DATA SHEET DSM8100-000: Mesa Beam Lead PIN Diode Applications: ● Designed for switching applications Features Low capacitance Low resistance ● Fast switching ● Oxide–nitride passivated ● Durable construction ● High voltage ● ● Description Skyworks’ Silicon Mesa Beam Lead PIN diode is surrounded by a glass frame for superior strength and electrical performance that surpasses the standard beam lead PINs. The DSM8100-000 is designed for low resistance, low capacitance and fast switching time. The oxide-nitride passivation layers provide reliable operation and stable junction parameters that provide complete sealing of the junction permitting use in assemblies with some degree of moisture sealing. A layer of glass provides increased mechanical strength. Absolute Maximum Ratings Characteristic Value Operating temperature -65 °C to +150 °C Storage temperature -65 °C to +200 °C Power dissipation (derate linearly to zero @ 175 °C) 250 mW Typical lead strength 8 grams pull The DSM8100 is ideal for microstrip or stripline circuits and for circuits requiring high isolation from a series mounted diode such as broad band multi-throw switches, phase shifters, limiters, attenuators and modulators. Mesa Beam Lead Diode Specifications Part Number Voltage Breakdown @ IR 10 µA (V) Max. Capacitance Total 10 V, 1 MHz (pF) Max. Series Resistance (Ω) 10 mA,100 MHz Max. CLT IF = 10 mA, IR = 6 mA (ns) Typ. Outline Drawing Number DSM8100-000 60 0.025 3.5 25 389-003 Skyworks Solutions, Inc. • Phone  376-3000 • Fax  376-3100 • [email protected] • www.skyworksinc.com Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • Oct. 17, 2003 1 DATA SHEET • DSM8100-000 Typical Performance Data Isolation (dB) Attenuation (dB) Conventional Beam Lead 10 Chip 0.75 0.60 0.45 0.30 0.15 (10 mA) 15 VR = 40 V 20 0 0.3 1 3 10 30 100 0 300 5 10 15 18 20 25 30 Time (ns) Frequency (GHz) Switching Time Data Typical Isolation and Insertion Loss Characteristics 100 RF Resistance (Ω) Capacitance (pF) 20 15 0.06 0.05 0.04 0.03 0.02 0.01 1 MHz 10 1 Above 1 GHz 0.1 0 10 20 30 0.1 1 10 100 Reverse Voltage (V) Forward Bias Current (mA) Typical Capacitance vs. Reverse Voltage Typical RF Resistance vs. Forward Bias Current Skyworks Solutions, Inc. • Phone  376-3000 • Fax  376-3100 • [email protected] • www.skyworksinc.com 2 Insertion Loss (dB) Mesa Beam Lead 5 45 40 35 30 25 20 15 10 5 0 Oct. 17, 2003 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. DATA SHEET • DSM8100-000 Typical Beam Lead Mounting Typical SPDT Circuit Arrangement Beam Lead Pin Duroid Substrate 50 Ω Transmission LIne 50 Ω Glass Bead Connecting Lead Beam Lead Pin 0.005" Preferred Beam Lead Orientation Metal Conductor Duroid 389-003 0.009 (0.23 mm) Min. 0.0115 (0.29 mm) Max. 0.009 (0.23 mm) Min. 0.0115 (0.29 mm) Max. 0.014 (0.36 mm) Max. 0.011 (0.28 mm) Max. 0.0035 (0.09 mm) Min. 0.0070 (0.18 mm) Max. 0.032 (0.81 mm) Min. 0.035 (0.89 mm) Max. 0.005 (0.13 mm) Max. 0.0002 (0.005 mm) Min. 0.0007 (0.018 mm) Max. Skyworks Solutions, Inc. • Phone  376-3000 • Fax  376-3100 • [email protected] • www.skyworksinc.com Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • Oct. 17, 2003 3 DATA SHEET • DSM8100-000 Beam-Lead Diodes Handling Due to their small size, beam-lead devices are fragile and should be handled with extreme care. The individual plastic packages should be handled and opened carefully, so that no undue mechanical strain is applied to the packaged device. It is recommended that the beam-lead devices be handled through use of a vacuum pencil using an appropriate size vacuum needle or a pointed wooden stick such as a sharpened Q-tip or match stick. The device will adhere to the point and can easily be removed from the container and positioned accurately for bonding without damage. Such handling should be done under a binocular microscope with magnification in the range of 20X to 30X. Special handling precautions are also required to avoid electrical damage, such as static discharge. Bonding The DSM8100-000 can best be bonded to substrates by means of thermocompression bonding. Essentially this type of bonding involves pressing the gold beam of the device against the gold plated metalized substrate under proper conditions of heat and pressure so that a metalurgical bond joint between the two occurs. Procedure The beam-lead devices to be bonded should be placed on a clean, hard surface such as a microscope slide. It is recommended that the beam side of the device be down so that this side will be toward the substrate when bonded. The device can be picked up by pressing lightly against one beam with the heated tip. The substrate can then be appropriately positioned under the tip and the device brought down against the substrate, with proper pressure applied by means of the weld head. A bonding tip temperature in the 350 °C to 450 °C range is recommended along with a bonding force of 50 to 70 grams. The bonding time is in the range of 2 to 3 seconds. Optimum bonding conditions should be determined by trial and error to compensate for slight variations in the condition of the substrate, bonding tip, and the type of device being bonded. Equipment The heat and pressure are obtained through use of a silicon carbide bonding tip with a radius of two to three mils. Such an item is available from several commercial sources. In order to supply the required tip-travel and apply proper pressure, a standard miniature weld head can be used. Also available is a heated wedge shank which is held by the weld head and in turn holds the tip and supplies heat to it. The wedge shank is heated by means of a simple AC power supply or a pulse type heated tool. Substrate For optimum bonding a gold plated surface at least 100 microinches thick is necessary. Although it is possible to bond to relatively soft metalized substrate material such as epoxy-fiberglass, etc., optimum bonding occurs when a hard material such as ceramic can be used. Quality If a good bond has been obtained, it is impossible to separate the beam-lead device from the metalized substrate without damage. If the device is destructively removed, the beam will tear away, leaving the bonded portion attached to the substrate. Beam–Lead Packaging The DSM8100-000 is shipped in 2" x 2" black gel packs. The beam-leads are mounted on the gel, the devices are covered with a piece of lint-free release paper, on top of which is placed a piece of conductive foam. Skyworks Solutions, Inc. • Phone  376-3000 • Fax  376-3100 • [email protected] • www.skyworksinc.com 4 Oct. 17, 2003 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice.