-004-03
10.
Taking the used isolator’s CTR into account, design with a sufficient allowance to decide
the primary forward current of the optical isolator.
フォトカプラの一次側電流は、お使いのフォトカプラの CTR を考慮し十分に余裕をもった設計にして下さい。
11.
Apply thermal compound to the surfaces between the IPM and its heat sink to reduce
the thermal contact resistance.
接触熱抵抗を小さくするために、IPMとヒートシンクの間にサーマルコンパウンドを塗布して下さい。
12.
Finish the heat sink surface within roughness of 10µm and flatness (camber) between
screw positions of 0 to +100µm. If the flatness is minus, the heat radiation becomes
worse due to a gap between the heat sink and the IPM. And, if the flatness is over
+100µm, there is a danger that the IPM copper
base may be deformed and this may cause a
+100μm
0
dielectric breakdown.
ヒートシンク表面の仕上げは、粗さ 10um 以下、ネジ位置間
Heat sink
での平坦度(反り)は、0∼100um として下さい。平坦度がマ
Mounting holes
イナスの場合、ヒートシンクと IPM の間に隙間ができ放熱が
悪化します。また、平坦度が+100um 以上の場合IPMの銅
ベースが変形し絶縁破壊を起こす危険性があります。
13. This product is designed on the assumption that it applies to an inverter use. Sufficient
examination is required when applying to a converter use. Please contact Fuji Electric
Co.,Ltd if you would like to applying to converter use.
本製品は、インバータ用途への適用を前提に設計されております。コンバータ用途へ適用される場合は、十分な
検討が必要です。もし、コンバータへ適用される場合は御連絡ください。
14. Please see the 『Fuji IGBT-IPM R SERIES APPLICATION MANUAL』 and 『Fuji IGBT
MODULES N SERIES APPLICATION MANUAL』.
『富士 IGBT-IPM R シリーズ アプリケーションマニュアル』及び『IGBT モジュール N シリーズ アプリケーションマニュ
Fuji Electric Co.,Ltd.
DWG.NO.
.
アル』を御参照ください。
MS6M0672
13/23
H04-004-03
12.Example of applied circuit 応用回路例
P
20kΩ
0 .1 u F
R
③
Vcc
U
①
5V
A C 2 0 0
V
④
+1 0 u F
IF
V
1k
②
W
⑧
B
⑦
N
M
+
20kΩ
IF
0 .1 u F
+1 0 u F
Vcc
⑤
5V
1k
⑥
20kΩ
⑫
IF
0 .1 u F
+1 0 u F
Vcc
⑪
⑨
5V
1k
⑩
⑭
I P M
Vcc
⑬
IF
IF
IF
5V
10uF
20kΩ
0 .1 u F
10uF
20kΩ
0 .1 u F
10uF
20kΩ
0 .1 u F
10uF
⑯
⑰
⑱
⑮
1k
⑲
The alarm signals should be connected to Vcc when it is not used.
不使用のアラーム端子は、制御電源 Vcc に接続して下さい。
13.Package and Marking
梱包仕様
Please see the MT6M4140 which is packing specification of P610 & P611& P621 package.
P610,611,621 梱包仕様書 MT6M4140 を御参照ください。
14.Cautions for storage and transportation
保管、運搬上の注意
・ Store the modules at the normal temperature and humidity (5 to 35°C, 45 to 75%).
常温常湿(5∼35℃、45∼75%)で保存して下さい。
・ Avoid a sudden change in ambient temperature to prevent condensation on the
module surfaces.
モジュールの表面が結露しないよう、急激な温度変化を避けて下さい。
・ Avoid places where corrosive gas generates or much dust exists.
腐食性ガスの発生場所、粉塵の多い場所は避けて下さい。
・ Store the module terminals under unprocessed conditions
モジュールの端子は未加工の状態で保管すること。.
・ Avoid physical shock or falls during the transportation.
