Low Cost, Low Power 12-Bit Differential ADC Driver AD8137 FEATURES 12-bit ADC drivers Portable instrumentation Battery-powered applications Single-ended-to-differential converters Differential active filters Video amplifiers Level shifters +IN VOCM 2 7 PD VS+ 3 6 VS– +OUT 4 5 –OUT 04771-0-001 8 Figure 1. 3 G=1 2 1 0 –1 G=5 –2 –3 G=2 –4 –5 G = 10 –6 –7 –8 –9 04771-0-002 APPLICATIONS AD8137 –IN 1 NORMALIZED CLOSED-LOOP GAIN (dB) Fully differential Extremely low power with power-down feature 2.6 mA quiescent supply current @ 5 V 450 µA in power-down mode @ 5 V High speed 110 MHz large signal 3 dB bandwidth @ G = 1 450 V/µs slew rate 12-bit SFDR performance @ 500 kHz Fast settling time: 100 ns to 0.02% Low input offset voltage: ±2.6 mV max Low input offset current: 0.45 µA max Differential input and output Differential-to-differential or single-ended-to-differential operation Rail-to-rail output Adjustable output common-mode voltage Externally adjustable gain Wide supply voltage range: 2.7 V to 12 V Available in small SOIC package FUNCTIONAL BLOCK DIAGRAM –10 RG = 1kΩ VO, dm = 0.1V p-p –11 –12 0.1 1 10 FREQUENCY (MHz) 100 1000 Figure 2. Small Signal Response for Various Gains GENERAL DESCRIPTON The AD8137 is a low cost differential driver with a rail-to-rail output that is ideal for driving 12-bit ADCs in systems that are sensitive to power and cost. The AD8137 is easy to apply, and its internal common-mode feedback architecture allows its output common-mode voltage to be controlled by the voltage applied to one pin. The internal feedback loop also provides inherently balanced outputs as well as suppression of even-order harmonic distortion products. Fully differential and single-ended-todifferential gain configurations are easily realized by the AD8137. External feedback networks consisting of four resistors determine the amplifier’s closed-loop gain. The power-down feature is beneficial in critical low power applications. The AD8137 is manufactured on Analog Devices’ proprietary second generation XFCB process, enabling it to achieve high levels of performance with very low power consumption. The AD8137 is available in the small 8-lead SOIC package and 3 mm × 3 mm LFCSP. It is rated to operate over the extended industrial temperature range of −40°C to +125°C. Rev. B Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 © 2005 Analog Devices, Inc. All rights reserved. AD8137 TABLE OF CONTENTS Specifications..................................................................................... 3 Applications..................................................................................... 18 Absolute Maximum Ratings............................................................ 6 Analyzing a Typical Application with Matched RF and RG Networks...................................................................................... 18 Thermal Resistance ...................................................................... 6 ESD Caution.................................................................................. 6 Estimating Noise, Gain, and Bandwith with Matched Feedback Networks .................................................................... 18 Pin Configuration and Function Descriptions............................. 7 Driving an ADC with Greater than 12-Bit Performance...... 22 Typical Performance Characteristics ............................................. 8 Outline Dimensions ....................................................................... 24 Theory of Operation ...................................................................... 17 Ordering Guide .......................................................................... 24 REVISION HISTORY 7/05—Rev. A to Rev. B Changes to Ordering Guide .......................................................... 24 8/04—Rev. 0 to Rev. A. Added 8-Lead LFCSP.........................................................Universal Changes to Layout ..............................................................Universal Changes to Product Title ................................................................. 1 Changes to Figure 1.......................................................................... 1 Changes to Specifications ................................................................ 3 Changes to Absolute Maximum Ratings ....................................... 6 Changes to Figure 4 and Figure 5................................................... 7 Added Figure 6, Figure 20, Figure 23, Figure 35, Figure 48, and Figure 58; Renumbered Successive Figures ........................... 7 Changes to Figure 32...................................................................... 12 Changes to Figure 40...................................................................... 13 Changes to Figure 55...................................................................... 16 Changes to Table 7 and Figure 63................................................. 18 Changes to Equation 19 ................................................................. 19 Changes to Figure 64 and Figure 65............................................. 20 Changes to Figure 66...................................................................... 22 Added Driving an ADC with Greater Than 12-Bit Performance Section ...................................................................... 22 Changes to Ordering Guide .......................................................... 24 Updated Outline Dimensions ....................................................... 24 5/04—Revision 0: Initial Version Rev. B | Page 2 of 24 AD8137 SPECIFICATIONS VS = ±5 V, VOCM = 0 V (@ 25°C, differential gain = 1, RL, dm = RF = RG = 1 kΩ, unless otherwise noted, TMIN to TMAX = −40°C to +125°C). Table 1. Parameter DIFFERENTIAL INPUT PERFORMANCE DYNAMIC PERFORMANCE −3 dB Small Signal Bandwidth −3 dB Large Signal Bandwidth Slew Rate Settling Time to 0.02% Overdrive Recovery Time NOISE/HARMONIC PERFORMANCE SFDR Input Voltage Noise Input Current Noise DC PERFORMANCE Input Offset Voltage Input Offset Voltage Drift Input Bias Current Input Offset Current Open-Loop Gain INPUT CHARACTERISTICS Input Common-Mode Voltage Range Input Resistance Input Capacitance CMRR OUTPUT CHARACTERISTICS Output Voltage Swing Output Current Output Balance Error VOCM to VO, cm PERFORMANCE VOCM DYNAMIC PERFORMANCE −3 dB Bandwidth Slew Rate Gain VOCM INPUT CHARACTERISTICS Input Voltage Range Input Resistance Input Offset Voltage Input Voltage Noise Input Bias Current CMRR POWER SUPPLY Operating Range Quiescent Current Quiescent Current, Disabled PSRR PD PIN Threshold Voltage Input Current OPERATING TEMPERATURE RANGE Conditions Min Typ VO, dm = 0.1 V p-p VO, dm = 2 V p-p VO, dm = 2 V step VO, dm = 3.5 V step G = 2, VI, dm = 12 V p-p triangle wave 64 79 76 110 450 100 85 MHz MHz V/µs ns ns 90 76 8.25 1 dB dB nV/√Hz pA/√Hz VO, dm = 2 V p-p, fC = 500 kHz VO, dm = 2 V p-p, fC = 2 MHz f = 50 kHz to 1 MHz f = 50 kHz to 1 MHz VIP = VIN = VOCM = 0 V TMIN to TMAX TMIN to TMAX −2.6 ±0.7 3 0.5 0.1 91 −4 Differential Common-mode Common-mode ∆VICM = ±1 V 66 Each single-ended output, RL, dm = 1 kΩ VS− + 0.55 f = 1 MHz VO, cm = 0.1 V p-p VO, cm = 0.5 V p-p 0.992 −28 ∆VO, dm/∆VOCM, ∆VOCM = ±0.5 V 62 79 VS+ − 0.55 20 −64 V mA dB 58 63 1.000 MHz V/µs V/V Rev. B | Page 3 of 24 1.008 +4 35 ±11 18 0.3 75 3.2 750 91 150/210 −40 mV µV/°C µA µA dB V KΩ KΩ pF dB VS− + 0.7 Power-Down = high/low 1 0.45 Unit +4 +2.7 Power-down = low ∆VS = ±1 V +2.6 800 400 1.8 79 −4 f = 100 kHz to 1 MHz Max +28 1.1 V kΩ mV nV/√Hz µA dB ±6 3.6 900 V mA µA dB VS− + 1.7 170/240 +125 V µA °C AD8137 VS = 5 V, VOCM = 2.5 V (@ 25°C, differential gain = 1, RL, dm = RF = RG = 1 kΩ, unless otherwise noted, TMIN to TMAX = −40°C to +125°C). Table 2. Parameter DIFFERENTIAL INPUT PERFORMANCE DYNAMIC PERFORMANCE −3 dB Small Signal Bandwidth −3 dB Large Signal Bandwidth Slew Rate Settling Time to 0.02% Overdrive Recovery Time NOISE/HARMONIC PERFORMANCE SFDR Input Voltage Noise Input Current Noise DC PERFORMANCE Input Offset Voltage Input Offset Voltage Drift Input Bias Current Input Offset Current Open-Loop Gain INPUT CHARACTERISTICS Input Common-Mode Voltage Range Input Resistance Input Capacitance CMRR OUTPUT CHARACTERISTICS Output Voltage Swing Output Current Output Balance Error VOCM to VO, cm PERFORMANCE VOCM DYNAMIC PERFORMANCE −3 dB Bandwidth Slew Rate Gain VOCM INPUT CHARACTERISTICS Input Voltage Range Input Resistance Input Offset Voltage Input Voltage Noise Input Bias Current CMRR POWER SUPPLY Operating Range Quiescent Current Quiescent Current, Disabled PSRR PD PIN Threshold Voltage Input Current OPERATING TEMPERATURE RANGE Conditions Min Typ VO, dm = 0.1 V p-p VO, dm = 2 V p-p VO, dm = 2 V step VO, dm = 3.5 V step G = 2, VI, dm = 7 V p-p triangle wave 63 76 75 107 375 110 90 MHz MHz V/µs ns ns 89 73 8.25 1 dB dB nV/√Hz pA/√Hz VO, dm = 2 V p-p, fC = 500 kHz VO, dm = 2 V p-p, fC = 2 MHz f = 50 kHz to 1 MHz f = 50 kHz to 1 MHz VIP = VIN = VOCM = 0 V TMIN to TMAX TMIN to TMAX −2.7 ±0.7 3 0.5 0.1 89 1 Differential Common-mode Common-mode ∆VICM = ±1 V 64 Each single-ended output, RL, dm = 1 kΩ VS− + 0.45 f = 1 MHz VO, cm = 0.1 V p-p VO, cm = 0.5 V p-p 0.980 −25 ∆VO, dm /∆VOCM, ∆VOCM = ±0.5 V 62 79 VS+ − 0.45 20 −64 V mA dB 60 61 1.000 MHz V/µs V/V Rev. B | Page 4 of 24 1.020 4 35 ±7.5 18 0.25 75 2.6 450 91 50/110 −40 mV µV/°C µA µA dB V KΩ KΩ pF dB VS− + 0.7 Power-down = high/low 0.9 0.45 Unit 4 +2.7 Power-down = low ∆VS = ±1 V +2.7 800 400 1.8 90 1 f = 100 kHz to 5 MHz Max +25 0.9 V kΩ mV nV/√Hz µA dB ±6 2.8 600 V mA µA dB VS− + 1.5 60/120 +125 V µA °C AD8137 VS = 3 V, VOCM = 1.5 V (@ 25°C, differential gain = 1, RL, dm = RF = RG = 1 kΩ, unless otherwise noted, TMIN to TMAX = −40°C to +125°C). Table 3. Parameter DIFFERENTIAL INPUT PERFORMANCE DYNAMIC PERFORMANCE −3 dB Small Signal Bandwidth −3 dB Large Signal Bandwidth Slew Rate Settling Time to 0.02% Overdrive Recovery Time NOISE/HARMONIC PERFORMANCE SFDR Input Voltage Noise Input Current Noise DC PERFORMANCE Input Offset Voltage Input Offset Voltage Drift Input Bias Current Input Offset Current Open-Loop Gain INPUT CHARACTERISTICS Input Common-Mode Voltage Range Input Resistance Input Capacitance CMRR OUTPUT CHARACTERISTICS Output Voltage Swing Output Current Output Balance Error VOCM to VO, cm PERFORMANCE VOCM DYNAMIC PERFORMANCE −3 dB Bandwidth Slew Rate Gain VOCM INPUT CHARACTERISTICS Input Voltage Range Input Resistance Input Offset Voltage Input Voltage Noise Input Bias Current CMRR POWER SUPPLY Operating Range Quiescent Current Quiescent Current, Disabled PSRR PD PIN Threshold Voltage Input Current OPERATING TEMPERATURE RANGE Conditions Min Typ VO, dm = 0.1 V p-p VO, dm = 2 V p-p VO, dm = 2 V Step VO, dm = 3.5 V Step G = 2, VI, dm = 5 V p-p Triangle Wave 61 62 73 93 340 110 100 MHz MHz V/µs ns ns 89 71 8.25 1 dB dB nV/√Hz pA/√Hz VO, dm = 2 V p-p, fC = 500 kHz VO, dm = 2 V p-p, fC = 2 MHz f = 50 kHz to 1 MHz f = 50 kHz to 1 MHz VIP = VIN = VOCM = 0 V TMIN to TMAX TMIN to TMAX −2.75 ±0.7 3 0.5 0.1 87 1 Differential Common-mode Common-mode ∆VICM = ±1 V 64 Each single-ended output, RL, dm = 1 kΩ VS− + 0.37 f = 1 MHz VO, cm = 0.1 V p-p VO, cm = 0.5 V p-p 0.96 −25 ∆VO, dm /∆VOCM, ∆VOCM = ±0.5 V 62 78 VS+ − 0.37 20 −64 V mA dB 61 59 1.00 MHz V/µs V/V Rev. B | Page 5 of 24 1.04 2.0 35 ±5.5 18 0.3 74 2.3 345 90 8/65 −40 mV µV/°C µA µA dB V MΩ MΩ pF dB VS− + 0.7 Power-down = high/low 0.9 0.4 Unit 2 +2.7 Power-down = low ∆VS = ±1 V +2.75 800 400 1.8 80 1.0 f = 100 kHz to 5 MHz Max +25 0.7 V kΩ mV nV/√Hz µA dB ±6 2.5 460 V mA µA dB VS− + 1.5 10/70 +125 V µA °C AD8137 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Supply Voltage VOCM Power Dissipation Input Common-Mode Voltage Storage Temperature Operating Temperature Range Lead Temperature (Soldering 10 sec) Junction Temperature Rating 12 V VS+ to VS− See Figure 3 VS+ to VS− −65°C to +125°C −40°C to +125°C 300°C 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, θJA is specified for the device soldered in a circuit board in still air. The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the package due to the load drive for all outputs. The quiescent power is the voltage between the supply pins (VS) times the quiescent current (IS). The load current consists of differential and common-mode currents flowing to the load, as well as currents flowing through the external feedback networks and the internal common-mode feedback loop. The internal resistor tap used in the common-mode feedback loop places a 1 kΩ differential load on the output. RMS output voltages should be considered when dealing with ac signals. Airflow reduces θJA. Also, more metal directly in contact with the package leads from metal traces, through holes, ground, and power planes reduces the θJA. Figure 3 shows the maximum safe power dissipation in the package vs. the ambient temperature for the SOIC-8 (125°C/W) and LFCSP (θJA = 70°C/W) package on a JEDEC standard 4-layer board. θJA values are approximations. 