運搬時に衝撃を与えたり落下させないで下さい。
15.Scope of application
適用範囲
This specification is applied to the IGBT-IPM (type: 7MBP50RTJ060).
本仕様書は、IGBT-IPM (型式:7MBP50RTJ060)に適用する。
16.Based safety standards
準拠安全規格
UL1557
Fuji Electric Co.,Ltd.
DWG.NO.
.
This material and the information herein is the property of
Fuji Electric Co.,Ltd.They shall be neither reproduced, copied,
lent, or disclosed in any way whatsoever for the use of any
third party,nor used for the manufacturing purposes without
the express written consent of Fuji Electric Co.,Ltd.
IF
20kΩ
0 .1 u F
MS6M0672
14/23
H04-004-03
18-1.Reliability Test Items
Reliability Test Items
Test
categories
Test items
4
5
6
1
2
3
Environment Tests
4
5
Pull force
: 40Nm(main terminal)
10Nm(control terminal)
Test time
: 10±1 sec.
Screw torque
: 2.5 ~ 3.5 N・m (M5)
Test time
: 10±1 sec.
Range of frequency : 10 ~ 500Hz
Sweeping time
: 15 min.
Acceleration
: 100m/s2
Sweeping direction : Each X,Y,Z axis
Test time
: 6 hr. (2hr./direction)
Shock
Maximum acceleration : 10000m/s2
0.5m/s
衝撃
Direction
: Each X,Y,Z axis
Test time
: 3 times/direction
Solderabitlity
Solder temp.
: 230±5 ℃
はんだ付け性
Immersion time
: 5±1sec.
Test time
: 1 time
Each terminal should be Immersed in solder
within 1~1.5mm from the body.
Resistance to
Solder temp.
: 260±5 ℃
Soldering Heat
Immersion time
: 10±1sec.
はんだ耐熱性
Test time
: 1 time
Each terminal should be Immersed in solder
within 1~1.5mm from the body.
High Temperature Storage temp.
: 125±5 ℃
Storage 高温保存 Test duration
: 1000hr.
Low Temperature Storage temp.
: -40±5 ℃
Storage 低温保存 Test duration
: 1000hr.
Temperature
Storage temp.
: 85±3 ℃
Humidity Storage Relative humidity
: 85±5%
Test duration
: 1000hr.
高温高湿保存
Unsaturated
Test temp.
: 120±2 ℃
Pressure Cooker Atmospheric pressure : 1.7×105 Pa
85±5%
プレッシャークッカー Test humidity
Test duration
: 20hr.
+3
Temperature
Cycle
Test temp.
:
Low temp. -40 -5 ℃
温度サイクル
+5
A - 112
Method 2
A - 121
5
(1:0)
5
(1:0)
A - 122
5
(1:0)
A - 131
5
(1:0)
A - 132
5
(1:0)
B - 111
5
(1:0)
B - 112
5
(1:0)
B - 121
5
(1:0)
B - 123
5
(1:0)
B - 131
5
(1:0)
B - 141
5
(1:0)
High temp. 125 -0 ℃
Number of cycles
RT 5 ~ 35 ℃
: High ~ RT ~ Low ~ RT
1hr. 0.5hr. 1hr. 0.5hr.
: 100 cycles
Test temp.
:
Dwell time
6 Thermal Shock
熱衝撃
+0
High temp. 100 -5 ℃
+5
Low temp. 0 -0 ℃
Used liquid : Water with ice and bolding water
Dipping time
: 5 min. par each temp.
Transfer time
: 10 sec.
Number of cycles
: 10 cycles
Fuji Electric Co.,Ltd.
DWG.NO.
.
Mechanical Tests
1 Terminal Strength
端子強度
(Pull test)
2 Mounting Strength
締め付け強度
3 Vibration
振動
Test methods and conditions
Reference
Number Acceptnorms
ance
of
EIAJ
sample number
ED-4071
A - 111
5
(1:0)
Method 1
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18-2.Reliability Test Items
Test
categories
Test items
Test methods and conditions
Endurance
Endurance
Tests Tests
1 High temperature
Reverse Bias
高温逆バイアス
Test tepm.