3.0 θJA 157 125 70 θJC 56 56 56 Unit °C/W °C/W °C/W Maximum Power Dissipation The maximum safe power dissipation in the AD8137 package is limited by the associated rise in junction temperature (TJ) on the die. At approximately 150°C, which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit may change the stresses that the package exerts on the die, permanently shifting the parametric performance of the AD8137. Exceeding a junction temperature of 175°C for an extended period of time can result in changes in the silicon devices, potentially causing failure. 2.5 LFCSP 2.0 1.5 1.0 SOIC-8 0.5 0 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (°C) 04771-0-022 Package Type SOIC-8/2-Layer SOIC-8/4-Layer LFCSP/4-Layer MAXIMUM POWER DISSIPATION (W) Table 5. Thermal Resistance Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. B | Page 6 of 24 AD8137 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 8 +IN VOCM 2 7 PD VS+ 3 6 VS– +OUT 4 5 –OUT 04771-0-001 AD8137 –IN 1 Figure 4. Pin Configuration Table 6. Pin Function Descriptions 3 4 5 6 7 8 VS+ +OUT −OUT VS− PD +IN Description Inverting Input. An internal feedback loop drives the output common-mode voltage to be equal to the voltage applied to the VOCM pin, provided the amplifier’s operation remains linear. Positive Power Supply Voltage. Positive Side of the Differential Output. Negative Side of the Differential Output. Negative Power Supply Voltage. Power Down. Noninverting Input. RF 50Ω VTEST CF RG = 1kΩ 52.3Ω MIDSUPPLY AD8137 VOCM 52.3Ω TEST SIGNAL SOURCE – + RL, dm 1kΩ – 50Ω RG = 1kΩ VO, dm + CF 04771-0-023 Mnemonic −IN VOCM RF Figure 5. Basic Test Circuit RF = 1kΩ 50Ω 52.3Ω VTEST RG = 1kΩ MIDSUPPLY VOCM 52.3Ω TEST SIGNAL SOURCE 50Ω RS – + AD8137 CL, dm – + RS RG = 1kΩ RF = 1kΩ Figure 6. Capacitive Load Test Circuit, G = 1 Rev. B | Page 7 of 24 RL, dm VO, dm 04771-0-062 Pin No. 1 2 AD8137 TYPICAL PERFORMANCE CHARACTERISTICS Unless otherwise noted, differential gain = 1, RG = RF = RL, dm = 1 kΩ, VS = 5 V, TA = 25°C, VOCM = 2.5V. Refer to the basic test circuit in Figure 5 for the definition of terms. 3 3 G=1 –1 G=2 G=5 –2 –3 –4 –5 G = 10 –6 –7 –8 –9 –10 –11 –12 0.1 RG = 1kΩ VO, dm = 0.1V p-p 1 10 FREQUENCY (MHz) 100 1000 Figure 7. Small Signal Frequency Response for Various Gains –2 –3 G=2 G=5 –4 –5 G = 10 –6 –7 –8 –9 –10 RG = 1kΩ –11 VO, dm = 2.0V p-p –12 0.1 1 10 FREQUENCY (MHz) 100 1000 4 VS = +5 2 VS = +3 3 VS = +5 2 1 0 VS = +3 1 VS = ±5 –1 CLOSED-LOOP GAIN (dB) –2 –3 –4 –5 –6 –7 –8 –9 0 VS = ±5 –1 –2 –3 –4 –5 –6 –7 –11 –12 VO, dm = 0.1V p-p 1 10 100 FREQUENCY (MHz) –9 –10 –11 1000 VO, dm = 2.0V p-p 1 Figure 8. Small Signal Frequency Response for Various Power Supplies 04771-0-005 04771-0-003 –8 –10 10 100 FREQUENCY (MHz) 1000 Figure 11. Large Signal Frequency Response for Various Power Supplies 3 4 2 3 1 2 0 T = +25°C CLOSED-LOOP GAIN (dB) 1 –1 T = +85°C –2 –3 T = +25°C –4 T = +125°C –5 T = –40°C –6 –7 –8 –9 0 –1 T = +85°C –2 –3 –4 T = +125°C –5 –6 –7 04771-0-006 –8 –10 –11 VO, dm = 0.1V p-p –12 1 10 100 FREQUENCY (MHz) –9 –10 VO, dm = 2.0V p-p –11 1000 Figure 9. Small Signal Frequency Response at Various Temperatures T = –40°C 04771-0-007 CLOSED-LOOP GAIN (dB) –1 Figure 10. Large Signal Frequency Response for Various Gains 3 CLOSED-LOOP GAIN (dB) G=1 1 0 04771-0-004 NORMALIZED CLOSED-LOOP GAIN (dB) 2 1 0 04771-0-002 NORMALIZED CLOSED-LOOP GAIN (dB) 2 1 10 100 FREQUENCY (MHz) 1000 Figure 12. Large Signal Frequency Response at Various Temperatures Rev. B | Page 8 of 24 AD8137 3 3 RL, dm = 1kΩ 2 RL, dm = 500Ω 2 1 1 0 RL, dm = 2kΩ –1 CLOSED-LOOP GAIN (dB) –2 –3 –4 –5 –6 –7 –8 –9 –3 –4 –5 –6 –7 RL, dm = 2kΩ –8 RL, dm = 500Ω VO, dm = 0.1V p-p 1 10 100 FREQUENCY (MHz) –10 RL, dm = 1kΩ –11 –12 1000 VO, dm = 2V p-p 1 Figure 13. Small Signal Frequency Response for Various Loads 04771-0-043 04771-0-041 –11 –12 10 100 FREQUENCY (MHz) 1000 Figure 16. Large Signal Frequency Response for Various Loads 3 3 2 1 0 –2 –3 CLOSED-LOOP GAIN (dB) CF = 1pF –1 CF = 0pF 2 CF = 0pF 1 0 CF = 2pF –4 –5 –6 –7 –8 –9 CF = 1pF –1 –2 –3 CF = 2pF –4 –5 –6 –7 –8 04771-0-008 –9 –10 –11 –12 VO, dm = 0.1V p-p 1 10 100 FREQUENCY (MHz) 04771-0-009 CLOSED-LOOP GAIN (dB) –2 –9 –10 –10 –11 –12 1000 VO, dm = 2.0V p-p 1 Figure 14. Small Signal Frequency Response for Various CF 10 100 FREQUENCY (MHz) 1000 Figure 17. Large Signal Frequency Response for Various CF 2 3 VOCM = 4V 1 VOCM = 2.5V 2 0 1 –1 0 –2 CLOSED-LOOP GAIN (dB) VOCM = 1V –3 –4 –5 –6 –7 –8 –9 –10 –1 0.5V p-p –2 –3 –4 –5 –6 –7 2V p-p –8 –9 04771-0-042 CLOSED-LOOP GAIN (dB) –1 –11 –12 –13 VO, dm = 0.1V p-p 1 10 100 FREQUENCY (MHz) 0.1V p-p –10 1V p-p 04771-0-044 CLOSED-LOOP GAIN (dB) 0 –11 –12 1000 1 Figure 15. Small Signal Frequency Response at Various VOCM 10 100 FREQUENCY (MHz) 1000 Figure 18. Frequency Response for Various Output Amplitudes Rev. B | Page 9 of 24 4 3 3 2 2 1 1 RF = 500Ω RF = 2kΩ –2 –3 RF = 1kΩ –4 –5 –6 –7 –8 G=1 VS = ±5V VO, dm = 0.1V p-p –9 –10 –11 1 10 100 FREQUENCY (MHz) RF = 500Ω –4 RF = 1kΩ –5 –6 –7 –8 G=1 VO, dm = 2V p-p 1 1000 10 100 FREQUENCY (MHz) 1000 Figure 22. Large Signal Frequency Response for Various RF –40 G=1 VO, dm = 2V p-p –50 –75 VS = +3V DISTORTION (dBc) –80 VS = +5V –85 VS = ±5V –90 G=1 VO, dm = 2V p-p –60 VS = +3V –70 VS = +5V –80 VS = ±5V –90 –95 –100 04771-0-045 –100 –105 0.1 1 FREQUENCY (MHz) 04771-0-063 DISTORTION (dBc) RF = 2kΩ –3 –9 –65 –110 0.1 10 Figure 20. Second Harmonic Distortion vs. Frequency and Supply Voltage 1 FREQUENCY (MHz) 10 Figure 23. Third Harmonic Distortion vs. Frequency and Supply Voltage –50 –55 –2 –10 –11 Figure 19. Small Signal Frequency Response for Various RF –70 0 –1 04771-0-036 0 –1 CLOSED-LOOP GAIN (dB) 4 04771-0-037 CLOSED-LOOP GAIN (dB) AD8137 –50 FC = 500kHz SECOND HARMONIC SOLID LINE THIRD HARMONIC DASHED LINE –55 –60 –60 –65 –65 VS = +3V DISTORTION (dBc) VS = +5V –70 –75 VS = +3V –80 VS = +3V –85 –75 –80 VS = +5V –85 VS = +3V VS = +5V –90 04771-0-027 –90 –95 –100 0.25 –70 1.25 2.25 3.25 4.25 5.25 6.25 VO, dm (V p-p) 7.25 8.25 –100 0.25 9.25 Figure 21. Harmonic Distortion vs. Output Amplitude and Supply, FC = 500 kHz FC = 2MHz SECOND HARMONIC SOLID LINE THIRD HARMONIC DASHED LINE –95 1.25 2.25 3.25 4.25 5.25 6.25 VO, dm (V p-p) 7.25 8.25 04771-0-026 DISTORTION (dBc) VS = +5V 9.25 Figure 24. Harmonic Distortion vs. Output Amplitude and Supply, FC = 2 MHz Rev. B | Page 10 of 24 AD8137 –40 –40 VO, dm = 2V p-p –50 –50 –60 –60 DISTORTION (dBc) RL, dm = 200Ω –70 –80 RL, dm = 1kΩ RL, dm = 500Ω –90 –80 RL, dm = 1kΩ –90 1 FREQUENCY (MHz) RL, dm = 500Ω –100 04771-0-032 –100 –110 0.1 RL, dm = 200Ω –70 –110 0.1 10 Figure 25. Second Harmonic Distortion at Various Loads 04771-0-033 DISTORTION (dBc) VO, dm = 2V p-p 1 FREQUENCY (MHz) 10 Figure 28. Third Harmonic Distortion at Various Loads –40 –40 VO, dm = 2V p-p RG = 1kΩ VO, dm = 2V p-p RG = 1kΩ –50 –50 –70 G=1 –80 –60 –70 G=2 –80 G=1 –90 –90 –100 –100 –110 0.1 1 FREQUENCY (MHz) –110 0.1 10 Figure 26. Second Harmonic Distortion at Various Gains 1 FREQUENCY (MHz) 10 Figure 29. Third Harmonic Distortion at Various Gains –40 –40 VO, dm = 2V p-p G=1 VO, dm = 2V p-p G=1 –50 –60 –60 RF = 500Ω –70 –80 RF = 2kΩ –90 –110 0.1 1 FREQUENCY (MHz) –80 –90 RF = 1kΩ –100 –70 RF = 500Ω –100 –110 0.1 10 Figure 27. Second Harmonic Distortion at Various RF RF = 1kΩ RF = 2kΩ 1 FREQUENCY (MHz) Figure 30. Third Harmonic Distortion at Various RF Rev. B | Page 11 of 24 04771-0-031 DISTORTION (dBc) –50 04771-0-030 DISTORTION (dBc) G=5 04771-0-035 DISTORTION (dBc) G=5 04771-0-034 DISTORTION (dBc) G=2 –60 10 AD8137 –50 –50 FC = 500kHz VO, dm = 2V p-p SECOND HARMONIC SOLID LINE THIRD HARMONIC DASHED LINE –60 DISTORTION (dBc) –70 –80 –90 –110 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 –80 –90 –100 04771-0-028 –100 –70 –110 0.5 4.5 04771-0-029 DISTORTION (dBc) –60 FC = 500kHz VO, dm = 2V p-p SECOND HARMONIC SOLID LINE THIRD HARMONIC DASHED LINE 0.7 0.9 1.1 VOCM (V) Figure 31. Harmonic Distortion vs. VOCM, VS = 5 V 1.5 1.7 VOCM (V) 1.9 2.1 2.3 2.5 Figure 34. Harmonic Distortion vs. VOCM, VS = 3 V 100 10 1 10 100 1k 10k 100k FREQUENCY (Hz) 1M 10M 100 10 1 10 100M Figure 32. Input Voltage Noise vs. Frequency 04771-0-047 VOCM NOISE (nV/√Hz) 1000 04771-0-046 INPUT VOLTAGE NOISE (nV/√Hz) 1.3 100 1k 10k 100k FREQUENCY (Hz) 1M 10M 100M Figure 35. VOCM Voltage Noise vs. Frequency 20 –10 VIN, cm = 0.2V p-p INPUT CMRR = ∆VO, cm/∆VIN, cm 10 VO, cm = 0.2V p-p VOCM CMRR = ∆VO, dm/∆VOCM –20 0 –30 VOCM CMRR (dB) –20 –30 –40 –50 –40 –50 –60 –70 –80 1 10 FREQUENCY (MHz) 04771-0-012 –60 04771-0-013 CMRR (dB) –10 –70 –80 100 1 Figure 33. CMRR vs. Frequency 10 FREQUENCY (MHz) Figure 36. VOCM CMRR vs. Frequency Rev. B | Page 12 of 24 100 AD8137 2.0 8 INPUT × 2 1.0 AMPLITUDE (V) 4 2 0 –2 0.5 0 ERROR = VO, dm - INPUT –0.5 TSETTLE = 110ns –1.0 –6 250ns/DIV –8 04771-0-016 –4 –1.5 50ns/DIV –2.0 TIME (ns) TIME (ns) Figure 40. Settling Time (0.02%) Figure 37. Overdrive Recovery 1.5 100 CF = 0pF 75 2V p-p 1.0 CF = 1pF CF = 0pF 50 CF = 0pF 1V p-p 0.5 CF = 1pF 25 VO, dm (V) VO, dm (mV) ERROR (V) 1DIV = 0.02% CF = 0pF VO, dm = 3.5V p-p INPUT OUTPUT VOLTAGE (V) VO, dm 1.5 6 04771-0-040 G=2 0 –25 CF = 1pF 0 –0.5 VO, dm = 100mV p-p 10ns/DIV –100 04771-0-015 –1.0 –75 20ns/DIV –1.5 04771-0-014 –50 TIME (ns) TIME (ns) Figure 38. Small Signal Transient Response for Various Feedback Capacitances Figure 41. Large Signal Transient Response for Various Feedback Capacitances 100 1.5 RS = 111, CL = 5pF 75 1.0 50 RS = 111, CL = 5pF 0.5 VO, dm (V) VO, dm (V) 25 0 –25 RS = 60.4, CL = 15pF RS = 60.4, CL = 15pF 0 –0.5 20ns/DIV –100 –1.0 04771-0-039 –75 20ns/DIV –1.5 TIME (ns) 04771-0-038 –50 TIME (ns) Figure 39. Small Signal Transient Response for Various Capacitive Loads Figure 42. Large Signal Transient Response for Various Capacitive Loads Rev. B | Page 13 of 24 AD8137 1000 –5 PSRR = ∆VO, dm/∆VS –15 100 OUTPUT IMPEDANCE (Ω) PSRR (dB) –25 –35 –PSRR –45 +PSRR –55 –65 10 1 –85 0.1 1 10 FREQUENCY (MHz) 04771-0-061 04771-0-011 0.1 –75 0.01 0.01 100 Figure 43. PSRR vs. Frequency 0.1 1 10 FREQUENCY (MHz) 100 Figure 46. Single-Ended Output Impedance vs. Frequency 4.0 1 0 3.5 2V p-p –3 3.0 –4 –5 VO, cm (V) –6 –7 VS = +5 VS = ±5 –8 1V p-p 2.5 2.0 –9 VS = +3 –12 –13 –14 VO, dm = 0.1V p-p 1 1.5 04771-0-010 –11 10 100 FREQUENCY (MHz) 20ns/DIV 1.0 1000 TIME (ns) Figure 47. VOCM Large Signal Transient Response Figure 44. VOCM Small Signal Frequency Response for Various Supply Voltages 350 700 –300 600 345 VOP SWING FROM RAIL (mV) VS+ – VOP 400 300 200 100 0 VS = +5V VS = +3V –100 –200 –300 VON – VS– –400 –500 –600 –700 200 1k RESISTIVE LOAD (Ω) –305 VON – VS– 340 –310 335 –315 VS+ – VOP 330 –320 325 320 –40 10k Figure 45. Output Saturation Voltage vs. Output Load –325 –330 –20 0 20 40 60 TEMPERATURE (°C) 80 100 120 Figure 48. Output Saturation Voltage vs. Temperature Rev. B | Page 14 of 24 VON SWING FROM RAIL (mV) 500 04771-0-049 SINGLE-ENDED OUTPUT SWING FROM RAIL (mV) 04771-0-050 –10 04771-0-065 CLOSED-LOOP GAIN (dB) –1 –2 AD8137 10 2.55 VOS, dm 0 0 –0.1 5 –0.2 10 –0.3 –40 VOS, cm (mV) 5 VOS, dm (mV) 0.1 –15 –20 0 20 40 60 TEMPERATURE (°C) 80 100 2.50 2.45 2.40 2.35 2.30 –40 120 1.2 70 1.0 50 0.8 0 20 40 60 TEMPERATURE (°C) 80 100 120 30 (µA) 0.6 IV OCM 0.4 10 –10 0.2 –30 0 –50 –0.4 0.50 1.50 2.50 VACM (V) 3.50 –70 4.50 0 Figure 50. Input Bias Current vs. Input Common-Mode Voltage, VACM 0.40 0.5 1.0 1.5 2.0 2.5 3.0 VOCM (V) 3.5 4.0 4.5 5.0 Figure 53. VOCM Bias Current vs. VOCM Input Voltage –0.1 3 2 IBIAS –0.2 0.30 0.25 0 IOS 0.20 –1 0.15 –2 IOS (nA) 1 VOCM CURRENT (µA) 0.35 04771-0-056 –0.2 –0.3 0.10 –40 –3 –20 0 20 40 60 TEMPERATURE (°C) 80 100 120 Figure 51. Input Bias and Offset Current vs. Temperature –0.5 –40 04771-0-054 –0.4 04771-0-053 IBIAS (µA) –20 Figure 52. Supply Current vs. Temperature 04771-0-059 INPUT BIAS CURRENT (µA) Figure 49. Offset Voltage vs. Temperature 04771-0-051 VOS, cm 