Bias Voltage
Bias Method
2 Temperature
hummidity baias
高温高湿バイアス
3 Intermitted
Operating Life
(Power cycle)
断続動作
Reference
Acceptnorms
Number
ance
EIAJ
of sample
number
ED-4071
D - 313
5
(1:0)
Test duration
Test tepm.
Relative humidity
Bias Voltage
Bias Method
Test duration
ON time
OFF time
Test tepm.
Number of cycles
+0
-5
: Ta = 125 ℃
(Tj ≦ 150 ℃)
: VC = 0.8×VCES
: Applied DC voltage to C-E
Vcc = 15V
: 1000hr.
: 85±3℃
: 85±5%
: VC = 0.8×VCES
Vcc = 15V
: Applied DC voltage to C-E
: 1000hr.
: 2 sec.
: 18 sec.
: ∆ Tj=100±5 deg
Tj ≦ 150 ℃, Ta=25±5 ℃
B- 121
5
(1:0)
D - 322
5
(1:0)
: 15000 cycles
19.Failure Criteria
Item
Characteristic
Electrical
characteristic
Visual
inspection
Leakage current
Saturation voltage
Forward voltage
Thermal
IGBT
resistance
FWD
Over Current Protection
Alarm signal hold time
Over heating Protection
Isolation voltage
Visual inspection
Peeling
Plating
and the others
Symbol
Failure criteria
Lower limit Upper limit
Unit
ICES
VCE(sat)
VF
Rth(j-c)
Rth(j-c)
Ioc
tALM
TcOH
mA
V
V
℃/W
℃/W
A
ms
℃
Viso
USL×2
USL×1.2
USL×1.2
USL×1.2
USL×1.2
LSL×0.8
USL×1.2
LSL×0.8
USL×1.2
LSL×0.8
USL×1.2
Broken insulation
-
The visual sample
-
Note
-
LSL : Lower specified limit.
USL : Upper specified limit.
Fuji Electric Co.,Ltd.
DWG.NO.
.
Note : Each parameter measurement read-outs shall be made after stabilizing the components at room
ambient for 2 hours minimum, 24 hours maximum after removal from the tests. And in case of the
wetting tests, for example, moisture resistance tests, each component shall be made wipe or dry
completely before the measurement.
MS6M0672
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H04-004-03
Warnings
1. This product shall be used within its abusolute maximun rating (voltage, current, and
temperature). This product may be broken in case of using beyond the ratings.
製品の絶対最大定格(電圧,電流,温度等)の範囲内で御使用下さい。絶対最大定格を超えて使用すると、素
子が破壊する場合があります。
2. Conect adequate fuse or protector of circuit between three-phase line and this
product to prevent the equipment from causing secondary destruction.
万 一 の 不 慮 の 事 故で素子が破壊した場合を考慮し、商用電 源と本製品の間に適切な容量のヒューズ
又はブレーカーを必ず付けて2次破壊を防いでください。
3. When studying the device at a nomal turn-off action,make sure that working paths
of the turn-off voltage and current are within the RBSOA specification. And ,when
studying the device duty at a short-circuit current non-repetitive interruption,
make sure that the paths are also within the avalanche proof(PAV) specification
which is calculated from the snubber inductance, the IPM inner inductance and
the turn-off current. In case of use of IGBT-IPM over these specifications, it
might be possible to be broken.
通 常 のターンオフ動作における素子責務の検討の際には、ターンオフ電圧・電流の動作軌跡が RBSOA
仕 様 内にあることを確認して下さい。また、非繰返しの短絡電流遮断における素子責務の検討に際して
は、スナバーインダクタンスとIPM内部インダクタンス及びターンオフ電流から算出されるアバランシェ耐
量 (PAV)仕 様 内である事を確認して下さい。これらの仕様を越えて使用すると、素子が破壊する場合が
あります。
4. Use this product after realizing enough working on environment and considering of
product's reliability life.This product may be broken before target life of the system
in case of using beyond the product's reliability life.