2.60 04771-0-052 0.2 15 SUPPLY CURRENT (mA) 0.3 –20 0 20 40 60 TEMPERATURE (°C) 80 100 Figure 54. VOCM Bias Current vs. Temperature Rev. B | Page 15 of 24 120 AD8137 1.5 VS = +5V VS = ±2.5V G = 1 (RF = RG = 1kΩ) RL, dm = 1kΩ INPUT = 1Vp-p @ 1MHz 4 1.0 SUPPLY CURRENT (mA) 3 2 VS = +3V VO, cm 1 0 –1 VS = ±5V –2 –3 –5 –5 –4 –3 –2 –1 0 VOCM 1 2 3 4 0 –0.5 –1.0 04771-0-060 –4 VO, dm 0.5 –0.5V PD 2µs/DIV –2.0V –1.5 04771-0-066 5 5 TIME (µs) Figure 58. Power-Down Transient Response Figure 55. VO, cm vs. VOCM Input Voltage 3.6 40 3.2 20 PD (0.8V TO 1.5V) SUPPLY CURRENT (mA) 2.8 –20 –40 –60 –80 2.4 2.0 1.6 1.2 04771-0-057 0.8 –100 –120 0 0.5 1.0 1.5 2.0 2.5 3.0 PD VOLTAGE (V) 3.5 4.0 4.5 0.4 100ns/DIV 0 5.0 04771-0-024 PD CURRENT (µA) 0 TIME (ns) Figure 59. Power-Down Turn-On Time Figure 56. PD Current vs. PD Voltage 3.4 3 PD (1.5V TO 0.8V) 3.0 IS + 0 –1 –2 IS– –3 0 0.5 1.0 1.5 2.0 2.5 3.0 PD VOLTAGE (V) 3.5 4.0 4.5 2.6 2.2 1.8 1.4 1.0 0.6 40ns/DIV 0.2 5.0 TIME (ns) Figure 60. Power-Down Turn-Off Time Figure 57. Supply Current vs. PD Voltage Rev. B | Page 16 of 24 04771-0-025 SUPPLY CURRENT (mA) 1 04771-0-058 SUPPLY CURRENT (mA) 2 AD8137 THEORY OF OPERATION 100 The AD8137 is a low power, low cost, fully differential voltage feedback amplifier that features a rail-to-rail output stage, common-mode circuitry with an internally derived commonmode reference voltage, and bias shutdown circuitry. The amplifier uses two feedback loops to separately control differential and common-mode feedback. The differential gain is set with external resistors as in a traditional amplifier while the output common-mode voltage is set by an internal feedback loop, controlled by an external VOCM input. This architecture makes it easy to arbitrarily set the output common-mode voltage level without affecting the differential gain of the amplifier. 80 60 40 20 OPEN-LOOP GAIN (dB) 0 –20 –40 –60 –80 –100 PHASE (DEGREES) –120 04771-0-021 –140 –160 –180 –200 0.0001 0.001 0.01 0.1 1 FREQUENCY (MHz) 10 100 Figure 62. Open-Loop Gain and Phase VOCM ACM –OUT CP +IN –IN CN +OUT CC 04771-0-017 CC Figure 61. Block Diagram From Figure 61, the input transconductance stage is an H-bridge whose output current is mirrored to high impedance nodes CP and CN. The output section is traditional H-bridge driven circuitry with common emitter devices driving nodes +OUT and −OUT. The 3 dB point of the amplifier is defined as gm BW = 2π × CC where gm is the transconductance of the input stage and CC is the total capacitance on node CP/CN (capacitances CP and CN are well matched). For the AD8137, the input stage gm is ~1 mA/V and the capacitance CC is 3.5 pF, setting the crossover frequency of the amplifier at 41 MHz. This frequency generally establishes an amplifier’s unity gain bandwidth, but with the AD8137, the closed-loop bandwidth depends upon the feedback resistor value as well (see Figure 19). The open-loop gain and phase simulations are shown in Figure 62. In Figure 61, the common-mode feedback amplifier ACM samples the output common-mode voltage, and by negative feedback forces the output common-mode voltage to be equal to the voltage applied to the VOCM input. In other words, the feedback loop servos the output common-mode voltage to the voltage applied to the VOCM input. An internal bias generator sets the VOCM level to approximately midsupply; therefore, the output common-mode voltage will be set to approximately midsupply when the VOCM input is left floating. The source resistance of the internal bias generator is large and can be overridden easily by an external voltage supplied by a source with a relatively small output resistance. The VOCM input can be driven to within approximately 1 V of the supply rails while maintaining linear operation in the common-mode feedback loop. The common-mode feedback loop inside the AD8137 produces outputs that are highly balanced over a wide frequency range without the requirement of tightly matched external components, because it forces the signal component of the output common-mode voltage to be zeroed. The result is nearly perfectly balanced differential outputs of identical amplitude and exactly 180° apart in phase. Rev. B | Page 17 of 24 AD8137 APPLICATIONS ANALYZING A TYPICAL APPLICATION WITH MATCHED RF AND RG NETWORKS Output balance is measured by placing a well-matched resistor divider across the differential voltage outputs and comparing the signal at the divider’s midpoint with the magnitude of the differential output. By this definition, output balance is equal to the magnitude of the change in output common-mode voltage divided by the magnitude of the change in output differentialmode voltage: Typical Connection and Definition of Terms Figure 63 shows a typical connection for the AD8137, using matched external RF/RG networks. The differential input terminals of the AD8137, VAP and VAN, are used as summing junctions. An external reference voltage applied to the VOCM terminal sets the output common-mode voltage. The two output terminals, VOP and VON, move in opposite directions in a balanced fashion in response to an input signal. Output Balance = RF RG VAP VOCM VIN VON + AD8137 RG VAN – VAN = VAP – RL, dm VO, dm VOP 04771-0-055 VOP = VOCM + Figure 63. Typical Connection The differential output voltage is defined as VO, dm = VOP − VON VOP + VON 2 VO , dm (5) 2 and (1) VON = VOCM − Common-mode voltage is the average of two voltages. The output common-mode voltage is defined as VO , cm = (4) The common-mode feedback loop drives the output commonmode voltage, sampled at the midpoint of the two internal common-mode tap resistors in Figure 61, to equal the voltage set at the VOCM terminal. This ensures that + RF CF (3) ∆VO , dm The differential negative feedback drives the voltages at the summing junctions VAN and VAP to be essentially equal to each other. CF VIP ∆VO , cm VO , dm (6) 2 ESTIMATING NOISE, GAIN, AND BANDWITH WITH MATCHED FEEDBACK NETWORKS (2) Output Balance Output balance is a measure of how well VOP and VON are matched in amplitude and how precisely they are 180° out of phase with each other. It is the internal common-mode feedback loop that forces the signal component of the output common-mode towards zero, resulting in the near perfectly balanced differential outputs of identical amplitude and exactly 180° out of phase. The output balance performance does not require tightly matched external components, nor does it require that the feedback factors of each loop be equal to each other. Low frequency output balance is ultimately limited by the mismatch of an on-chip voltage divider. Estimating Output Noise Voltage and Bandwidth The total output noise is the root-sum-squared total of several statistically independent sources. Since the sources are statistically independent, the contributions of each must be individually included in the root-sum-square calculation. Table 7 lists recommended resistor values and estimates of bandwidth and output differential voltage noise for various closed-loop gains. For most applications, 1% resistors are sufficient. Table 7. Recommended Values of Gain-Setting Resistors, and Voltage Gain for Various Closed-Loop Gains Gain 1 2 5 10 Rev. B | Page 18 of 24 RG (Ω) 1k 1k 1k 1k RF (Ω) 1k 2k 5k 10 k 3 dB Bandwidth (MHz) 72 40 12 6 Total Output Noise (nV/√Hz) 18.6 28.9 60.1 112.0 AD8137 The differential output voltage noise contains contributions from the AD8137’s input voltage noise and input current noise as well as those from the external feedback networks. Feedback Factor Notation When working with differential drivers, it is convenient to introduce the feedback factor β, which is defined as The contribution from the input voltage noise spectral density is computed as ⎛ R ⎞ Vo_n1 = vn ⎜1 + F ⎟ , or equivalently, vn/β ⎝ RG ⎠ (7) where vn is defined as the input-referred differential voltage noise. This equation is the same as that of traditional op amps. The contribution from the input current noise of each input is computed as Vo_n 2 = in (RF ) (8) where in is defined as the input noise current of one input. Each input needs to be treated separately since the two input currents are statistically independent processes. β≡ Input Common-Mode Voltage The linear range of the VAN and VAP terminals extends to within approximately 1 V of either supply rail. Since VAN and VAP are essentially equal to each other, they are both equal to the amplifier’s input common-mode voltage. Their range is indicated in the specifications tables as input common-mode range. The voltage at VAN and VAP for the connection diagram in Figure 63 can be expressed as VAN = VAP = VACM = (V + VIN ) ⎞ ⎛ RG ⎛ RF ⎞ × IP × VOCM ⎟ ⎜ ⎟+⎜ + + 2 R R R R G G ⎝ F ⎠ ⎝ F ⎠ (9) Using the β notation, Equation (15) can be written as VACM = βVOCM + (1 − β )VICM The contribution from each RF is computed as (10) VACM = VICM + β(VOCM − VICM ) The behavior of the node voltages of the single-ended-todifferential output topology can be deduced from the signal definitions and Figure 63. Referring to Figure 63, (CF = 0) and setting VIN = 0 one can write: VIP − VAP VAP − VON = RG RF (11) ⎡ RG ⎤ VAN = VAP = VOP ⎢ ⎥ ⎣ RF + RG ⎦ (12) (17) where VICM is the common-mode voltage of the input signal, that is VICM ≡ VIP + VIN 2 For proper operation, the voltages at VAN and VAP must stay within their respective linear ranges. Solving the above two equations and setting VIP to Vi gives the gain relationship for VO, dm/Vi. RF V RG i (16) or equivalently, Voltage Gain VOP − VON = VO, dm = (15) where VACM is the common-mode voltage present at the amplifier input terminals. This result can be intuitively viewed as the thermal noise of each RG multiplied by the magnitude of the differential gain. Vo_n 4 = 4 kTRF (14) This notation is consistent with conventional feedback analysis and is very useful, particularly when the two feedback loops are not matched. The contribution from each RG is computed as ⎛R ⎞ Vo_n 3 = 4 kTRG ⎜ F ⎟ ⎝ RG ⎠ RG RF + RG Calculating Input Impedance The input impedance of the circuit in Figure 63 depends on whether the amplifier is being driven by a single-ended or a differential signal source. For balanced differential input signals, the differential input impedance (RIN, dm) is simply (13) An inverting configuration with the same gain magnitude can be implemented by simply applying the input signal to VIN and setting VIP = 0. For a balanced differential input, the gain from VIN, dm to VO, dm is also equal to RF/RG, where VIN, dm = VIP − VIN. R IN, dm = 2 RG (18) For a single-ended signal (for example, when VIN is grounded, and the input signal drives VIP), the input impedance becomes Rev. B | Page 19 of 24 R IN = RG RF 1− 2(RG + RF ) (19) AD8137 5V 0.1µF 0.1µF 1kΩ 1kΩ VOCM 3 8 2 1 VIN 1.0nF 5 + VDD VIN– AD8137 – AD7450A 4 6 VREFB 2.5V 1kΩ 1kΩ 50Ω VIN+ GND 1.0nF 2.5kΩ +1.88V +1.25V +0.63V VACM WITH VREFB = 0 VREF ADR525A 2.5V SHUNT VREFA REFERENCE 04771-0-018 +2.5V GND –2.5V 50Ω Figure 64. AD8137 Driving AD7450A, 12-Bit A/D Converter 5V The input impedance of a conventional inverting op amp configuration is simply RG, but is higher in Equation 19 because a fraction of the differential output voltage appears at the summing junctions, VAN and VAP. This voltage partially bootstraps the voltage across the input resistor RG, leading to the increased input resistance. 0.1µF VIN 0V TO 5V 1kΩ 3 1kΩ 8 VOCM 2 1 5 + AD8137 – Input Common-Mode Swing Considerations 4 6 1kΩ TO AD7450A VREF 5V 0.1µF 0.1µF 10µF Consider the case in Figure 64, where VIN is 5 V p-p swinging about a baseline at ground and VREFB is connected to ground. The input signal to the AD8137 is originating from a source with a very low output resistance. + + AD8031 0.1µF – 10kΩ ADR525A 2.5V SHUNT REFERENCE 04771-0-019 1kΩ In some single-ended-to-differential applications when using a single-supply voltage, attention must be paid to the swing of the input common-mode voltage, VACM. Figure 65. Low-Z Bias Source The circuit has a differential gain of 1.0 and β = 0.5. VICM has an amplitude of 2.5 V p-p and is swinging about ground. Using the results in Equation 16, the common-mode voltage at the AD8137’s inputs, VACM, is a 1.25 V p-p signal swinging about a baseline of 1.25 V. The maximum negative excursion of VACM in this case is 0.63 V, which exceeds the lower input common-mode voltage limit. One way to avoid the input common-mode swing limitation