製 品 の 使 用 環 境を十分に把握し、製品の信頼性寿命が満足できるか検討の上、本製品を適用して下さ
い。製品の信頼性寿命を超えて使用した場合、装置の目標寿命より前に素子が破壊する場 合がありま
す。
5. If the product had been used in the environment with acid, organic matter, and
corrosive gas (For example : hydrogen sulfide, sulfurous acid gas), the product's
performance and appearance can not be ensured easily.
酸・有機物・腐食性ガス(硫化水 素,亜硫酸ガス等)を含む環 境 下で使用された場合、製品 機 能・外観
などの保証は致しかねます。
6. Use the product within the power cycle curve. (Thechnical Rep.No. : MT6M4057)
本 製 品 は、パワーサイクル寿命カーブ以下で使用下さい。(技 術 資 料 No.: MT6M4057)
7. Never add mechanical stress to deform the main or control terminal.
The deformed terminal may cause poor contact problem.
主端子及び制御端子に応力を与えて変形させないで下さい。 端子の変形により、接触不良などを引き起こす
Fuji Electric Co.,Ltd.
DWG.NO.
.
場 合 があります。
MS6M0672
22/23
H04-004-03
8. According to the outline drawing, select proper length of screw for main terminal.
Longer screws may break the case.
本 製 品に使用する主端子用のネジの長さは、外形図に従い正しく選定下さい。ネジが長いとケースが破
損する場合があります。
9.
If excessive static electricity is applied to the control terminals, the devices can
be broken. Implement some countermeasures against static electricity.
制御端子に過大な静電気が印加された場合、素子が破壊する場合があります。取り扱い時 は 静 電 気 対
策を実施して下さい。
Caution
1.
Fuji Electric is constantly making every endeavor to improve the product quality and
reliability. However, semiconductor products may rarely happen to fail or malfunction. To
prevent accidents causing injuly or death,
damage to property like by fire, and other social
damage resulted from a failure or malfunction of the Fuji Electric semiconductor products,
take some measures to keep safety such as redundant design, spread-fire-preventive design,
and malfunction-protective design..
富士電機は絶えず製品の品質と信頼性の向上に努めています。しかし、半導体製品は故障が発生したり、誤
動作する場合があります。富士電機製半導体製品の故障または誤動作が、結果として人身事故・火災等によ
る財産に対する損害や社会的な損害を起こさないように冗長設計・延焼防止設計・誤動作防止設計など安全
確保のための手段を講じて下さい。
2.
The application examples described in this specification only explain typical ones that
used the Fuji Electricproducts. This specification never ensure to enforce the industrial
property and other rights, nor license theenforcement rights.
本仕様書に記載してある応用例は、富士電機製品を使用した代表的な応用例を説明するものであり、本仕様
書によって工業所有権、その他権利の実施に対する保障または実施権の許諾を行うものではありません。
The product described in this specification is not designed nor made for being applied to the
equipment
or systems used under life-threatening situations. When you consider applying
the product of this specification to particular used, such as vehicle-mounted units, shipboard
equipment, aerospace equipment, medical devices, atomic control systems and submarine
relay equipment or systems, please apply after confirmation of this product to be satisfied
about system construction and required reliability.
本仕様書に記載された製品は、人命にかかわるような状況下で使用される機器あるいはシステムに用いられ
ることを目的として設計・製造されたものではありません。本仕様書の製品を車両機器、船舶、航空宇宙、医
療機器、原子力制御、海底中継機器あるいはシステムなど、特殊用途へのご利用をご検討の際は、システム
構成及び要求品質に満足することをご確認の上、ご利用下さい。
If there is any unclear matter in this specification, please contact Fuji Electric Co.,Ltd.
Fuji Electric Co.,Ltd.
DWG.NO.
.
3.
MS6M0672
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H04-004-03