is to bias VIN and VREF at midsupply. In this case, VIN is 5 V p-p swinging about a baseline at 2.5 V, and VREF is connected to a low-Z 2.5 V source. VICM now has an amplitude of 2.5 V p-p and is swinging about 2.5 V. Using the results in Equation 17, VACM is calculated to be equal to VICM because VOCM = VICM. Therefore, VICM swings from 1.25 V to 3.75 V, which is well within the input common-mode voltage limits of the AD8137. Another benefit seen by this example is that since VOCM = VACM = VICM, no wasted common-mode current flows. Figure 65 illustrates a way to provide the low-Z bias voltage. For situations that do not require a precise reference, a simple voltage divider will suffice to develop the input voltage to the buffer. Another way to avoid the input common-mode swing limitation is to use dual power supplies on the AD8137. In this case, the biasing circuitry is not required. Bandwidth vs. Closed-Loop Gain The AD8137’s 3 dB bandwidth will decrease proportionally to increasing closed-loop gain in the same way as a traditional voltage feedback operational amplifier. For closed-loop gains greater than 4, the bandwidth obtained for a specific gain can be estimated as f − 3dB ,VO, dm = RG × ( 72 MHz ) RG + RF (20) or equivalently, β(72 MHz). This estimate assumes a minimum 90 ° phase margin for the amplifier loop, a condition approached for gains greater than four. Lower gains will show more bandwidth than predicted by the equation due to the peaking produced by the lower phase margin. Rev. B | Page 20 of 24 AD8137 Estimating DC Errors Driving a Capacitive Load Primary differential output offset errors in the AD8137 are due to three major components: the input offset voltage, the offset between the VAN and VAP input currents interacting with the feedback network resistances, and the offset produced by the dc voltage difference between the input and output common-mode voltages in conjunction with matching errors in the feedback network. A purely capacitive load will react with the bondwire and pin inductance of the AD8137, resulting in high frequency ringing in the transient response and loss of phase margin. One way to minimize this effect is to place a small resistor in series with each output to buffer the load capacitance. The resistor and load capacitance will form a first-order, low-pass filter, so the resistor value should be as small as possible. In some cases, the ADCs require small series resistors to be added on their inputs. The first output error component is calculated as ⎛ R + RG ⎞ Vo_e 1 = VIO ⎜ F ⎟ , or equivalently as VIO/β ⎝ RG ⎠ (21) Figure 39 and Figure 42 illustrate transient response vs. capacitive load, and were generated using series resistors in each output and a differential capacitive load. where VIO is the input offset voltage. Layout Considerations The second error is calculated as Standard high speed PCB layout practices should be adhered to when designing with the AD8137. A solid ground plane is recommended and good wideband power supply decoupling networks should be placed as close as possible to the supply pins. ⎛ R + RG ⎞⎛ RG RF ⎞ Vo_e 2 = I IO ⎜ F ⎟ = I IO (RF ) ⎟⎜ ⎝ RG ⎠⎝ RF + RG ⎠ (22) where IIO is defined as the offset between the two input bias currents. The third error voltage is calculated as Vo_e 3 = ∆enr × (VICM − VOCM ) (23) where Δenr is the fractional mismatch between the two feedback resistors. The total differential offset error is the sum of these three error sources. Additional Impact of Mismatches in the Feedback Networks The internal common-mode feedback network will still force the output voltages to remain balanced, even when the RF/RG feedback networks are mismatched. The mismatch, however, will cause a gain error proportional to the feedback network mismatch. Ratio-matching errors in the external resistors will degrade the ability to reject common-mode signals at the VAN and VIN input terminals, similar to a four-resistor difference amplifier made from a conventional op amp. Ratio-matching errors will also produce a differential output component that is equal to the VOCM input voltage times the difference between the feedback factors (βs). In most applications using 1% resistors, this component amounts to a differential dc offset at the output that is small enough to be ignored. To minimize stray capacitance at the summing nodes, the copper in all layers under all traces and pads that connect to the summing nodes should be removed. Small amounts of stray summing-node capacitance will cause peaking in the frequency response, and large amounts can cause instability. If some stray summing-node capacitance is unavoidable, its effects can be compensated for by placing small capacitors across the feedback resistors. Terminating a Single-Ended Input Controlled impedance interconnections are used in most high speed signal applications, and they require at least one line termination. In analog applications, a matched resistive termination is generally placed at the load end of the line. This section deals with how to properly terminate a single-ended input to the AD8137. The input resistance presented by the AD8137 input circuitry is seen in parallel with the termination resistor, and its loading effect must be taken into account. The Thevenin equivalent circuit of the driver, its source resistance, and the termination resistance must all be included in the calculation as well. An exact solution to the problem requires solution of several simultaneous algebraic equations and is beyond the scope of this data sheet. An iterative solution is also possible and is simpler, especially considering the fact that standard resistor values are generally used. Figure 66 shows the AD8137 in a unity-gain configuration, and with the following discussion, provides a good example of how to provide a proper termination in a 50 Ω environment. Rev. B | Page 21 of 24 AD8137 +5V This example shows that when RF and RG are large compared to RT, the gain reduction produced by the increase in RG is essentially cancelled by the increase in the Thevenin voltage caused by RT being greater than the output resistance of the signal source. In general, as RF and RG become smaller in terminated applications, RF needs to be increased to compensate for the increase in RG. 0.1µF 1kΩ 50Ω VIN SIGNAL SOURCE 2V p-p RT 52.3Ω 0V – 3 1kΩ 8 VOCM 2 1 1.02kΩ 5 + AD8137 – When generating the typical performance characteristics data, the measurements were calibrated to take the effects of the terminations on closed-loop gain into account. 4 6 0.1µF –5V 04771-0-020 + 1kΩ Power Down Figure 66. AD8137 with Terminated Input The 52.3 Ω termination resistor, RT, in parallel with the 1 kΩ input resistance of the AD8137 circuit, yields an overall input resistance of 50 Ω that is seen by the signal source. In order to have matched feedback loops, each loop must have the same RG if it has the same RF. In the input (upper) loop, RG is equal to the 1 kΩ resistor in series with the (+) input plus the parallel combination of RT and the source resistance of 50 Ω. In the upper loop, RG is therefore equal to 1.03 kΩ. The closest standard value is 1.02 kΩ and is used for RG in the lower loop. Things become more complicated when it comes to determining the feedback resistor values. The amplitude of the signal source generator VIN is two times the amplitude of its output signal when terminated in 50 Ω. Therefore, a 2 V p-p terminated amplitude is produced by a 4 V p-p amplitude from VS. The Thevenin equivalent circuit of the signal source and RT must be used when calculating the closed-loop gain because RG in the upper loop is split between the 1 kΩ resistor and the Thevenin resistance looking back toward the source. The Thevenin voltage of the signal source is greater than the signal source output voltage when terminated in 50 Ω because RT must always be greater than 50 Ω. In this case, RT is 52.3 Ω and the Thevenin voltage and resistance are 2.04 V p-p and 25.6 Ω, respectively. Now the upper input branch can be viewed as a 2.04 V p-p source in series with 1.03 kΩ. Since this is to be a unity-gain application, a 2 V p-p differential output is required, and RF must therefore be 1.03 kΩ × (2/2.04) = 1.01 kΩ ≈ 1 kΩ. The AD8137 features a PD pin that can be used to minimize the quiescent current consumed when the device is not being used. PD is asserted by applying a low logic level to Pin 7. The threshold between high and low logic levels is nominally 1.1 V above the negative supply rail. See the Specification tables (Table 1 to Table 3) for the threshold limits. DRIVING AN ADC WITH GREATER THAN 12-BIT PERFORMANCE Since the AD8137 is suitable for 12-bit systems, it is desirable to measure the performance of the amplifier in a system with greater than 12-bit linearity. In particular, the effective number of bits, ENOB, is most interesting. The AD7687, 16-bit, 250 KSPS ADC’s performance makes it an ideal candidate for showcasing the 12-bit performance of the AD8137. For this application, the AD8137 is set in a gain of two and driven single-ended through a 20 kHz band-pass filter, while the output is taken differentially to the input of the AD7687 (see Figure 67). This circuit has mismatched RG impedances and, therefore, has a dc offset at the differential output. It is included as a test circuit to illustrate the performance of the AD8137. Actual application circuits should have matched feedback networks. For an AD7687 input range up to −1.82 dBFS, the AD8137 power supply is a single 5 V applied to VS+ with VS− tied to ground. To increase the AD7687 input range to −0.45 dBFS, the AD8137 supplies are increased to +6 V and −1 V. In both cases, the VOCM pin is biased with 2.5 V and the PD pin is left floating. All voltage supplies are decoupled with 0.1 µF capacitors. Figure 68 and Figure 69 show the performance of the −1.82 dBFS setup and the −0.45 dBFS setup, respectively. Rev. B | Page 22 of 24 AD8137 VS+ 1.0kΩ 20kHz V+ GND 33Ω 499Ω VIN + BPF VOCM VDD 1nF AD8137 AD7687 GND – 1nF 04771-0-067 33Ω 499Ω 1.0kΩ +2.5 VS– 0 –10 AMPLITUDE (dB OF FULL SCALE) THD = –93.63dBc SNR = 91.10dB SINAD = 89.74dB ENOB = 14.6 0 20 40 60 80 FREQUENCY (kHz) 100 120 THD = –91.75dBc SNR = 91.35dB SINAD = 88.75dB ENOB = 14.4 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 –140 –150 –160 04771-0-069 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 –140 –150 –160 –170 04771-0-068 AMPLITUDE (dB OF FULL SCALE) Figure 67. AD8137 Driving AD7687, 16-Bit 250 KSPS ADC 0 140 20 40 60 80 FREQUENCY (kHz) 100 120 140 Figure 69. AD8137 Performance on +6 V, −1 V Supplies, −0.45 dBFS Figure 68. AD8137 Performance on Single 5 V Supply, −1.82 dBFS Rev. B | Page 23 of 24 AD8137 OUTLINE DIMENSIONS 5.00 (0.1968) 4.80 (0.1890) 8 5 4.00 (0.1574) 3.80 (0.1497) 1 4 1.27 (0.0500) BSC 0.25 (0.0098) 0.10 (0.0040) 6.20 (0.2440) 5.80 (0.2284) 0.50 (0.0196) × 45° 0.25 (0.0099) 1.75 (0.0688) 1.35 (0.0532) 8° 0.25 (0.0098) 0° 1.27 (0.0500) 0.40 (0.0157) 0.17 (0.0067) 0.51 (0.0201) COPLANARITY SEATING 0.31 (0.0122) 0.10 PLANE COMPLIANT TO JEDEC STANDARDS MS-012-AA CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN Figure 70. 8-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-8) Dimensions shown in millimeters and (inches) 3.00 BSC SQ 0.60 MAX 0.50 0.40 0.30 1 8 PIN 1 INDICATOR 0.90 MAX 0.85 NOM TOP VIEW 2.75 BSC SQ 0.50 BSC 1.50 REF EXPOSED PAD (BOTTOM VIEW) 5 1.89 1.74 1.59 4 1.60 1.45 1.30 0.70 MAX 0.65 TYP 12° MAX PIN 1 INDICATOR 0.05 MAX 0.01 NOM SEATING PLANE 0.30 0.23 0.18 0.20 REF Figure 71. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD] 3 mm × 3 mm Body, Very Thin, Dual Lead (CP-8-2) Dimensions shown in millimeters ORDERING GUIDE Model AD8137YR AD8137YR-REEL AD8137YR-REEL7 AD8137YRZ1 AD8137YRZ-REEL1 AD8137YRZ-REEL71 AD8137YCP-R2 AD8137YCP-REEL AD8137YCP-REEL7 AD8137YCPZ-R21 AD8137YCPZ-REEL1 AD8137YCPZ-REEL71 1 Temperature Range −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C –40°C to +125°C –40°C to +125°C –40°C to +125°C –40°C to +125°C –40°C to +125°C –40°C to +125°C Package Description 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) Z = Pb-free part; # denotes lead-free, may be top or bottom marked. © 2005 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D04771–0–7/05(B) Rev. B | Page 24 of 24 Package Option R-8 R-8 R-8 R-8 R-8 R-8 CP-8-2 CP-8-2 CP-8-2 CP-8-2 CP-8-2 CP-8-2 Branding HFB HFB HFB HFB# HFB# HFB#